CN203850265U - Wafer and wafer carrier bonding separator and wafer bonding separation lifting unit thereof - Google Patents
Wafer and wafer carrier bonding separator and wafer bonding separation lifting unit thereof Download PDFInfo
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- CN203850265U CN203850265U CN201420220838.7U CN201420220838U CN203850265U CN 203850265 U CN203850265 U CN 203850265U CN 201420220838 U CN201420220838 U CN 201420220838U CN 203850265 U CN203850265 U CN 203850265U
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- 238000000926 separation method Methods 0.000 title claims abstract description 7
- 238000006073 displacement reaction Methods 0.000 claims abstract description 11
- 238000010521 absorption reaction Methods 0.000 claims description 16
- 238000001179 sorption measurement Methods 0.000 claims description 3
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 230000007423 decrease Effects 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A wafer and wafer carrier bonding separator is provided with a wafer positioning unit, a wafer carrier supplying unit which is adjacent to the wafer positioning unit, a wafer carrier displacement unit which is adjacent to the wafer carrier supplying unit, a wafer carrier positioning unit which is adjacent to the wafer carrier supplying unit, a wafer movement unit which is adjacent to the wafer positioning unit, and a wafer bonding separation lifting unit which is arranged below the wafer carrier positioning unit. With the wafer bonding separation lifting unit of the utility model adopted, a wafer can be bonded with or separated from a wafer carrier, and therefore, manual loading time and risks of wafer fracture can be decreased.
Description
Technical field
The utility model relates to a kind of wafer and wafer carrier and engages seperator and wafer thereof and engage and separate lifting unit, espespecially a kind of can be by the device of wafer automation loading or removal on wafer carrier.
Background technology
In silicon wafer process, wafer can pass through multiple tracks processing procedure, and so, in each processing procedure, wafer is mostly manually to transmit by carrier to the transmission work table, after the processing procedure of this work table finishes, then this wafer is positioned over to carrier with manual type.
Again this carrier is moved to the work table of next processing procedure, then take out wafer with manual type, after this processing procedure finishes, with manual type, wafer is placed to return load tool.
From the above mentioned, hold known, in silicon wafer process, separating and combination between wafer and carrier, its be rely on manual type carry out.So cause the loading of wafer and the time separating too tediously long with manual type system, and wafer is easy to improve the risk that wafer is damaged in the process of a dead lift, therefore each manufacturer thinks deeply the possibility that how to reduce artificial use invariably.
Summary of the invention
The utility model object is to provide a kind of wafer and wafer carrier to engage seperator and wafer joint separates lifting unit, in the mode of automation, by a wafer and a wafer carrier, the two is separated from each other or engages, use and reach automation loading or removal, and then the time of reducing artificial loading, and the possibility of reduction wafer breakage.
For achieving the above object, the wafer that the utility model adopts engages seperator technical scheme and is with wafer carrier: a kind of wafer engages seperator with wafer carrier, and it has:
One wafer positioning unit;
One wafer carrier feeding unit, it is adjacent to this wafer positioning unit;
One wafer carrier displacement unit, it is adjacent to this wafer carrier feeding unit;
One wafer carrier positioning unit, it is adjacent to wafer carrier feeding unit;
One wafer mobile unit, it is adjacent to this wafer positioning unit; And
One wafer engages and separates lifting unit, and it is the below of being located at this wafer carrier positioning unit.
In such scheme, also have at least one wafer Xia He district, this wafer casket box fauna is with respect to this wafer positioning unit.
In such scheme, also have at least one wafer carrier Xia He district, this wafer carrier casket box fauna is adjacent to this wafer carrier positioning unit, and this wafer carrier Xia He district has at least one wafer carrier casket box lifting module.
In such scheme, described wafer positioning unit has a wafer circulator and a wafer positioning inductor, and this wafer positioning inductor system is located at the top of this wafer circulator.Described wafer positioning unit also has a wafer sequence number reader, and this wafer sequence number reader system is located at the top of this wafer circulator.
In such scheme, described wafer carrier feeding unit has a wafer carrier lifting module and wafer carrier absorption module, and this wafer carrier absorption module system is located at the top of this wafer carrier lifting module.Described wafer carrier feeding unit also has a wafer carrier track module, this wafer carrier track module system is located between this wafer carrier lifting module and this wafer carrier absorption module, or this wafer carrier track module system is located at the top of this wafer carrier lifting module.
