CN203731112U - Lamp - Google Patents

Abstract

The utility model relates to lamps and aims to provide a lamp with a circuit unit, connected with a semiconductor lighting module, less prone to damage of power wiring. The lamp comprises the semiconductor lighting module (10) serving as a light source, a base (20), the circuit unit (40) and an insulating part (80). The semiconductor lighting module (10) is mounted on the upper surface (21) of the base (20); the circuit unit (40) is arranged below the base (20); the insulating part (80) is arranged between the base (20) and the circuit unit (40); the power wiring (44) of the circuit unit (40) is enabled to pass through cutthrough portions (26 and 84) on the base (20) and the insulating part (80) to be led out above the base (20) and then connected to an electrical terminal (14) of the semiconductor lighting module (10). The lamp is structurally characterized in that a wall (85) with the upper end protruding above the upper surface (21) of the base (20) and cutting through the cutthrough portion (26) of the base (20) extends out from the upper surface (80a) of the insulating part (80) to be positioned between the cutthrough portion (84) of the insulating part (80) and the electrical terminal (14) of the semiconductor lighting module (10), and the power wiring (44) passes across the wall (85) to be connected onto the electrical terminal (14).

Description

Lamp

Technical field

The utility model relates to the lamp taking the light emitting semiconductor module of LED module etc. as light source, specially refers to the syndeton between light emitting semiconductor module and circuit unit.

Background technology

Have at the upper surface of substrate 901 and load LED module 902 as the lamp 900 shown in Figure 12 of lamp one example in the past, and below substrate 901 structure of configuration circuit unit 903, electrical connection between LED module 902 and circuit unit 903 is mostly by making the power wiring 904,905 of circuit unit 903, export to the top of substrate 901 by through hole set in substrate 901 906,907 always, make it be connected with the electrified terminal of LED module 902, carry out.Generally speaking, as power wiring 904,905, utilize the so-called covering thread after coated the insulating coating of the surface of lead-in wire resin etc., therefore, seek the insulation between the substrate 901 that formed by the metal of aluminium etc.

Prior art

Patent documentation 1: JP 2011-82132 communique

Utility model content

Utility model summary

The problem that utility model will solve

In above-mentioned lamp 900, must be larger if the part that in power wiring 904,905, derive basad 901 top is bending as the power wiring 905 shown in Figure 12,, by the emergent light of its bending partial occlusion LED module 902, the light distribution characteristic of lamp 900 is degenerated.Therefore, preferably, power wiring 904,905 connects up and makes it not bending as far as possible, but power wiring 904,905 easily contacts with substrate 901 thus.Particularly, power wiring 904,905 easily contacts with the upper end circumference edge portion 908,909 of through hole in substrate 901 906,907.

Because substrate when lamp is lighted 901 causes relative high temperature by the heating of LED module 902, so if contacted power wiring 904,905 in substrate 901, there is the danger of power wiring 904,905 breakages such as insulating coating dissolves.Clear and definite in recent years, this breakage may cause the broken string of power wiring 904,905, and the broken string of power wiring 904,905 is one of very large reasons that decline in the lamp life-span.

Therefore, the purpose of this utility model is that a kind of not lamp of cracky of power wiring of the circuit unit being connected with light emitting semiconductor module is provided.

Solve the means of problem

The related light fixture of the utility model is standby: as the light emitting semiconductor module of light source; Substrate, loads this light emitting semiconductor module at upper surface; Circuit unit, is disposed at the below of this substrate; Insulating element, is disposed between above-mentioned substrate and foregoing circuit unit; Make the power wiring of foregoing circuit unit, derive to the top of above-mentioned substrate by the breakthrough part arranging respectively on above-mentioned substrate and insulating element, be connected on the electrified terminal of above-mentioned light emitting semiconductor module, it is characterized by, from the upper surface of above-mentioned insulating element, the breakthrough part of above-mentioned substrate is connected and upper end than the upper surface of above-mentioned substrate more upward outstanding wall portion stretch out, make it between the breakthrough part of above-mentioned insulating element and the electrified terminal of above-mentioned light emitting semiconductor module, above-mentioned power wiring strides across above-mentioned wall portion, is connected on above-mentioned electrified terminal.

