CN203679472U - Steel mesh silk screen sintering device for printed board - Google Patents
Steel mesh silk screen sintering device for printed board Download PDFInfo
- Publication number
- CN203679472U CN203679472U CN201320824036.2U CN201320824036U CN203679472U CN 203679472 U CN203679472 U CN 203679472U CN 201320824036 U CN201320824036 U CN 201320824036U CN 203679472 U CN203679472 U CN 203679472U
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- China
- Prior art keywords
- steel mesh
- board
- microwave
- printed board
- microwave board
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 229910000831 Steel Inorganic materials 0.000 title claims abstract description 64
- 239000010959 steel Substances 0.000 title claims abstract description 64
- 238000005245 sintering Methods 0.000 title claims abstract description 34
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 24
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 17
- 239000006071 cream Substances 0.000 description 15
- 239000000758 substrate Substances 0.000 description 12
- 239000000956 alloy Substances 0.000 description 11
- 229910045601 alloy Inorganic materials 0.000 description 11
- 238000013461 design Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000007790 scraping Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a steel mesh silk screen sintering device for a printed board. The device comprises a microwave board, a steel mesh, and a solder paste layer, wherein the steel mesh is flatly placed on the microwave board and is clung to a ground part on the back side of the microwave board, the solder paste layer is arranged on the steel mesh, part of the solder paste layer flows into the back side of the microwave board along meshes of the steel mesh, a BGA array is arranged on the steel mesh, and the thickness of the steel mesh is set to be 0.1-0.2mm. The steel mesh silk screen sintering device for the printed board, provided by the utility model, improves the production efficiency of sintering the printed board of a microwave product, and lowers the cost.
Description
Technical field
The utility model relates to frequency microwave technical field, is specifically related to a kind of printed board steel mesh silk-screen sintering equipment.
Background technology
Existing frequency microwave series products requires good earthing effect, tend to affect properties of product if earthing effect is bad, therefore in design, the microwave board of radio frequency products is designed to bottom large area ground connection, and by technology mode, printed board reverse side grounded part is welded in product shell, in industry, the normal technology mode adopting has at present:
1) substrate sintering process
Adopt the main flow process of substrate sintering process mode:
Be ready to alloy substrates and treat fixing microwave board and housing, and according to microwave board profile cut alloy substrates, make its size consistent with microwave board, and in cutting, need chip room reserved in microwave board to excise in the lump, guarantee alloy substrates and treat that fixing microwave board reverse side ground connection size is basically identical, before welding, smear scaling powder in enclosure interior, and substrate, printed board are put into housing successively, fixing tight with briquetting, then place it in warm table and heat, treat that alloy substrates, microwave board, housing are sintered into integrative-structure.
Shortcoming:
1, this technology mode need to cut alloy substrates before welding, if adopt hand cut, lower for this kind of mode efficiency of production of product in batches, and is unfavorable for homogeneity of product production.
If 2 adopt laser cutting machine to cut it, satisfactory laser cutting machine is expensive on the market at present, is unfavorable for cost control.
3, this technology mode need to be smeared scaling powder before sintering in housing, after product sintering completes, need to clean it with chemicals, is unfavorable for environment-protective process trend.
4, due to need to be at reserved chip position chip placement after microwave board sintering, must prevent being connected of microstrip line and ground connection place, use in alloy substrates sintering process, infiltrate microwave board front after very easily causing alloy softening and cause microstrip line ground short circuit.
5, the printed board alloy sheet of abnormity cutting trouble, efficiency is low.
2) conducting resinl sintering process
Adopt the main flow process of conducting resinl sintering process mode:
Treating that fixing microwave board reverse side ground connection place evenly smears conducting resinl with painting brush, and microwave board is being put into housing, fixing tight with briquetting, then place it in warm table and heat, treat that conducting resinl, microwave board, housing are sintered into integrative-structure.
Shortcoming:
1, conducting resinl is expensive, and the product of unnecessary batch production, is unfavorable for cost control.
