CN203800080U - LED display unit module capable of eliminating stroboscopic dazzle light - Google Patents
LED display unit module capable of eliminating stroboscopic dazzle light Download PDFInfo
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- CN203800080U CN203800080U CN201420181485.4U CN201420181485U CN203800080U CN 203800080 U CN203800080 U CN 203800080U CN 201420181485 U CN201420181485 U CN 201420181485U CN 203800080 U CN203800080 U CN 203800080U
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- led
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- packaging
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- unit module
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- 235000012431 wafers Nutrition 0.000 claims abstract description 95
- 238000004806 packaging method and process Methods 0.000 claims abstract description 57
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000010410 layer Substances 0.000 claims description 42
- 230000005496 eutectics Effects 0.000 claims description 17
- 239000000843 powder Substances 0.000 claims description 11
- 239000012790 adhesive layer Substances 0.000 claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 238000004891 communication Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 4
- 238000004020 luminiscence type Methods 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 abstract 8
- 230000017525 heat dissipation Effects 0.000 abstract 6
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 230000008030 elimination Effects 0.000 description 8
- 238000003379 elimination reaction Methods 0.000 description 8
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- 230000006870 function Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002161 passivation Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 108010076504 Protein Sorting Signals Proteins 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
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- 238000001514 detection method Methods 0.000 description 1
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- 230000006872 improvement Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
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- 229920001296 polysiloxane Polymers 0.000 description 1
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Abstract
The utility model relates to an LED display unit module capable of eliminating stroboscopic dazzle light. The LED display unit module comprises a packaging substrate, a wafer support, a bonding layer, an interface device, multiple LED wafers, a special integrated circuit chip, a heat dissipation layer and a heat dissipation cover plate. The packaging substrate is arranged in the wafer support, and the multiple LED wafers are arranged on the top surface of the packaging substrate in an upside-down mounting mode and are connected with the packaging substrate through the bonding layer; the special integrated circuit chip is arranged on the bottom surface of the packaging substrate in an upside-down mounting mode and is fixed to the wafer support through the heat dissipation layer and the heat dissipation cover plate; the interface device is arranged in the wafer support between the bottom surface of the packaging substrate and the heat dissipation cover plate and is exposed outwards through an opening in the heat dissipation cover plate; the LED wafers are provided with a phosphor layer at the top light emitting surface for enhancing the luminescence inertia of the LED wafers; the multiple LED wafers are electrically connected with the special integrated circuit chip through the bonding layer and the packaging substrate; and the packaging substrate is electrically connected with an external circuit though the interface device.
Description
Technical field
The utility model relates to semiconductor applications, relates in particular to a kind of LED display unit module of eliminating stroboscopic and dazzling light.
Background technology
The application of semiconductor light-emitting-diode (LED, Light Emitting Diode) has jumbo expansion in this year, and wherein, the market of tool potentiality at the soonest of growing up is application backlight of LCDs (LCD).Between several years, white light-emitting diode is general gradually along with the application backlight of small display screen, and the color liquid crystal panel in current nearly all mobile phone all provides backlight by light-emitting diode.Along with improving constantly of LED Display Technique, the quality that people show for LED, the comfort level of watching has also had further requirement.
The resolution of human eye can reach 5.67 hundred million picture element densities, colourity between pixel and the pixel of all objects of therefore watching by human eye and luminosity are all successional and transition change gradually, can there is not flex point or sudden change, Just because of this, human eye watches object can feel very comfortable under natural daylight.But in the processing of general pattern at present, when image is reproduced in reduction, be mostly to take digital technology to process transmission, storage, the technology such as display driver, and in light emitting display body part, such as TFT or LED, the good MOSFET of the selector switch characteristic of all trying one's best or LED, can between playing, signal sequence have good quick switching characteristic, but this can cause the colourity of show image and the sudden change of luminosity, cause human eye watching a period of time after sensation fatigue, there is uncomfortable sensation.
Utility model content
The purpose of this utility model is to provide a kind of LED display unit module that can eliminate stroboscopic and dazzle light that can overcome above-mentioned defect.