Utility model effect

The related lamp of the utility model because the breakthrough part of substrate is connected and upper end than the upper surface of above-mentioned substrate more upward outstanding wall portion between the breakthrough part of insulating element and the electrified terminal of light emitting semiconductor module, power wiring strides across above-mentioned wall portion, be connected on above-mentioned electrified terminal, so above-mentioned power wiring is difficult for contacting with the upper end circumference edge portion of breakthrough part in above-mentioned substrate.Thereby power wiring is difficult to damaged by the heat of substrate, is difficult for causing the decline in the lamp life-span causing because of the broken string of power wiring.

Brief description of the drawings

Fig. 1 is the profile that represents the related lamp of present embodiment.

Fig. 2 is the profile that represents the related lamp of present embodiment.

Fig. 3 is the plane of the lamp of the state after representing the spherical shell to unload.

Fig. 4 is the oblique view of the lamp of the state after representing the spherical shell to unload.

Fig. 5 is the amplification profile of the part of being surrounded by double dot dash line in presentation graphs 1.

Fig. 6 is the appearance plane used of explanation breakthrough part, wall portion and power wiring.

Fig. 7 (a), Fig. 7 (b) are the related wall portion planes used of the different example of explanation.

Fig. 8 is the related wall portion oblique view used of the different example of explanation.

Fig. 9 is the related wall portion profile used of the different example of explanation.

Figure 10 is the related LED module oblique view used of the different example of explanation.

Figure 11 is the related LED module plane used of the different example of explanation.

Figure 12 is the profile that represents the related lamp of past case.

Detailed description of the invention

Below, for the related lamp of present embodiment, describe on one side with reference to accompanying drawing on one side.Fig. 1 and Fig. 2 are the profiles that represents the related lamp of present embodiment.Fig. 3 is the plane of the lamp of the state after representing the spherical shell to unload.Further, Fig. 1 is the profile along the A-A line in Fig. 3, and Fig. 2 is the profile along the B-B line in Fig. 3.

(overall structure)

As shown in Figures 1 and 2, the related lamp 1 of present embodiment is as the lamp of the G type of so-called ball-type bulb, possesses: as the LED module 10 of light source; LED module 10 is loaded in substrate 20 on upper surface 21; Spherical shell 30, the top of cover cap LED module 10; Circuit unit 40, is disposed at the below of above-mentioned substrate 20; Lamp holder 50, and circuit unit 40 is electrically connected; Circuit seat 60, harvesting circuit unit 40; Shell 70, the side of cover cap substrate 20 and circuit seat 60; Insulating element 80, is disposed between substrate 20 and circuit unit 40.

(LED module)

As shown in Figure 3, LED module 10 for example has: the installation base plate 11 that general square shape is tabular; The LED12 of multiple roughly rectangular shapes, is installed on the upper surface of installation base plate 11; The seal member 13 of multiple elongate, covers those LED12.Although LED12 is preferably, adopt COB(Chip on Board at the upper surface of installation base plate 11) device that technology is installed, can be also to use SMD(Surface Mount Device) device installed of the element of type.Further, in the present embodiment, although utilize the example of LED using explanation as semiconductor light-emitting elements, semiconductor light-emitting elements can be both for example LD(laser diode), can be also EL element (electroluminescent cell).

Installation base plate 11 is for example the metallic matrix substrate being made up of resin plate and metallic plate, is provided with the electric power electrified terminal 14 used of accepting LED12 driving use at upper surface.Each LED12 is for example the LED that carries out the GaN class of blue-light-emitting, and 25 forms with 5 row 5 row are configured to rectangular.Each seal member 13 for example adopts has sneaked into the transparent silicones that blue light is transformed to after the phosphor body particle of sodium yellow and has formed, be arranged in the element line of the LED12 separately form with 5 group being formed of the seal member 13 of 5 row, 1 row 1 row ground seals respectively.

Further, installation base plate 11 is not defined as metallic matrix substrate, can be the existing installation base plate beyond the metallic matrix such as resin substrate, ceramic substrate substrate yet.In addition, LED12 and seal member 13 are not defined as the LED of the GaN class of carrying out blue-light-emitting and blue light are transformed to the seal member of sodium yellow, can be the LED of other illuminant colours and the seal member that carries out other wavelength conversions yet.In addition, in seal member, not to sneak into wavelength shifter, in the time using white luminous LED, or at 3 kinds of LED with blue-light-emitting, emitting red light, green emitting and while obtaining white light by colour mixture, do not need sneaking into of wavelength shifter.Moreover, both can replace wavelength shifter was sneaked in seal member, and form wavelength conversion layer on the surface of seal member, also can on the inner face of spherical shell 30 33, form wavelength conversion layer.