2, with painting brush evenly the mode of smearing have some limitations, for the control of conducting resinl coating thickness be difficult to realize.
3,, in conducting resinl heat-agglomerating process, still there will be silver slurry to ooze out and cause microstrip line ground short circuit.
4, the composition of conducting resinl is that epoxy resin adds silver powder composition, and epoxy resin is fragility, after using for many years, easily becomes fragile, and causes imperfect earth, and product index declines.
Utility model content
The utility model has overcome the deficiencies in the prior art, and the printed board steel mesh silk-screen sintering equipment that a kind of production efficiency is high, can reduce production costs is provided.
Consider the problems referred to above of prior art, according to the disclosed aspect of the utility model, the utility model by the following technical solutions:
A kind of printed board steel mesh silk-screen sintering equipment, comprise microwave board, steel mesh, tin paste layer, the smooth ground connection place that is placed on described microwave board and is close to microwave board reverse side of described steel mesh, described tin paste layer is arranged on described steel mesh, a part for described tin paste layer flow into described microwave board reverse side along the mesh of described steel mesh, on described steel mesh, be provided with BGA array, described steel mesh thickness is set to 0.1～0.2mm.
In order to realize better the utility model, further technical scheme is:
According to an embodiment of the present utility model, after taking off described steel mesh, also comprise housing, on described housing, be provided with a cavity that holds described microwave board.
According to an embodiment of the present utility model, four angles place of described housing is respectively provided with a screwed hole.
According to an embodiment of the present utility model, the two sides that described housing is relative are respectively provided with the ear of two protrusions.
According to an embodiment of the present utility model, in described each ear, be respectively provided with a through hole.
The utility model can also be:
According to an embodiment of the present utility model, also comprise warm table, described housing is positioned on warm table.
According to an embodiment of the present utility model, described warm table is temperature control heating platform.
Compared with prior art, one of the beneficial effects of the utility model are:
Printed board steel mesh silk-screen sintering equipment of the present utility model, has improved the production efficiency of microwave product printed board sintering, and through experiment statistics, with respect to the sintering processing of alloy substrates, efficiency can improve 80%; Because tin cream is more a lot of than conducting resinl low price, can significantly reduce the production cost of bulk article.
Accompanying drawing explanation
For clearer explanation present specification embodiment or technical scheme of the prior art, to the accompanying drawing of required use in the description of embodiment or prior art be briefly described below, apparently, the accompanying drawing the following describes is only the reference to some embodiment in present specification, for those skilled in the art, in the situation that not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is according to the Facad structure schematic diagram of the microwave board of an embodiment of the utility model.
Fig. 2 is according to the reverse side structural representation of the microwave board of an embodiment of the utility model.
Fig. 3 is according to the structural representation of the steel mesh of an embodiment of the utility model.
Fig. 4 is the schematic diagram coordinating with microwave board according to the steel mesh of an embodiment of the utility model.
Fig. 5 is according to the structural representation of the housing of an embodiment of the utility model.
Fig. 6 is the schematic diagram coordinating with warm table according to the housing of an embodiment of the utility model.
Fig. 7 is the schematic diagram coordinating with microwave board according to the housing of an embodiment of the utility model.
The specific embodiment
Below in conjunction with embodiment, the utility model is described in further detail, but embodiment of the present utility model is not limited to this.
Fig. 1 is according to the Facad structure schematic diagram of the microwave board of an embodiment of the utility model.Microwave board 1 as shown in Figure 1, the front 11 of microwave board 1.
Fig. 2 is according to the reverse side structural representation of the microwave board of an embodiment of the utility model.Microwave board 1 as shown in Figure 1, the reverse side 12 of microwave board 1.
Fig. 3 is according to the structural representation of the steel mesh of an embodiment of the utility model, comprises steel mesh 3, on this steel mesh 3, is provided with grid, is generally to adopt BGA array, and steel mesh 3 thickness are preferably set to 0.1～0.2mm.
