CN203895433U - Sealing ring structure - Google Patents
Sealing ring structure Download PDFInfo
- Publication number
- CN203895433U CN203895433U CN201420329361.6U CN201420329361U CN203895433U CN 203895433 U CN203895433 U CN 203895433U CN 201420329361 U CN201420329361 U CN 201420329361U CN 203895433 U CN203895433 U CN 203895433U
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- Prior art keywords
- seal ring
- buffer part
- ring structure
- metal wire
- conductive pole
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Abstract
The utility model provides a sealing ring structure which comprises at least two metal lines, the adjacent metal lines are connected via conductive poles, and the metal lines or conductive poles are connected with buffering portions. According to the utility model, the buffering portions connected to the metal lines or conductive poles are used to buffer shear stress generated when chips are cut, and the chips are avoided from scrap due to layering. The buffering portions connected to the conductive poles are S-shaped, so that metal grids in a sealing ring area have certain elasticity, and the resistance of the sealing ring is enhanced due to flexibility of metal and the elastic structure. The buffering portions connected to the metal lines include fishbone-shaped metal strips, and each metal strip can be used as a buffering wall which resists outside force of the sealing ring, and the performance of the sealing ring can be greatly improved.
Description
Technical field
The utility model belongs to field of semiconductor manufacture, relates to a kind of seal ring structure.
Background technology
In semiconductor chip fabrication, chip periphery need to be passed through sealing ring bonding (seal ring bonding), makes chip internal keep sealing state.Traditional sealing ring generally adopts that multiple layer metal is stacked to be added, and is generally double seal ring (inside and outside totally two circles) or single sealing ring (an only circle), and the width of metal is about 10～20 microns.Sealing ring is continuous metal wire, is trapped among the outer ring of chip.The circuit region of sealing ring inner side can avoid being subject to the impact of external environment condition, prevents chip rupture, guarantees that the performance of semiconductor chip is stable for a long time.In addition; sealing ring can also further protect the integrated circuit of its inner side to avoid being subject to that moisture causes is deteriorated; because the dielectric layer of chip internal is generally formed by porous low dielectric constant material; moisture can permeate dielectric layer with low dielectric constant easily and arrive integrated circuit; sealing ring is formed by metal; it has blocked moisture penetration route, and can discharge in fact any moisture infiltration.
At present, in the product encapsulation process of advanced technologies (as 65nm/40nm), often suffer the problem of chip edge layering, main cause is because the adhesion between the powerful not or each thin layer of sealing ring of chip itself is not strong.At cutting crystal grain, when (Die Saw), the irresistible manager of chip edge cuts the caused shear stress of processing procedure (laser high temperature and blade machine cuts), finally causes that chip is from edge's layering of breaking.
Failure analysis shows, between traditional sealing ring conductive pole and metal wire, contact area is less, and because two steps are made, fusion ability a little less than, once so outside destroy BD (black diamond, Black Diamond, main component is prestox cyclisation tetrasiloxane (OMCTS) and oxide, the dielectric constant of BD reduces along with increasing of OMCTS composition) layer and NDC (nitrogen-doped silicon carbide, Nitrogen doped Silicon Carbite) layer adhesive power the two is torn, the contact-making surface of conductive pole and metal level is difficult to the shearing external force that opposing comes from this interface, sealing ring is destroyed, crack finally enters chip internal, chip itself is caused to fatal harm.
Therefore, provide a kind of new seal ring structure to be necessary to address the above problem.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of seal ring structure, easily in the time that crystal grain cuts, produces lamination because of shearing force for solving prior art seal ring structure, causes the problem of defect.
For achieving the above object and other relevant objects, the utility model provides a kind of seal ring structure, comprises at least double layer of metal line, between adjacent two layers metal wire, connects by conductive pole, and described metal wire or conductive pole are connected with buffer part.
Alternatively, described buffer part is connected in described conductive pole, and described buffer part is S type.
