CN110343927A - A method of reducing liquid metal alloy thermally conductive sheet thermal resistance - Google Patents
A method of reducing liquid metal alloy thermally conductive sheet thermal resistance Download PDFInfo
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- CN110343927A CN110343927A CN201910650527.1A CN201910650527A CN110343927A CN 110343927 A CN110343927 A CN 110343927A CN 201910650527 A CN201910650527 A CN 201910650527A CN 110343927 A CN110343927 A CN 110343927A
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- 229910001338 liquidmetal Inorganic materials 0.000 title claims abstract description 120
- 239000000956 alloy Substances 0.000 title claims abstract description 89
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 87
- 238000000034 method Methods 0.000 title claims abstract description 43
- 230000000737 periodic effect Effects 0.000 claims abstract description 34
- 238000009826 distribution Methods 0.000 claims description 38
- 239000000463 material Substances 0.000 claims description 37
- 229910052738 indium Inorganic materials 0.000 claims description 29
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 29
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 28
- 229910052797 bismuth Inorganic materials 0.000 claims description 28
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 28
- 229910052718 tin Inorganic materials 0.000 claims description 28
- 238000002203 pretreatment Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 115
- 238000002360 preparation method Methods 0.000 description 12
- 230000008569 process Effects 0.000 description 12
- 241000209094 Oryza Species 0.000 description 9
- 235000007164 Oryza sativa Nutrition 0.000 description 9
- 235000009566 rice Nutrition 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002344 surface layer Substances 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000004744 fabric Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 239000000741 silica gel Substances 0.000 description 4
- 229910002027 silica gel Inorganic materials 0.000 description 4
- 238000010792 warming Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002545 silicone oil Polymers 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- IGUXCTSQIGAGSV-UHFFFAOYSA-K indium(iii) hydroxide Chemical compound [OH-].[OH-].[OH-].[In+3] IGUXCTSQIGAGSV-UHFFFAOYSA-K 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D18/00—Pressure casting; Vacuum casting
- B22D18/02—Pressure casting making use of mechanical pressure devices, e.g. cast-forging
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/10—Liquid materials
- C09K5/12—Molten materials, i.e. materials solid at room temperature, e.g. metals or salts
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
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- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention belongs to liquid metal alloy Material Fields, and in particular to a method of reduce liquid metal alloy thermally conductive sheet thermal resistance.The invention discloses a kind of methods for reducing liquid metal for conducting heat piece thermal resistance, include the steps that pretreated liquid metal alloy being pressed into the thermally conductive sheet with periodic structure.
Description
Technical field
The invention belongs to liquid metal material fields, and in particular to a kind of side for reducing liquid metal alloy thermally conductive sheet thermal resistance
Method.
Background technique
Currently, microelectric technique rapidly develops so that electronic chip overall power density substantially increases, heat flow density is also therewith
Increase.Heat dissipation quality can seriously affect system stability and hardware longevity.Chip technology proposes high-performance heat dissipating method
Unprecedented urgent need, so that superelevation heat flow density chip cooling is always the research field of Showed Very Brisk in the world.
The heat dissipation of chip requires to be contacted using heat-conducting interface material with radiator or radiating surface, this boundary material
Effect be fill two interfaces between microvoid.Traditional heat-conducting interface material is heat-conducting silicone grease or heat conductive silica gel, substantially
Principle is the filler particles that high thermal conductivity is filled in silicone oil.But because silicone oil or silica gel substrate thermal conductivity are extremely low, overall
Thermal conductivity is very low, generally below 5W/mK, and thermal resistance is greater than 0.3cm2K/W.This is very for the heat dissipation of electronic chip of high speed development
Unfavorable, for example, the heat flow density of 5G communication chip is greater than 20W/mK, heat-conducting silicone grease silica gel material will be generated in interface and will be up to
6 degree of temperature rise.To solve this problem, liquid metal alloy Heat Conduction Material progresses into the visual field of people in recent years.Such as
GaInBi series liquid metal alloy material, fusing point are 58-60 degree, when chip temperature is more than the fusing point, liquid metal alloy
Piece melts and plays the role of filling interface gap.