In such scheme, described wafer carrier displacement unit has a Linear-moving module and a wafer carrier holds module, this Linear-moving module system is positioned at a side of this wafer adsorption module, this wafer carrier holds module system and couples this Linear-moving module, and holds between module at this wafer carrier.Described Linear-moving module is a linear shifter, a linear slide rail assembly, a linear track moves assembly or a linear chain moves assembly; It is that a fixture assembly, a hitcher assembly or push away tool assembly that this wafer carrier holds module.
For achieving the above object, the technical scheme that the wafer joint that the utility model adopts separates lifting unit is: a kind of wafer engages and separates lifting unit, and it is located at the below of a wafer carrier positioning unit, and this wafer engages separation lifting unit to be had:
One lifting module; And
One wafer cushion cap, it is the top of being located at this lifting module.
In such scheme, described wafer carrier positioning unit also has a wafer carrier sequence number reader and wafer sequence number reader.
The utility model wafer engages seperator with wafer carrier, is the action of carrying out loading and the removal of wafer with automation, uses lifting operating efficiency.
Brief description of the drawings
Fig. 1 is the utility model embodiment wafer engages seperator schematic perspective view with wafer carrier;
Fig. 2 is the utility model embodiment wafer engages seperator sectional perspective schematic diagram with wafer carrier;
Fig. 3 is the utility model embodiment wafer engages seperator another angle sectional perspective schematic diagram with wafer carrier.Wafer circulator
In above accompanying drawing: 10, wafer Xia He district; 100, wafer casket box; 11, wafer positioning unit; 110, wafer; 111, wafer circulator; 112 wafer positioning inductors; 113, wafer sequence number reader; 12, wafer carrier feeding unit; 120, wafer carrier lifting module; 121, wafer carrier absorption module; 122, wafer carrier; 123, wafer carrier track module; 13, wafer carrier displacement unit; 130, Linear-moving module; 131, wafer carrier holds module; 14, wafer carrier positioning unit; 140, wafer carrier inductor; 141, wafer carrier sequence number reader; 15, wafer carrier Xia He district; 150, wafer carrier casket box; 151, wafer casket box lifting module; 16, wafer mobile unit; 17, wafer engages and separates lifting unit.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described:
Embodiment: shown in Fig. 1-3:
Please coordinate with reference to the 1st figure extremely with shown in the 3rd figure, this creation is that a kind of wafer engages seperator with wafer carrier, and it has at least one wafer Xia He district 10, a wafer positioning unit 11, a wafer carrier feeding unit 12, a wafer carrier displacement unit 13, a wafer carrier positioning unit 14, at least one wafer carrier Xia He district 15, engages and separate lifting unit 17 with wafer with a wafer mobile unit 16.
The quantity system in wafer Xia He district 10 can be one or more, and it is according to actual behaviour in service, and increases and decreases.
Wafer positioning unit 11 is with respect to wafer Xia He district 10, and wafer positioning unit 11 has a wafer circulator 111, a wafer positioning inductor 112 and a wafer sequence number reader 113.Wafer circulator 111 is to make a wafer 110 rotate.Wafer positioning inductor 112 is the top of being located at wafer circulator 111, and wafer positioning inductor 112 is to respond to the telltale mark that the wafer 110 in rotation has, and this telltale mark is as unfilled corner or a flat limit.Wafer sequence number reader 113 is the top of being located at wafer circulator 111, and wafer sequence number reader 113 is to read the sequence number that is positioned at wafer 110 surfaces.The setting position system of wafer sequence number reader 113 does not limit, therefore wafer sequence number reader 113 also can be located at wafer carrier positioning unit 14, it is not to be shown in figure, so the setting position of wafer sequence number reader 113 does not limit.
Wafer carrier feeding unit 12 is adjacent to wafer positioning unit 11, and as shown in the 2nd figure and the 3rd figure, wafer carrier feeding unit 12 has a wafer carrier lifting module 120, adsorbs module 121 and a wafer carrier track module 123 with a wafer carrier.Wafer carrier lifting module 120 is to receive at least one or more wafer carrier 122, and wafer carrier absorption module 121 is the top of being located at wafer carrier lifting module 120.Wafer carrier track module 123 is to be located between wafer carrier lifting module 120 and wafer carrier absorption module 121, or wafer carrier track module 123 is the top of being located at wafer carrier lifting module 120.Wafer carrier track module 123 is to carry out towards both sides, and the distance system that this is carried out can pass through for a wafer carrier 122.Wafer carrier lifting module 120 is to make a wafer carrier 122 increase, this wafer carrier 122 is the wafer carrier track module 123 by carrying out, and higher than wafer carrier track module 123, wafer carrier absorption module 121 is decline and adsorb wafer carrier 122, and adsorb after wafer carrier 122 when wafer carrier adsorbs module 121, wafer carrier absorption module 121 is to rise together with wafer carrier 122, and wafer carrier lifting module 120 is to drop to a ready position.Wafer carrier track module 123 is to reply to original position, i.e. former rounding state, and wafer carrier absorption module 121 is decline, so that wafer carrier 122 is placed in wafer carrier track module 123.Wafer carrier absorption module 121 is to stop adsorbing wafer carrier 122, and rises to original position.
