CN204369797U - A kind of metallic gasket - Google Patents
A kind of metallic gasket Download PDFInfo
- Publication number
- CN204369797U CN204369797U CN201420714751.5U CN201420714751U CN204369797U CN 204369797 U CN204369797 U CN 204369797U CN 201420714751 U CN201420714751 U CN 201420714751U CN 204369797 U CN204369797 U CN 204369797U
- Authority
- CN
- China
- Prior art keywords
- metallic gasket
- melting point
- low melting
- point metal
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
A kind of metallic gasket that the utility model relates to, it is characterized in that, it is made up of low melting point metal and wire netting.Described low melting point metal is gallium-base alloy, indium-base alloy or bismuth-base alloy.During use, the high heat/specific conductivity due to described low melting point metal can ensure the heat conduction/electrical property of metallic gasket excellence, and therefore, metallic gasket can use as heat-conducting pad, also can be used as conductive spacer.Described wire netting can prevent metallic gasket from use occurring leakage phenomenon of trickling.Heat conduction/the excellent electrical property of a kind of metallic gasket that the utility model relates to, easy to operate, and there will not be in use procedure the leakage phenomenon that trickles, the long-term safety steady running of system can be ensured.The utility model can be widely used in heat conduction/electrical domain that space flight thermal control, the advanced energy, information electronic etc. need reduce contact heat/resistance.
Description
Technical field
The utility model relates to a kind of metallic gasket, and this metallic gasket take low-melting point metal alloy as heat conduction function body.Low melting point metal being overlying on the metallic gasket that wire netting is formed can prevent low melting point metal from use occurring the phenomenon that overflow was lost efficacy.The utility model can be widely used in heat conduction/electrical domain that space flight thermal control, the advanced energy, information electronic etc. need reduce contact heat/resistance.
Background technology
From the progress of heat interfacial material, the low melting point metal heat-conducting cream developed gradually is in recent years the thermal conductivity of a kind of high-end heat interfacial material, its ultra-traditional heat-conducting cream far away, and heat-transfer effect is remarkable.Common low melting point metal heat-conducting cream is gallium-base alloy, because its fusing point is low, be in a liquid state, be suitable as interface heat sink material most under normal temperature, but its mobility is very much not easy to apply, easily occurs trickling Problem of Failure.Subsequently, other investigator adds metal oxide or organism in liquid metal, its adhesivity is improved greatly, is easy to smear, more convenient to operate.But, due to metal oxide or organic thermal conductivity very low, the heat transfer property of low melting point metal heat-conducting cream will be reduced.
From the progress of electro-conductive material, usually, the generation of contact resistance mainly contains two reasons: the first, uneven due to contact surface, and the actual contact surface of metal reduces, and when electric current flows through conductor time, the effective thermal interface of its contact surface reduces.The second, the oxide film that contact surface can form one deck electroconductibility very poor is in atmosphere attached to surface, and resistance is increased.Contact resistance is excessive is the major reason that contact surface is aging.The method of the reduction contact resistance of current main flow has: the material 1) improving contact surface, improves conductivity, as changed surface gold-plating etc. into by copper; 2) oxide film of cleaning contact surface formation in time; 3) at contact interface filled conductive cream.Change contact surface material cost higher, performance boost is less; Cleaning contact surface oxide film increases maintenance cost, and feasibility is not high; Contact interface filled conductive cream limited efficiency, it is nonmetal that its major cause is that the base mateiral of current conductive paste is, and specific conductivity is very limited.In addition, be metal according to base mateiral, when melting point metal is too high, metal not easily melts, and can not accomplish seamless combination between electronic component, still there is larger clearance, causes contact resistance to reduce not obvious; When fusing point is lower, the phenomenon that overflow was lost efficacy by there will be because of metal fusing.
For solving the problem, the utility model proposes a kind of metallic gasket, this metallic gasket take low melting point metal as heat conduction function body, low melting point metal is overlying on the metallic gasket that wire netting is formed and can prevents low melting point metal from use occurring melting the phenomenon of rear overflow inefficacy.
Summary of the invention
The purpose of this utility model is to provide a kind of metallic gasket, this metallic gasket take low-melting point metal alloy as heat conduction function body, low melting point metal is overlying on the metallic gasket that wire netting is formed and can prevents low melting point metal from use occurring the phenomenon that overflow was lost efficacy.