Fig. 4 is the schematic diagram coordinating with microwave board according to the steel mesh of an embodiment of the utility model.A kind of printed board steel mesh silk-screen sintering equipment as shown in Figure 1 to 4, comprise microwave board 1, steel mesh 3, tin paste layer, the smooth ground connection place that is placed on described microwave board 1 and is close to microwave board 1 reverse side 12 of described steel mesh 3, described tin paste layer is arranged on described steel mesh 3, a part for described tin paste layer flow into described microwave board 1 reverse side 12 along the mesh of described steel mesh 3, on described steel mesh 3, be provided with BGA array, described steel 3 net thickness are set to 0.1～0.2mm.
Fig. 5 is according to the structural representation of the housing of an embodiment of the utility model.As shown in Figure 5, on described housing 4, be provided with a cavity 41 that holds described microwave board 1.
Four angles place of described housing 4 is respectively provided with a screwed hole 42.
The two sides 43,44 that described housing 4 is relative are respectively provided with the ear 45 of two protrusions.
In described each ear 45, be respectively provided with a through hole 451.
Fig. 6 is the schematic diagram coordinating with warm table according to the housing of an embodiment of the utility model.Comprise as shown in Figure 6 warm table 5, described housing 4 is positioned on warm table 5, and microwave board 1 is placed in housing 4.
Fig. 7 is the schematic diagram coordinating with microwave board according to the housing of an embodiment of the utility model.As shown in Figure 7, microwave board 1 is positioned in the cavity 41 of housing 4.
Another embodiment, the technique of taking in conjunction with above scheme:
---steel silk screen design---print solder paste---is sintered to fix microwave board reverse side grounding design.
One embodiment, use for reference the paste solder printing technology in components and parts reflow soldering process, design processing silk-screen steel mesh, and in microwave board reverse side earthing position print solder paste, tin cream thickness can determine by the thickness of silk screen, and the gap of tin cream can be determined by steel mesh order number, tin cream is evenly printed on after microwave board reverse side, put it into housing and carry out sintering, microwave board, housing are sintered into integrative-structure.
The operation principle of one embodiment, utilizes screen printing technique, and uniform tin cream silk-screen, in printed board, after tin cream at high temperature dissolves, is served as to microwave board ground plane and housing and merges medium, makes printed board and housing form integrative-structure.
Another embodiment, microwave board requires reverse side large area ground connection and has good solderability, steel mesh area is greater than microwave board area, steel mesh and generally adopts BGA array can make tin cream can be printed on microwave board reverse side, steel mesh THICKNESS CONTROL is between 0.1～0.2mm, this thickness can be controlled the thickness of tin cream in printed board, and last warm table is necessary for temperature control heating platform.
Another embodiment, technological process:
1) microwave board reverse side grounding design
In design microwave board, only to place at printed board front design circuit and components and parts, microwave board reverse side large area is designed to ground connection.
2) steel mesh designs and produces
Steel mesh is designed to BGA shape.
3) print solder paste
Before printing, need to guarantee the clean of steel mesh, microwave board reverse side ground connection place is placed upward, and be placed on microwave board and be close to reverse side ground connection place smooth steel mesh, utilize scraping article that tin cream is spread upon on steel mesh, in the time of printing, the contact angle of scraping article and steel mesh is 45～60 °, can infiltrate steel mesh due to tin cream, tin cream can guarantee to be evenly printed on microwave board reverse side.
4) be sintered to fix
The microwave board printing is put into housing, by the heating of warm table, allow after tin cream fusing microwave board and the housing structure that is fixed as one
One embodiment, by adopting above involved structure, has:
Significantly improved the production efficiency of microwave product printed board sintering, through experiment statistics, with respect to the sintering of alloy substrates, efficiency can improve 80%; Because tin cream is than conducting resinl low price, can significantly reduce the production cost of bulk article; In steel mesh tin cream technique, welding can be controlled effectively by steel mesh thickness, guarantee the quality of microwave product in printed board sintering process, avoid using the scolder occurring in alloy substrates or conducting resinl sintering to ooze out phenomenon, guarantee that the clean and circuit in product following process process is complete.Adopt after the microwave board and housing merging of tin cream steel mesh printing-sintering, ground connection is good, and cleannes significantly improve, and can reduce the time of cleaning after sintering.
