CN203631497U - Automatic edge scraping machine for wafer - Google Patents
Automatic edge scraping machine for wafer Download PDFInfo
- Publication number
- CN203631497U CN203631497U CN201320709390.0U CN201320709390U CN203631497U CN 203631497 U CN203631497 U CN 203631497U CN 201320709390 U CN201320709390 U CN 201320709390U CN 203631497 U CN203631497 U CN 203631497U
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- Prior art keywords
- wafer
- placing device
- edge scraping
- mechanical arm
- automatic edge
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Abstract
The utility model discloses an automatic edge scraping machine for a wafer. The automatic edge scraping machine comprises containing devices used for containing the wafer, a moving device used for moving the wafer, and an edge scraping device used for conducting edge scraping on the wafer. The containing devices comprise the first containing device and the second containing device. The edge scraping device is arranged between the first containing device and the second containing device. The moving device is provided with a pick-and-place device used for picking and placing the wafer. The moving device moves to the edge scraping device after picking the wafer from the first containing device so that the wafer can be subjected to edge scraping, moves to the second containing device to place the wafer subjected to edge scraping, and returns to the initial position finally. The automatic edge scraping machine for the wafer can automatically and continuously conduct edge scraping, as a result, products after edge scraping are attractive in appearance, uniform, and not prone to breakage, labor intensity of workers can be mitigated greatly, human cost is reduced, and efficiency is improved greatly.
Description
Technical field
The utility model relates to LED photoelectric field, refers to especially a kind of wafer automatic edge scraping machine of wafer corner scraping of the LED of being applied to photoelectricity industry.
Background technology
In LED photoelectricity industry, the wafer of producing all will carry out a job conventionally: scraping is carried out in wafer corner, then could further apply.Because the technique such as plated film can cause the adhesion of chip edge partially conductive material in process of production.Long outer time delay, builds golden 8-15 micron because air flow problems causes epitaxial wafer edge, produces the out-of-flatness of Waffer edge microcosmic, and in rear technique, (wafer grinding that contains the numerous tube cores of number that front technique is made, then with being laser-cut into many independently tube cores.) grinding and cutting process causes grinding thickness inhomogeneous, section such as secretly splits at the bad appearance.
Wafer is first silicon to be passed through to purifying, melts, and after distillation, makes silicon crystal rod, and wafer factory takes these silicon crystals rods to grind again, and polishing and section become wafer master slice; Because circular wafer itself does not have directivity, be not suitable for the transmission of electronics, therefore these wafers also must cut out a limit, as similar leg-of-mutton " end ", so the shape of wafer is to fall a limit by the flat-cut on this circle in circle, becomes the circle that has " end ".
In the prior art, the scraping of wafer is all by manually completing with blade conventionally, and the product after having scraped has following several defect: 1, not attractive in appearance, inhomogeneous; 2, easy fragmentation; 3, expense, time-consuming, hand labor intensity is large.
Utility model content
Given this,, for overcoming the above-mentioned technological deficiency of manually bringing, it is attractive in appearance, evenly and be not easy the automatic edge scraping machine of fragmentation that the purpose of this utility model is to propose a kind of efficiency product high, that scrape out.
The technical scheme adopting is:
A kind of wafer automatic edge scraping machine, comprise the placing device for laying wafer, for the mobile device of mobile wafer and for giving the edging device of wafer scraping, described placing device comprises the first placing device and the second placing device, described edging device is located between the first placing device and the second placing device, described mobile device is provided with the fetching device for picking and placeing wafer, mobile device can be got wafer from the first placing device, moving to edging device carries out wafer scraping, and then move to the second placing device and put the wafer after scraping, finally get back to initial position.
Preferably, described the first placing device or the second placing device comprise cartridge holder, wafer magazine, servomotor and precise guide rail, and described servomotor is provided with accurate lead screw; Described wafer magazine is placed in cartridge holder, and described cartridge holder is arranged on accurate lead screw, and described accurate lead screw matches with precise guide rail.
Further, described cartridge holder is provided with two for laying the cavity of wafer magazine.
Further, described the first placing device or the second placing device also comprise the transducer having or not for responding to wafer.
Preferably, described mobile device comprises lower shaft on the mechanical arm Y-axis that can move left and right, the mechanical arm antero posterior axis that can move forward and backward and mechanical arm moving up and down; After described mechanical arm antero posterior axis is fixedly connected with lower shaft on mechanical arm, can move left and right at mechanical arm Y-axis; The length of described mechanical arm Y-axis is at least not less than from the first placing device to the distance the second placing device.
