CN105080892A - Washing device and method for wafer supporting pieces - Google Patents
Washing device and method for wafer supporting pieces Download PDFInfo
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- CN105080892A CN105080892A CN201510460195.2A CN201510460195A CN105080892A CN 105080892 A CN105080892 A CN 105080892A CN 201510460195 A CN201510460195 A CN 201510460195A CN 105080892 A CN105080892 A CN 105080892A
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- wafer holder
- wafer
- cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning In General (AREA)
Abstract
The invention discloses a washing device and method for wafer supporting pieces. The washing device comprises the first set of wafer supporting pieces and the second set of wafer supporting pieces. The first set of wafer supporting pieces and the second set of wafer supporting pieces are used alternately, and when the first set of wafer supporting pieces are in the stretch-out state, the second set of wafer supporting pieces are in the retracting state, or when the first set of wafer supporting pieces are in the retracting state, the second set of wafer supporting pieces are in the stretch-out state. Due to the fact that the first set of wafer supporting pieces and the second set of wafer supporting pieces are used alternately, when wafers are supported by one set of wafer supporting pieces, the other set of wafer supporting pieces make full contact with washing liquid, the good cleanliness of the wafer supporting pieces is kept all the time, dirt on the wafer supporting pieces is prevented from contaminating the wafers, the defects of the wafers are reduced, and the yield of the wafers is increased.
Description
Technical field
The invention belongs to semiconductor crystal wafer cleaning field, relate to a kind of cleaning device and cleaning method of wafer holder.
Background technology
The deep-submicron stage is being entered into along with integrated circuit feature size, the cleanliness factor of crystal column surface required in IC wafers manufacturing process is more and more harsher, in order to ensure the cleanliness factor on wafer material surface, there is hundreds of roads matting in the manufacturing process of integrated circuit, matting account for 20% of whole manufacture process.
Tradition adopts to crystal column surface cleaning the slot type cleaning equipment that output ratio is higher, and the main wash step of cleaning equipment generally first carries out chemical liquids cleaning and dipping, then carries out clear water and cleans operation.Wafer is after chemical liquids cleaning and dipping, crystal column surface still can remain some accessory substances and chemical liquids, so follow-up clear water to clean technique particularly important, can produce at crystal column surface if do not wash clean clearly and to remain as chemical liquids or crystal column surface exists the defect of particle and so on.
In existing slot type cleaning equipment, support member is the parts for supporting wafer in rinse bath, but in Long-Time Service process, contact position between support member and wafer often forms clean dead angle, as shown in Figure 1, Fig. 1 is the structural representation of existing wafer holder, wafer 3 is supported to be positioned over by support member 2 simultaneously and fills in the rinse bath 1 of cleaning fluid, owing to often forming clean dead angle between support member 2 and wafer 3, usual meeting is more residual dirts on support member 2, and the dirt often recontamination wafer 3 remained on support member 2, cause wafer defect, cause the reduction of wafer yield.Therefore, there is the problem at clean dead angle in those skilled in the art's existing wafer holder urgently to be resolved hurrily, improves the cleanliness factor of wafer.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of cleaning device and cleaning method of wafer holder, solves the problem that existing wafer holder exists clean dead angle, improves the cleanliness factor of wafer.
In order to solve the problems of the technologies described above, the invention provides a kind of cleaning device of wafer holder, comprise the rinse bath for cleaning semiconductor crystal wafer,
First group of wafer holder, be located in described rinse bath, and the stretching motion of vertical direction can be done in described rinse bath, when described first group of wafer holder is in and stretches out state, it is for supporting wafer, during described first group of wafer holder contraction state, it fully contacts with the cleaning fluid in described rinse bath, to remove its surface smut;
Second group of wafer holder, be located in described rinse bath, and the stretching motion of vertical direction can be done in described rinse bath, when described second group of wafer holder is in and stretches out state, it is for supporting wafer, during described second group of wafer holder contraction state, it fully contacts with the cleaning fluid in described rinse bath, to remove its surface smut;
Wherein, be used alternatingly first group of wafer holder and second group of wafer holder, when first group of wafer holder be in stretch out state time, then second group of wafer holder is in contraction state, or when first group of wafer holder is in contraction state, then second group of wafer holder is in the state of stretching out.