The utility model provides a kind of LED display unit module of eliminating stroboscopic and dazzling light, it is characterized in that comprising: base plate for packaging, chip support, adhesive layer, interface arrangement, multiple LED wafer, dedicated IC chip, heat dissipating layer and heat-dissipating cover plate;
Described base plate for packaging is arranged in described chip support, and described multiple LED flip-chip are arranged at the end face of described base plate for packaging, is connected with described base plate for packaging by described adhesive layer; Described dedicated IC chip upside-down mounting is arranged at the bottom surface of described base plate for packaging, is fixed in described chip support by described heat dissipating layer and heat-dissipating cover plate; Described interface arrangement is arranged in the chip support between bottom surface and the described heat-dissipating cover plate of described base plate for packaging, and exposes by the outward opening having on described heat-dissipating cover plate; Described LED wafer has phosphor powder layer on the exiting surface of top, for increasing the luminous inertia of described LED wafer;
Described multiple LED wafer is electrically connected with described dedicated IC chip by described adhesive layer and described base plate for packaging; Described base plate for packaging is electrically connected with external circuit by described interface arrangement.
Preferably, described LED display unit module also comprises:
Diaphragm, has optical grating structure, is covered on the top exiting surface of described multiple LED wafers.
Preferably, described LED display unit module also comprises:
Fixture, described heat-dissipating cover plate is anchored on described chip support by described fixture.
Preferably, described chip support specifically comprises:
Multiple second grooves of the first groove of accommodating described dedicated IC chip and accommodating described multiple LED wafers.
Preferably, described multiple LED wafer is specially:
The red wafer of multiple LED, the green wafer of multiple LED and the blue wafer of multiple LED; The synthetic many group wafer cells of the red wafer of described multiple LED, the green wafer of multiple LED and the blue wafer set of multiple LED, each group wafer cell comprises the red wafer of one or more LED, the green wafer of one or more LED and the blue wafer of one or more LED.
Further preferably, the red wafer of described multiple LED, the green wafer of described multiple LED and the blue wafer of described multiple LED are LED eutectic wafer.
Further preferably, between the center of described many group wafer cells, be equally spaced.
Preferably, described base plate for packaging comprises at least two circuit layers and at least one insulating medium layer, isolates, and be electrically connected by the through hole of described insulating medium layer between every two-layer described circuit layer by insulating medium layer.
Preferably, described base plate for packaging also comprises packaging solder ball.
Preferably, described interface arrangement is the USB interface of compatible power supply and data communication, is connected by cementing and described base plate for packaging.
Elimination stroboscopic of the present utility model is dazzled the LED display unit module of light, by increasing coating phosphor powder layer at LED wafer on the exiting surface of top, thereby passivation the luminous sudden change causing from the switching characteristic of digital signal and the switching characteristic of LED wafer, effectively weaken the light of dazzling that LED numeral shows the switch stroboscopic that produces, strengthened the comfort level that human eye is watched.
Brief description of the drawings
The elimination stroboscopic that Fig. 1 provides for the utility model embodiment is dazzled the profile of the LED display unit module of light;
The phosphor powder layer that Fig. 2 provides for the utility model embodiment changes the effect schematic diagram of the characteristics of luminescence of LED wafer;
The elimination stroboscopic that Fig. 3 provides for the utility model embodiment is dazzled the chip support of LED display unit module and the generalized section of base plate for packaging of light;
The elimination stroboscopic that Fig. 4 provides for the utility model embodiment is dazzled the front view of the LED display unit module of light;
The elimination stroboscopic that Fig. 5 provides for the utility model embodiment is dazzled the rearview of the LED display unit module of light.
Embodiment
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Elimination stroboscopic of the present utility model is dazzled the LED display unit module of light, is mainly used in LED display, Ultra fine pitch LED display, super-high density LED display, the just luminous TV of LED, the just luminous monitor of LED, LED video wall, LED instruction, the display floater manufacture in the fields such as LED special lighting.