(substrate)

Substrate 20 is for example roughly discoideus, and it is configured to the opening shutoff of spherical shell 30, loads LED module 10 in the substantial middle of the upper surface 21 as spherical shell 30 side interareas.As shown in Figure 2, LED module 10, carries out for example mostly by, being screwed in screw hole 21a set on the upper surface 21 of substrate 20 screw 15 after through hole 11a perforation set on the installation base plate 11 of LED module 10 making it the installation of substrate 20.Further, LED module 10 also can utilize bonding agent or connected structure, is arranged in substrate 20.

As shown in Figure 3, on the upper surface 21 of substrate 20, being provided with roughly circular slot part 22 makes it around LED module 10, as shown in Figure 2, substrate 20 and spherical shell 30 enter in slot part 22 interpolations of substrate 20 under the state behind the open side end 31 of spherical shell 30, have been undertaken bonding by interior the filled bonding agent 90 of slot part 22.Near the upper surface 21 of substrate 20, the well width of slot part 22, along with broadening upward and gradually, is easy to enter in slot part 22 interpolations the open side end 31 of spherical shell 30.

Fig. 4 is the oblique view of the lamp of the state after representing the spherical shell to unload.As shown in Figure 4, on the wall 22a of slot part 22, open uniformly-spaced along the circumferencial direction sky of wall 22a, on 4 positions (visible in Fig. 4 is 2 positions wherein), be provided with recess 23, as shown in Figure 2, in those recesses 23, entered a part for bonding agent 90.Therefore,, even if apply the power that open side end 31 will be transferred to from substrate 20 together with bonding agent 90, the part entering in bonding agent 90 in recess 23 is still blocked in substrate 20, and utilizes its grappling effect to prevent coming off of spherical shell 30.

In addition, on the lower surface 24 of substrate 20, be provided with the hole portion 25 being communicated with recess 23, enter recess 23 when interior at bonding agent 90, because the air in recess 23 extrudes toward the below of substrate 20 from hole portion 25, so bonding agent 90 is easy to enter in recess 23.

As shown in Figure 3, in substrate 20, connect the breakthrough part 26 of substrate 20 across the " loaded " position of LED module 10 by above-below direction, be arranged on 2 positions.Each breakthrough part 26 is incision-like of cutting towards inner side from the side 27 of substrate 20, and on looking squarely, those breakthrough parts 26 are arranged on the rotating shaft while lamp 1 being screwed into lamp socket by lamp axle J(.Also in Fig. 1 and Fig. 2, illustrate.) same hypothesis straight line L on.

The side 27 of substrate 20 adapts to the shape of the inner face 75 of the main part 71 of shell 70, and lower side region becomes taper surface.Therefore, the side 27 of substrate 20 is carried out face with the inner face 75 of shell 70 and is contacted in vast scope, and the heat of substrate 20 is easy to conduction to shell 70.The heat being produced by LED12 is mainly by substrate 20 and shell 70, then is transmitted to lamp holder 50 by circuit seat 60, constantly rejects heat to wall or ceiling from lamp holder 50 via ligthing paraphernalia (not shown).

As shown in Figure 3, the installation base plate 11 of general square shape is arranged on the upper surface 21 of substrate 20 with the attitude tilting for hypothesis straight line L, and thus, a pair of long limit of installation base plate 11 and pair of short edges all become the angle tilting for hypothesis straight line L.Further, the angle tilting for hypothesis straight line L here refers to, and for hypothesis straight line L, both out of plumb was also not parallel, namely exceedes the angle of 90 ° of 0 ° and less thaies.

