CN203842887U - Cleaning device for wafer - Google Patents
Cleaning device for wafer Download PDFInfo
- Publication number
- CN203842887U CN203842887U CN201420128545.6U CN201420128545U CN203842887U CN 203842887 U CN203842887 U CN 203842887U CN 201420128545 U CN201420128545 U CN 201420128545U CN 203842887 U CN203842887 U CN 203842887U
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- Prior art keywords
- cleaning device
- wafer
- wafer cleaning
- opening
- main body
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Abstract
The utility model provides a cleaning device for a wafer. The cleaning device at least comprises a main spraying body which is an accommodating chamber enclosed by a side wall with multiple openings communicated with the accommodating chamber. At least one linear trajectory is formed in such a manner that the multiple openings are distributed along an axial direction of the main spraying body. The spacing distance between the two openings is smaller than one sixth of the length of the main spraying body in at least one linear trajectory. Each liner trajectory is not smaller than the two third of main spraying body in length. The cleaning device for the wafer has following beneficial effects: problems in the prior art that that a wafer surface has defects caused by dirt embedded into a wafer cylinder brush due to few number of nozzles of a wafer spraying rod and large spacing distance between every two nozzles; the main spraying body is provided with the openings which are of high intensity and used for spraying so that dirt embedded into bristle gaps of a wafer cleaning brush is timely removed during a wafer cleaning process; and yield rate in manufacture procedures is improved.
Description
Technical field
The utility model relates to a kind of semi-conductor processing equipment, particularly relates to a kind of wafer cleaning device.
Background technology
In semiconductor fabrication process, along with the continuous upgrading of process technique, more and more higher to the requirement of flatness of wafer surface.And cmp technology can realize the planarization of the crystal column surface overall situation.In follow-up processing technology, because front road grinding step can bring and stain material to crystal column surface, these are stained material and comprise abrasive grain as the silica dioxide granule of ceria, aluminium oxide, glue and be added into the residues such as surfactant, aggressive agent and other additives in abrasive material.In chemical mechanical planarization process, make these particles embed crystal column surface under mechanical pressure, for fear of reducing the reliability of device and device being introduced to defect, so the cleaning of subsequent handling becomes more important and strict.But after chemical mechanical milling tech, in the process that wafer is cleaned, adopt existing wafer cleaning device can bring secondary pollution to wafer when cleaning wafer.
Fig. 1 is wafer cleaning device of the prior art, wherein, wafer 10 is fixed on the top of bracket 13, with the spray bars 12 of nozzle by cleaning solution by described nozzles spray on two surfaces and cylinder brush 11 of wafer 10, thereby then two cylinder brush 11 surfaces that allow described bristle touch described wafer by rotation with bristle will remain in the removing residues on described wafer 10 surfaces.And in prior art with the shape of the spray bars of nozzle as shown in Figure 2, in a side of spray bars 12, be provided with several nozzles 13, the spray bars of using in prior art, its with nozzle be roughly 3 to 5.Spacing between nozzle 13 is wider.And when the cylinder brush surface that thing is bonded at rolling in cleaning process of staining of crystal column surface, especially some particles are larger stains thing, embed sometimes between the surperficial bristle gap of described cylinder brush, and in continuing the process of cleaning, if embedding the thing of staining in bristle gap is not washed away in time by the cleaning solution from described spray bars, this stains thing can form contacting of frictional property with crystal column surface in the process that the continuation of cylinder brush is rolled, thereby can damage crystal column surface, to processing procedure, brings defect.
Whether the cleaning fluid that therefore causes the factor of a kind of key of wafer surface defects to spray from the nozzle of described spray bars is even, and in prior art, spacing is wider each other for the nozzle that described spray bars arranges, nozzle number is few, in the process of rinsing wafer, is easy to bring defect to wafer.At present with the further yield of lifting process of cleaning device of the prior art.Therefore be necessary to propose the probability that a kind of new wafer cleaning device reduces the defect that crystal column surface brings due to cleaning.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of wafer cleaning device, for solving prior art, because wafer spray bars is provided with the wide brilliant cylinder brush causing of the few and injector spacing of number of nozzle, embeds and stains thing and rinsed in time the problem of bringing defect to crystal column surface.
For achieving the above object and other relevant objects, the utility model provides a kind of wafer cleaning device, it is characterized in that, described wafer cleaning device at least comprises:
By sidewall, surrounded the sprinkling main body of container cavity;
The sidewall of described sprinkling main body is provided with several openings; Described opening and described container cavity connect;
Described several openings are at least one line style track along described sprinkling main body axis direction;
Described in described line style track, opening spacing is each other less than 1/6 of described sprinkling principal length;
The length of described line style track is not less than 2/3 of described sprinkling principal length.