Fig. 1 is the profile that elimination stroboscopic that the utility model embodiment provides is dazzled the LED display unit module of light.As shown in Figure 1, LED display unit module comprises: base plate for packaging 4, chip support 3, adhesive layer 11, interface arrangement 6, multiple LED wafer 2, dedicated IC chip 9, heat dissipating layer 8 and heat-dissipating cover plate 10;
Base plate for packaging 4 is arranged in chip support 3, and multiple LED wafers 2 directly weld (Direct Attach, DA) eutectic upside-down mounting and are arranged at the end face of base plate for packaging 4, are connected with base plate for packaging 4 by adhesive layer 11; Dedicated IC chip 9 upside-down mountings are arranged at the bottom surface of base plate for packaging 4, by BGA technique or utilize adhesive layer technique to be connected with base plate for packaging 4, and assist dedicated IC chip 9 to dispel the heat by heat dissipating layer 8 and heat-dissipating cover plate 10; Interface arrangement 6 is arranged in the chip support 3 between bottom surface and the heat-dissipating cover plate 10 of base plate for packaging 4, and by the opening 101 that has on heat-dissipating cover plate 10 to exposing outside;
Wherein, LED wafer 2 has phosphor powder layer 21 on the exiting surface of top.The light that phosphor powder layer 21 sends LED wafer 2, realizes secondary by phosphor powder layer 21 luminous.The feature that phosphor powder is pulled the trigger light is can not suddenly change, thus passivation the luminous sudden change causing from the switching characteristic of digital signal and the switching characteristic of LED wafer.Increase thus the luminous inertia of LED wafer, effectively weakened the light of dazzling that LED numeral shows the switch stroboscopic that produces, strengthened the comfort level that human eye is watched.
The effect of improving the characteristics of luminescence by employing phosphor powder layer 21 can be as shown in Figure 2, employing has the LED wafer 2 of phosphor powder layer 21, can effectively improve the steepness of trailing edge and the rising edge of digital signal waveform, make shutoff or the unlatching of LED light be gradual process, therefore also contribute to eliminate the dazzle of LED stroboscopic.
Multiple LED wafers 2 are electrically connected with dedicated IC chip 9 by adhesive layer 11 and base plate for packaging 4; Base plate for packaging 4 is electrically connected with external circuit by interface arrangement 6.Interface arrangement 6 can be the USB interface of standard USB interface or compatible power supply and data communication.Interface arrangement 6 is connected with base plate for packaging 4 by cementing.
In conjunction with the generalized section of the chip support shown in Fig. 3 and base plate for packaging, chip support 3 is elaborated.
The silicones injection moulding that chip support 3 adopts high machinery and thermodynamic stability and has good dielectric property is made, or uses other satisfactory die-casting material die casting to make.Specifically comprise: multiple the second grooves 32 and the packaging solder ball 33 of the first groove 31 of accommodating dedicated IC chip, accommodating multiple LED wafers.
Concrete, LED wafer of the present utility model comprises the red wafer of LED, the green wafer of LED and the blue wafer of LED, they are preferably LED eutectic wafer, are welded on the pixel sides of PCB multilayer printed circuit board by eutectic.Because LED eutectic wafer does not re-use the integrated operations of traditional LED such as die bond, routing welding in its production technology, therefore can adopt disposable its dress on base plate for packaging 4 that completes of die bond ultrasonic seamless bonding machine to paste and welding sequence.Meanwhile, the dustproof transparence processing of protection against the tide having completed in the processing procedure of itself due to LED eutectic wafer, so also saved traditional LED packaging process.Therefore, adopt the LED display unit module of the present utility model of LED eutectic wafer can save a large amount of manufacturing costs, simultaneously also for display panel rate of finished products, stability, non-maintaining in the long life provide good technology and technique to ensure.
