CN203733919U - Filter device based on gluing cover plate - Google Patents
Filter device based on gluing cover plate Download PDFInfo
- Publication number
- CN203733919U CN203733919U CN201320804466.8U CN201320804466U CN203733919U CN 203733919 U CN203733919 U CN 203733919U CN 201320804466 U CN201320804466 U CN 201320804466U CN 203733919 U CN203733919 U CN 203733919U
- Authority
- CN
- China
- Prior art keywords
- cover plate
- filter
- plate assembly
- self
- composite material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004026 adhesive bonding Methods 0.000 title claims abstract description 12
- 239000002131 composite material Substances 0.000 claims abstract description 19
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 13
- 239000003292 glue Substances 0.000 claims abstract description 13
- 229910052709 silver Inorganic materials 0.000 claims abstract description 13
- 239000004332 silver Substances 0.000 claims abstract description 13
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 238000005476 soldering Methods 0.000 claims abstract description 5
- 238000003466 welding Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000003754 machining Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 6
- 238000013461 design Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 241000500881 Lepisma Species 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Disclosed is a filter device based on a gluing cover plate. The filter device comprises a filter chamber and a cover plate assembly. The cover plate assembly is firmly fixed and pasted to the filter chamber through conductive silver glue. The cover plate assembly comprises a composite material plate whose upper and lower surfaces are coated by copper layers. The cover plate assembly is provided with a blind nut and a tuning self-locking screw. The tuning self-locking screw is connected to the blind nut through a thread. The cover plate of the filter is improved, so that machining process for manufacturing the cover plate is greatly shortened, the nut is welded onto the composite material plate in a reflow soldering or other welding modes without blinding. Since the blinding process is omitted, the flatness of the cover plate is greatly improved. The whole composite material cover plate is connected and pasted to the filter chamber through the conductive silver glue, so as to achieve the effects of touching the ground and improving the seal performance of the whole device, and eliminate electromagnetic leakage. Thus, signal adjusting quality is effectively improved.
Description
Technical field
The utility model relates to signal process field, particularly a kind of filter apparatus based on can gluing cover plate.
Background technology
The cover plate of the traditional filter using is at present in the process pressing, can produce larger distortion, in order to ensure the quality of regulation of signal, need to adjust the evenness of cover plate, therefore in the time of design, adopted a large amount of attachment screws, thereby make the design process of filter cavity and cover plate and processing technology comparatively complicated, also just increased the cost of filter, increased weight.
Utility model content
The purpose of this utility model is to overcome the shortcoming of prior art with not enough, and a kind of filter apparatus based on can gluing cover plate is provided.
The technical solution adopted in the utility model is:
A kind of filter of composite material cover plate: comprise filter cavity and cover plate assembly, described cover plate assembly is adhesively fixed and is fixed on filter cavity by conductive silver glue, described cover plate assembly is that upper and lower two surfaces arrange the composite panel that covers copper layer, this cover plate group is provided with self-clinching nut and tuning self-locking screw, and described tuning self-locking screw is connected with self-clinching nut by screw thread.
Preferably, described self-clinching nut welds on the cover board by Reflow Soldering or other welding manners.
The utility model has following advantage and effect with respect to prior art:
1, the cover plate of filter described in the utility model, for covering carbon/carbon-copper composite material cover plate, can effectively shorten the technical process of making cover plate, and nut, without pressing, adopts Reflow Soldering or other welding manners to be directly welded on composite panel.
2, the utility model is owing to there is no the process of pressing, the evenness of cover plate can improve greatly, whole composite material cover plate is connected with the cavity of filter by the gluing mode of conductive silver glue, both can play the effect of ground connection, can improve again the sealing property of whole device, stop electromagnetic leakage, therefore can improve the quality of Signal Regulation.
3, the utility model is connected with cavity because composite material cover plate adopts the gluing mode of conductive silver glue, also just can save all trip bolts, also can save the screwed hole on trip bolt via hole and the cavity on cover plate, therefore can greatly reduce the cost of filter, and can weight reduction.
4, filter cavity of the present utility model is due to the simplification of described cover plate assembly, and its Design and manufacture process can be ignored the problem how to be connected with cover plate, thereby greatly reduces research and development, the manufacturing cost of filter.
Brief description of the drawings
Fig. 1 is blast structural representation of the present utility model;
Fig. 2 is cutaway view of the present utility model;
Fig. 3 is Fig. 2 partial enlarged drawing.
Embodiment
Below in conjunction with embodiment and accompanying drawing, the utility model is described in further detail, but execution mode of the present utility model is not limited to this.
As shown in Figure 1 and Figure 2, the filter apparatus based on can gluing cover plate of the present embodiment, comprise filter cavity 5 and cover plate assembly, described cover plate assembly is arranged on filter cavity 5, also comprise and cover copper layer 2, composite panel 3, self-clinching nut 4, tuning self-locking screw 1, described two surfaces up and down of covering copper layer 2 and arranging composite panel 3, described self-clinching nut 4 is arranged on composite panel 3, described tuning self-locking screw 1 is connected with self-clinching nut 4 by screw thread, and whole composite material cover plate 3 is fastened on the cavity 5 of filter by conductive silver glue 6.
