CN203733841U - Led封装基座 - Google Patents

Led封装基座 Download PDF

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Publication number
CN203733841U
CN203733841U CN201420124240.8U CN201420124240U CN203733841U CN 203733841 U CN203733841 U CN 203733841U CN 201420124240 U CN201420124240 U CN 201420124240U CN 203733841 U CN203733841 U CN 203733841U
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CN
China
Prior art keywords
copper
pedestal
copper pedestal
plastic cement
pedestals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201420124240.8U
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English (en)
Inventor
许良
陈浩博
江忠平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGXI TRUSTBON PHOTONICS TECHNOLOGY Co Ltd
Original Assignee
JIANGXI TRUSTBON PHOTONICS TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to CN201420124240.8U priority Critical patent/CN203733841U/zh
Application granted granted Critical
Publication of CN203733841U publication Critical patent/CN203733841U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

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  • Led Device Packages (AREA)

Abstract

一种LED封装基座，包括铜基座、塑胶，塑胶内侧面设有荧光粉层，铜基座固定在塑胶上，其特征在于，所述的铜基座分为三块，分别为左、右两侧铜基座和中间铜基座，中间铜基座上固定芯片，将芯片热量传导至与LED灯珠相接触的散热器上，两侧铜基座分别用于金线焊接和外接PCB板相连，以实现LED电气连接，两侧铜基座焊盘薄于中间铜基座。本实用新型的LED封装基座，由传统铜基座分两部分改成分三个不相连部分，使固定芯片铜基座与实现电气相连的铜焊盘分离，同时将两侧铜基座焊盘高于中间固定芯片铜基座，使中间铜基座能直接同散热器金属层紧密接触，减少中间绝缘层，传热效果大为改善。

Description

LED封装基座
技术领域
 本实用新型涉及电子元器件，尤其一种LED封装基座。
背景技术
目前SMD LED封装形式很多，但其导热基座与导电基座一体，且两者在同一平面，这样使得导热基座与散热器间存在一绝缘层，热量不易散发出去。
发明内容
本实用新型的目的就是提供一种结构简单、散热效果好的LED封装基座。
本实用新型的LED封装基座，包括铜基座、塑胶，塑胶内侧面设有荧光粉层，铜基座固定在塑胶上，其特征在于，所述的铜基座分为三块，分别为左、右两侧铜基座和中间铜基座，中间铜基座上固定芯片，将芯片热量传导至与LED灯珠相接触的散热器上，两侧铜基座分别用于金线焊接和外接PCB板相连，以实现LED电气连接，两侧铜基座焊盘薄于中间铜基座。
本实用新型的LED封装基座，由传统铜基座分两部分改成分三个不相连部分，使固定芯片铜基座与实现电气相连的铜焊盘分离，同时将两侧铜基座焊盘高于中间固定芯片铜基座，使中间铜基座能直接同散热器金属层紧密接触，减少中间绝缘层，传热效果大为改善。
附图说明
图1为本实用新型结构示意图。
具体实施方式
一种LED封装基座，包括铜基座、塑胶1，塑胶1内侧面设有荧光粉层，铜基座固定在塑胶1上，其特征在于，所述的铜基座分为三块，分别为左、右两侧铜基座4和中间铜基座2，中间铜基座2上固定芯片3，两侧铜基座4分别用于金线焊接和外接PCB板相连，两侧铜基座4的焊盘薄于中间铜基座2。

Claims (1)

1.一种LED封装基座，包括铜基座、塑胶（1），塑胶（1）内侧面设有荧光粉层，铜基座固定在塑胶（1）上，其特征在于：所述的铜基座分为三块，分别为左、右两侧铜基座（4）和中间铜基座（2），中间铜基座（2）上固定芯片（3），两侧铜基座（4）分别用于金线焊接和外接PCB板相连，两侧铜基座（4）的焊盘薄于中间铜基座（2）。
CN201420124240.8U 2014-03-19 2014-03-19 Led封装基座 Expired - Fee Related CN203733841U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201420124240.8U CN203733841U (zh) 2014-03-19 2014-03-19 Led封装基座

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201420124240.8U CN203733841U (zh) 2014-03-19 2014-03-19 Led封装基座

Publications (1)

Publication Number Publication Date
CN203733841U true CN203733841U (zh) 2014-07-23

Family

ID=51203888

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201420124240.8U Expired - Fee Related CN203733841U (zh) 2014-03-19 2014-03-19 Led封装基座

Country Status (1)

Country Link
CN (1) CN203733841U (zh)

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140723

Termination date: 20160319