Although the liquid metal alloy thermally conductive sheet capacity of heat transmission with higher, there are still many during practical application
Problem.Although a deficiency be after its fusing can with filling interface gap, due to the pressure at hot interface after assembly and uneven,
Cause some places covering/infiltration relatively good, and some places are poor, this is especially prominent on biggish radiating surface.It is tied
The effect that fruit will lead to different thermally conductive sheets is different, fluctuated, seriously affects it with effect.
Summary of the invention
In order to solve the above-mentioned technical problem, the first aspect of the invention provides a kind of reduction liquid metal for conducting heat piece heat
The method of resistance includes the steps that pretreated liquid metal alloy being pressed into the thermally conductive sheet with periodic structure.
As a kind of perferred technical scheme, the liquid metal alloy includes indium, tin, at least two in bismuth.
As a kind of perferred technical scheme, in the liquid metal alloy indium, tin, bismuth mass percent are as follows:
Indium 58~64%；
Tin 16~22%；
Bismuth 17~23%.
As a kind of perferred technical scheme, in the liquid metal alloy indium, tin, bismuth mass percent are as follows:
Indium 61%；
Tin 19%；
Bismuth 20%.
As a kind of perferred technical scheme, the pre-treatment step of the liquid metal alloy are as follows: by liquid metal alloy
It is compressed into tablet form material.
As a kind of perferred technical scheme, the periodic structure includes the week of plane layer, the distribution of plane layer upper surface
The periodically protrusion of phase property protrusion and the distribution of plane layer lower surface.
As a kind of perferred technical scheme, the plane layer with a thickness of 30~60 microns.
As a kind of perferred technical scheme, the periodically protrusion, plane layer lower surface of the plane layer upper surface distribution
The height of the periodically protrusion of distribution is respectively 40~70 microns.
As a kind of perferred technical scheme, the periodically protrusion, plane layer lower surface of the plane layer upper surface distribution
The adjacent protrusion spacing of the periodically protrusion of distribution is respectively 30~120 microns.
As a kind of perferred technical scheme, the protrusion is selected from one of cylinder, square, cuboid, prism.
The utility model has the advantages that the present invention has the liquid metal alloy sheet material of periodic structure by preparation, make liquid metal will
The filling of all contact surface gaps complete wetting, achievees the effect that low thermal resistance, high thermal conductivity, and effectively prevents overflowing for liquid metal
Out.
Detailed description of the invention
Fig. 1 is the schematic diagram with periodic structure liquid metal alloy thermally conductive sheet.
Fig. 2 is structural schematic diagram of the liquid metal for conducting heat piece as boundary material.
Fig. 3 is liquid metal for conducting heat piece partial enlarged view-horizontal spacing direction.
Fig. 4 is liquid metal for conducting heat piece partial enlarged view-longitudinal pitch direction.
Fig. 5 is the thermal resistance curve figure of embodiment 1.
Symbol description: 1 plane layer；The periodically protrusion of 2-1 plane layer upper surface distribution；2-2 plane layer following table EDS maps
Periodically protrusion；The untreated thermal resistance curve measured of 5-1 liquid metal alloy；5-2 liquid metal alloy passes through step
(1) and after step (2) thermal resistance curve measured.
Specific embodiment
To solve the above-mentioned problems, the present invention provides a kind of methods for reducing liquid metal for conducting heat piece thermal resistance, including will
The step of thermally conductive sheet with periodic structure is made in pretreated liquid metal alloy.
Liquid metal alloy
As a preferred embodiment, the liquid metal alloy includes at least one of indium, tin, bismuth.
The indium is silvery white and slightly nattier blue metal, and fusing point is 156.61 degrees Celsius.The thermal conductivity of the indium is
81.6W/(m·℃)；Between room temperature to fusing point, slowly, surface forms very thin oxidation film to the oxygen effect in indium and air, temperature
When spending higher, with active nonmetallic effect.Bulk metal indium is not reacted with boiling water and aqueous slkali, but powdered indium can be slow with water
Slow effect generates indium hydroxide.