Like this, because installation base plate 11 becomes the angle tilting for hypothesis straight line L, so joint 45 also becomes the angle tilting for hypothesis straight line L, the near-end 44a that stretches out of the power wiring 44 stretching out from joint 45 also becomes the angle tilting for hypothesis straight line L.Double dot dash line M shown in Fig. 3 is and the line that near-end 44a overlaps that stretches out of power wiring 44, and those double dot dash lines M also becomes the angle tilting for hypothesis straight line L.Like this, if the near-end 44a that stretches out of power wiring 44 tilts for the hypothesis straight line L that links a pair of breakthrough part 84, be difficult to the near-end 44a that stretches out of power wiring 44 to apply load, power wiring 44 is difficult for broken string.Be difficult for the effect of broken string in order to obtain power wiring 44, preferably, suppose that angle [alpha] between straight line L and double dot dash line M exceedes 0 ° and be less than or equal to 75 °.

(spherical shell)

As shown in Figures 1 and 2, spherical shell 30 is shapes that the lamp of G type is used, the roughly spherical globular part 32 that has open side cylindraceous end 31 roughly and extend to the upside of open side end 31, on the inner face 33 of globular part 32, forms and improves light distribution characteristic optical diffusion film used (not shown).Further, spherical shell 30 is not defined as the shape that the lamp of G type is used, and can be other the shape such as shape of using of the lamp of A type yet.

(circuit unit)

Circuit unit 40 is used for making LED module 10 luminous, for example, have the various electronic units 42,43 of installing on roughly discoideus circuit substrate 41 and circuit substrate 41, is stored in the space being surrounded by circuit seat 60 and insulating element 80.Further, electronic unit also has except enclosing the parts of symbol " 42 ", " 43 ".

The a pair of power wiring 44 of the outlet side of circuit unit 40 and the electrified terminal 14 of LED module 10 are electrically connected.Particularly, each power wiring 44 is via breakthrough part 26 set in breakthrough part set on insulating element 80 84 and substrate 20, derive top by basad 20, and the joint 45 that utilizes the front end of those power wirings 44 to install is connected with the electrified terminal 14 of LED module 10.Each power wiring 44 is for example the coated lead-in wire of insulating coating by resin etc.

As shown in Figure 2, power wiring 46,47 and the lamp holder 50 of the input side of circuit unit 40 are electrically connected.Particularly, power wiring 46 is derived to the outside of circuit seat 60 by through hole 63 set from the small-bore portion 62 of circuit seat 60, is connected in the case portion 51 of lamp holder 50.In addition, power wiring 47 is derived to the outside of circuit seat 60 by the lower side opening 64 of the small-bore portion 62 from circuit seat 60, is connected with the eyelet portion 52 of lamp holder 50.Each power wiring 46,47 is for example the coated lead-in wire of insulating coating by resin etc.

(lamp holder)

Lamp holder 50 is lamp holders of so-called Edison's type, is to be installed on while being lit on ligthing paraphernalia at LED lamp 1, accepts electric power part used from the lamp socket of ligthing paraphernalia, have: case portion 51 is tubulars, and periphery is external screw thread; Eyelet portion 52, is situated between and is installed in case portion 51 by insulating materials 53.Further, lamp holder 50 is not defined as Edison's type, for example, can be pin type (the specifically G type of GY, GX etc.) yet.

(circuit seat)

Circuit seat 60 is for example the general cylindrical shape shape that opening has been carried out in both sides, is made up of, in the major part of the interior harvesting circuit unit 40 of heavy caliber portion 61 the heavy caliber portion 61 that is positioned at upper side with the small-bore portion 62 that is positioned at lower side.On the other hand, in small-bore portion 62, external mounting lamp holder 50, the lower side opening 64 of circuit seat 60 is by shutoff whereby.Circuit seat 60 preferably, for example, adopts the insulating properties material of resin etc. to form.

In the heavy caliber portion 61 of circuit seat 60, installing insulating parts 80 are so that shutoff side opening on it, under state after installation, on inner face by heavy caliber portion 61, on the inner face of set multiple fins 65 and insulating element 80, set multiple fin 80a seize circuit substrate 41 on both sides by the arms, come holding circuit unit 40.Further, the method for holding circuit unit 40 can be both the method for for example having utilized screw, bonding agent or connected structure etc., can be also by the method after multiple Combination of Methods.

(shell)

As shown in Figures 1 and 2, shell 70 be for example two ends carry out opening and from top the drum of reduced downward, have: main part 71, external mounting is in the heavy caliber portion 61 of substrate 20 and circuit seat 60; Extension 72, stretches out from main part 71, makes it more outstanding than the outer circumferential edges on the upper surface of substrate 20 21.In main part 71, except the heavy caliber portion 61 of substrate 20 and circuit seat 60, also receive and keep the open side end 31 of spherical shell 30, major part and the insulating element 80 of circuit unit 40.