Preferably, described first group of wafer holder and second group of wafer holder include multiple support member for supporting wafer.
Preferably, the quantity of described first group of wafer holder and second group of wafer holder is equal.
Preferably, described first group of wafer holder and second group of wafer holder are evenly distributed in the edge of wafer.
Preferably, the edge of described first group of wafer holder and the spaced distribution wafer of second group of wafer holder.
Preferably, be provided with cleaning shower nozzle in described rinse bath, described cleaning shower nozzle is used for described first group of wafer holder or second group of wafer holder jet cleaning liquid.
Preferably, described cleaning shower nozzle is provided with valve for regulating the flow of cleaning fluid.
The present invention also provides a kind of cleaning method of wafer holder, comprises the following steps:
S01, in first group of wafer cleaning operation process, first group of wafer holder is stretched out and supporting wafer, and second group of wafer holder is shunk and also fully contacted with cleaning fluid, to remove the dirt in second group of wafer holder;
S02, in second group of wafer cleaning operation process, second group of wafer holder is stretched out and supporting wafer, and first group of wafer holder is shunk and also fully contacted with cleaning fluid, to remove the dirt in first group of wafer holder;
S03, in subsequent wafer washing and cleaning operation process, be used alternatingly first group of wafer holder and second group of wafer holder, until complete subsequent wafer washing and cleaning operation.
Preferably, after described first group of wafer holder and second group of wafer holder fully contact with cleaning fluid, and by ultra-pure water, the cleaning fluid on its surface is removed.
Compared with existing scheme, the cleaning device of wafer holder provided by the invention and cleaning method, by being used alternatingly first group of wafer holder and second group of wafer holder, when group wafer holder of is wherein in supporting wafer state, another group wafer holder then fully contacts with cleaning fluid, and the cleannes making wafer holder remain good, avoid the dirt immune wafer in wafer holder, reduce wafer defect, improve the yield of wafer.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of existing wafer holder;
The structural representation of the using state of Fig. 2 the present invention first group of wafer holder;
The structural representation of the using state of Fig. 3 the present invention second group of wafer holder.
In figure, Reference numeral is:
1, rinse bath; 2, support member; 3, wafer; 4, first group of wafer holder; 5, second group of wafer holder.
Detailed description of the invention
For making the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, embodiments of the present invention are described in further detail.Those skilled in the art the content disclosed by this description can understand other advantages of the present invention and effect easily.The present invention can also be implemented or be applied by detailed description of the invention different in addition, and the every details in this description also can based on different viewpoints and application, carries out various modification or change not deviating under spirit of the present invention.
Above-mentioned and other technical characteristic and beneficial effect, by conjunction with the embodiments and the cleaning device of accompanying drawing 2-3 to wafer holder of the present invention be described in detail.
As Figure 2-3, the invention provides a kind of cleaning device of wafer holder, comprising rinse bath 1, the first group of wafer holder 4 for cleaning semiconductor crystal wafer and second group of wafer holder 5.Concrete, first group of wafer holder 4 is located in described rinse bath 1, and the stretching motion of vertical direction can be done in rinse bath 1, when first group of wafer support 4 is in and stretches out state, it is for supporting wafer 3, during first group of wafer holder 4 contraction state, it fully contacts with the cleaning fluid in rinse bath, to remove its surface smut.Same, second group of wafer holder 5 is also located in rinse bath 1, and the stretching motion of vertical direction can be done in rinse bath 1, when second group of wafer holder 5 is in and stretches out state, it is for supporting wafer 3, during second group of wafer holder 5 contraction state, it fully contacts with the cleaning fluid in rinse bath 1, to remove its surface smut.