The tin is a kind of metallic element of low melting point for having silvery white gloss, and fusing point is 231.89 degrees Celsius.It is described
The thermal conductivity of tin is 15.08W/ (m DEG C)；In air the Surface Creation stannic oxide protective film of tin and stablize, heat lower oxygen
Change reaction to accelerate.Tin is at normal temperature rich in malleability, and especially at 100 DEG C, its malleability is very good, can transform into very thin tin
Foil.
The bismuth is metal of the silvery white to pink, and the crisp easy crushing of matter, the chemical property of bismuth is more stable, and fusing point is
271.3 degree Celsius.Bismuth exists in the form of free metal and mineral in nature.At room temperature, bismuth is not reacted with oxygen or water,
It is stable in the air.
As a preferred embodiment, in the liquid metal alloy indium, tin, bismuth mass percent are as follows:
Indium 58~64%；
Tin 16~22%；
Bismuth 17~23%.
As a preferred embodiment, in the liquid metal alloy indium, tin, bismuth mass percent are as follows:
Indium 61%；
Tin 19%；
Bismuth 20%.
The preparation method of the liquid metal alloy, comprising the following steps: weigh liquid metal alloy according to component formula
Raw material simple substance, be added after mixing into crucible；It is warming up to 250-300 DEG C, 2-8 hours is kept the temperature, then cools to room temperature,
Obtained liquid metal alloy is placed in the containers for future use of inert atmosphere protection.
By choosing the metal of special ratios in the application, make liquid metal alloy fusing point obtained at 50-80 degrees Celsius.
Pretreatment
As a preferred embodiment, the pre-treatment step of the liquid metal alloy are as follows: by liquid metal alloy
It is compressed into tablet form material.
In the application, the equipment that liquid metal alloy is compressed into tablet form material is not particularly limited, preferably roll squeezer.
Periodic structure
In one embodiment, leading with periodic structure is made in the liquid metal alloy for being compressed into tablet form material
Backing.
As a preferred embodiment, the periodic structure includes the week of plane layer, the distribution of plane layer upper surface
The periodically protrusion of phase property protrusion and the distribution of plane layer lower surface.
As a preferred embodiment, the plane layer with a thickness of 30~60 microns.
As a preferred embodiment, the periodically protrusion, plane layer lower surface of the plane layer upper surface distribution
The height of the periodically protrusion of distribution is respectively 40~70 microns.
As a preferred embodiment, the periodically protrusion, plane layer lower surface of the plane layer upper surface distribution
The adjacent protrusion spacing of the periodically protrusion of distribution is respectively 30~120 microns.
The protrusion is selected from one of cylinder, square, cuboid, prism.
As a preferred embodiment, the bulge-structure is cuboid.
In the application, setting for the thermally conductive sheet with periodic structure is made in the liquid metal alloy for being compressed into tablet form material
It is standby to be not particularly limited, such as gas cutting, plasma arc cutting, laser cutting, carbon arc air gouging, the cutting of carbon arc air, roll-in etc.；It is preferred that
For roll squeezer.
The thermally conductive sheet for having periodical cuboid bulge-structure is as shown in Fig. 1, and the thermally conductive sheet includes plane layer
1, the periodically protrusion 2-2 of the periodically protrusion 2-1 of plane layer upper surface distribution and the distribution of plane layer lower surface.
As a preferred embodiment, the plane layer 1 with a thickness of 30~60 microns, such as to can be 31 micro-
Rice, 32 microns, 33 microns, 34 microns, 35 microns, 36 microns, 37 microns, 38 microns, 39 microns, 40 microns, 41 microns, it is 42 micro-
Rice, 43 microns, 44 microns, 45 microns, 46 microns, 47 microns, 48 microns, 49 microns, 50 microns, 51 microns, 52 microns, it is 53 micro-
Rice, 54 microns, 55 microns, 56 microns, 57 microns, 58 microns, 59 microns, 60 microns etc..
Preferably, the plane layer 1 with a thickness of 50 microns.