Further, the left and right precise guide rail slide block that described mechanical arm Y-axis comprises precision stepper motor and matches with precision stepper motor, described mechanical arm antero posterior axis comprises cylinder, front and back screw mandrel and front and back precise guide rail slide block; On described mechanical arm, lower shaft comprises servomotor, precise guide rail and upper and lower accurate lead screw.
Further, described fetching device is the first sucker, and described the first sucker is arranged on the screw mandrel of front and back.
Preferably, described edging device comprises the receiving system for receiving wafer and the scraping parts that the wafer on receiving system carried out to work.
Further, described receiving system comprise to be used for receiving the lifting shaft of wafer, for locate wafer wafer locating piece, the second sucker, be arranged on the second sucker below for rotating an electric rotating machine and the 3rd transducer of this second sucker, described lifting shaft is connected with a lift cylinder, described lifting shaft be arranged on second sucker periphery corresponding to wafer locating piece.
Further, described scraping parts comprise electronic bistrique and be connected with electronic bistrique respectively for controlling trunnion axis, vertical axis and the angle axle of electronic bistrique position.
With respect to prior art, the utility model advantage is:
The utility model by setting lay the first placing device of wafer and the second placing device, for the mobile device of mobile wafer and for the edging device to wafer scraping, described mobile device is provided with the fetching device for picking and placeing wafer, then according to the action of a set of work capable of circulation of these device designs, make: by this fetching device, mobile device can be got wafer from the first placing device, moving to edging device carries out wafer scraping, and then move to the second placing device and put the wafer after scraping, finally get back to initial position.Thereby can make the utility model can carry out automatically, continuously scraping, thus can reach the product of not only scraping out attractive in appearance, even, be not easy fragmentation, and can alleviate widely workman labour intensity, save human cost, raising efficiency greatly.
Accompanying drawing explanation
In order to be illustrated more clearly in the utility model embodiment or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only embodiment of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of the first placing device of the present utility model or the second placing device;
Fig. 3 is the structural representation of mobile device of the present utility model;
Fig. 4 is the structural representation that the receiving system master of the utility model edging device looks;
Fig. 5 is the structural representation that the receiving system of the utility model edging device is overlooked;
Fig. 6 is the structural representation of the receiving system solid of the utility model edging device;
Fig. 7 is the structural representation that the scraping parts master of the utility model edging device looks;
Fig. 8 is the structural representation of the scraping parts solid of the utility model edging device.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only the utility model preferred embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment obtaining under creative work prerequisite, all belong to the scope of the utility model protection.
Referring to Fig. 1, a kind of wafer automatic edge scraping machine, comprise the placing device for laying wafer, for the mobile device 2 of mobile wafer and for giving the edging device 3 of wafer scraping, described placing device comprises the first placing device 1 and the second placing device 4, described edging device 3 is located between the first placing device 1 and the second placing device 4, described mobile device 2 is provided with the fetching device for picking and placeing wafer, mobile device 2 can be got wafer from the first placing device 1, moving to edging device 3 carries out wafer scraping, and then move to the second placing device 4 and put the wafer after scraping, finally get back to initial position.
Wherein, for placing device:
Referring to Fig. 2, the first placing device 1 of this automatic edge scraping machine or the second placing device 4 comprise cartridge holder 41, wafer magazine 42, the first servomotor 43 and the first precise guide rail 44, and described the first servomotor 43 is provided with accurate lead screw 45; Described wafer magazine 42 is placed in cartridge holder 41, and described cartridge holder 41 is arranged on accurate lead screw 45, and described accurate lead screw 45 matches with precise guide rail 44.Preferably the first placing device 1 is identical with the structure of the second placing device 4.The first placing device is used for laying the wafer 46 after scraping for wafer 46, the second placing devices of laying before scraping.
Can be further, described cartridge holder 41 is provided with two for laying the cavity of wafer magazine.One can certainly be only arranged, three can also be arranged for laying the cavity of wafer magazine.Can arrange according to actual needs.