The present invention is in order to keep the cleannes of wafer holder, be used alternatingly first group of wafer holder 4 and second group of wafer holder 5, when first group of wafer holder 4 be in stretch out state time, then second group of wafer holder 5 is in contraction state, or when first group of wafer holder 4 is in contraction state, then second group of wafer holder 5 is in the state of stretching out.
By being used alternatingly first group of wafer holder 4 and second group of wafer holder 5, when group wafer holder of is wherein in supporting wafer 3 state, another group wafer holder then fully contacts with cleaning fluid, makes the cleannes that wafer holder remains good.
Concrete, in the present embodiment, first group of wafer holder 4 and second group of wafer holder 5 include multiple support member for supporting wafer.In preferred version, the quantity of first group of wafer holder 4 and second group of wafer holder 5 is equal, can be evenly distributed in the edge of wafer 3 simultaneously.
Meanwhile, stressed more even in order to what make wafer 3, the edge of first group of wafer holder 4 and the spaced distribution wafer 3 of second group of wafer holder 5.
In order to improve the cleanliness factor of wafer holder further, also can be provided with cleaning shower nozzle (not shown) in rinse bath 1, cleaning shower nozzle is used for first group of wafer holder 4 or second group of wafer holder 5 jet cleaning liquid.In addition, clean shower nozzle and be provided with valve for regulating the flow of cleaning fluid, better to regulate the flow and impulsive force that spray to wafer holder.
The present invention also provides a kind of cleaning method of wafer holder, comprises the following steps:
S01, in first group of wafer cleaning operation process, first group of wafer holder 4 is stretched out and supporting wafer 3, second group of wafer holder 5 is shunk and fully contact with cleaning fluid, to remove the dirt in second group of wafer holder 5;
S02, in second group of wafer cleaning operation process, second group of wafer holder 5 is stretched out and supporting wafer 3, first group of wafer holder 4 is shunk and fully contact with cleaning fluid, to remove the dirt in first group of wafer holder 4;
S03, in subsequent wafer washing and cleaning operation process, be used alternatingly first group of wafer holder 4 and second group of wafer holder 5, until complete wafer cleaning operation.
Cleaning fluid in the present invention comprises chemical liquid or ultra-pure water, after first group of wafer holder 4 or second group of wafer holder 5 fully contact with chemical liquid, then is removed by the chemical liquid on its surface by ultra-pure water.
In sum, the cleaning device of wafer holder provided by the invention and cleaning method, by being used alternatingly first group of wafer holder 4 and second group of wafer holder 5, when group wafer holder of is wherein in supporting wafer state, another group wafer holder then fully contacts with cleaning fluid, and the cleannes making wafer holder remain good, avoid the dirt immune wafer in wafer holder, reduce wafer defect, improve the yield of wafer.
Above-mentioned explanation illustrate and describes some preferred embodiments of the present invention, but as previously mentioned, be to be understood that the present invention is not limited to the form disclosed by this paper, should not regard the eliminating to other embodiments as, and can be used for other combinations various, amendment and environment, and can in invention contemplated scope described herein, changed by the technology of above-mentioned instruction or association area or knowledge.And the change that those skilled in the art carry out and change do not depart from the spirit and scope of the present invention, then all should in the protection domain of claims of the present invention.
Claims (9)
1. a cleaning device for wafer holder, comprising the rinse bath for cleaning semiconductor crystal wafer, it is characterized in that,
First group of wafer holder, be located in described rinse bath, and the stretching motion of vertical direction can be done in described rinse bath, when described first group of wafer holder is in and stretches out state, it is for supporting wafer, during described first group of wafer holder contraction state, it fully contacts with the cleaning fluid in described rinse bath, to remove its surface smut;
Second group of wafer holder, be located in described rinse bath, and the stretching motion of vertical direction can be done in described rinse bath, when described second group of wafer holder is in and stretches out state, it is for supporting wafer, during described second group of wafer holder contraction state, it fully contacts with the cleaning fluid in described rinse bath, to remove its surface smut;
Wherein, be used alternatingly first group of wafer holder and second group of wafer holder, when first group of wafer holder be in stretch out state time, then second group of wafer holder is in contraction state, or when first group of wafer holder is in contraction state, then second group of wafer holder is in the state of stretching out.