As a kind of preferred version of wafer cleaning device of the present utility model, the shape of described opening comprises circle, ellipse or polygon.
As a kind of preferred version of wafer cleaning device of the present utility model, described opening is the slit along described sprinkling main body axis direction.
As a kind of preferred version of wafer cleaning device of the present utility model, described slit is positioned at the middle part of described sprinkling main body.
As a kind of preferred version of wafer cleaning device of the present utility model, the width of described rectangular aperture or the diameter of circular open are 0.1 millimeter to 0.5 millimeter.
As a kind of preferred version of wafer cleaning device of the present utility model, described line style track is straight path.
As a kind of preferred version of wafer cleaning device of the present utility model, in described several openings, between adjacent two openings, spacing equates.
A kind of preferred version as wafer cleaning device of the present utility model, described line style track is two parallel straight paths, and described two parallel straight paths are to each other apart from being not more than the wherein any spacing between adjacent two openings of straight line track of formation.
As a kind of preferred version of wafer cleaning device of the present utility model, the opening shape that forms described two parallel straight paths is circle or rectangle.
As a kind of preferred version of wafer cleaning device of the present utility model, in described two parallel straight paths, form the wherein opening of straight line track and distribute with respect to the interleaved openings that forms another straight path.
As mentioned above, wafer cleaning device of the present utility model, there is following beneficial effect: sprinkling main body of the present utility model has the opening for spraying that closeness is high, therefore in wafer cleaning process, can effectively also remove in time the thing of staining embedding in wafer cleaning brush bristle gap.Improved the yield of processing procedure.
Accompanying drawing explanation
Fig. 1 is shown as wafer cleaning device schematic diagram of the prior art.
Fig. 2 is shown as the generalized section of the spray bars of wafer cleaning device of the prior art.
Fig. 3 to Fig. 8 shows opening and the distribution schematic diagram thereof of the various shape having in the sprinkling main body of wafer cleaning device of the present utility model.
Element numbers explanation
10 wafers
11 brush pots
12a spray bars
12 spray main body
13 brackets
121 nozzles
122,123,124 openings
A/F d
Aperture pitch h
Straight path spacing x
Opening length k
Spray principal length L
Line style path length m
The specific embodiment
By particular specific embodiment, embodiment of the present utility model is described below, person skilled in the art scholar can understand other advantages of the present utility model and effect easily by the disclosed content of this description.
Refer to Fig. 1 to Fig. 8.Notice, appended graphic the illustrated structure of this description, ratio, size etc., equal contents in order to coordinate description to disclose only, for person skilled in the art scholar, understand and read, not in order to limit the enforceable qualifications of the utility model, therefore the technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under the effect that the utility model can produce and the object that can reach, all should still drop on the technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, in this description, quote as " on ", the term of D score, " left side ", " right side ", " centre " and " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, under without essence change technology contents, when being also considered as the enforceable category of the utility model.
As shown in Figures 3 to 8, the utility model provides a kind of wafer cleaning device, and described wafer cleaning device has the main body 12 of sprinkling, and this sprinkling main body is by sidewall, to be surrounded and had the structure of container cavity, the effect of described container cavity is that cleaning fluid is accommodated in described sprinkling main body, for cleaning wafer.In Fig. 3 to Fig. 7, the sidewall of described sprinkling main body 12 is provided with some openings 122 or opening 123.Described opening connects through described sidewall and container cavity, to allow cleaning fluid to be sent to the outside of described sprinkling main body 12 from described container cavity.The shape of described opening comprises circle, ellipse or polygon.Opening 122 as shown in Fig. 3 to Fig. 5 be shaped as rectangle; Opening 123 shown in Fig. 6 and Fig. 7 be shaped as circle.The shape of described opening can also be other irregular closed figures except circle, ellipse or polygon.When described opening is rectangle, and the width of described rectangle compares very littlely with its length, can think that being shaped as of described opening is positioned at the slit in described sprinkling main body wall.And as a kind of preferred version of the present utility model, the opening of described shape of slit distributes along described sprinkling main body axis direction, and its length direction of the rectangular aperture of described shape of slit is along the axis direction of described sprinkling main body.
