CN203540995U - Overflow pure water circulating system of silicon wafer cleaning machine - Google Patents

Overflow pure water circulating system of silicon wafer cleaning machine Download PDF

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Publication number
CN203540995U
CN203540995U CN201320693396.3U CN201320693396U CN203540995U CN 203540995 U CN203540995 U CN 203540995U CN 201320693396 U CN201320693396 U CN 201320693396U CN 203540995 U CN203540995 U CN 203540995U
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CN
China
Prior art keywords
water
water channel
silicon wafer
wafer cleaning
overflow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320693396.3U
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Chinese (zh)
Inventor
王飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JIANGSU JINVINPV CO Ltd
Original Assignee
JIANGSU JINVINPV CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JIANGSU JINVINPV CO Ltd filed Critical JIANGSU JINVINPV CO Ltd
Priority to CN201320693396.3U priority Critical patent/CN203540995U/en
Application granted granted Critical
Publication of CN203540995U publication Critical patent/CN203540995U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cleaning By Liquid Or Steam (AREA)

Abstract

The utility model discloses an overflow pure water circulating system of a silicon wafer cleaning machine and relates to the field of the photovoltaic industry, in particular to a set of silicon wafer cleaning equipment. The overflow pure water circulating system of the silicon wafer cleaning machine comprises four rinse tanks. The upper ends of the four rinse tanks are sequentially arranged from high to low, a same water storage tank is arranged below the four rinse tanks, and a heating pipe and a water pump are arranged in the water storage tank. A first circulating water channel is vertically arranged on one side of the rinse tank with the lowest upper end among the four rinse tanks, a water inlet is formed in the upper end of the first circulating water channel, and a water outlet of the first circulating water channel is communicated with the water storage tank. A second circulating water channel is vertically arranged on one side of the rinse tank with the highest upper end among the four rinse tanks, a water inlet of the second circulating water channel is connected with the outlet end of the water pump, and a water outlet is formed in the upper end of the second circulating water channel. Through the overflow pure water circulating system of the silicon wafer cleaning machine, pure water in the water storage tank is heated to be utilized cyclically, and thus not only is water for use saved, but also the temperature of overflow inlet water is controlled better. In the respect of production, the probability of occurrence of dirty wafers is controlled better and reduced, and the silicon wafer cleaning effect is improved.