Wafer carrier displacement unit 13 is adjacent to wafer carrier feeding unit 12.Wafer carrier displacement unit 13 has a Linear-moving module 130 and a wafer carrier holds module 131.Linear-moving module 130 is a side that is positioned at wafer adsorption module 121, and Linear-moving module 130 is can a linear shifter, a linear slide rail assembly, a linear track moves assembly or a linear chain moves assembly.It is to couple Linear-moving module 130 that wafer carrier holds module 131, and wafer carrier to hold module 131 be between wafer carrier lifting module 120 and wafer carrier absorption module 121.It can be that a fixture assembly, a hitcher assembly or push away tool assembly that wafer carrier holds module 131.Wafer carrier hold module 131 be hold, hook is moving or promote to be positioned at the wafer carrier 122 of wafer carrier track module 123, below only discuss to hold wafer carrier 122, and unrestricted.This fixture assembly is the combination of a clamping device, and it is to hold wafer carrier 122.This hitcher assembly is the combination of hitcher device, and it is to draw wafer carrier 122 by hook.This pushes away the combination that tool assembly is a push rod device, and it is to promote wafer carrier 122.
Wafer carrier positioning unit 14 is adjacent to wafer carrier feeding unit 12, and wafer carrier positioning unit 14 has at least one wafer carrier inductor 140 and a wafer carrier sequence number reader 141.As mentioned above, be to hold after wafer carrier 122 when wafer carrier holds module 131, Linear-moving module 130 is the top that wafer carrier is held to module 131 and moves to wafer carrier positioning unit 14, it is to decontrol wafer carrier 122 that wafer carrier holds module 131, so that wafer carrier 122 is positioned over wafer carrier positioning unit 14, Linear-moving module 130 is to make wafer carrier hold module 131 to get back to original position.Wafer carrier inductor 140 is whether really induction is positioned at wafer carrier positioning unit 14 location, if without location really, engages seperator with wafer carrier be to send an alert news to this wafer, really do not locate so that staff learns wafer carrier 122.Wafer carrier sequence number reader 141 is the top that is positioned at wafer carrier positioning unit 14, and wafer carrier sequence number reader 141 is to read the sequence number that is positioned at wafer carrier 122.In the time that wafer engages with wafer carrier, the sequence number of the sequence number of wafer carrier 122 and above-mentioned wafer 110 can be read respectively and links, to confirm and the foundation of comparing wafer and wafer carrier as successive process, more can differentiate rapidly the process stage of wafer 110.
If further discuss, wafer carrier sequence number reader 141 is the sequence number that can read wafer carrier 122, wafer sequence number reader 113 is the sequence number that can read wafer 110, those sequence number systems can read respectively and link, or jointly read and link, it is according to depending on the position that wafer sequence number reader 113 is set, and those sequence number systems are for differentiating the process stage of wafer 110.
Wafer carrier Xia He district 15 is adjacent to wafer carrier positioning unit 14, or adjacent to wafer Xia He district 10.As above-mentioned wafer Xia He district 10, the quantity system in wafer carrier Xia He district 15 can be one or more, and it is according to actual behaviour in service, and increases and decreases.Wafer carrier Xia He district 15 has at least one wafer casket box lifting module 151.When wafer carrier casket box 150 is positioned over wafer casket box lifting module 151, wafer casket box lifting module 151 is to rise or to decline, so that 150 liftings thereupon of wafer carrier casket box.
Wafer mobile unit 16 is between wafer Xia He district 10 and wafer positioning unit 11.Wafer mobile unit 16 is can be to seize assembly or a mechanical arm assembly on both sides by the arms.
Wafer engages and separates lifting unit 17 is the below of being located at wafer carrier positioning unit 14, and wafer engages separation lifting unit 17 and has a wafer cushion cap and a lifting module, and wafer cushion cap system is located at the top of lifting unit.
The present embodiment can carry out two kinds of patterns, and one is wafer and wafer carrier engaged mode, and another is wafer and wafer carrier clastotype.Be below first to discuss with wafer and wafer carrier engaged mode.