As a preferred embodiment, periodically the protrusion 2-1, plane layer following table of the plane layer upper surface distribution
The height of the periodically protrusion 2-2 of EDS maps is respectively 40~70 microns, such as can be 40 microns, 41 microns, 42 microns, 43
Micron, 44 microns, 45 microns, 46 microns, 47 microns, 48 microns, 49 microns, 50 microns, 51 microns, 52 microns, 53 microns, 54
Micron, 55 microns, 56 microns, 57 microns, 58 microns, 59 microns, 60 microns, 61 microns, 62 microns, 63 microns, 64 microns, 65
Micron, 66 microns, 67 microns, 68 microns, 69 microns, 70 microns etc..
Preferably, periodically protrusion 2-1, the periodicity of plane layer following table EDS maps of the plane layer upper surface distribution are convex
The height for playing 2-2 is respectively 60 microns.
It is highly preferred that the periodicity of periodically protrusion 2-1, the plane layer following table EDS maps of the plane layer upper surface distribution
The long side of raised 2-2 is respectively 180-220 microns, such as can be 181 microns, 182 microns, 183 microns, 184 microns, 185
Micron, 186 microns, 187 microns, 188 microns, 189 microns, 190 microns, 191 microns, 192 microns, 193 microns, 194 microns,
195 microns, 196 microns, 197 microns, 198 microns, 199 microns, 200 microns, 201 microns, 202 microns, 203 microns, it is 204 micro-
Rice, 205 microns, 206 microns, 207 microns, 208 microns, 209 microns, 210 microns, 211 microns, 212 microns, 213 microns,
214 microns, 215 microns, 216 microns, 217 microns, 218 microns, 219 microns, 220 microns etc.；The plane layer upper surface point
The periodically protrusion 2-1 of cloth, the short side of the periodically protrusion 2-2 of plane layer following table EDS maps are respectively 30-70 microns, such as can
To be 31 microns, 32 microns, 33 microns, 34 microns, 35 microns, 36 microns, 37 microns, 38 microns, 39 microns, 40 microns, 41
Micron, 42 microns, 43 microns, 44 microns, 45 microns, 46 microns, 47 microns, 48 microns, 49 microns, 50 microns, 51 microns, 52
Micron, 53 microns, 54 microns, 55 microns, 56 microns, 57 microns, 58 microns, 59 microns, 60 microns, 61 microns, 62 microns, 63
Micron, 64 microns, 65 microns, 66 microns, 67 microns, 68 microns, 69 microns, 70 microns etc.；
It is highly preferred that the periodicity of periodically protrusion 2-1, the plane layer following table EDS maps of the plane layer upper surface distribution
The long side of raised 2-2 is respectively 200 microns；The periodically protrusion 2-1 of the plane layer upper surface distribution, plane layer lower surface point
The short side of the periodically protrusion 2-2 of cloth is respectively 50 microns.
As a preferred embodiment, periodically the protrusion 2-1, plane layer following table of the plane layer upper surface distribution
The adjacent protrusion horizontal spacing of the periodically protrusion 2-2 of EDS maps is respectively 30~70 microns, for example, can be 31 microns, it is 32 micro-
Rice, 33 microns, 34 microns, 35 microns, 36 microns, 37 microns, 38 microns, 39 microns, 40 microns, 41 microns, 42 microns, it is 43 micro-
Rice, 44 microns, 45 microns, 46 microns, 47 microns, 48 microns, 49 microns, 50 microns, 51 microns, 52 microns, 53 microns, it is 54 micro-
Rice, 55 microns, 56 microns, 57 microns, 58 microns, 59 microns, 60 microns, 61 microns, 62 microns, 63 microns, 64 microns, it is 65 micro-
Rice, 66 microns, 67 microns, 68 microns, 69 microns, 70 microns etc.；Longitudinal pitch is respectively 80~120 microns, such as be can be
81 microns, 82 microns, 83 microns, 84 microns, 85 microns, 86 microns, 87 microns, 88 microns, 89 microns, 90 microns, 91 microns,
92 microns, 93 microns, 94 microns, 95 microns, 96 microns, 97 microns, 98 microns, 99 microns, 100 microns, 101 microns, it is 102 micro-
Rice, 103 microns, 104 microns, 105 microns, 106 microns, 107 microns, 108 microns, 109 microns, 110 microns, 111 microns,
112 microns, 113 microns, 114 microns, 115 microns, 116 microns, 117 microns, 118 microns, 119 microns, 120 microns etc..