Can be more further, described the first placing device or the second placing device also comprise the transducer having or not for responding to wafer.Take described cartridge holder be provided with two for the cavity of laying wafer magazine as example, the wafer magazine of two boxes is placed in cartridge holder, and multiple wafers are housed in wafer magazine.The inner both sides relatively of this wafer magazine are provided with the groove arranged side by side of multiple pairings, and wafer is arranged in the groove of pairing, forms layered laminate.Then, be divided into first sensor 47 and the second transducer 48, the second transducers 48 and be arranged on the below of wafer magazine for responding to transducer that wafer has or not, be used for responding on corresponding wafer magazine whether wafer is housed; First sensor 47 is arranged on the below of groove, and whether be used for responding on this wafer magazine has wafer to exist.First sensor 47 can be the optical fiber of a restriction reflection-type, and it can detect the fixing distance of induction.When servomotor drives cartridge holder while moving down, the detection that drops to the first inductor apart from time, servomotor just stops.The second transducer 48 can be a kind of mechanical actuating switch, can push the second transducer and produce signal when wafer magazine is placed on cartridge holder when the inside, whether puts wafer magazine thereby detect cartridge holder.
So motion flow when this first placing device work can be:
Manually be placed with the wafer magazine of wafer, can put two boxes, also can put a box, by the second sensor sensing;
Servomotor drives cartridge holder to do upper and lower rectilinear motion by screw mandrel guide rail, often takes after a slice wafer, and servomotor can rise or fall certain distance so that first sensor can detect next wafer.
So do action, until the wafer of wafer magazine takes.
Then, for mobile device:
Referring to Fig. 3, the mobile device 2 of this automatic edge scraping machine comprises lower shaft 23 on the mechanical arm Y-axis 21 that can move left and right, the mechanical arm antero posterior axis 22 that can move forward and backward and mechanical arm moving up and down; After described mechanical arm antero posterior axis 22 is fixedly connected with lower shaft on mechanical arm 23, can move left and right at mechanical arm Y-axis 21, the length of described mechanical arm Y-axis 21 is at least not less than from the distance the first placing device 1 to second placing device 4.As long as it can be realized this mobile device to the requirement of length and move to edging device from the first placing device, then move to the second placing device.
Can be further, the left and right precise guide rail slide block 212 that described mechanical arm Y-axis 21 comprises precision stepper motor 211 and matches with precision stepper motor 211, stepping motor is provided with Timing Belt 213; Described mechanical arm antero posterior axis 22 comprises cylinder 221, front and back screw mandrel 222 and front and back precise guide rail slide block 223; On described mechanical arm, lower shaft 23 comprises the second servomotor 231, the second precise guide rail 232 and upper and lower accurate lead screw 233.On mechanical arm, lower shaft is provided with a synchronous fixed block, and this synchronous fixed block is arranged on Timing Belt 213, with Timing Belt synchronizing moving, and can set in Timing Belt optional position from left to right.Namely, mechanical arm Y-axis is realized the movement from left to right or from right to left of whole mobile device, on mechanical arm, lower shaft is realized the movement that mobile device is adjusted up and down, and mechanical arm antero posterior axis is realized with the action of other devices (comprising the first placing device, edging device and the second placing device) and being connected.
Can be further, described fetching device is the first sucker 24, described the first sucker 24 is arranged on the screw mandrel of front and back.By being arranged on the first sucker on mechanical arm antero posterior axis, realize the whole moving process to wafer.The first sucker is realized getting and putting wafer by pull of vacuum.
So the motion flow of this mobile device can be:
Since the first placing device, the first sucker of mechanical arm antero posterior axis holds wafer from magazine;
Lower shaft cooperative mechanical arm antero posterior axis on mechanical arm, adjusts upper and lower distance and makes the wafer and the magazine that hold have certain gap, facilitates mechanical arm antero posterior axis to take out wafer;
The circular wafer of taking-up is moved to edging device place by mechanical arm Y-axis cooperative mechanical arm antero posterior axis.
Then, for edging device:
Referring to Fig. 4-Fig. 8, the edging device 3 of this automatic edge scraping machine comprises the receiving system 31 for receiving wafer and the scraping parts 32 that the wafer on receiving system carried out to work.
Can be further, referring to Fig. 4-Fig. 6, described receiving system 31 comprise to be used for receiving the lifting shaft 311 of wafer, for locate wafer wafer locating piece 312, the second sucker 313, be arranged on the second sucker 313 belows for rotating an electric rotating machine 313 and the 3rd transducer 314 of this second sucker, described lifting shaft 311 is connected with a lift cylinder 315, described lifting shaft be arranged on second sucker 313 peripheries corresponding to wafer locating piece.Described wafer locating piece is two, the symmetrical two ends that are installed on the second sucker respectively, and this wafer sheet locating piece also connects respectively a location cylinder that is used for making location action.Described the 3rd transducer is used for responding to the straight flange (be background technology described in have beyond " end ") of wafer, and it can determine when can compensate by distance of reaction is different.During as the 3rd inductor induction wafer periphery, be a kind of signal, in the time sensing periphery and straight flange junction, the change of distance of induction, just can be by carry out the compensation (electronic bistrique grinds straight flange according to this signal) to straight flange according to this variable signal.