The technical solution of the utility model is as follows:
A kind of metallic gasket, it is characterized in that, as shown in Figure 1, it is made up of low melting point metal 2 and wire netting 1;
Described low melting point metal 2 has very high thermal conductivity and specific conductivity.
High heat/the specific conductivity of described low melting point metal 2 can ensure the heat conduction/electrical property of metallic gasket excellence, and therefore, metallic gasket can use as heat-conducting pad, also can be used as conductive spacer;
Described wire netting 1 is the skeleton of described metallic gasket, controls the thickness of pad on the one hand, alleviates the flowing of low melting point metal simultaneously.
Described low melting point metal 2 is the one in gallium base binary alloy, gallium based multicomponent alloy, indium-base alloy or bismuth-base alloy.
Described gallium base binary alloy is the one in gallium-indium alloy, gallium lead alloy or gallium mercury alloys.
Described gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin zinc alloy.
Described indium-base alloy is indium bismuth tin alloy.
Described wire netting 1 is the one in copper mesh, iron net, aluminium net or nickel screen.
Described wire netting 1 thickness is 0.002 ~ 10mm.
Described metallic gasket 9 is by after described low melting point metal heat fused, and described wire netting is entirely put into low melting point metal liquation, rolls or rolls, obtain the metallic gasket of surfacing after cooled and solidified to it.
Described metallic gasket thickness is 0.005 ~ 15mm.
During use, metallic gasket is placed between scatterer and thermal source or between electronic component, and closely fixes.Along with temperature raises, low melting point metal will melt, but, because there is wire netting to exist, low melting point metal can not be lost efficacy in overflow.Low melting point metal is owing to having very high heat/specific conductivity, and therefore, metallic gasket can use as heat-conducting pad, also can be used as conductive spacer.When metallic gasket uses as heat-conducting pad, heat trnasfer rapidly can be realized between thermal source and radiating element, reduces thermal contact resistance significantly; When using as conductive spacer, the contact resistance between electronic component significantly can be reduced.
A kind of metallic gasket tool described in the utility model has the following advantages:
(1) low melting point metal selected and the thermal conductivity of wire netting higher, heat trnasfer rapidly can be realized between thermal source and radiating element, thermal contact resistance can be reduced significantly.
(2) low melting point metal selected and the specific conductivity of wire netting higher, significantly can reduce the contact resistance between electronic component.
(3) low melting point metal is combined with wire netting, and along with low melting point metal fusing, its mobility becomes large, and now, wire netting plays the effect stoping low melting point metal flowing, and low melting point metal is not easily trickled inefficacy.
(4) low melting point metal being coated in metallic gasket that wire netting is made can any size cutting, and the sheet not frangibility that cutting obtains, moreover the thickness of metallic gasket also can be selected according to actual needs.
(5) metallic gasket can not mix other organism, and long-time use can not be lost efficacy because evaporation becomes dry, thus its use temperature is higher, longer service life.
Accompanying drawing explanation
Fig. 1 is a kind of schematic diagram of structure of metallic gasket.
Description of reference numerals: 1-wire netting, 2-low melting point metal.
Fig. 2 is that in embodiment 1, a kind of metallic gasket is applied to the schematic diagram in heat-removal system as heat-conducting pad.
Description of reference numerals: 3-scatterer, 4-heat-conducting pad, 5-thermal source.
Fig. 3 is that in embodiment 1, a kind of metallic gasket is applied to the schematic diagram in electronic component as conductive spacer.
Description of reference numerals: 6-conductive spacer, 7-electronic component.
Embodiment
The utility model is further described below in conjunction with drawings and the specific embodiments.
Embodiment 1
Embodiment 1 illustrates a kind of typically used of a kind of metallic gasket of the present utility model in field of heat transfer.Fig. 2 is a kind of metallic gasket is applied in heat-removal system schematic diagram as heat-conducting pad.Wherein: 3 is scatterer, 4 is heat-conducting pad, and 5 is thermal source.
As shown in Figure 1, in the present embodiment, low melting point metal is indium bismuth tin alloy, and its fusing point is 60 ° of C.Wire netting is copper mesh, and wire netting thickness is 0.1mm, and metallic gasket thickness is 0.11mm.
During use, heat-conducting pad 4 is placed in thermal source 5 surface, with fastener, scatterer 3 and thermal source 5 is closely fixed.Along with temperature raises, low melting point metal melts, because there is wire netting to exist, makes low melting point metal not easily overflow inefficacy.Heat-conducting pad 4 to realize between thermal source 5 and 3, scatterer heat trnasfer rapidly, reduces thermal contact resistance.