Preferably, periodically protrusion 2-1, the periodicity of plane layer following table EDS maps of the plane layer upper surface distribution are convex
The adjacent protrusion horizontal spacing for playing 2-2 is respectively 50 microns, and longitudinal pitch is respectively 100 microns.
Wherein, described " horizontal spacing " refers to the distance between the adjacent protrusion that long side is parallel to each other.
" longitudinal pitch " refers to that long side is in the distance between conplane adjacent protrusion.
In the application, the periodicity of periodically protrusion 2-1, the plane layer following table EDS maps of the plane layer upper surface distribution
Raised 2-2 is symmetrical about plane layer 1.
The structure such as Fig. 2 of the liquid metal as boundary layer, two sides can be heater or radiator.
Applicants have discovered that liquid metal is in process of setting, the rapid nucleation and crystallization of liquid metal at contact point and to
Liquid-metal layer direction is shunk, and the separating distance of solid liquid interface is caused to increase, and the quantity and area of micro- contact point reduce, and
And liquid metal is easy to produce spilling so as to cause possible short circuit in use.The applicant has been surprisingly found that, pass through by
The sheet material with periodic structure is made in liquid metal alloy, and the periodicity that submillimeter level is contained on liquid metal sheet material surface rises
Volt, the specific dimensions and spacing of these relief fabrics mutually cooperate with, under pressure the liquid metal deformation energy of different location
Power is different, can tentatively be filled to contact surface rapidly, the step will guarantee that each of contact surface place is " compression "
's.Later, when temperature increased fusing point, liquid metal fusing, thus make all contact surface gaps will complete wetting filling,
Achieve the effect that low thermal resistance, high thermal conductivity, and effectively prevents the spilling of liquid metal.
A method of reducing liquid metal for conducting heat piece thermal resistance, comprising the following steps:
(1) liquid metal alloy pre-processes: liquid metal alloy is compressed into tablet form material；
(2) thermally conductive sheet with periodic structure is made in the flaky material that step (1) obtains.
The present invention is specifically described below by embodiment.It is necessarily pointed out that following embodiment is only used
In the invention will be further described, it should not be understood as limiting the scope of the invention, professional and technical personnel in the field
The some nonessential modifications and adaptations made according to the content of aforementioned present invention, still fall within protection scope of the present invention.
In addition, if without other explanations, it is raw materials used to be all commercially available.
Embodiment
Embodiment 1
A method of reducing liquid metal for conducting heat piece thermal resistance, comprising the following steps:
(1) liquid metal alloy pre-processes: liquid metal alloy is compressed into tablet form material using roll squeezer；
(2) roll squeezer is utilized, the thermally conductive sheet with periodic structure is made in the flaky material that step (1) obtains.
The liquid metal alloy is made of indium, tin, bismuth；
The mass percent of indium, tin, bismuth in the liquid metal alloy are as follows:
Indium 61%；
Tin 19%；
Bismuth 20%.
The preparation method of the liquid metal alloy, comprising the following steps: weigh liquid metal alloy according to component formula
Raw material simple substance, be added after mixing into crucible；280 DEG C are warming up to, 5 hours is kept the temperature, then cools to room temperature, will obtain
Liquid metal alloy be placed in the containers for future use of inert atmosphere protection.
The thermally conductive sheet of the periodic structure such as Fig. 1, Fig. 3, Fig. 4.
The thermally conductive sheet includes plane layer 1, the periodically protrusion 2-1 of plane layer upper surface distribution and plane layer lower surface point
The periodically protrusion 2-2 of cloth.
The protrusion is cuboid.