Cover plate in the present embodiment is for covering composite copper material flitch, and the object of covering copper is the conductivity in order to ensure upper and lower two surfaces of cover plate, makes cover plate and filter cavity be linked to be an entirety, the object being grounded.The more traditional aluminium sheet of composite panel has that quality is light, price is low, material evenness advantages of higher, therefore can be used as the substitute of conventional cover plate.
Self-clinching nut 4 in the present embodiment is to adopt Reflow Soldering or other welding manners to be welded to cover on composite copper material flitch 3, instead of adopts the mode pressing.Due to traditional mode that presses, can cause cover plate to produce moderate finite deformation, in order to adjust its planarization, meet the requirement of electromagnetic shielding, prevent electromagnetic leakage, need a large amount of trip bolts that cover plate is flattened, and be fastened on cavity, meanwhile, also need on cavity wall, be provided with corresponding a large amount of screw hole, so greatly increase difficulty and the CNC(Digit Control Machine Tool of design) workload of processing, the cost of whole filter, weight are increased.The mode that adopts welded nut, because welding temperature is lower, the deflection that covers composite copper material flitch 3 is very little, and the evenness of cover plate meets instructions for use.Again cover plate 3 and filter cavity 5 are fixed up by the gluing mode of conductive silver glue, have so both ensured the reliability connecting, improved again the sealing of whole device.Adopt described cover plate that can be gluing, can be by the trip bolt cancel all between composite panel 3 and filter cavity 5, thus reduce design and the processing and manufacturing cost of filter cavity, cover plate, alleviate weight, improve the competitiveness of product in market.
Described conductive silver glue 6 be a kind of solidify or dry after there is the adhesive of certain electric conductivity, it is that conducting particles is as chief component composition taking matrix resin and conductive filler conventionally, bonding effect by matrix resin combines conducting particles, form conductive path, realize by the conduction of sticky material and connecting.Because the matrix resin of conductive silver glue is a kind of adhesive, can select suitable curing temperature to carry out bonding, as epoxy resin adhesive can solidify in room temperature to 150 DEG C, 200 DEG C of above welding temperatures that connect far below tin lead welding, can effectively avoid welding material deformation, the fire damage of electronic device and the formation of internal stress that high temperature may cause.Meanwhile, due to developing rapidly of home communications industry and 4G network, the minimum pitch of the 0.65mm of slicker solder welding can not meet the actual demand that conduction connects far away, and conductive silver glue can be made slurry, realizes very high linear resolution.And conductive silver glue technique is simple, easy operating, can enhance productivity, so also avoided the environmental pollution that in tin-lead solder, heavy metal lead causes. conductive silver glue is to substitute slicker solder welding, realizes the ideal chose that conduction connects.
Above-described embodiment is preferably execution mode of the utility model; but execution mode of the present utility model is not restricted to the described embodiments; other any do not deviate from change, the modification done under Spirit Essence of the present utility model and principle, substitutes, combination, simplify; all should be equivalent substitute mode, within being included in protection range of the present utility model.
Claims (2)
1. the filter apparatus based on can gluing cover plate, comprise filter cavity and cover plate assembly, it is characterized in that: described cover plate assembly is adhesively fixed and is fixed on filter cavity by conductive silver glue, described cover plate assembly is that upper and lower two surfaces arrange the composite panel that covers copper layer, this cover plate group is provided with self-clinching nut and tuning self-locking screw, described tuning self-locking screw is connected with self-clinching nut by screw thread, and self-clinching nut is welded on cover plate assembly.
2. the filter apparatus based on can gluing cover plate as claimed in claim 1, is characterized in that: described self-clinching nut is welded on cover plate assembly by Reflow Soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320804466.8U CN203733919U (en) | 2013-12-09 | 2013-12-09 | Filter device based on gluing cover plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320804466.8U CN203733919U (en) | 2013-12-09 | 2013-12-09 | Filter device based on gluing cover plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203733919U true CN203733919U (en) | 2014-07-23 |
Family
ID=51203966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320804466.8U Expired - Lifetime CN203733919U (en) | 2013-12-09 | 2013-12-09 | Filter device based on gluing cover plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203733919U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489997A (en) * | 2015-11-24 | 2016-04-13 | 武汉凡谷电子技术股份有限公司 | Assembling technology for metal cover board and cavity component of cavity filter |
| CN110678057A (en) * | 2019-10-09 | 2020-01-10 | 中国电子科技集团公司第十三研究所 | Filter surface grounding device and method |
-
2013
- 2013-12-09 CN CN201320804466.8U patent/CN203733919U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105489997A (en) * | 2015-11-24 | 2016-04-13 | 武汉凡谷电子技术股份有限公司 | Assembling technology for metal cover board and cavity component of cavity filter |
| CN110678057A (en) * | 2019-10-09 | 2020-01-10 | 中国电子科技集团公司第十三研究所 | Filter surface grounding device and method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140723 |
|
| CX01 | Expiry of patent term |