Shell 70 is for example made up of metal material.As metal material, for example enumerate by Al, Ag, Au, Ni, Rh, Pd or 2 alloys that form above within them, or the alloy of Cu and Ag etc.This metal material is because heat conductivity is good, so can make the thermal efficiency that is transmitted to shell 70 well to lamp holder 50 side conduction.Further, the material of shell 70 is not defined as metal, for example, can be resin that pyroconductivity is high etc. yet.

Shell 70 is arranged in substrate 20 by riveted joint, particularly, as shown in Figure 3, by utilizing on the side 27 of substrate 20 along the set multiple recesses 28 of the empty standard width of a room in an old-style house gap of circumferencial direction, on those corresponding positions of recess 28, form riveting portion 73, install.

As shown in Figures 1 and 2, the extension 72 of shell 70 is more outstanding than the outer circumferential edges on the upper surface of substrate 20 21, abuts on the outer surface 34 of spherical shell 30.As long as because be formed as this structure, if the loading of bonding agent 90 too much overflows in slot part 22, the bonding agent 90 overflowing is still enclosed in the space 74 being surrounded by substrate 20, spherical shell 30 and shell 70, do not spill to the outside of shell 70, so the bonding agent 90 of can't help to spill makes the appearance design of lamp 1 impaired.Further, also can utilize the bonding agent 90 spilling in space 74, bonding spherical shell 30 and substrate 20, or spherical shell 30 and shell 70.In addition because can by extension 72 hide and hiding spherical shell 30 on be easy to occur the inhomogeneous position of light, namely near the border between globular part 32 and open side end 31, so the light distribution characteristic of lamp 1 is improved.

(insulating element)

Insulating element 80 is the bottom tube-likes that have that form by cylinder cylindraceous portion 81 roughly with by the roughly discoideus cap 82 of the upper side opening shutoff of this portion 81, is embedded in the set roughly columned recess 29 of lower surface 24 substantial middle of substrate 20.Slightly little compared with the internal diameter of the external diameter of cylinder portion 81 and the recess 29 of substrate 20, but because on the outer circumference surface of cylinder portion 81, open and be interval with multiple fin 81a by circumferencial direction sky, if so insulating element 80 is embedded in recess 29, those fins 81a touches on the inwall of recess 29, and insulating element 80 becomes the state being pressed in recess 29.

Insulating element 80 is formed by the insulating properties material of resin etc., mainly utilizes cap 82 that the circuit unit 40 that is positioned at the substrate 20 of top and is positioned at below is insulated.As shown in Figure 3, at the upper surface (being also the upper surface 80b of insulating element 80) of cap 82, be respectively equipped with a pair of jut 83, breakthrough part 84 and wall portion 85, make it corresponding with the position of a pair of breakthrough part 26 of substrate 20, more particularly on looking squarely, be positioned at the breakthrough part 26 of substrate 20.

Each jut 83 is roughly cylindric, slightly little compared with the kerf width of its diameter and the breakthrough part 26 of substrate 20.When in the time that the recess 29 of substrate 20 is embedded in insulating element 80, as long as insert a pair of jut 83 of insulating element 80 in a pair of breakthrough part 26 of substrate 20, just can carry out the location of the rotation direction centered by lamp axle J between substrate 20 and insulating element 80, the breakthrough part 26 of substrate 20 and the breakthrough part 84 of insulating element 80 are overlapped on looking squarely.Looking squarely while overlapping at like this breakthrough part 26 and breakthrough part 84, be easy to make power wiring 44 to insert those breakthrough parts 26,84.

Fig. 5 is the amplification profile of the part of being surrounded by double dot dash line in presentation graphs 1.As shown in Figure 5, each breakthrough part 84 is through holes that cap 82 is connected by above-below direction, configures to such an extent that more lean on LED module 10 sides (lamp axle J side) than jut 83, causes jut 83 in the time that power wiring 44 is connected with LED module 10 not counteract.Further, breakthrough part 84 is not defined as the through hole that cap 82 is connected by above-below direction, can be the otch that cap 82 is connected by above-below direction yet.Being shaped as arbitrarily of through hole or otch.