In carrying out wafer and wafer carrier engaged mode is discussed, please coordinate again with reference to shown in the 1st figure to the 3 figure, wafer Xia He district 10 cordings have a wafer casket box 100, have at least one wafer 110 in wafer casket box 100.
Wafer mobile unit 16 by taking out in wafer casket box 100, and is positioned over wafer positioning unit 11 by wafer 110.As mentioned above, wafer positioning unit 11 is location wafer 110, and reads the sequence number of wafer 110.This sequence number system is used for differentiating the process stage of this wafer 110.
Wafer carrier feeding unit 12 is that a wafer carrier 122 is provided.Wafer carrier displacement unit 13 is that wafer carrier 122 is moved to wafer carrier positioning unit 14.Wafer carrier positioning unit 14 is to confirm whether wafer carrier 122 has certain location, and reads the sequence number of wafer carrier 122.If wafer carrier 122 is located really, the wafer cushion cap system that wafer engages separation lifting unit 17 is subject to the driving of lifting module and rises, and this wafer cushion cap is higher than the wafer carrier 122 that is positioned at wafer carrier positioning unit 14.Wafer mobile unit 16 is that the wafer of locating 110 is moved to this wafer cushion cap from wafer positioning unit 14, and wafer 110 is positioned over to wafer cushion cap.
After wafer 110 has been positioned over wafer cushion cap, lifting module system declines wafer cushion cap, and this wafer cushion cap system drops to the position lower than wafer carrier 122, so that wafer 100 is arranged in wafer carrier 122.The wafer carrier 122 with wafer 110 is to move into the wafer carrier casket box 150 that is arranged in wafer carrier Xia He district 15.Wafer carrier 122 is a framework, and framework can be ring-type, rectangle or polygon.Wafer casket box lifting module 151 is to coordinate the quantity of the interior wafer carrier 122 of wafer carrier casket box 150 and lifting, in order to the immigration of wafer carrier 122.
If in the time carrying out wafer and wafer carrier clastotype, the wafer carrier with wafer 110 122 that is arranged in the wafer carrier casket box 150 in wafer carrier Xia He district 15 is to be moved into wafer carrier positioning unit 14.Above-mentioned lifting module system rises wafer cushion cap, so that by wafer 110 and wafer carrier 122, the two is separated.
Wafer mobile unit 16 is the mobile wafer 110 that is positioned at wafer cushion cap, and wafer 110 is moved into the wafer casket box 100 that is arranged in wafer Xia He district 10, or wafer mobile unit 16 moves to wafer positioning unit 11, behind wafer 110 location, then wafer 122 is moved in wafer casket box 100.
The wafer carrier 122 that is positioned at wafer carrier positioning unit 14 and does not have a wafer 110 is to be moved to wafer carrier feeding unit 12 by wafer carrier displacement unit 13.Wafer carrier absorption module 121 is decline and adsorb wafer carrier 122, and wafer carrier track module 123 is expansion, and wafer carrier lifting module 120 is fastened and risen with carrying wafer carrier 122.Carry after wafer carrier 122 until wafer carrier lifting module 120, wafer carrier absorption module 121 stops adsorbing wafer carrier 122 and returns back to original position, wafer carrier lifting module 120 is to decline with storage wafer carrier 122, and wafer carrier track module 123 is to get back to original position.Wafer casket box lifting module 151 is to coordinate the quantity of the interior wafer carrier 122 of wafer carrier casket box 150 and lifting, in order to shifting out of wafer carrier 122.
Comprehensively above-mentioned, the present embodiment system is used wafer mobile unit to transport wafer, therefore need not use manually, it is to save in a large number artificial expenditure.
Moreover the present embodiment system is more used wafer positioning unit and wafer carrier positioning unit, the two is to locate respectively wafer and wafer carrier, uses the precision that promotes subsequent wafer processing.
Again one, the wafer Xia He district of the present embodiment and wafer carrier Xia He district, the two is to increase and decrease according to actual behaviour in service, thus single or multiple wafer casket box and wafer carrier casket box can be set respectively, by automation with lifting operating efficiency.
Again two, the present embodiment system can carry out respectively wafer and wafer carrier engaged mode, and wafer and wafer carrier clastotype, therefore this creation can be carried out with automation the action of loading and the removal of wafer, uses lifting operating efficiency.
Above-described embodiment is only explanation technical conceive of the present utility model and feature, and its object is to allow person skilled in the art can understand content of the present utility model and implement according to this, can not limit protection range of the present utility model with this.All equivalences of doing according to the utility model Spirit Essence change or modify, within all should being encompassed in protection range of the present utility model.