When the opening number of described shape of slit is one, described slit distributes along described sprinkling main body axis direction in described sprinkling main body wall.As shown in Figure 8, described slit 124 is positioned at the sidewall of described sprinkling main body 12, and distributes along the axis direction of described sprinkling main body 12.When the number of described opening is when to be several and described opening be shaped as rectangle, the opening of described several rectangular shapes also can form the opening of shape of slit, and as shown in Figure 3, the A/F d of described opening 122 is less than 1/10th of opening length k.No matter one of described slit or several, as a kind of preferred version of the present utility model, described slit or the track consisting of some slits are positioned at the middle part of described sprinkling main body, be that the region that described sprinkling main body two ends do not arrange described opening equates, that is to say that a described slit opening or several slit openings all concentrate on the centre of described sprinkling main body wall, when being conducive to rinse so just over against wafer or brush pot.
When the number of described opening is several, described several openings form at least one line style track along described sprinkling main body axis direction, as shown in Fig. 3 to Fig. 7, in Fig. 3, described opening be shaped as rectangle, described several rectangular-shaped openings distribute along the axis direction of described sprinkling main body 12, and the distribution of described some rectangular apertures forms a linear track, again as shown in Figure 4 and Figure 5, the distribution of described some rectangular apertures forms two line style tracks along the direction of described sprinkling main body axis.The track that secondly described opening forms can also be three or four above line style tracks of line.As a kind of preferred version of the present utility model, described line style track is straight path.Described in Fig. 3 to Fig. 7, line style track is all straight path.Described line style track, except being described straight path, can also be curvilinear path, and described curvilinear path is equally along the axis direction of described sprinkling main body.Straight path described in Fig. 3 and Fig. 6 is one, and the straight path shown in Fig. 4, Fig. 5 and Fig. 7 is two.As a kind of preferred version of the present utility model, in the situation that described straight path is one or more, this one or more straight path is parallel distributed.Two straight paths shown in Fig. 4, Fig. 5 and Fig. 7 are parallel distributed.
In order to solve in prior art upper 3 to 5 nozzles that arrange of described spray bars 12a as shown in Figure 2, because nozzle number is few, distribution density is low and cause spray effect bad, does not rinse out in time the problem that thing causes wafer defect that stains of crystal column surface.Therefore described in the described line style track of the utility model, opening spacing is each other set to be less than 1/6 of described sprinkling principal length, that is has improved the distribution density of described opening.The length of described line style track is not less than 2/3 of described sprinkling principal length simultaneously.In Fig. 7, the length of described straight path is m, and the length of described sprinkling main body is L, and the amount that the opening that described m>2/3L makes to form described line style track sprays cleaning fluid is enough to the thing of staining being bonded between described brush pot bristle to wash out.Make the spacing each other of opening described in described straight path is 1/6 of the h length L that is less than described sprinkling main body simultaneously, has improved the distribution density of described opening.
For making this device reach comparatively ideal spray effect, simultaneously as a kind of preferred version of the present utility model, the width of described opening is restricted between 0.1 millimeter to 0.5 millimeter.In Fig. 3, described in be shaped as in the A/F d and Fig. 7 of opening 122 of rectangle, described in be shaped as the A/F d of circular opening 123, the numerical value of described A/F d is between 0.1 millimeter to 0.5 millimeter.
As a kind of preferred version of the present utility model, spacing in described some openings between adjacent two openings equates, that is to say in the some openings that form in every described line style track, spacing between its adjacent two openings equates, that is each opening in described every line style track is equidistant distribution, can make like this cleaning fluid of this device spray evenly.In Fig. 4, in two straight paths, form every straight path described in be shaped as each opening 122 of rectangle, adjacent aperture pitch h each other equates.And for example in Fig. 7, in two straight paths, form every straight path described in be shaped as each circular opening 123, adjacent aperture pitch h each other equates.
Simultaneously as a kind of preferred version of the present utility model, described two parallel straight paths spacing is each other not more than the wherein spacing between adjacent two openings of straight line track arbitrarily of formation.In order to reach comparatively ideal spray effect, in Fig. 4, the adjacent aperture pitch each other of the opening that is shaped as rectangle 122 that forms any described straight path is h, and described linear pattern track is two parallel straight paths, described two straight paths spacing is to each other x, and it is h that the spacing x of described straight path is less than the adjacent aperture pitch each other of the described straight path split shed 122 of formation.The condition that x is less than h makes the tightr of described line style track parallel arranged, the value of described h is restricted in the scope of 0.1 millimeter to 0.5 millimeter simultaneously, the aperture distribution that forms every line style track is concentrated, and distribution density is large, so just can reach better spray effect.
The opening shape that forms described two parallel straight paths can be circular, ellipse, polygon or any closed figures.As a kind of preferred version of the present embodiment, the opening shape that forms described two parallel straight paths is circle or rectangle.As shown in Fig. 4, Fig. 5 and Fig. 7.