The accommodating one group of LED wafer set of each second groove 32.Concrete, above-mentioned the second groove 32 rules are arranged, preferred, are equidistant arrangement, and each group wafer at least comprises the red wafer of an eutectic LED, a green wafer of eutectic LED and a blue wafer of eutectic LED.In the front view shown in Fig. 4, provide the example that every group of wafer comprises the red wafer of an eutectic LED, a green wafer of eutectic LED and a blue wafer of eutectic LED.In other examples, also can have and comprise the redness of unnecessary or the possibility of green or blue led wafer, even can comprise the eutectic wafer of other color.Putting in order of LED eutectic wafer in every group of wafer can be identical with mode, can be also different.
Base plate for packaging 4 also has multiple packaging solder ball 33; Packaging solder ball 33 is the pad of dedicated IC chip face-down bonding on base plate for packaging 4.
Base plate for packaging 4 comprises at least two circuit layer (not shown)s and at least one insulating medium layer (not shown), isolates, and be electrically connected by the through hole of described insulating medium layer between every two-tier circuit layer by insulating medium layer.
Concrete, the circuit layer of base plate for packaging 4 is that multilayer vapor deposition forms, and can be two-layer, four layers, six layers or other numbers of plies, insulating barrier is preferably highly purified resin medium, insulate bonding between adjacent circuit layer by insulating barrier.Between each circuit layer by various guide hole (not shown)s of arranging in advance or the staggered electric connection of blind hole (not shown).After crimping moulding, a side of base plate for packaging 4 be pixel sides for welding LED wafer, opposite side is circuit side, for welding other necessary circuit, data-interface and processing module.In the present embodiment, be preferably the dedicated IC chip 9 that welding has video communication control circuit and power circuit function.The base plate for packaging 4 of the present embodiment is high-density integrated, has good bending resistance tensile strength and evenness.
Again as shown in Figure 1, in interface arrangement 6, there is the electric connection line (not shown) that connects external circuit, for example electric wire, contact pin or the other forms of electric connection line for being electrically connected.The multiple LED wafers 2 of upside-down mounting on base plate for packaging 4 are connected with the electric connection line in interface arrangement 6 by base plate for packaging 4 with dedicated IC chip 9, thereby realize and being electrically connected of external circuit.
Between heat-dissipating cover plate 10 and dedicated IC chip 9, also have heat dissipating layer 8, preferred, heat dissipating layer 8 is made for silicon thermal paste; Heat-dissipating cover plate 10 is aluminium cover plate.
The utility model LED display unit module also comprises fixture 7, preferred, and this fixture 7 can be that magnetic is installed inserts, can certainly adopt the installation inserts of other modes as fixture 7.Heat-dissipating cover plate 10 is anchored on chip support 3 by fixture 7.
The utility model LED display unit module also comprises diaphragm 1, is covered on multiple LED wafers.
Concrete, protection mould 1 is preferably the diaphragm that has optical grating function concurrently.
In the time of the above-mentioned LED display unit module of integrated the present invention, first on the chip support 3 that is cast with base plate for packaging 4, adopt surface mounting technology (Surface Mounted Technology burying, SMT) or adhesive bonding technique be pasted into the multiple LED wafers 2 of eutectic upside-down mounting, replant into upside-down mounting dedicated IC chip 9, after electrical detection is confirmed, silicon-coating thermal paste on dedicated IC chip 9, forms heat dissipating layer 8, and heat-dissipating cover plate 10 is pasted in above-mentioned silicon thermal paste.Finally, after said modules is clean, stick in the one side with multiple LED wafers 2 and chip support 3 diaphragm 1 that has optical grating function concurrently.The front view of the LED display unit module after integrated and rearview are respectively as shown in Figure 4, Figure 5.
Elimination stroboscopic of the present utility model is dazzled the LED display unit module of light, by increasing coating phosphor powder layer at LED wafer on the exiting surface of top, thereby passivation the luminous sudden change causing from the switching characteristic of digital signal and the switching characteristic of LED wafer, effectively weaken the light of dazzling that LED numeral shows the switch stroboscopic that produces, strengthened the comfort level that human eye is watched.