Description

Silicon wafer cleaner overflow pure water circulating system
Technical field
The utility model relates to the field of photovoltaic industry, relates in particular to Wafer Cleaning equipment.
Background technology
Wafer Cleaning machine has 10 tanks, is respectively to treat washing trough, ultrasonic cleaning tank, ultrasonic potcher.When cleaning silicon chip, each groove temperature need be controlled between 30 ~ 50 ℃ because temperature raise time non-ionic surface active agent flee from water trend strengthen, adsorbance increase.The impact of the dirt-removing power of temperature on non-ionic surface active agent is significantly, and when temperature is during close to cloud point, cleaning performance is best.But the dirty material of silicon chip after cleaning agent ultrasonic cleaning can produce a large amount of foams in cleaning process, through potcher, be must open relief cock foam is gone out to tank to drain into sewer main.Owing to opening overflow, enter pure water in rinse bath later and do not enter the water temperature that heat treated is cleaned in can four potchers of shadow, can directly have influence on Wafer Cleaning effect out.
Summary of the invention
The purpose of this utility model is in order to overcome the deficiencies in the prior art, and a kind of silicon wafer cleaner overflow pure water circulating system is provided, and can control the cleaning temperature in silicon wafer cleaning tank, saves pure water resource.
The purpose of this utility model is achieved in that silicon wafer cleaner overflow pure water circulating system, comprise four potchers, the upper end of four potchers is arranged in order from high to low, and same catch basin is set below four potchers, and heating tube and water pump are set in catch basin; In four potchers, a side of the minimum potcher in upper end vertically arranges the first cyclic water channel, the upper end of the first cyclic water channel arranges water inlet, the water overflow of the minimum potcher in upper end flows into the first cyclic water channel from water inlet, and the delivery port of the first cyclic water channel is communicated with catch basin; In four potchers, a side of the highest potcher in upper end vertically arranges the second cyclic water channel, the water inlet of the second cyclic water channel is connected with described water delivery side of pump, the upper end of the second cyclic water channel sets out the mouth of a river, and the water of the second cyclic water channel flows in the highest potcher in upper end from delivery port.
The utility model is by increasing a catch basin in cleaning machine inside, overflow water is all guided in catch basin, and heating tube is installed in catch basin, after opening overflow, the water in catch basin can be recycled, and the foam rushed out of potcher can directly overflow from catch basin top and can again not flow into potcher.
Pure water in heating catch basin recycles now, has both saved water, has better controlled again the water temperature of overflow water inlet.From production aspect, better control and reduced the probability of dirty appearance, improved the effect of Wafer Cleaning.
Accompanying drawing explanation
Fig. 1 is a kind of structural representation of the present utility model.
The specific embodiment
As shown in Figure 1, silicon wafer cleaner overflow pure water circulating system, mainly comprise the first potcher 1, the second potcher 2, the 3rd potcher 3, the 4th potcher 4, the upper end of the first potcher 1, the second potcher 2, the 3rd potcher 3, the 4th potcher 4 is arranged in order from high to low, below the first potcher 1, the second potcher 2, the 3rd potcher 3, the 4th potcher 4, same catch basin 7 is set, interior heating tube 6 and the water pump 8 of arranging of catch basin 7.In a side of the 4th potcher 4, the first cyclic water channel 5 is vertically set, the upper end of the first cyclic water channel 5 arranges water inlet 5-1, the delivery port 5-2 that the water overflow of the 4th potcher 4 flows into the first cyclic water channel 5, the first cyclic water channels 5 from water inlet 5-1 is communicated with catch basin 7.One side of the first potcher 1 vertically arranges the second cyclic water channel 9, the water inlet 9-1 of the second cyclic water channel 9 is connected with the output of water pump 8, the upper end of the second cyclic water channel 9 sets out mouth of a river 9-2, and the water of the second cyclic water channel 9 flows in the first potcher 1 from delivery port 9-2.

Claims (1)

1. silicon wafer cleaner overflow pure water circulating system, comprises four potchers, it is characterized in that: the upper end of four potchers is arranged in order from high to low, and same catch basin is set below four potchers, and heating tube and water pump are set in catch basin; In four potchers, a side of the minimum potcher in upper end vertically arranges the first cyclic water channel, the upper end of the first cyclic water channel arranges water inlet, the water overflow of the minimum potcher in upper end flows into the first cyclic water channel from water inlet, and the delivery port of the first cyclic water channel is communicated with catch basin; In four potchers, a side of the highest potcher in upper end vertically arranges the second cyclic water channel, the water inlet of the second cyclic water channel is connected with described water delivery side of pump, the upper end of the second cyclic water channel sets out the mouth of a river, and the water of the second cyclic water channel flows in the highest potcher in upper end from delivery port.
CN201320693396.3U 2013-11-06 2013-11-06 Overflow pure water circulating system of silicon wafer cleaning machine Expired - Fee Related CN203540995U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320693396.3U CN203540995U (en) 2013-11-06 2013-11-06 Overflow pure water circulating system of silicon wafer cleaning machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320693396.3U CN203540995U (en) 2013-11-06 2013-11-06 Overflow pure water circulating system of silicon wafer cleaning machine

Publications (1)

Publication Number Publication Date
CN203540995U true CN203540995U (en) 2014-04-16

Family

ID=50459165

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320693396.3U Expired - Fee Related CN203540995U (en) 2013-11-06 2013-11-06 Overflow pure water circulating system of silicon wafer cleaning machine

Country Status (1)

Country Link
CN (1) CN203540995U (en)

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140416

Termination date: 20181106