Alternatively, described conductive pole is point-like, and each conductive pole is connected with a buffer part.
Alternatively, described conductive pole is wire, and each conductive pole is connected with at least one buffer part.
Alternatively, described buffer part at least bends extension once.
Alternatively, described seal ring structure is single sealing ring, comprises a circle metal wire; Described buffer part is connected in described metal wire outside or both sides, and described buffer part is some fishbone shape bonding jumpers.
Alternatively, described seal ring structure is double seal ring, comprises two circle metal wires; Described buffer part is connected in every metal line outside or both sides, and described buffer part is some fishbone shape bonding jumpers.
Alternatively, in two circle metal wires, inner ring metal wire is connected by described fishbone shape bonding jumper with outer ring metal wire.
Alternatively, described fishbone shape bonding jumper is acute angle with described metal wire or obtuse angle is connected.
Alternatively, parallel to each other between the fishbone shape bonding jumper of described metal wire the same side.
Alternatively, between adjacent two layers fishbone shape bonding jumper, connect by conductive pole.
As mentioned above, seal ring structure of the present utility model, there is following beneficial effect: the buffer part that seal ring structure utilization of the present utility model is connected in metal wire or conductive pole is alleviated the shear stress producing while coming from crystal grain cutting, can avoid the chip rejection causing due to layering reason.Wherein, the buffer part that is connected in conductive pole is S type, makes the wire netting in sealing ring region have certain elastic reaction, adds the structural design with spring function by the pliability feature of metal, thereby plays the resistivity that strengthens sealing ring; The buffer part that is connected in metal wire is fishbone shape bonding jumper, and every " fishbone " in this design all can serve as the cushion wall of sealing ring opposing external force, can greatly improve the performance of sealing ring.In the manufacture process of seal ring structure of the present utility model, only need to change metal line pattern or the via layer figure in sealing ring region, it is light shield design, other processing procedure is constant, thus the resistivity of the shearing external force producing when going to strengthen sealing ring crystal grain is cut with minimum cost as far as possible.
Brief description of the drawings
Fig. 1 is shown as the generalized section of seal ring structure of the present utility model.
Fig. 2 is shown as conductive pole and is connected in the plan structure schematic diagram of the buffer part of conductive pole.
Fig. 3 is shown as buffer part and at least bends extension schematic diagram once.
Fig. 4 is shown as the generalized section of double seal ring structure.
Fig. 5 is shown as the schematic top plan view of double seal ring structure.
Fig. 6 be shown as conductive pole while being wire each conductive pole be connected with the schematic diagram of at least one buffer part.
Fig. 7 be shown as conductive pole while being point-like each conductive pole be connected with the schematic diagram of a buffer part.
Fig. 8 is shown as metal wire and is connected in the schematic diagram of the buffer part in metal wire outside.
Fig. 9 is shown as metal wire and is connected in the schematic diagram of the buffer part of metal wire both sides.
Figure 10 is shown as the schematic diagram connecting by conductive pole between adjacent two layers fishbone shape bonding jumper.
Figure 11 is shown as buffer part and is connected in respectively the schematic diagram in inner ring metal wire and outer ring metal wire outside.
Figure 12 is shown as buffer part and is connected in respectively the schematic diagram of inner ring metal wire and metal wire both sides, outer ring.
Figure 13 is shown as the schematic diagram that inner ring metal wire is connected by fishbone shape bonding jumper with outer ring metal wire.
Element numbers explanation
1 metal wire
11 inner ring metal wires
12 outer ring metal wires
2 conductive poles
3 buffer part
Embodiment
By particular specific embodiment, execution mode of the present utility model is described below, person skilled in the art scholar can understand other advantages of the present utility model and effect easily by the disclosed content of this specification.