Can be further, referring to Fig. 7-Fig. 8, described scraping parts 32 comprise electronic bistrique 321 and be connected with electronic bistrique 321 respectively for controlling trunnion axis 322, vertical axis 323 and the angle axle 324 of electronic bistrique position.Scraping parts adopt electronic bistrique, and the alloy bistrique that further can adopt high speed electric module to use, rather than adopt the form of blade makes the product scraping out than more attractive in appearance, even with blade and be not easy fragmentation.And trunnion axis, vertical axis and angle axle also become respectively X-axis, Z axis and R axle.The movement of the horizontal direction of the electronic bistrique of X-axis control, the movement of the vertical direction of the electronic bistrique of Z axis control, makes precompression and the amount of feeding between electronic bistrique and wafer all automatically adjustable by X-axis and Z axis, can also compensate the grinding of the straight flange to wafer.And the electronic bistrique of R axle control carries out the swing of certain angle, the alloy bistrique that makes electronic bistrique and wafer carry out contacting, and the larger contact of angle of swing is fewer, otherwise larger.
So the motion flow of this edging device can be:
By lift cylinder, lifting shaft is risen, manipulator antero posterior axis is placed on wafer on lifting shaft;
By lift cylinder, lifting shaft is declined, wafer is placed on the second sucker;
The wafer locating piece at two ends positions wafer by location cylinder;
After having good positioning, the second sucker starts to start, and holds wafer;
Electric rotating machine drives the second sucker to be rotated;
The right-angle side of the 3rd sensor sensing wafer.
Electronic bistrique, by after the adjustment of X-axis, Z axis and R axle, grinds wafer.
And the motion flow of whole automatic edge scraping machine of the present utility model is:
By this fetching device (the first sucker), mobile device takes out a slice wafer from the first placing device;
Then mobile device moves to after edging device, receives the wafer that mobile device takes out on the one hand by the receiving system of edging device, by the scraping parts of edging device, the circular wafer being on receiving system is ground to (being scraping) on the other hand;
Then the mobile device wafer after receiving system is taken scraping away again, then move to the second placing device place and lay.
Mobile device is got back to initial position.
The 1-4 step that circulates above-mentioned.
With respect to prior art, the utility model advantage is:
The utility model automatic edge scraping machine is without the form of blade, but the alloy bistrique of using with high speed electric module grinds, and the product scraping is out attractive in appearance, even and be not easy fragmentation;
Can alleviate widely workman's labour intensity and save human cost, according to this design the utility model, the each automatic edge scraping machine that manually can see 4-5 platform.
Efficiency promotes greatly.Compared with manually, its efficiency promotes greatly.
It should be noted that, the electric part of the utility model automatic edge scraping machine all can be by PLC(Programmable Logic Controller, programmable logic controller (PLC)) control, such as the motion (the mechanical arm Y-axis in book as described above) of the motion (motion of the various cylinders in book as described above) of all transducers (comprising first, second, third transducer), motor and machinery all can by the programming of PLC realize above-mentioned in the motion flow of each device.
The utility model automatic edge scraping machine provides a kind of running parameter as follows: (automatic scraping editor's running parameter can comprise as follows, but is not limited to this):
Scraping speed: 20-25sec/pc;
Adapt to wafer: 4 cun;
Handling mode: manual placement and the taking-up of product (wafer);
Power supply: 200-240V, single-phase: 50-60HZ;
Gross power: 2200w is containing the industrial dust collector of 1000w;
Supply gas pressure: be greater than 0.5Mpa;
Equipment size: 1300*900*1600 unit's (millimeter)
Net weight: 300kg.
This automatic edge scraping machine can be used for the scraping of the wafers such as the GaAs, silicon nitride, sapphire of 4 inches.Adopt Automatic Control, greatly improved production efficiency.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection range of the present utility model.
Claims (10)
1. a wafer automatic edge scraping machine, it is characterized in that, comprise placing device for laying wafer, for the mobile device of mobile wafer and for the edging device to wafer scraping, described placing device comprises the first placing device and the second placing device, described edging device is located between the first placing device and the second placing device, and described mobile device is provided with the fetching device for picking and placeing wafer; Mobile device can be got wafer from the first placing device, moves to edging device and carries out wafer scraping, and then move to the second placing device and put the wafer after scraping, finally gets back to initial position.