The thermal conductivity of indium bismuth tin alloy can reach 26W
/(mK), relatively traditional high-end nonmetallic heat conductive silicone grease, as SHIN-ETSU HANTOTAI 7783, thermal conductivity improves 4 times.Therefore, in same heat flow density situation, according to SHIN-ETSU HANTOTAI 7783 heat-conducting silicone grease, the contact interface temperature difference is 12oC, and the contact surface temperature difference can be reduced to 3oC by the heat-conducting pad in the present embodiment, and temperature drop is with the obvious advantage.Meanwhile, conventional thermal conductive silicone grease main component is silicone oil, and life-time service easily lost efficacy because volatilization becomes dry, and heat-conducting pad not only can not evaporate leakage, and long service life, safe and reliable.
Embodiment 2
Embodiment 2 illustrates a kind of typically used of a kind of metallic gasket of the present utility model in conduction field.Fig. 3 is a kind of metallic gasket is applied in electronic component schematic diagram as heat-conducting pad.Wherein: 6 is conductive spacer, and 7 is electronic component.
As shown in Figure 2, in the present embodiment, low melting point metal is indium bismuth tin alloy, and fusing point is 60 ° of C.Wire netting is copper mesh, and wire netting thickness is 0.1mm, and metallic gasket thickness is 0.11mm.
During use, conductive spacer 6 is placed between two electronic components 7, it is heated, until low melting point metal fusing (because there is wire netting to exist, making low melting point metal not easily overflow inefficacy), after low melting point metal cooled and solidified, form one with electronic component.Conductive spacer significantly can reduce the contact resistance between electronic component.
Experiment proves, between two electronic components, area is 3cm
×during 3cm, their contact resistance is 100m Ω, if when using traditional conductive paste, contact resistance between two electronic components is reduced to 10m Ω, and when adopting the metallic gasket that the utility model proposes, the contact resistance between two electronic components can be reduced to 3m Ω, contact resistance reduces with the obvious advantage.In addition, because metallic gasket of the present utility model is formed by metal, its boiling point is very high, and the use temperature of this kind of metallic gasket can be made high compared with the use temperature of conventional conductive cream, and then makes its work-ing life also longer.
Finally it should be noted that above embodiment only in order to the technical solution of the utility model to be described and unrestricted.Although be described in detail the utility model with reference to embodiment, those of ordinary skill in the art is to be understood that, the technical solution of the utility model is modified or equivalent replacement, do not depart from the spirit and scope of technical solutions of the utility model, it all should be encompassed in the middle of right of the present utility model.
Claims (8)
1. a metallic gasket, is characterized in that, it is made up of low melting point metal and wire netting;
Described low melting point metal has very high thermal conductivity and specific conductivity;
High heat/the specific conductivity of described low melting point metal can ensure the heat conduction/electrical property of metallic gasket excellence, and therefore, metallic gasket can use as heat-conducting pad, also can be used as conductive spacer;
Described wire netting is the skeleton of described metallic gasket, controls the thickness of pad on the one hand, alleviates the flowing of low melting point metal simultaneously.
2., by a kind of metallic gasket according to claim 1, it is characterized in that, described low melting point metal is the one in gallium base binary alloy, gallium based multicomponent alloy, indium-base alloy or bismuth-base alloy.
3., by a kind of metallic gasket according to claim 2, it is characterized in that, described gallium base binary alloy is the one in gallium-indium alloy, gallium lead alloy or gallium mercury alloys.
4., by a kind of metallic gasket according to claim 2, it is characterized in that, described gallium based multicomponent alloy is gallium-indium-tin alloy or gallium indium tin zinc alloy.
5., by a kind of metallic gasket according to claim 2, it is characterized in that, described indium-base alloy is indium bismuth tin alloy.
6., by a kind of metallic gasket according to claim 1, it is characterized in that, described wire netting is the one in copper mesh, iron net, aluminium net or nickel screen.
7., by a kind of metallic gasket according to claim 1, it is characterized in that, described wire netting thickness is 0.005 ~ 10mm.