In this description, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is and the difference of other embodiment, identical similar part cross-references between each embodiment.
" embodiment ", " another embodiment ", " embodiment " that spoken of in this manual, etc., refer to specific features, structure or the feature described in conjunction with this embodiment and be included at least one embodiment that the application's generality describes.In description, multiple local appearance statement of the same race is not necessarily to refer to same embodiment.Furthermore, while describing a specific features, structure or feature in conjunction with arbitrary embodiment, what advocate is to realize this feature, structure or feature in conjunction with other embodiment also to drop in scope of the present utility model.
Although the utility model is described with reference to multiple explanatory embodiment of the present utility model here, but, should be appreciated that, those skilled in the art can design a lot of other modification and embodiments, and these are revised and within embodiment will drop on the disclosed principle scope and spirit of the application.More particularly, in the scope of, accompanying drawing open in the application and claim, can carry out multiple modification and improvement to the building block of subject combination layout and/or layout.Except modification that building block and/or layout are carried out with improving, to those skilled in the art, other purposes will be also obvious.
Claims (7)
1. a printed board steel mesh silk-screen sintering equipment, it is characterized in that, comprise microwave board, steel mesh, tin paste layer, the smooth ground connection place that is placed on described microwave board and is close to microwave board reverse side of described steel mesh, described tin paste layer is arranged on described steel mesh, a part for described tin paste layer flow into described microwave board reverse side along the mesh of described steel mesh, is provided with BGA array on described steel mesh, and described steel mesh thickness is set to 0.1～0.2mm.
2. printed board steel mesh silk-screen sintering equipment according to claim 1, is characterized in that, also comprises housing, is provided with a cavity that holds described microwave board on described housing.
3. printed board steel mesh silk-screen sintering equipment according to claim 2, is characterized in that, four angles place of described housing is respectively provided with a screwed hole.
4. printed board steel mesh silk-screen sintering equipment according to claim 2, is characterized in that, the two sides that described housing is relative are respectively provided with the ear of two protrusions.
5. printed board steel mesh silk-screen sintering equipment according to claim 4, is characterized in that, is respectively provided with a through hole in described each ear.
6. according to the printed board steel mesh silk-screen sintering equipment described in claim 2～5 any one, it is characterized in that, also comprise warm table, described housing is positioned on warm table.
7. printed board steel mesh silk-screen sintering equipment according to claim 6, is characterized in that, described warm table is temperature control heating platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320824036.2U CN203679472U (en) | 2013-12-12 | 2013-12-12 | Steel mesh silk screen sintering device for printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320824036.2U CN203679472U (en) | 2013-12-12 | 2013-12-12 | Steel mesh silk screen sintering device for printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203679472U true CN203679472U (en) | 2014-07-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320824036.2U Expired - Lifetime CN203679472U (en) | 2013-12-12 | 2013-12-12 | Steel mesh silk screen sintering device for printed board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203679472U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110678015A (en) * | 2019-09-09 | 2020-01-10 | 成都泰格微电子研究所有限责任公司 | Sintering type printed circuit board medium hole plugging process and structure |
-
2013
- 2013-12-12 CN CN201320824036.2U patent/CN203679472U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110678015A (en) * | 2019-09-09 | 2020-01-10 | 成都泰格微电子研究所有限责任公司 | Sintering type printed circuit board medium hole plugging process and structure |
| CN110678015B (en) * | 2019-09-09 | 2020-09-29 | 成都泰格微电子研究所有限责任公司 | Sintering type printed circuit board medium hole plugging process and structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140702 |
|
| CX01 | Expiry of patent term |