Above-described embodiment; the purpose of this utility model, technical scheme and beneficial effect are further described; institute is understood that; the foregoing is only embodiment of the present utility model; and be not used in limit protection range of the present utility model; all within spirit of the present utility model and principle, any amendment of making, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (10)
1. eliminate stroboscopic and dazzle a LED display unit module for light, it is characterized in that, comprising: base plate for packaging, chip support, adhesive layer, interface arrangement, multiple LED wafer, application-specific integrated circuit (ASIC) core, heat dissipating layer and heat-dissipating cover plate;
Described base plate for packaging is arranged in described chip support, and described multiple LED flip-chip are arranged at the end face of described base plate for packaging, is connected with described base plate for packaging by described adhesive layer; Described dedicated IC chip upside-down mounting is arranged at the bottom surface of described base plate for packaging, is fixed in described chip support by described heat dissipating layer and described heat-dissipating cover plate; Described interface arrangement is arranged in the chip support between bottom surface and the described heat-dissipating cover plate of described base plate for packaging, and exposes by the outward opening having on described heat-dissipating cover plate; Described LED wafer has phosphor powder layer on the exiting surface of top, for increasing the luminous inertia of described LED wafer;
Described multiple LED wafer is electrically connected with described dedicated IC chip by described adhesive layer and described base plate for packaging; Described base plate for packaging is electrically connected with external circuit by described interface arrangement.
2. LED display unit module according to claim 1, is characterized in that, described LED display unit module also comprises:
Diaphragm, has optical grating structure, is covered on the top exiting surface of described multiple LED wafers.
3. LED display unit module according to claim 1, is characterized in that, described LED display unit module also comprises:
Fixture, described heat-dissipating cover plate is anchored on described chip support by described fixture.
4. LED display unit module according to claim 1, is characterized in that, described chip support specifically comprises:
Multiple second grooves of the first groove of accommodating described dedicated IC chip and accommodating described multiple LED wafers.
5. LED display unit module according to claim 1, is characterized in that, described multiple LED wafers are specially:
The red wafer of multiple LED, the green wafer of multiple LED and the blue wafer of multiple LED; The synthetic many group wafer cells of the red wafer of described multiple LED, the green wafer of multiple LED and the blue wafer set of multiple LED, each group wafer cell comprises the red wafer of one or more LED, the green wafer of one or more LED and the blue wafer of one or more LED.
6. LED display unit module according to claim 5, is characterized in that, the red wafer of described multiple LED, the green wafer of described multiple LED and the blue wafer of described multiple LED are LED eutectic wafer.
7. LED display unit module according to claim 5, is characterized in that, between the center of described many group wafer cells, is equally spaced.
8. LED display unit module according to claim 1, it is characterized in that, described base plate for packaging comprises at least two circuit layers and at least one insulating medium layer, isolates, and be electrically connected by the through hole of described insulating medium layer between every two-layer described circuit layer by insulating medium layer.
9. LED display unit module according to claim 1, is characterized in that, described base plate for packaging also comprises packaging solder ball.
10. LED display unit module according to claim 1, is characterized in that, described interface arrangement is the USB interface of compatible power supply and data communication, is connected by cementing and described base plate for packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420181485.4U CN203800080U (en) | 2014-04-15 | 2014-04-15 | LED display unit module capable of eliminating stroboscopic dazzle light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420181485.4U CN203800080U (en) | 2014-04-15 | 2014-04-15 | LED display unit module capable of eliminating stroboscopic dazzle light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203800080U true CN203800080U (en) | 2014-08-27 |
Family
ID=51382273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420181485.4U Expired - Lifetime CN203800080U (en) | 2014-04-15 | 2014-04-15 | LED display unit module capable of eliminating stroboscopic dazzle light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203800080U (en) |
-
2014
- 2014-04-15 CN CN201420181485.4U patent/CN203800080U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160804 Address after: 214100, Jiangsu, Wuxi Province, high road, Binhu District No. 999 (software R & D building) Patentee after: HUANSHI ADVANCED DIGITAL DISPLAY WUXI CO.,LTD. Address before: 100097 room B1F, unit four, building No. three, Far East Road, Haidian District, Beijing Patentee before: Yan Min Patentee before: Cheng Jun Patentee before: Zhou Mingbo |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140827 |