Each wall portion 85 stretches out upward from the upper surface 80b of insulating element 80, the breakthrough part of substrate 20 26 is connected, and upper end is more outstanding than the upper surface of substrate 20 21.More strictly speaking, be exactly that the height level H1 of upper end of wall portion 85 is higher than the height level H2 of the upper surface of substrate 20 21.

Each wall portion 85 configure than breakthrough part 84 more by LED module 10 sides (lamp axle J side), between breakthrough part 84 and the electrified terminal 14 of LED module 10.And power wiring 44 will stride across wall portion 85, be connected on electrified terminal 14.Thereby, on power wiring 44, derive and stride across part before wall portion 85 by intervenient wall portion 85 from breakthrough part 84, stop and the contacting of substrate 20.On the other hand, on power wiring 44, aloft pass through to arrive electrified terminal 14 because of the upper end from wall portion 85 to the part that arrives electrified terminal 14 from striding across wall portion 85, so be difficult to contact with the upper surface 21 being positioned at than the substrate 20 more on the lower of the upper end of wall portion 85.

Because be that such power wiring 44 is difficult to the structure contacting with substrate 20, so the heat of substrate 20 is difficult for conduction to power wiring 44, even the heating of LED module 10 becomes relative high temperature substrate 20 in the time lighting because of lamp, power wiring 44 is not vulnerable to hot impact and breakage yet.In addition because also not because of with the situation injured on the surface of power wiring 44 that contacts of substrate 20, so be also difficult to make thus power wiring 44 breakages.

Fig. 6 is the appearance plane used of explanation breakthrough part, wall portion and power wiring.As shown in Figure 6, wall portion 85 is look squarely U font tabular, has: the sweep 85a of semicircle arcuation, along the upper end excircle of the breakthrough part 84 of insulating element 80 and bending; Extension 85b, the 85c of pair of straight wire, stretch out from the two ends of this sweep 85a.

Power wiring 44 strides across sweep 85a, because the curved shape of its sweep 85a is difficult to produce displacement from striding across position.Moreover because be provided with extension 85b, 85c at the two ends of sweep 85a, so even if in the situation that power wiring 44 has produced displacement from sweep 85a, power wiring 44 is also difficult to come off from wall portion 85, power wiring 44 is difficult for contacting with substrate 20.

Fig. 7 (a), Fig. 7 (b) are the related wall portion planes used of the different example of explanation.In the related lamp 1 of present embodiment, also can replace wall portion 85, and adopt that wall portion 185 shown in Fig. 7 (a).Wall portion 185 is look squarely U font tabular, has: the flection part 185a of semicircle arcuation, along the upper end excircle of breakthrough part 84 and bending; Extension 185b, the 185c of pair of straight wire, stretch out from the two ends of this sweep 185a; But those extensions 185b, 185c are elongated to than breakthrough part 84 more forward, between those extensions 185b, 185c, configure breakthrough part 84.As long as be formed as this structure, power wiring 44 is difficult to come off from wall portion 185 more, and power wiring 44 is difficult for contacting with substrate 20.

In addition, in the related lamp 1 of present embodiment, also can replace wall portion 85, and adopt the wall portion 285 shown in Fig. 7 (b).Wall portion 285 is look squarely C font tabular, has along the upper end excircle of breakthrough part 284 and bending circular-arc sweep 285a is not equivalent to the extension 85b of wall portion 85, the part of 85c.The central angle (180 °～270 °) of sweep 285a is more than or equal to the central angle (approximately 180 °) of the sweep 85a of wall portion 85, is covered with the major part of the upper end excircle of breakthrough part 284.As long as be formed as this structure, even if there is no extension, power wiring 44 is also difficult to come off from wall portion 285, and power wiring 44 is difficult for contacting with substrate 20.

Further, the related wall portion of the utility model is not defined as looks squarely U font or looks squarely C font, also can any shape, but preferably, for example, look squarely V font, look squarely the power wirings 44 such as コ font and be difficult to produce the shape of displacement.

As shown in Figure 3, between the inner face 26a of breakthrough part 26 and wall portion 85, be provided with gap, wall portion 85 does not touch substrate 20.Thereby the heat of substrate 20 is difficult to conduction to wall portion 85, be difficult for causing that wall portion 85 is subject to repeatedly expanding, shrinking from the hot impact of substrate 20, and that situation of breaking.Thereby, be difficult for producing the danger that power wiring 44 is contacted because of breaking of wall portion 85 with substrate 20.

