CN203850296U - 一种mcpcb基板led集成光源 - Google Patents
一种mcpcb基板led集成光源 Download PDFInfo
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Abstract
本实用新型提供了一种MCPCB基板LED集成光源，所述MCPCB基板与所述荧光粉硅胶层之间设有高反射涂层；所述MCPCB基板由下向上依次包括金属基层、导热绝缘层、电路层、阻焊层；所述LED芯片阵列焊接在电路层上。本实用新型的优点是：既能提高光源光效，也能延长光源寿命。
Description
技术领域
本实用新型涉及一种LED集成光源技术，尤其涉及一种MCPCB基板LED集成光源。
背景技术
如图1所示，MCPCB基板结构由阻焊层1(白油层)、电路层2(铜箔层)、导热绝缘层3和金属基层4(铝基板)组成。电路层2要求具有很大的载流能力，从而应使用较厚的铜箔，厚度一般35μm～280μm；导热绝缘层3是PCB铝基板核心技术之所在，它一般是由特种材料构成，热阻小(导热系数从1w/mK到280w/mk)，粘弹性能优良，具有抗热老化的能力，能够承受机械及热应力。金属基层4是铝基板的支撑构件，要求具有高导热性，一般是铝板，也可使用铜板(其中铜板能够提供更好的导热性)，适合于钻孔、冲剪及切割等常规机械加工。
采用MCPCB基板的LED集成光源，目前一般分为阻焊层作为反射层或镀银作为反射层两种方式。
如图2所示，阻焊层作为反射层的MCPCB基板LED集成光源，由荧光粉硅胶层5、阻焊层1(白油层)、电路层2(铜箔层)、导热绝缘层3和金属基层4(铝基板)、LED芯片阵列6组成。阻焊层1一般为白色油墨，主要功能是保护电路层不暴露在空气中，防止电路层的线路之间的爬电，短路；同时，在半导体元器件(电阻，电容，集成芯片等)回流焊贴片过程中，用于限制当焊锡27熔化呈液态状时的流动范围，使之局限在MCPCB基板10设定的连接半导体器件的管脚焊盘上。但是，阻焊白油的反射率很低，一般的 对应于450nm到700nm波长之间反射率在83％～90％。所以，用阻焊层1作为反射层的LED集成光源的光效低，光效在85流明/瓦(3000K,RA80)左右。
如图3所示，镀银作为反射层的MCPCB基板LED集成光源，由荧光粉硅胶层5、镀银反射层7、阻焊层1(白油层)、电路层2(铜箔层)、导热绝缘层3和金属基层4(铝基板)、LED芯片阵列6组成。银的反射率很高，对应于450nm到700nm波长之间反射率达到大于95％。但是，银在空气中是非常不稳定的化学元素，很容易被氧化和硫化，产生黑色的氧化银和硫化银。用银作为反射层的LED集成光源起始光效很高，可以达到100流明/瓦(3000K,RA80)。但是，在长时间(几个星期到几个月)的应用点亮中，空气会渗透穿过覆盖在银层表面的荧光粉硅胶层，和银产生硫化和氧化的化学反应，导致银层表面发黑，从而导致银层的对可见光的反射率降低，造成LED集成光源的光通量衰减。使得LED集成光源在长时间点亮后的光效，降低至起始光效的70％甚至50％。
实用新型内容
本实用新型解决的技术问题是，提供一种既能提高光源光效，也能延长光源寿命的MCPCB基板LED集成光源。
为了解决上述问题，本实用新型提供一种MCPCB基板LED集成光源，包括MCPCB基板、LED芯片阵列和荧光粉硅胶层，所述MCPCB基板与所述荧光粉硅胶层之间设有高反射涂层；
；所述MCPCB基板由下向上依次包括金属基层、导热绝缘层、电路层、阻焊层；所述LED芯片阵列焊接在电路层上。
进一步，所述高反射涂层的材料为对450nm到700nm光波长反射率达95％以上的材料。
进一步，所述高反射涂层材质是硅胶类或环氧树脂类。
进一步，所述涂层厚度从1微米到500微米。
进一步，所述高反射涂层通过用印刷的方式，如喷涂印刷，针筒点胶法，钢网印刷，丝网印刷等方法制备。
进一步，所述金属基层为铝板或铜板；所述导热绝缘层为热阻小、粘弹性能优良、具有抗热老化的能力特种材料；所述电路层为铜箔；所述阻焊层为白色油墨；所述LED芯片阵列为GaN芯片阵列。
本实用新型的优点是：
既能提高光源光效，也能延长光源寿命。
附图说明
图1为MCPCB基板结构示意图LED封装。
图2为阻焊层作为反射层的MCPCB基板LED集成光源结构示意图。
图3为镀银作为反射层的MCPCB基板LED集成光源结构示意图。
图4为本实用新型实施例的MCPCB基板LED集成光源结构示意图。
图5为本实用新型实施例的MCPCB基板LED集成光源顶视图。
具体实施方式
下文中将结合附图对本实用新型的实施例进行详细说明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互任意组合。
实施例一：
本实用新型提供了如附图4所示的一种MCPCB基板LED集成光源，包括MCPCB基板、LED芯片阵列6和荧光粉硅胶层5，MCPCB基板与荧光粉硅胶层5之间设有高反射涂层8。
MCPCB基板10由下向上依次包括金属基层4、导热绝缘层3、电路层2、阻焊层1。
高反射涂层8的材料为对450nm到700nm光波长反射率达95％以上的材 料。高反射涂层8材质是硅胶类或环氧树脂类。高反射涂层8厚度从1微米到500微米。高反射涂层8通过用印刷的方式，如喷涂印刷，针筒点胶法，钢网印刷，丝网印刷等方法制备。