Refer to Fig. 1 to Figure 13.Notice, appended graphic the illustrated structure of this specification, ratio, size etc., all contents in order to coordinate specification to disclose only, understand and read for person skilled in the art scholar, not in order to limit the enforceable qualifications of the utility model, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the utility model can produce and the object that can reach, all should still drop on the technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, in this specification, quote as " on ", the term of D score, " left side ", " right side ", " centre " and " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, changing under technology contents, when being also considered as the enforceable category of the utility model without essence.
Embodiment mono-
Refer to Fig. 1, the utility model provides a kind of seal ring structure, comprises at least double layer of metal line 1, between adjacent two layers metal wire 1, connects by conductive pole 2, and described conductive pole 2 is connected with buffer part 3.
Refer to Fig. 2, be shown as described conductive pole 2 and be connected in the plan structure schematic diagram of the buffer part 3 of conductive pole 2.Described buffer part is S type, can be by make described buffer part 3 one-body molded with described conductive pole 2 in the graphic designs that changes via layer.Described buffer part is S type, can play the effect that is similar to spring, absorbs external stress, prevents that described conductive pole 2 from separating with lower metal.
Concrete, described buffer part 3 can at least bend extension once, further improves its buffer capacity, refers to Fig. 3, is shown as buffer part and at least bends extension schematic diagram once, and certainly, it can also further repeatedly bend extension.
What Fig. 1 showed is the cutaway view of single seal ring structure, and seal ring structure of the present utility model can be also double seal ring, refers to Fig. 4 and Fig. 5, is shown as respectively generalized section and the schematic top plan view of double seal ring structure.Described double seal ring comprises two circle metal wires: inner ring metal wire 11 and outer ring metal wire 12.
Concrete, described conductive pole 2 can be wire or point-like, for wire conductive pole, its length is longer, and negligible amounts, each conductive pole 2 can be connected with at least one buffer part 3, as shown in Figure 6.For point-like conductive pole, its transverse width is close with longitudinal width or equate, size is less, and quantity is more, and each conductive pole 2 can only connect a buffer part 3, as shown in Figure 7.
The buffer part that seal ring structure utilization of the present utility model is connected in conductive pole is alleviated the shear stress producing while coming from crystal grain cutting, can avoid the chip rejection causing due to layering reason, wherein said buffer part is S type, make the wire netting in sealing ring region there is certain elastic reaction, pliability feature by metal is added the structural design with spring function, thereby plays the resistivity that strengthens sealing ring.In the manufacture process of seal ring structure of the present utility model, only need to change the via layer figure in sealing ring region, it is light shield design, other processing procedure is constant, thus the resistivity of the shearing external force producing when going to strengthen sealing ring crystal grain is cut with minimum cost as far as possible.
Embodiment bis-
The present embodiment and embodiment mono-adopt essentially identical technical scheme, and difference points out to be that in embodiment mono-, buffer part is arranged on conductive pole, and in the present embodiment, buffer part is arranged on metal wire.
Refer to Fig. 8, be shown as metal wire 1 and be connected in the schematic diagram of the buffer part 3 in metal wire 1 outside.Seal ring structure of the present utility model can be single sealing ring or double seal ring, and Fig. 8 is shown as the situation of single sealing ring, comprises a circle metal wire 1.It is pointed out that described metal wire 1 outside refers to the side near Cutting Road region, while cutting due to crystal grain, stress is passed to sealing ring region from Cutting Road region, and described buffer part 3 is arranged at described metal wire outside and dispersibles external force.
Concrete, described buffer part 3 is some fishbone shape bonding jumpers, described fishbone shape bonding jumper is acute angle with described metal wire 1 or obtuse angle is connected.Described fishbone shape bonding jumper is connected with described metal wire on-right angle the dispersion that is more conducive to external force, avoids directly impacting described metal wire.
Certainly, described buffer part 3 also can be connected in metal wire 1 both sides, as shown in Figure 9.Described metal wire 1 both sides are equipped with fishbone shape bonding jumper can reach " double insurance " effect, prevents that to greatest extent external force from causing conductive pole to separate with metal wire.
