CN203502895U - Cooling device for computer microprocessor - Google Patents
Cooling device for computer microprocessor Download PDFInfo
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- CN203502895U CN203502895U CN201320640692.7U CN201320640692U CN203502895U CN 203502895 U CN203502895 U CN 203502895U CN 201320640692 U CN201320640692 U CN 201320640692U CN 203502895 U CN203502895 U CN 203502895U
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- cooling device
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Abstract
The utility model discloses a cooling device for a computer microprocessor. The cooling device comprises a liquid circulating cooling device, a semiconductor refrigerating device, a heat conduction device and a control module used for controlling work states of the liquid circulating cooling device and the semiconductor refrigerating device. The semiconductor refrigerating device is communicated with a liquid circulating loop of the liquid circulating cooling device through the heat conduction device. The control module is connected with a power source of a computer CPU fan. The cooling device for the computer microprocessor is intelligent and reliable in cooling and low in cost, the temperature difference between the cooling device and the environment temperature is small, vapor is prevented from being condensed on the surface of the microprocessor, and the cooling device is safe in use.
Description
[technical field]
The utility model relates to a kind of computer cooling device, is specifically related to a kind of cooling device of computer microprocessor.
[background technology]
Along with popularizing of scientific and technological development and computing machine, people are more and more higher to the requirement of computing power.In the performance boost of computing machine, high computing density also cause the power consumption of computing machine and thermal value increasing, especially for the server of high capacity operation and the desktop computer that is equipped with high-end CPU and video card, adopt the mode of traditional fan cooling far can not reach its radiating requirements, can cause accumulation of heat, easily cause computer-internal local overheating, affect the normal work of computing machine, the serviceable life of shortening core component.In prior art, also there is the scheme of using water-cooled or semiconductor refrigerating to dispel the heat to computing machine, the scheme of use water-cooled is vulnerable to the restriction of environment temperature, in addition the restriction of cabinet inside volume, radiating efficiency still can not reach the radiating requirements of part high-performance computer; And use semiconductor refrigerating mode, the cold junction of semiconductor cooler and heat generating components laminating, because huyashi-chuuka (cold chinese-style noodles) temperature and the environment temperature difference of semiconductor cooler are larger, while reaching certain gradient, can cause airborne water vapor in heat generating components surface condensation, the use of electronic devices and components is caused to very large potential safety hazard.
[summary of the invention]
For above-mentioned defect, the utility model discloses a kind of cooling device of computer microprocessor, its cooling intelligence, reliable, with low cost, having a narrow range of temperature of cooling device and environment temperature, has avoided water vapor in microprocessor surface condensation, uses safety.
The technical solution of the utility model is as follows:
A cooling device for computer microprocessor, comprises liquid-circulating cooling device, semiconductor cooling device, heat conducting device and for controlling the control module of liquid-circulating cooling device and semiconductor cooling device duty; Described semiconductor cooling device is communicated with the liquid circulation loop of liquid-circulating cooling device by heat conducting device; Described control module is connected with the cpu fan power supply of computing machine.
In the cooling device of computer microprocessor of the present utility model, liquid-circulating cooling device is started working when computer starting, liquid coolant forms closed circuit, to the microprocessor of computing machine, carry out cooling, when computer microprocessor heat radiation pressure is larger, the cpu fan Power supply state variation of computing machine, thus make control module control semiconductor cooling device work, play auxiliary cooling effect; Cooling intelligence, reliable, directly adopt cpu fan power supply signal to control, without separately establishing sensing device, reduced cost, can regulate according to the heating situation intelligence of microprocessor the working method of cooling device simultaneously, avoid cooling device and environment temperature gradient excessive and cause water vapor to condense, use safety.
[accompanying drawing explanation]
Fig. 1 is the structural representation of looking up of the utility model embodiment;
Fig. 2 is the decomposition view of Fig. 1;
Fig. 3 is the inner structure elevational schematic view of Fig. 1 middle shell;
Fig. 4 is the circuit connection diagram of the utility model embodiment.
[embodiment]
Below in conjunction with accompanying drawing, embodiment of the present utility model is elaborated.