The plane layer 1 with a thickness of 50 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Height is respectively 60 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Long side is respectively 200 microns, and short side is respectively 50 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Adjacent protrusion horizontal spacing is respectively 50 microns, and longitudinal pitch is respectively 100 microns.
Embodiment 2
A method of reducing liquid metal for conducting heat piece thermal resistance, comprising the following steps:
(1) liquid metal alloy pre-processes: liquid metal alloy is compressed into tablet form material using roll squeezer；
(2) roll squeezer is utilized, the thermally conductive sheet with periodic structure is made in the flaky material that step (1) obtains.
The liquid metal alloy is made of indium, tin, bismuth；
The mass percent of indium, tin, bismuth in the liquid metal alloy are as follows:
Indium 58%；
Tin 22%；
Bismuth 20%.
The preparation method of the liquid metal alloy, comprising the following steps: weigh liquid metal alloy according to component formula
Raw material simple substance, be added after mixing into crucible；280 DEG C are warming up to, 5 hours is kept the temperature, then cools to room temperature, will obtain
Liquid metal alloy be placed in the containers for future use of inert atmosphere protection.
The periodic structure is the same as embodiment 1.
Embodiment 3
A method of reducing liquid metal for conducting heat piece thermal resistance, comprising the following steps:
(1) liquid metal alloy pre-processes: liquid metal alloy is compressed into tablet form material using roll squeezer；
(2) roll squeezer is utilized, the thermally conductive sheet with periodic structure is made in the flaky material that step (1) obtains.
The liquid metal alloy is made of indium, tin, bismuth；
The mass percent of indium, tin, bismuth in the liquid metal alloy are as follows:
Indium 64%；
Tin 19%；
Bismuth 17%.
The preparation method of the liquid metal alloy, comprising the following steps: weigh liquid metal alloy according to component formula
Raw material simple substance, be added after mixing into crucible；280 DEG C are warming up to, 5 hours is kept the temperature, then cools to room temperature, will obtain
Liquid metal alloy be placed in the containers for future use of inert atmosphere protection.
The periodic structure is the same as embodiment 1.
Embodiment 4
A method of reducing liquid metal for conducting heat piece thermal resistance, comprising the following steps:
(1) liquid metal alloy pre-processes: liquid metal alloy is compressed into tablet form material using roll squeezer；
(2) roll squeezer is utilized, the thermally conductive sheet with periodic structure is made in the flaky material that step (1) obtains.
The composition of the liquid metal alloy and the preparation method is the same as that of Example 1.
The thermally conductive sheet of the periodic structure includes the periodically protrusion 2-1 peace of plane layer 1, the distribution of plane layer upper surface
The periodically protrusion 2-2 of surface layer following table EDS maps.
The protrusion is cuboid.
The plane layer 1 with a thickness of 30 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Height is respectively 60 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Long side is respectively 220 microns, and short side is respectively 70 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Adjacent protrusion horizontal spacing is respectively 30 microns, and longitudinal pitch is respectively 80 microns.
Embodiment 5
A method of reducing liquid metal for conducting heat piece thermal resistance, comprising the following steps:
(1) liquid metal alloy pre-processes: liquid metal alloy is compressed into tablet form material using roll squeezer；
(2) roll squeezer is utilized, the thermally conductive sheet with periodic structure is made in the flaky material that step (1) obtains.
The composition of the liquid metal alloy and the preparation method is the same as that of Example 1.
The thermally conductive sheet of the periodic structure includes the periodically protrusion 2-1 peace of plane layer 1, the distribution of plane layer upper surface
The periodically protrusion 2-2 of surface layer following table EDS maps.
The protrusion is cuboid.
The plane layer 1 with a thickness of 60 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Height is respectively 60 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Long side is respectively 180 microns, and short side is respectively 30 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Adjacent protrusion horizontal spacing is respectively 70 microns, and longitudinal pitch is respectively 120 microns.
Embodiment 6
A method of reducing liquid metal for conducting heat piece thermal resistance, comprising the following steps:
(1) liquid metal alloy pre-processes: liquid metal alloy is compressed into tablet form material using roll squeezer；
(2) roll squeezer is utilized, the thermally conductive sheet with periodic structure is made in the flaky material that step (1) obtains.