2. the cleaning device of wafer holder according to claim 1, is characterized in that, described first group of wafer holder and second group of wafer holder include multiple support member for supporting wafer.
3. the cleaning device of wafer holder according to claim 2, is characterized in that, the quantity of described first group of wafer holder and second group of wafer holder is equal.
4. the cleaning device of wafer holder according to claim 2, is characterized in that, described first group of wafer holder and second group of wafer holder are evenly distributed in the edge of wafer.
5. the cleaning device of wafer holder according to claim 2, is characterized in that, the edge of described first group of wafer holder and the spaced distribution wafer of second group of wafer holder.
6. the cleaning device of wafer holder according to claim 1, is characterized in that, is provided with cleaning shower nozzle in described rinse bath, and described cleaning shower nozzle is used for described first group of wafer holder or second group of wafer holder jet cleaning liquid.
7. the cleaning device of wafer holder according to claim 6, is characterized in that, described cleaning shower nozzle is provided with valve for regulating the flow of cleaning fluid.
8., according to the cleaning method of the arbitrary described wafer holder of claim 1 ~ 7, it is characterized in that, comprise the following steps:
S01, in first group of wafer cleaning operation process, first group of wafer holder is stretched out and supporting wafer, and second group of wafer holder is shunk and also fully contacted with cleaning fluid, to remove the dirt in second group of wafer holder;
S02, in second group of wafer cleaning operation process, second group of wafer holder is stretched out and supporting wafer, and first group of wafer holder is shunk and also fully contacted with cleaning fluid, to remove the dirt in first group of wafer holder;
S03, in subsequent wafer washing and cleaning operation process, be used alternatingly first group of wafer holder and second group of wafer holder, until complete subsequent wafer washing and cleaning operation.
9. the cleaning method of wafer holder according to claim 8, is characterized in that, after described first group of wafer holder and second group of wafer holder fully contact with cleaning fluid, and is removed by the cleaning fluid on its surface by ultra-pure water.
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CN201510460195.2A CN105080892B (en) | 2015-07-30 | 2015-07-30 | A kind of cleaning device and cleaning method of wafer holder |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111081603A (en) * | 2019-11-25 | 2020-04-28 | 北京北方华创微电子装备有限公司 | Wafer cleaning equipment and wafer cleaning method |
CN111326448A (en) * | 2018-12-13 | 2020-06-23 | 夏泰鑫半导体(青岛)有限公司 | Semiconductor cleaning device |
CN113675113A (en) * | 2021-08-20 | 2021-11-19 | 华海清科股份有限公司 | Horizontal wafer cleaning device and cleaning method |
CN115815198A (en) * | 2022-11-30 | 2023-03-21 | 西安奕斯伟材料科技有限公司 | Cleaning device |
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GB2349742A (en) * | 1999-04-01 | 2000-11-08 | Nec Corp | Method and apparatus for processing a wafer to remove an unnecessary substance therefrom |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111326448A (en) * | 2018-12-13 | 2020-06-23 | 夏泰鑫半导体(青岛)有限公司 | Semiconductor cleaning device |
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CN113675113A (en) * | 2021-08-20 | 2021-11-19 | 华海清科股份有限公司 | Horizontal wafer cleaning device and cleaning method |
CN113675113B (en) * | 2021-08-20 | 2024-04-05 | 华海清科股份有限公司 | Wafer horizontal cleaning device and cleaning method |
CN115815198A (en) * | 2022-11-30 | 2023-03-21 | 西安奕斯伟材料科技有限公司 | Cleaning device |
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