Concrete, between the fishbone shape bonding jumper of described metal wire 1 the same side, be preferably parallel to each other.
Owing to conventionally can form conductive pole in semiconductor technology below metal level in the time making metal level; therefore; in the utility model; between adjacent two layers fishbone shape bonding jumper, can interconnect by conductive pole 2; as shown in figure 10 (in order to show the distribution situation of conductive pole; layer of metal line and one deck fishbone shape bonding jumper in Figure 10, are only drawn, i.e. buffer part 3).Between adjacent two layers fishbone shape bonding jumper, interconnect the ability of the opposing external force that can further strengthen sealing ring by conductive pole 2, and the conductive pole between adjacent two layers fishbone shape bonding jumper can and adjacent two layers metal wire between conductive pole form simultaneously, can not increase process complexity.Described conductive pole can further adopt the design in embodiment mono-, or adopts conventional conductive pillar structure.
The situation that what Fig. 8, Fig. 9 and Figure 10 all showed is when described seal ring structure is single sealing ring, while being double seal ring for described seal ring structure, it comprises two circle metal wires: inner ring metal wire 11 and outer ring metal wire 12; Described buffer part 3 is connected in every metal line outside (as shown in figure 11) or both sides (as shown in figure 12), and described buffer part is some fishbone shape bonding jumpers.
Further, refer to Figure 13, in two circle metal wires, inner ring metal wire can be connected by described fishbone shape bonding jumper with outer ring metal wire.In the time that external force breaks through the defence line of outer ring metal wire 12, the fishbone shape bonding jumper between inner ring metal wire and outer ring metal wire can play second defense reaction, improves seal ring structure to shearing the resistivity of external force.
Seal ring structure utilization of the present utility model is connected in metal wire buffer part and alleviates the shear stress producing while coming from crystal grain cutting, can avoid the chip rejection causing due to layering reason.The buffer part that is connected in metal wire is fishbone shape bonding jumper, and every " fishbone " in this design all can serve as the cushion wall of sealing ring opposing external force, can greatly improve the performance of sealing ring.In the manufacture process of seal ring structure of the present utility model, only need to change the metal line pattern in sealing ring region, it is light shield design, other processing procedure is constant, thus the resistivity of the shearing external force producing when going to strengthen sealing ring crystal grain is cut with minimum cost as far as possible.
In sum, the buffer part that seal ring structure utilization of the present utility model is connected in metal wire or conductive pole is alleviated the shear stress producing while coming from crystal grain cutting, can avoid the chip rejection causing due to layering reason.Wherein, the buffer part that is connected in conductive pole is S type, makes the wire netting in sealing ring region have certain elastic reaction, adds the structural design with spring function by the pliability feature of metal, thereby plays the resistivity that strengthens sealing ring; The buffer part that is connected in metal wire is fishbone shape bonding jumper, and every " fishbone " in this design all can serve as the cushion wall of sealing ring opposing external force, can greatly improve the performance of sealing ring.In the manufacture process of seal ring structure of the present utility model, only need to change metal line pattern or the via layer figure in sealing ring region, it is light shield design, other processing procedure is constant, thus the resistivity of the shearing external force producing when going to strengthen sealing ring crystal grain is cut with minimum cost as far as possible.So the utility model has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, modify or change above-described embodiment.Therefore, have in technical field under such as and conventionally know that the knowledgeable modifies or changes not departing from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.
Claims (11)
1. a seal ring structure, comprises at least double layer of metal line, between adjacent two layers metal wire, connects by conductive pole, it is characterized in that: described metal wire or conductive pole are connected with buffer part.
2. seal ring structure according to claim 1, is characterized in that: described buffer part is connected in described conductive pole, and described buffer part is S type.
3. seal ring structure according to claim 2, is characterized in that: described conductive pole is point-like, and each conductive pole is connected with a buffer part.