Moreover, because wall portion 85 is tabular, so be more difficult for breaking compared with wall portion being formed as to the situation of tubular.That is to say, for example, shown in Fig. 7 (b), if wall portion 285 is look squarely C font tabular, even if the direction that arrow is pressed because of heat by wall portion 285 expands, also because there is gap 285c between the end 285a, the 285b that look squarely of wall portion 285, so can discharge stress by its gap 285c.But, suppose that wall portion is the tubular of looking squarely O font,, because there is not the gap of stress release, so its stress is retained in wall portion, there is the danger of wall portion breakage.

As shown in Figure 5, the part that in wall portion 85, power wiring 44 strides across, namely sweep 85a is present in than the electrified terminal of LED module 10 14 and more approaches on substrate 20 on the height level on surface 21.That is to say, the height level H1 of sweep 85a upper end is more identical with the height level of installation base plate 11 upper surfaces than the height level H3(of the electrified terminal of the LED module of substrate 20 10 14 lower ends) lower.Thereby, on power wiring 44, stride across wall portion 85 part afterwards because extend to the direction of the upper surface 21 away from substrate 20, be connected on electrified terminal 14, so power wiring 44 is difficult for contacting with substrate 20.

Fig. 8 is the related wall portion oblique view used of the different example of explanation.Fig. 9 is the related wall portion amplification profile used of the different example of explanation.The related insulating element 380 of different example shown in Fig. 8 only has wall portion 385 and related insulating element 80 differences of present embodiment.Wall portion 385 is look squarely U font tabular, has: sweep 385a, along the upper end excircle of the breakthrough part 84 of insulating element 380 and bending; A pair of extension 385b, 385c, stretch out from the two ends of this sweep 385a; Be provided with recess 385d in the upper end of sweep 385a.Power wiring 44 strides across sweep 385a under the state being embedded in recess 385d.As long as be formed as this structure, power wiring 44 is difficult to produce displacement more.

In the situation that being formed as said structure, as shown in Figure 9, if the height level H4 at the minimum position of recess 385d is higher than the height level H2 of the upper surface of substrate 20 21, power wiring 44 is difficult for contacting with substrate 20.In addition, if the height level H4 at the minimum position of recess 385d is lower than the height level H3 of electrified terminal 14, power wiring 44 is difficult for contacting with substrate 20 more.Moreover if the height level H5 at the highest position of recess 385d is higher than the height level H3 of electrified terminal 14, power wiring 44 is difficult to come off from recess 385d.

[different example]

Above, according to embodiment, understand specifically the related lamp of the utility model, but the related lamp of the utility model is not defined as above-mentioned embodiment, can be the mode after changing that suitably applies yet in the scope that does not depart from technical conceive of the present utility model.For example, material, the numerical value etc. in above-mentioned embodiment only example preferred example, be not defined as them.

In addition, the encapsulating structure of such as LED can be also that (Surface Mounted Device:SMD) type, COB(Chip On Board are installed in outer cover type, surface) any structures of type, power LED type etc.

In addition, for example LED module can be also following structure.Figure 10 is the related LED module oblique view used of the different example of explanation.Figure 11 is the related LED module plane used of the different example of explanation.Further, Figure 10 represents spherical shell to unload, the lamp of the state after also the screw of fixed L ED module being unloaded, the lamp of the state after Figure 11 represents the fixed part of fixed L ED module to be unloaded again.

Lamp 1 difference that the structure of its LED module of lamp that different example is related and the mounting structure of LED module and above-mentioned embodiment are related.For other place, because substantially identical with the related lamp 1 of above-mentioned embodiment, so the description thereof will be omitted.Further, for the parts identical with above-mentioned embodiment, still use the symbol identical with above-mentioned embodiment.

As shown in figure 10, the related LED module 110 of different example is loaded in the upper face center of substrate 20, as shown in figure 11, for example there are multiple LED(that the upper surface of the tabular installation base plate of general square shape 111, installation base plate 111 installs not shown) and cover the seal member 113 of those LED.