The composition of the liquid metal alloy and the preparation method is the same as that of Example 1.
The thermally conductive sheet of the periodic structure includes the periodically protrusion 2-1 of plane layer 1, the distribution of plane layer upper surface.
The protrusion is cuboid.
The plane layer 1 with a thickness of 30 microns；
The height of the periodically protrusion 2-1 of the plane layer upper surface distribution is respectively 60 microns；
The periodically protrusion 2-1 long side of the plane layer upper surface distribution is 200 microns, and short side is 50 microns；
The periodically adjacent protrusion horizontal spacing of protrusion 2-1 of the plane layer upper surface distribution is 50 microns, between longitudinal direction
Away from being 100 microns.
Embodiment 7
A method of reducing liquid metal for conducting heat piece thermal resistance, comprising the following steps:
(1) liquid metal alloy pre-processes: liquid metal alloy is compressed into tablet form material using roll squeezer；
(2) roll squeezer is utilized, the thermally conductive sheet with periodic structure is made in the flaky material that step (1) obtains.
The composition of the liquid metal alloy and the preparation method is the same as that of Example 1.
The thermally conductive sheet of the periodic structure includes the periodically protrusion 2-1 peace of plane layer 1, the distribution of plane layer upper surface
The periodically protrusion 2-2 of surface layer following table EDS maps.
The protrusion is cuboid.
The plane layer 1 with a thickness of 50 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Height is respectively 60 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Long side is respectively 200 microns, and short side is respectively 50 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Adjacent protrusion horizontal spacing is respectively 10 microns, and longitudinal pitch is respectively 60 microns.
Embodiment 8
A method of reducing liquid metal for conducting heat piece thermal resistance, comprising the following steps:
(1) liquid metal alloy pre-processes: liquid metal alloy is compressed into tablet form material using roll squeezer；
(2) roll squeezer is utilized, the thermally conductive sheet with periodic structure is made in the flaky material that step (1) obtains.
The composition of the liquid metal alloy and the preparation method is the same as that of Example 1.
The thermally conductive sheet of the periodic structure includes the periodically protrusion 2-1 peace of plane layer 1, the distribution of plane layer upper surface
The periodically protrusion 2-2 of surface layer following table EDS maps.
The protrusion is cuboid.
The plane layer 1 with a thickness of 50 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Height is respectively 60 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Long side is respectively 200 microns, and short side is respectively 50 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Adjacent protrusion horizontal spacing is respectively 100 microns, and longitudinal pitch is respectively 150 microns.
Embodiment 9
A method of reducing liquid metal for conducting heat piece thermal resistance, comprising the following steps:
(1) liquid metal alloy pre-processes: liquid metal alloy is compressed into tablet form material using roll squeezer；
(2) roll squeezer is utilized, the thermally conductive sheet with periodic structure is made in the flaky material that step (1) obtains.
The composition of the liquid metal alloy and the preparation method is the same as that of Example 1.
The thermally conductive sheet of the periodic structure includes the periodically protrusion 2-1 peace of plane layer 1, the distribution of plane layer upper surface
The periodically protrusion 2-2 of surface layer following table EDS maps.
The protrusion is cuboid.
The plane layer 1 with a thickness of 50 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Height is respectively 60 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Long side is respectively 200 microns, and short side is respectively 10 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Adjacent protrusion horizontal spacing is respectively 50 microns, and longitudinal pitch is respectively 100 microns.
Embodiment 10
A method of reducing liquid metal for conducting heat piece thermal resistance, comprising the following steps:
(1) liquid metal alloy pre-processes: liquid metal alloy is compressed into tablet form material using roll squeezer；
(2) roll squeezer is utilized, the thermally conductive sheet with periodic structure is made in the flaky material that step (1) obtains.
The composition of the liquid metal alloy and the preparation method is the same as that of Example 1.