2. wafer automatic edge scraping machine as claimed in claim 1, is characterized in that, described the first placing device or the second placing device comprise cartridge holder, wafer magazine, the first servomotor and the first precise guide rail, and described the first servomotor is provided with accurate lead screw; Described wafer magazine is placed in cartridge holder, and described cartridge holder is arranged on accurate lead screw, and described accurate lead screw matches with the first precise guide rail.
3. wafer automatic edge scraping machine as claimed in claim 2, is characterized in that, described cartridge holder is provided with two for laying the cavity of wafer magazine.
4. wafer automatic edge scraping machine as claimed in claim 3, is characterized in that, described the first placing device or the second placing device also comprise the transducer having or not for responding to wafer.
5. wafer automatic edge scraping machine as claimed in claim 1, is characterized in that, described mobile device comprises lower shaft on the mechanical arm Y-axis that can move left and right, the mechanical arm antero posterior axis that can move forward and backward and mechanical arm moving up and down; After described mechanical arm antero posterior axis is fixedly connected with lower shaft on mechanical arm, can move left and right at mechanical arm Y-axis; The length of described mechanical arm Y-axis is at least not less than from the first placing device to the distance the second placing device.
6. wafer automatic edge scraping machine as claimed in claim 5, it is characterized in that, the left and right precise guide rail slide block that described mechanical arm Y-axis comprises precision stepper motor and matches with precision stepper motor, described mechanical arm antero posterior axis comprises cylinder, front and back screw mandrel and front and back precise guide rail slide block; On described mechanical arm, lower shaft comprises the second servomotor, the second precise guide rail and upper and lower accurate lead screw.
7. wafer automatic edge scraping machine as claimed in claim 6, is characterized in that, described fetching device is the first sucker, and described the first sucker is arranged on the screw mandrel of front and back.
8. wafer automatic edge scraping machine as claimed in claim 1, is characterized in that, described edging device comprises the receiving system for receiving wafer and the scraping parts that the wafer on receiving system carried out to work.
9. wafer automatic edge scraping machine as claimed in claim 8, it is characterized in that, described receiving system comprise to be used for receiving the lifting shaft of wafer, for locate wafer wafer locating piece, the second sucker, be arranged on the second sucker below for rotating an electric rotating machine and the 3rd transducer of this second sucker, described lifting shaft is connected with a lift cylinder, described lifting shaft be arranged on second sucker periphery corresponding to wafer locating piece.
10. wafer automatic edge scraping machine as claimed in claim 9, is characterized in that, described scraping parts comprise electronic bistrique and be connected with electronic bistrique respectively for controlling trunnion axis, vertical axis and the angle axle of electronic bistrique position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320709390.0U CN203631497U (en) | 2013-11-11 | 2013-11-11 | Automatic edge scraping machine for wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320709390.0U CN203631497U (en) | 2013-11-11 | 2013-11-11 | Automatic edge scraping machine for wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203631497U true CN203631497U (en) | 2014-06-04 |
Family
ID=50817948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320709390.0U Withdrawn - After Issue CN203631497U (en) | 2013-11-11 | 2013-11-11 | Automatic edge scraping machine for wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203631497U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103594397A (en) * | 2013-11-11 | 2014-02-19 | 厦门市弘瀚电子科技有限公司 | Automatic edge scraping machine for wafer |
| CN104485302A (en) * | 2014-12-29 | 2015-04-01 | 颀中科技（苏州）有限公司 | Wafer transfer batching and collecting equipment |
-
2013
- 2013-11-11 CN CN201320709390.0U patent/CN203631497U/en not_active Withdrawn - After Issue
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103594397A (en) * | 2013-11-11 | 2014-02-19 | 厦门市弘瀚电子科技有限公司 | Automatic edge scraping machine for wafer |
| CN103594397B (en) * | 2013-11-11 | 2016-02-03 | 厦门市弘瀚电子科技有限公司 | A kind of wafer automatic edge scraping machine |
| CN104485302A (en) * | 2014-12-29 | 2015-04-01 | 颀中科技（苏州）有限公司 | Wafer transfer batching and collecting equipment |
| CN104485302B (en) * | 2014-12-29 | 2017-05-10 | 颀中科技（苏州）有限公司 | Wafer transfer batching and collecting equipment |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20140604 Effective date of abandoning: 20160203 |
|
| C25 | Abandonment of patent right or utility model to avoid double patenting |