金属基层4为铝板或铜板；导热绝缘层3为热阻小、粘弹性能优良、具有抗热老化的能力特种材料；电路层2为铜箔；阻焊层1为白色油墨；LED芯片阵列6为GaN芯片阵列。正、负极通过焊锡27焊接在电路层2上。
如附图5所示，LED芯片阵列由多颗芯片6串联、并联组成；芯片6串并线路连接通过MCPCB线路层。荧光粉硅胶层5设置在围坝胶30圈定的范围内。
芯片固晶通过焊锡来完成； 焊锡固晶的实现，是通过针筒点胶法，或沾胶法，或钢网印刷法把锡膏印到MCPCB的焊脚上，通过高温回流焊方式完成固晶。
生产本实用新型LED光源的方法，包括如下步骤：
(a)在LED芯片阵列6周边涂覆上高反射涂层8，烘烤成型；
(b)在MCPCB基板上焊接LED芯片阵列6；
(c)用荧光粉硅胶对LED芯片阵列6及高反射涂层8进行覆盖。
步骤(b)中的高反射涂层8为对450nm到700nm光波长反射率达95％以上的材料；高反射涂层8材质是硅胶类或环氧树脂类；高反射涂层8通过用印刷的方式，如喷涂印刷，针筒点胶法，钢网印刷，丝网印刷等方法制备。
所述步骤(b)中的LED芯片阵列为GaN芯片阵列；
所述步骤(b)中的焊接方式，是通过针筒点胶法，或沾胶法，或钢网印刷法把锡膏印到MCPCB的焊脚上，通过高温回流焊方式完成GaN芯片阵列和MCPCB的焊接。
以上所述仅为本实用新型的优选实施例而已，并不用于限制本实用新型，对于本领域的技术人员来说，本实用新型可以有各种更改和变化。凡在本实用新型的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本实用新型的保护范围之内。
Claims (5)
1.一种MCPCB基板LED集成光源，包括MCPCB基板、LED芯片阵列和荧光粉硅胶层，其特征在于：
所述MCPCB基板与所述荧光粉硅胶层之间设有高反射涂层；
所述MCPCB基板由下向上依次包括金属基层、导热绝缘层、电路层、阻焊层；所述LED芯片阵列焊接在电路层上。
2.如权利要求1所述的一种MCPCB基板LED集成光源，其特征在于：
所述高反射涂层的材料为对450nm到700nm光波长反射率达95％以上的材料。
3.如权利要求2所述的一种MCPCB基板LED集成光源，其特征在于：
所述高反射涂层材质是硅胶类或环氧树脂类。
4.如权利要求3所述的一种MCPCB基板LED集成光源，其特征在于：
所述涂层厚度从1微米到500微米。
5.如权利要求4所述的一种MCPCB基板LED集成光源，其特征在于：
所述金属基层为铝板或铜板；所述电路层为铜箔；所述阻焊层为白色油墨；所述LED芯片阵列为GaN芯片阵列。
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329605A (zh) * | 2014-10-28 | 2015-02-04 | 浙江大学 | 梳齿状散热的led灯 |
| CN104409616A (zh) * | 2014-11-14 | 2015-03-11 | 易美芯光（北京）科技有限公司 | 一种覆晶led集成光源结构及其制备方法 |
| CN106887497A (zh) * | 2015-12-15 | 2017-06-23 | 易美芯光（北京）科技有限公司 | 一种低热阻led光源 |
| CN109155348A (zh) * | 2016-05-20 | 2019-01-04 | 奥斯兰姆奥普托半导体有限责任公司 | 辐射发射组件 |
| CN110225651A (zh) * | 2019-06-19 | 2019-09-10 | 深圳市洲明科技股份有限公司 | 线路板及显示屏 |
| CN112582524A (zh) * | 2019-09-12 | 2021-03-30 | 群创光电股份有限公司 | 发光装置及其制造方法 |
-
2014
- 2014-01-07 CN CN201420008041.0U patent/CN203850296U/zh not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104329605A (zh) * | 2014-10-28 | 2015-02-04 | 浙江大学 | 梳齿状散热的led灯 |
| CN104409616A (zh) * | 2014-11-14 | 2015-03-11 | 易美芯光（北京）科技有限公司 | 一种覆晶led集成光源结构及其制备方法 |
| CN106887497A (zh) * | 2015-12-15 | 2017-06-23 | 易美芯光（北京）科技有限公司 | 一种低热阻led光源 |
| CN109155348A (zh) * | 2016-05-20 | 2019-01-04 | 奥斯兰姆奥普托半导体有限责任公司 | 辐射发射组件 |
| CN109155348B (zh) * | 2016-05-20 | 2021-10-15 | 奥斯兰姆奥普托半导体有限责任公司 | 辐射发射组件 |
| CN110225651A (zh) * | 2019-06-19 | 2019-09-10 | 深圳市洲明科技股份有限公司 | 线路板及显示屏 |
| CN112582524A (zh) * | 2019-09-12 | 2021-03-30 | 群创光电股份有限公司 | 发光装置及其制造方法 |
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