CN203912434U - Self-radiating PCB integrated board - Google Patents
Self-radiating PCB integrated board Download PDFInfo
- Publication number
- CN203912434U CN203912434U CN201420274894.9U CN201420274894U CN203912434U CN 203912434 U CN203912434 U CN 203912434U CN 201420274894 U CN201420274894 U CN 201420274894U CN 203912434 U CN203912434 U CN 203912434U
- Authority
- CN
- China
- Prior art keywords
- heat
- circuit board
- pcb
- pcb substrate
- copper foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a self-radiating PCB integrated board including a PCB substrate, an electric element connected to the PCB substrate and copper foil pieces used for connecting with the electric device element. A radiating layer that is not in contact with the copper foil pieces is arranged on the PCB substrate. Pins of the electric element are connected to the radiating layer via leads. According to the utility model, when using, heat generated by the working electric element can be distributed to the radiating layer 4 immediately through the leads 6 and then dissipated out, so that the circuit board can be protected against damage and use safety is enhanced and service lifetime is prolonged.
Description
Technical field
The utility model relates to a kind of from dispelling the heat PCB circuit board.
Background technology
Traditional PCB circuit board mainly consists of PCB substrate, electric elements and copper-foil conducting electricity, and PCB substrate is the insulated substrate consisting of glass fibre framework filling epoxy resin, when its actual use, because the heat of each electric elements is loose uneven, cause PCB circuit board easily to occur the circuit board inequality of being heated, thereby cause the problems such as the damage of PCB circuit board or short circuit.
Summary of the invention
The utility model, for addressing the above problem, provides a kind of PCB of the heat radiation certainly circuit board that can preferably the spread heat of heating element be gone out.
Of the present utility model a kind of from dispelling the heat PCB circuit board, comprise PCB substrate, be connected to electric elements on PCB substrate and for being electrically connected to the Copper Foil of electric elements, on described PCB substrate, be provided with the heat dissipating layer not contacting with Copper Foil, the pin of described electric elements is connected on described heat dissipating layer by lead-in wire.
Described heat dissipating layer is copper foil layer or aluminium foil layer or graphite linings.
Described lead-in wire is that heat-conducting insulation material is made.
Of the present utility model from dispelling the heat PCB circuit board when applying, the instant dispersion of heat producing when can preferably heating element be worked is gone out, thereby better protective circuit plate is not damaged, and uses safety and has extended its useful life.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model.
Embodiment
As shown in Figure 1, of the present utility model a kind of from dispelling the heat PCB circuit board, comprise PCB substrate 1, be connected to electric elements 3 on PCB substrate 1 and for being electrically connected to the Copper Foil 2 of electric elements 3, on PCB substrate 1, be provided with the heat dissipating layer 4 not contacting with Copper Foil 2, the pin 5 of electric elements 36 is connected on described heat dissipating layer 4 by going between; Heat dissipating layer 4 is copper foil layer or aluminium foil layer or graphite linings; Lead-in wire 6 is heat-conducting insulation material making.Of the present utility model from dispelling the heat PCB circuit board when applying; the heat producing when heating element can be worked is by the 6 instant heat dissipating layers 4 that are distributed to that go between; then dissipate away, thereby better protective circuit plate is not damaged, uses safety and extended its useful life.
Claims (3)
1. one kind from the PCB circuit board that dispels the heat, comprise PCB substrate (1), be connected to electric elements (3) on PCB substrate (1) and for being electrically connected to the Copper Foil (2) of electric elements (3), it is characterized in that, on described PCB substrate (1), be provided with the heat dissipating layer (4) not contacting with Copper Foil (2), the pin (5) of described electric elements (3) is connected on described heat dissipating layer (4) by lead-in wire (6).
2. a kind of PCB circuit board that certainly dispels the heat as claimed in claim 1, is characterized in that, described heat dissipating layer (4) is copper foil layer or aluminium foil layer or graphite linings.
3. a kind of PCB circuit board that certainly dispels the heat as claimed in claim 1, is characterized in that, described lead-in wire (6) is heat-conducting insulation material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420274894.9U CN203912434U (en) | 2014-05-28 | 2014-05-28 | Self-radiating PCB integrated board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420274894.9U CN203912434U (en) | 2014-05-28 | 2014-05-28 | Self-radiating PCB integrated board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203912434U true CN203912434U (en) | 2014-10-29 |
Family
ID=51786673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420274894.9U Expired - Fee Related CN203912434U (en) | 2014-05-28 | 2014-05-28 | Self-radiating PCB integrated board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203912434U (en) |
-
2014
- 2014-05-28 CN CN201420274894.9U patent/CN203912434U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013541857A5 (en) | LED-based light source using anisotropic conductor | |
| JP2018501633A (en) | Electromagnetic wave absorption extinguishing and shielding sheet and electronic device high heat dissipation fusion sheet, and manufacturing method thereof | |
| CN104221142B (en) | Thermally conductive body and electronic device using same | |
| US20160007440A1 (en) | Heat channeling and dispersing structure and manufacturing method thereof | |
| CN202535631U (en) | Aluminum oxide ceramic circuit board having metal posts and packaging structure of aluminum oxide ceramic circuit board | |
| CN103879087A (en) | Heat-conducting copper foil | |
| CN106783753A (en) | Semiconductor devices | |
| CN203912434U (en) | Self-radiating PCB integrated board | |
| CN104708869A (en) | Aluminum-based copper-clad plate with high thermal conductivity and manufacturing method thereof | |
| CN203167425U (en) | Metal printed circuit board | |
| CN104994682A (en) | PCB having good heat-dissipation performance and mobile terminal applied therewith | |
| CN203968557U (en) | High conductive graphite film | |
| CN203631589U (en) | Inverted LED packaging structure and LED lamp strip | |
| CN102802347B (en) | Directed conductivity printed circuit board (PCB) and electronic equipment | |
| CN203352939U (en) | Multi-surface circuit board | |
| CN203040008U (en) | Printed circuit board with copper base embedded with circuit | |
| CN203942394U (en) | A kind of electric machine radiator | |
| JP2014049642A5 (en) | ||
| CN203563291U (en) | Elastic graphite LED circuit board heat conduction gasket type heat conduction structure | |
| KR102068493B1 (en) | Thermal diffusion sheet and the manufacturing method thereof | |
| KR102068492B1 (en) | Thermal diffusion sheet and the manufacturing method thereof | |
| CN102339943A (en) | Heat-radiating structure for polycrystalline metal base-type light-emitting diode (LED) and method for manufacturing same | |
| CN202034362U (en) | Composite substrate for high-power element | |
| CN203895533U (en) | Protective resistor and explosion-proof battery | |
| CN203884067U (en) | Multilayer printed circuit board (PCB) with novel insulation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141029 Termination date: 20150528 |
|
| EXPY | Termination of patent right or utility model |