CN203726036U - SMT reflow soldering fixture - Google Patents
SMT reflow soldering fixture Download PDFInfo
- Publication number
- CN203726036U CN203726036U CN201320855528.8U CN201320855528U CN203726036U CN 203726036 U CN203726036 U CN 203726036U CN 201320855528 U CN201320855528 U CN 201320855528U CN 203726036 U CN203726036 U CN 203726036U
- Authority
- CN
- China
- Prior art keywords
- reflow soldering
- soldering fixture
- smt reflow
- smt
- turnover panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses an SMT reflow soldering fixture which comprises a bottom plate. The SMT reflow soldering fixture is characterized in that bases are arranged on the two sides of the middle portion of the bottom plate, an overturning plate is arranged between the bases, and buckles are arranged on the overturning plate. By means of the SMT reflow soldering fixture, reflow soldering operation on the front face and the back face can be conveniently carried out, and the SMT reflow soldering fixture is simple in structure and convenient to use.
Description
Technical field
The utility model relates to SMT technical field, is specifically related to a kind of SMT Reflow Soldering fixture.
Background technology
SMT is electronic circuit surface installation technique (surface mounting technology, the abbreviation of Surface Mounted Technology), most popular a kind of technology and technique in current Electronic Assemblies industry, that one will (be called for short SMC/SMD without pin or short leg surface-assembled components and parts, Chinese claims sheet components and parts) be arranged on printed circuit board (Printed Circuit Board, be called for short PCB) surface or the surface of other substrate on, by the method such as Reflow Soldering or the immersed solder circuit load technology of welding assembly in addition, be characterized in that packing density is high, electronic product volume is little, lightweight, the volume and weight of surface mount elements only has 1/10 left and right of traditional inserting element, after general employing SMT, electronic product volume-diminished 40%~60%, weight saving 60%~80%, reliability is high, shock resistance is strong, welding point defect rate is low, high frequency characteristics is good, electromagnetism and Radio frequency interference are reduced.Easily be automated, enhance productivity, reduce costs and reach 30%~50%, save material, the energy, equipment, manpower, time etc.At present in the time carrying out solder reflow operation, when having welded one side, reinstall to again the welding of carrying out another side on fixture after circuit board need to being removed to upset, very trouble, efficiency are low.
Summary of the invention
For achieving the above object, the technical scheme that the utility model is taked is:
A kind of SMT Reflow Soldering fixture, comprises base plate, it is characterized in that the middle both sides of described base plate arrange base, between described base, turnover panel is set, and on described turnover panel, buckle is set.
As preferably, the circular hole coordinating with turnover panel two ends projection is set on described base.
As preferably, on four angles of described base plate, cylinder is set.
As preferably, on described turnover panel, rectangular opening is set.
As preferably, described rectangular opening place mounting circuit boards.
As preferably, described circuit board passes through snap lock.
As preferably, described buckle both sides arrange the projection highly not waiting.
A kind of SMT Reflow Soldering fixture tool described in the utility model, has made up the deficiencies in the prior art, simple in structure, easy to use, improved welding efficiency.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
Detailed description of the invention
Below in conjunction with accompanying drawing and example, the utility model is described further.
As shown in the figure, a kind of SMT Reflow Soldering fixture, comprise base plate 1, it is characterized in that: the middle both sides of described base plate 1 arrange base 3, between described base 3, turnover panel 6 is set, on described turnover panel 6, buckle 4 is set, the circular hole coordinating with turnover panel 6 two ends projections is set on described base 3, on four angles of described base plate 1, cylinder 2 is set, on described turnover panel 6, rectangular opening 7 is set, described rectangular opening 7 place's mounting circuit boards 5, described circuit board 5 is locked by buckle 4, and described buckle 4 both sides arrange the projection highly not waiting.
When actual use, the circuit board of needs welding is installed on turnover panel, and by snap lock, buckle both sides arrange the projection highly not waiting, can be according to the thickness choice for use of circuit board, after locking, first carry out the welding of one side, after completing, directly turnover panel is turned to the welding of carrying out again another side, small column is used for supporting turnover panel, a kind of SMT Reflow Soldering fixture tool described in the utility model, make up the deficiencies in the prior art, simple in structure, easy to use, improved welding efficiency.
The foregoing is only preferred embodiment of the present utility model, not in order to limit the utility model, all any amendments of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within being all included in protection domain of the present utility model.
Claims (7)
1. a SMT Reflow Soldering fixture, comprises base plate (1), it is characterized in that: the middle both sides of described base plate (1) arrange base (3), between described base (3), turnover panel (6) is set, and on described turnover panel (6), buckle (4) is set.
2. a kind of SMT Reflow Soldering fixture according to claim 1, is characterized in that the upper circular hole coordinating with turnover panel (6) two ends projection that arranges of described base (3).
3. a kind of SMT Reflow Soldering fixture according to claim 1, arranges cylinder (2) on four angles of the base plate (1) described in it is characterized in that.
4. a kind of SMT Reflow Soldering fixture according to claim 1, is characterized in that, on described turnover panel (6), rectangular opening (7) is set.
5. a kind of SMT Reflow Soldering fixture according to claim 4, the rectangular opening (7) described in it is characterized in that is located mounting circuit boards (5).
6. a kind of SMT Reflow Soldering fixture according to claim 1 or 5, is characterized in that described circuit board (5) is by buckle (4) locking.
7. a kind of SMT Reflow Soldering fixture according to claim 1, is characterized in that described buckle (4) both sides arrange the projection highly not waiting.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320855528.8U CN203726036U (en) | 2013-12-23 | 2013-12-23 | SMT reflow soldering fixture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201320855528.8U CN203726036U (en) | 2013-12-23 | 2013-12-23 | SMT reflow soldering fixture |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203726036U true CN203726036U (en) | 2014-07-23 |
Family
ID=51196141
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201320855528.8U Expired - Fee Related CN203726036U (en) | 2013-12-23 | 2013-12-23 | SMT reflow soldering fixture |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN203726036U (en) |
-
2013
- 2013-12-23 CN CN201320855528.8U patent/CN203726036U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140723 Termination date: 20161223 |