As a kind of preferred version of the present utility model, in described two parallel straight paths, form the wherein opening of straight line track and distribute with respect to the interleaved openings that forms another straight path.As show in Fig. 5 and Fig. 7 two straight paths, described in pie graph 5, the rectangular aperture of every straight path presents and is interspersed with respect to the aperture distribution in another straight path.Can increase the contact area of cleaning fluid and wafer and brush pot like this, reach better developing result.As shown in Figure 4, the opening that forms the rectangular shape of described every straight path presents the distribution mode of alignment to the aperture distribution modes different from aperture distribution described in Fig. 5 with respect to the opening in another straight path.The distribution mode of described opening is as shown in Figure 4 also within the utility model scope required for protection.
In sum, wafer cleaning device of the present utility model, solved in prior art because wafer spray bars is provided with the few and wide brilliant cylinder brush causing of injector spacing of number of nozzle and embedded and stain thing and rinsed in time the problem of bringing defect to crystal column surface, sprinkling main body of the present utility model has the opening for spraying that closeness is high, therefore in wafer cleaning process, can have and remove in time embedding wafer cleaning and brush the thing of staining in bristle gap.Improved the yield of processing procedure.So the utility model has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, modify or change above-described embodiment.Therefore, have in technical field under such as and conventionally know that the knowledgeable modifies or changes not departing from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.
Claims (10)
1. a wafer cleaning device, is characterized in that, described wafer cleaning device at least comprises:
By sidewall, surrounded the sprinkling main body of container cavity;
The sidewall of described sprinkling main body is provided with several openings; Described opening and described container cavity connect;
Described several openings are at least one line style track along described sprinkling main body axis direction;
Described in described line style track, opening spacing is each other less than 1/6 of described sprinkling principal length;
The length of described line style track is not less than 2/3 of described sprinkling principal length.
2. wafer cleaning device according to claim 1, is characterized in that: the shape of described opening comprises circle, ellipse, rectangle or bent limit shape.
3. wafer cleaning device according to claim 2, is characterized in that: described opening is the slit along described sprinkling main body axis direction.
4. wafer cleaning device according to claim 3, is characterized in that: described slit is positioned at the middle part of described sprinkling main body.
5. wafer cleaning device according to claim 2, is characterized in that: the width of described rectangular aperture or the diameter of circular open are 0.1 millimeter to 0.5 millimeter.
6. wafer cleaning device according to claim 1, is characterized in that: described line style track is straight path.
7. wafer cleaning device according to claim 6, is characterized in that: in described several openings, between adjacent two openings, spacing equates.
8. wafer cleaning device according to claim 7, it is characterized in that: described line style track is two parallel straight paths, described two parallel straight paths are to each other apart from being not more than the wherein any spacing between adjacent two openings of straight line track of formation.
9. wafer cleaning device according to claim 8, is characterized in that: the opening shape that forms described two parallel straight paths is circle or rectangle.
10. wafer cleaning device according to claim 9, is characterized in that: in described two parallel straight paths, form the wherein opening of straight line track and distribute with respect to the interleaved openings that forms another straight path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420128545.6U CN203842887U (en) | 2014-03-20 | 2014-03-20 | Cleaning device for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420128545.6U CN203842887U (en) | 2014-03-20 | 2014-03-20 | Cleaning device for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203842887U true CN203842887U (en) | 2014-09-24 |
Family
ID=51555949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420128545.6U Expired - Fee Related CN203842887U (en) | 2014-03-20 | 2014-03-20 | Cleaning device for wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203842887U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112589668A (en) * | 2019-10-01 | 2021-04-02 | 力晶积成电子制造股份有限公司 | Post-grinding cleaning device |
| CN113118951A (en) * | 2019-12-31 | 2021-07-16 | 清华大学 | Cavitation jet nozzle and wafer processing device with same |
| CN113118100A (en) * | 2019-12-31 | 2021-07-16 | 清华大学 | Wafer cleaning device and cleaning method |
-
2014
- 2014-03-20 CN CN201420128545.6U patent/CN203842887U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112589668A (en) * | 2019-10-01 | 2021-04-02 | 力晶积成电子制造股份有限公司 | Post-grinding cleaning device |
| CN113118951A (en) * | 2019-12-31 | 2021-07-16 | 清华大学 | Cavitation jet nozzle and wafer processing device with same |
| CN113118100A (en) * | 2019-12-31 | 2021-07-16 | 清华大学 | Wafer cleaning device and cleaning method |
| CN113118100B (en) * | 2019-12-31 | 2022-09-06 | 清华大学 | Wafer cleaning device and cleaning method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140924 Termination date: 20190320 |
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| CF01 | Termination of patent right due to non-payment of annual fee |