4. seal ring structure according to claim 2, is characterized in that: described conductive pole is wire, and each conductive pole is connected with at least one buffer part.
5. seal ring structure according to claim 2, is characterized in that: described buffer part at least bends extension once.
6. seal ring structure according to claim 1, is characterized in that: described seal ring structure is single sealing ring, comprises a circle metal wire; Described buffer part is connected in described metal wire outside or both sides, and described buffer part is some fishbone shape bonding jumpers.
7. seal ring structure according to claim 1, is characterized in that: described seal ring structure is double seal ring, comprises two circle metal wires; Described buffer part is connected in every metal line outside or both sides, and described buffer part is some fishbone shape bonding jumpers.
8. seal ring structure according to claim 7, is characterized in that: in two circle metal wires, inner ring metal wire is connected by described fishbone shape bonding jumper with outer ring metal wire.
9. according to the seal ring structure described in claim 6 or 7, it is characterized in that: described fishbone shape bonding jumper is acute angle with described metal wire or obtuse angle is connected.
10. according to the seal ring structure described in claim 6 or 7, it is characterized in that: parallel to each other between the fishbone shape bonding jumper of described metal wire the same side.
11. according to the seal ring structure described in claim 6 or 7, it is characterized in that: between adjacent two layers fishbone shape bonding jumper, connect by conductive pole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420329361.6U CN203895433U (en) | 2014-06-19 | 2014-06-19 | Sealing ring structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420329361.6U CN203895433U (en) | 2014-06-19 | 2014-06-19 | Sealing ring structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203895433U true CN203895433U (en) | 2014-10-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420329361.6U Expired - Fee Related CN203895433U (en) | 2014-06-19 | 2014-06-19 | Sealing ring structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN203895433U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106601712A (en) * | 2015-10-20 | 2017-04-26 | 力成科技股份有限公司 | Carrier substrate |
| CN107026243A (en) * | 2016-01-29 | 2017-08-08 | 上海和辉光电有限公司 | A kind of display panel and display device |
| CN108630613A (en) * | 2017-03-20 | 2018-10-09 | 中芯国际集成电路制造(上海)有限公司 | Seal ring structure and preparation method thereof, chip structure |
| CN109935552A (en) * | 2019-03-29 | 2019-06-25 | 长江存储科技有限责任公司 | 3D memory device and its manufacturing method |
| CN113629015A (en) * | 2020-05-08 | 2021-11-09 | 联华电子股份有限公司 | Packaging ring structure |
-
2014
- 2014-06-19 CN CN201420329361.6U patent/CN203895433U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106601712A (en) * | 2015-10-20 | 2017-04-26 | 力成科技股份有限公司 | Carrier substrate |
| CN106601712B (en) * | 2015-10-20 | 2019-03-05 | 力成科技股份有限公司 | Carrier substrates |
| CN107026243A (en) * | 2016-01-29 | 2017-08-08 | 上海和辉光电有限公司 | A kind of display panel and display device |
| CN107026243B (en) * | 2016-01-29 | 2019-06-11 | 上海和辉光电有限公司 | A kind of display panel and display device |
| CN108630613A (en) * | 2017-03-20 | 2018-10-09 | 中芯国际集成电路制造(上海)有限公司 | Seal ring structure and preparation method thereof, chip structure |
| CN109935552A (en) * | 2019-03-29 | 2019-06-25 | 长江存储科技有限责任公司 | 3D memory device and its manufacturing method |
| CN109935552B (en) * | 2019-03-29 | 2021-02-12 | 长江存储科技有限责任公司 | 3D memory device and method of manufacturing the same |
| CN113629015A (en) * | 2020-05-08 | 2021-11-09 | 联华电子股份有限公司 | Packaging ring structure |
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Legal Events
| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141022 Termination date: 20190619 |
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| CF01 | Termination of patent right due to non-payment of annual fee |