Claims (10)
1. wafer engages a seperator with wafer carrier, it is characterized in that: it has:
One wafer positioning unit;
One wafer carrier feeding unit, it is adjacent to this wafer positioning unit;
One wafer carrier displacement unit, it is adjacent to this wafer carrier feeding unit;
One wafer carrier positioning unit, it is adjacent to wafer carrier feeding unit;
One wafer mobile unit, it is adjacent to this wafer positioning unit; And
One wafer engages and separates lifting unit, and it is the below of being located at this wafer carrier positioning unit.
2. wafer engages seperator with wafer carrier according to claim 1, it is characterized in that: also have at least one wafer Xia He district, this wafer casket box fauna is with respect to this wafer positioning unit.
3. wafer engages seperator with wafer carrier according to claim 1, it is characterized in that: also there is at least one wafer carrier Xia He district, this wafer carrier casket box fauna is adjacent to this wafer carrier positioning unit, and this wafer carrier Xia He district has at least one wafer carrier casket box lifting module.
4. wafer engages seperator with wafer carrier according to claim 1, it is characterized in that: described wafer positioning unit has a wafer circulator and a wafer positioning inductor, and this wafer positioning inductor system is located at the top of this wafer circulator.
5. wafer engages seperator with wafer carrier according to claim 1, it is characterized in that: described wafer carrier feeding unit has a wafer carrier lifting module and wafer carrier absorption module, this wafer carrier absorption module system is located at the top of this wafer carrier lifting module.
6. wafer engages seperator with wafer carrier according to claim 5, it is characterized in that: described wafer carrier feeding unit also has a wafer carrier track module, this wafer carrier track module system is located between this wafer carrier lifting module and this wafer carrier absorption module, or this wafer carrier track module system is located at the top of this wafer carrier lifting module.
7. wafer engages seperator with wafer carrier according to claim 1, it is characterized in that: described wafer carrier displacement unit has a Linear-moving module and a wafer carrier holds module, this Linear-moving module system is positioned at a side of this wafer adsorption module, this wafer carrier holds module system and couples this Linear-moving module, and holds between module at this wafer carrier.
8. wafer engages seperator with wafer carrier according to claim 7, it is characterized in that: described Linear-moving module is a linear shifter, a linear slide rail assembly, a linear track moves assembly or a linear chain moves assembly; It is that a fixture assembly, a hitcher assembly or push away tool assembly that this wafer carrier holds module.
9. wafer engages and separates a lifting unit, it is characterized in that: it is located at the below of a wafer carrier positioning unit, and this wafer engages separation lifting unit to be had:
One lifting module; And
One wafer cushion cap, it is the top of being located at this lifting module.
10. wafer engages and separates lifting unit according to claim 9, it is characterized in that: described wafer carrier positioning unit also has wafer carrier sequence number reader and wafer sequence number reader.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420220838.7U CN203850265U (en) | 2014-05-04 | 2014-05-04 | Wafer and wafer carrier bonding separator and wafer bonding separation lifting unit thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420220838.7U CN203850265U (en) | 2014-05-04 | 2014-05-04 | Wafer and wafer carrier bonding separator and wafer bonding separation lifting unit thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203850265U true CN203850265U (en) | 2014-09-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420220838.7U Expired - Lifetime CN203850265U (en) | 2014-05-04 | 2014-05-04 | Wafer and wafer carrier bonding separator and wafer bonding separation lifting unit thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203850265U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485302A (en) * | 2014-12-29 | 2015-04-01 | 颀中科技（苏州）有限公司 | Wafer transfer batching and collecting equipment |
| CN105280532A (en) * | 2015-03-13 | 2016-01-27 | 苏州均华精密机械有限公司 | Quick material changing device and method for wafer ring |
-
2014
- 2014-05-04 CN CN201420220838.7U patent/CN203850265U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104485302A (en) * | 2014-12-29 | 2015-04-01 | 颀中科技（苏州）有限公司 | Wafer transfer batching and collecting equipment |
| CN104485302B (en) * | 2014-12-29 | 2017-05-10 | 颀中科技（苏州）有限公司 | Wafer transfer batching and collecting equipment |
| CN105280532A (en) * | 2015-03-13 | 2016-01-27 | 苏州均华精密机械有限公司 | Quick material changing device and method for wafer ring |
| CN105280532B (en) * | 2015-03-13 | 2018-05-15 | 苏州均华精密机械有限公司 | Quick material changing device and method for wafer ring |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140924 |
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| CX01 | Expiry of patent term |