The thermally conductive sheet of the periodic structure includes the periodically protrusion 2-1 peace of plane layer 1, the distribution of plane layer upper surface
The periodically protrusion 2-2 of surface layer following table EDS maps.
The protrusion is cuboid.
The plane layer 1 with a thickness of 50 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Height is respectively 60 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Long side is respectively 200 microns, and short side is respectively 100 microns；
The periodically protrusion 2-2's of periodically protrusion 2-1, plane layer following table EDS maps that the plane layer upper surface is distributed
Adjacent protrusion horizontal spacing is respectively 50 microns, and longitudinal pitch is respectively 100 microns.
Performance test
Thermo-resistance measurement: thermo-resistance measurement is carried out to liquid metal for conducting heat piece using Hunan instrument DRL heat conductive silica gel/thermal resistance instrument, is calculated
Thermal resistance change rate, measurement pressure are 100Psi, thermal resistance unit cm2K/W the results are shown in Table 1.
Thermal resistance change rate=(R0-R1) × 100%/R0；
R0Refer to the untreated thermal resistance measured of the liquid metal alloy in each embodiment；
R1Refer to the thermal resistance for measuring the liquid metal alloy in each embodiment after step (1) and step (2)；
Fig. 5 is the untreated thermal resistance curve 5-1 measured of liquid metal alloy and liquid metal alloy warp in embodiment 1
Cross the thermal resistance curve 5-2 measured after step (1) and step (2).
1. thermal resistance change rate of table
| Embodiment | Thermal resistance change rate (%) |
| Embodiment 1 | 60 |
| Embodiment 2 | 45 |
| Embodiment 3 | 48 |
| Embodiment 4 | 54 |
| Embodiment 5 | 50 |
| Embodiment 6 | 14 |
| Embodiment 7 | 20 |
| Embodiment 8 | 23 |
| Embodiment 9 | 29 |
| Embodiment 10 | 30 |
The above is only presently preferred embodiments of the present invention, is not the limitation for making other forms to invention, any
Those skilled in the art are changed or are changed to the equivalent of equivalent variations possibly also with the technology contents of the disclosure above
Embodiment, but without departing from the technical solutions of the present invention, above embodiments are made according to the technical essence of the invention
Any simple modification, equivalent variations and remodeling, still fall within the protection scope of technical solution of the present invention.
Claims (10)
1. a kind of method for reducing liquid metal for conducting heat piece thermal resistance, which is characterized in that including by pretreated liquid metal alloy
The step of being pressed into the thermally conductive sheet with periodic structure.
2. the method as described in claim 1, which is characterized in that the liquid metal alloy includes indium, tin, at least two in bismuth
Kind.
3. method according to claim 2, which is characterized in that the mass percent of indium, tin, bismuth in the liquid metal alloy
Are as follows:
Indium 58~64%；
Tin 16~22%；
Bismuth 17~23%.
4. method as claimed in claim 2 or claim 3, which is characterized in that the quality hundred of indium, tin, bismuth in the liquid metal alloy
Divide ratio are as follows:
Indium 61%；
Tin 19%；
Bismuth 20%.
5. the method as described in claim 1, which is characterized in that the pre-treatment step of the liquid metal alloy are as follows: by liquid
Metal alloy is compressed into tablet form material.
6. the method as described in claim 1, which is characterized in that the periodic structure includes plane layer, plane layer upper surface
The periodically protrusion of distribution and the periodically protrusion of plane layer lower surface distribution.
7. method as claimed in claim 6, which is characterized in that the plane layer with a thickness of 30~60 microns.
8. the method for claim 7, which is characterized in that the periodically protrusion, plane of the plane layer upper surface distribution
The height of the periodically protrusion of layer following table EDS maps is respectively 40~70 microns.
9. the method for claim 7, which is characterized in that the periodically protrusion, plane of the plane layer upper surface distribution
The adjacent protrusion spacing of the periodically protrusion of layer following table EDS maps is respectively 30~120 microns.
10. such as the described in any item methods of claim 6~9, which is characterized in that the protrusion is selected from cylinder, square, rectangular
One of body, prism.
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