8., by a kind of metallic gasket according to claim 1, it is characterized in that, described metallic gasket thickness is 0.005 ~ 15mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420714751.5U CN204369797U (en) | 2014-11-25 | 2014-11-25 | A kind of metallic gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420714751.5U CN204369797U (en) | 2014-11-25 | 2014-11-25 | A kind of metallic gasket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204369797U true CN204369797U (en) | 2015-06-03 |
Family
ID=53326034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420714751.5U Active CN204369797U (en) | 2014-11-25 | 2014-11-25 | A kind of metallic gasket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204369797U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106960830A (en) * | 2017-03-15 | 2017-07-18 | 东莞市明骏智能科技有限公司 | Sealing frame and application, integral heat dissipation structure and electronic component for sealing liquid metal |
| CN107634041A (en) * | 2017-09-26 | 2018-01-26 | 鲁东大学 | A kind of hot interface of low interface thermal contact resistance and preparation method thereof |
| CN110367972A (en) * | 2019-06-28 | 2019-10-25 | 重庆市职业病防治院（重庆市第六人民医院） | A kind of electrocardio monitoring electrode plate |
| CN111849428A (en) * | 2020-06-18 | 2020-10-30 | 上海大陆天瑞激光表面工程有限公司 | Thermal interface material |
-
2014
- 2014-11-25 CN CN201420714751.5U patent/CN204369797U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106960830A (en) * | 2017-03-15 | 2017-07-18 | 东莞市明骏智能科技有限公司 | Sealing frame and application, integral heat dissipation structure and electronic component for sealing liquid metal |
| CN107634041A (en) * | 2017-09-26 | 2018-01-26 | 鲁东大学 | A kind of hot interface of low interface thermal contact resistance and preparation method thereof |
| CN110367972A (en) * | 2019-06-28 | 2019-10-25 | 重庆市职业病防治院（重庆市第六人民医院） | A kind of electrocardio monitoring electrode plate |
| CN111849428A (en) * | 2020-06-18 | 2020-10-30 | 上海大陆天瑞激光表面工程有限公司 | Thermal interface material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204369797U (en) | A kind of metallic gasket | |
| CN103289650B (en) | Low-melting metal conductive paste | |
| CN104032199B (en) | A kind of low melting point liquid metal and its preparation method and application | |
| CN104992742B (en) | High viscosity low-melting-point metal conductive paste and preparation method thereof | |
| CN104218010B (en) | A kind of metal heat interface material | |
| WO2014106313A1 (en) | Method for reducing contact resistance based on metal with low melting point and oxide thereof | |
| CN104745911A (en) | Preparation method and application of high-viscosity low-melting-point metal heat-conducting fin | |
| CN103396769B (en) | Low-melting-point metal thermal-conducting paste as well as preparation method and application thereof | |
| JP2005203778A (en) | Heat sink and heat spreader assembly | |
| CN203040093U (en) | Radiating device applied to high-power heat source | |
| CN103862742A (en) | Phase-change metal thermal interface composite material and preparation method thereof | |
| CN205161023U (en) | Liquid metal base heat conduction membrane composite construction | |
| CN102051157B (en) | High-thermal-conductivity low-thermal-resistance interface material | |
| CN205179609U (en) | Structure of fixed low melting metal conducting strip | |
| CN103725261B (en) | A kind of Ternary liquid metal heat interface material with two melting point character | |
| JP5469089B2 (en) | Method of forming a heat sink | |
| CN107343378A (en) | The heat dissipating method that a kind of liquid metal is combined with silicone grease | |
| CN104917025B (en) | A kind of method of cable conduction connection | |
| CN104911441A (en) | Low-melting metal, preparation method thereof and appliance | |
| CN201829441U (en) | Surface mount fuse | |
| CN203967064U (en) | A kind of chip-packaging structure | |
| CN104582446B (en) | A kind of heat-conducting pad of composite construction | |
| CN206686497U (en) | A kind of heat abstractor based on metal phase change thermal conductivity | |
| CN106714530A (en) | Heat dissipation device based on metal phase change thermal conductivity and electric conductivity and using method thereof | |
| CN209563099U (en) | A kind of metal gasket |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 100040, room 368, Yuquan building, 3 Shijingshan Road, Beijing, Shijingshan District Patentee after: BEIJING LIQUIDKING TECHNOLOGY Co.,Ltd. Address before: 100040, room 368, Yuquan building, 3 Shijingshan Road, Beijing, Shijingshan District Patentee before: BEIJING EMIKON TECHNOLOGY DEVELOPMENT CO.,LTD. |
|
| PP01 | Preservation of patent right | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20230420 Granted publication date: 20150603 |