Installation base plate 111 is for example the metallic matrix substrate being made up of resin plate and metallic plate, and at upper surface, the LED that for example carries out the GaN class of blue-light-emitting amounts to 72 with the form of 12 row 6 row, is configured to rectangular.Seal member 113 for example adopts has sneaked into the transparent silicones that blue light is transformed to after the phosphor body particle of sodium yellow and has formed, being by the frame section 113a and the 113b of grid portion of multiple elongate of those frame sections of link 913a, the ladder-shaped that 113c forms of a pair of elongate, in 6 113b of grid portion by uniformly-spaced arranging, sealing respectively 12 LED.Among the 113b of grid portion, the 113c of seal member 113, sealing near 6 113b of the grid portion central authorities that are just positioned at installation base plate 111 of LED, not sealing LED in the 113c of grid portion in addition or the 113a of pair of frames portion.

On LED module 110, the joint 45 that the front end of the power wiring 44 of connecting circuit unit 40 is installed, as shown in figure 10, covers the fixed part 114 of ring-type from the top of LED module 110 and joint 45, together with its fixed part 114, LED module 110 is screwed in substrate 20.On fixed part 114, on the position being communicated with the screw hole 21a of substrate 20, be provided with through hole 115, screw is connected through hole 115, and be screwed in the screw hole 21a of substrate 20, fix LED module 110.

Also have, as shown in figure 11, under the occasion of the related lamp of different example, because the installation base plate of general square shape 111 is arranged on the upper surface 21 of substrate 20 with the attitude tilting for hypothesis straight line L, joint 45 also becomes the angle tilting for hypothesis straight line L, so the situation of the lamp 1 related with above-mentioned embodiment is identical, power wiring 44 is difficult for broken string.

Utilizability in industry

The utility model can be applicable to general LED lamp.

Symbol description

1 lamp

10 light emitting semiconductor modules

14 electrified terminals

20 substrates

21 upper surfaces

26 breakthrough parts

The inner face of 26a through hole

The side of 27 through holes

40 circuit units

44 power wirings

80 insulating elements

The upper surface of 80a insulating element

84 breakthrough parts

85,185,285,385 wall portions

85a, 185a, 385a flection part

85b, 85c, 185b, 185c, 385b, 385c extension

385d recess

Claims (6)

1. a lamp, possesses: as the light emitting semiconductor module of light source; Substrate, loads this light emitting semiconductor module at upper surface; Circuit unit, is disposed at the below of this substrate; Insulating element, is disposed between above-mentioned substrate and foregoing circuit unit; Make the power wiring of foregoing circuit unit, derive to the top of above-mentioned substrate by the breakthrough part arranging respectively on above-mentioned substrate and insulating element, be connected on the electrified terminal of above-mentioned light emitting semiconductor module, it is characterized by,

From the upper surface of above-mentioned insulating element, the wall portion that the breakthrough part of above-mentioned substrate is connected stretches out, make it between the breakthrough part of above-mentioned insulating element and the electrified terminal of above-mentioned light emitting semiconductor module, between the inner face of the through hole of above-mentioned substrate and above-mentioned wall portion, be provided with gap, above-mentioned power wiring strides across above-mentioned wall portion, is connected on above-mentioned electrified terminal.

2. lamp as claimed in claim 1, is characterized by,

Above-mentioned wall portion has along the upper end excircle of the breakthrough part of above-mentioned insulating element and bending sweep, and above-mentioned power wiring strides across above-mentioned bend, is connected on above-mentioned electrified terminal.

3. lamp as claimed in claim 2, is characterized by,

Above-mentioned wall portion is look squarely U font tabular, has the above-mentioned sweep of semicircle arcuation and the extension of the pair of straight wire of stretching out from the two ends of this sweep, configures the breakthrough part of above-mentioned insulating element between above-mentioned a pair of extension.

4. the lamp as described in claim 1～3 any one, is characterized by,

The breakthrough part of above-mentioned substrate is the incision-like of cutting towards inner side from the side of above-mentioned substrate.

5. lamp as claimed in claim 1, is characterized by,

The part that above-mentioned power wiring in above-mentioned wall portion strides across is present in than the electrified terminal of above-mentioned light emitting semiconductor module and more approaches on the height level of above-mentioned upper surface of substrate.

6. lamp as claimed in claim 1, is characterized by,

Upper end in above-mentioned wall portion is provided with recess, and above-mentioned power wiring strides across above-mentioned wall portion under the state being embedded in above-mentioned recess.