As shown in Figures 1 to 4, the cooling device of computer microprocessor of the present utility model comprises liquid-circulating cooling device, semiconductor cooling device, heat conducting device 3 and for controlling the control module of liquid-circulating cooling device and semiconductor cooling device duty; Described semiconductor cooling device is communicated with the liquid circulation loop of liquid-circulating cooling device by heat conducting device 3; Described control module is connected with the cpu fan power supply of computing machine, and control module is controlled semiconductor cooling device work when computer CPU fan power supply voltage reaches predetermined value;
In the cooling device of computer microprocessor of the present utility model, liquid-circulating cooling device is started working when computer starting, liquid coolant forms closed circuit, to the microprocessor of computing machine, carry out cooling, when computer microprocessor heat radiation pressure is larger, computer CPU fan power supply power supply state changes, for example, the supply voltage of computer CPU fan power supply rises to regulate computing machine cpu fan rotating speed, thereby make the control module being attached thereto control semiconductor cooling device work, play auxiliary cooling effect, cooling intelligence, reliably, directly adopt cpu fan power supply signal to control, without separately establishing sensing device, reduced cost, can regulate according to the heating situation intelligence of microprocessor the working method of cooling device simultaneously, avoid cooling device and environment temperature gradient excessive and cause water vapor to condense, use safety,
Further, described liquid-circulating cooling device comprises housing 1, water pump 8, heating radiator 10, liquid coolant and at least one heat exchanger 9, the top of described housing 1 one sides is provided with large water tank 100 and the little water tank 101 being interconnected, large water tank 100 is provided with inlet, little water tank 101 is provided with liquid outlet, and the opposite side of housing 1 is provided with water pump water tank 102, water pump 8 and heating radiator 10; The liquid outlet of described water pump 8 is communicated with the inlet of heat exchanger 9, the liquid outlet of heat exchanger 9 is communicated with the inlet of heating radiator 10, the liquid outlet of heating radiator 10 is communicated with the inlet of little water tank 101, the liquid outlet of large water tank 100 is communicated with the inlet of water pump water tank 102, and the inlet of water pump water tank 102 and water pump 8 is communicated with; During computer starting, liquid-circulating cooling device starts working, liquid coolant is passed through water pump 8 inflow heat exchangers 9 from water pump water tank 102 under the effect of water pump 8, inflow radiator 10 after the heat that liquid coolant is sent by heat exchanger 9 absorption microprocessors, after heating radiator 10 heat radiations, flow into little water tank 101, from little water tank 101, flow into large water tank 100, from large water tank 100, flow back to water pump water tank 102, form closed circuit, to the microprocessor of computing machine, carry out cooling;
Further, the liquid level of described large water tank 100 and little water tank 101, higher than the liquid level of water pump water tank 102, to guarantee that the liquid level of water pump water tank 102 maintains constant altitude, is avoided causing water pump 8 faults because water pump high water tank declines;
Further, the bottom of described large water tank 100 offers heat conduction mouth 103, the top of described heat conducting device 3 is conducted mouth 103 by heat and is contacted with the liquid coolant in large water tank 100, semiconductor cooling device is freezed by 3 pairs of liquid coolants of heat conducting device under the control of control module, play auxiliary cooling effect;
Further, described liquid-circulating cooling device also comprises O-ring seal 2, the inner side of described heat conduction mouthful 103 bottoms is provided with for placing the recess 104 of O-ring seal, described heat conducting device 3 is pressed abd fixed on large water tank 100 with O-ring seal 2, O-ring seal 2 can guarantee sealing better, prevents that liquid coolant leakage from causing damage to computing machine components and parts;
Further, described semiconductor cooling device comprises semiconductor chilling plate 5, heat radiator 6 and radiator fan 7, the top laminating of the hot junction of described semiconductor chilling plate 5 and heat radiator 6, radiator fan 7 is fixed on the bottom of heat radiator 6, and the bottom laminating of the cold junction of semiconductor chilling plate 5 and described heat conducting device 3 is fixing; After semiconductor chilling plate 5 energisings, its cold junction refrigeration, freezes by 3 pairs of liquid coolants of heat conducting device, and its hot junction is by heat radiator 6 and radiator fan 7 heat radiations;
Further, the surrounding of described semiconductor chilling plate 5 is wrapped up by heat-preservation cotton 4, is semiconductor chilling plate 5 and surrounding environment isolation, reduces the impact of environment temperature on semiconductor chilling plate 5 work;
Further, described control module is 12V five pin relays, with computer power supply output matching; Described 12V five pin relays control end a be connected with a utmost point of computer CPU fan power supply, control end b is connected with another utmost point of computer CPU fan power supply, common port c is connected with the negative pole of 12V direct supply, and input end d is connected with the positive pole of 12V direct supply; In described liquid-circulating cooling device, one end of water pump 8 and heating radiator 10 is connected with the common port c of 12V five pin relays, and the other end is connected with the input end d of 12V five pin relays; In described semiconductor cooling device, one end of semiconductor chilling plate 5 and radiator fan 7 is connected with the common port c of 12V five pin relays, and the other end is connected with the output terminal e that often opens of 12V five pin relays; During computer booting, water pump 8 and heating radiator 10 obtain electric work, liquid-circulating cold sweat radiator cooler dispels the heat to computer microprocessor, when computer microprocessor heat radiation pressure is larger, the power supply state of computer CPU fan power supply changes, and for example voltage raises to adjust cpu fan rotating speed, the critical value that power supply state is changed to 12V five pin relay conductings makes, the output terminal of often opening of 12V five pin relays obtains electricly, and 7 work of semiconductor chilling plate 5 and radiator fan, to liquid coolant auxiliary cooling.
Above-described embodiment of the present invention, does not form limiting the scope of the present invention.Any modification of doing within the spirit and principles in the present invention, be equal to and replace and improvement etc., within all should being included in claim protection domain of the present invention.
Claims (8)
1. a cooling device for computer microprocessor, is characterized in that: comprise liquid-circulating cooling device, semiconductor cooling device, heat conducting device and for controlling the control module of liquid-circulating cooling device and semiconductor cooling device duty; Described semiconductor cooling device is communicated with the liquid circulation loop of liquid-circulating cooling device by heat conducting device; Described control module is connected with computer CPU fan power supply, and control module is controlled semiconductor cooling device work when computer CPU fan power supply voltage reaches predetermined value.
2. the cooling device of computer microprocessor as claimed in claim 1, it is characterized in that: described liquid-circulating cooling device comprises housing, water pump, heating radiator, liquid coolant and at least one heat exchanger, the top of described housing one side is provided with large water tank and the little water tank being interconnected, large water tank is provided with inlet, little water tank is provided with liquid outlet, and the opposite side of housing is provided with water pump water tank, water pump and heating radiator; The liquid outlet of described water pump is communicated with the inlet of heat exchanger, the liquid outlet of heat exchanger is communicated with the inlet of heating radiator, the liquid outlet of heating radiator is communicated with the inlet of little water tank, and the liquid outlet of large water tank is communicated with the inlet of water pump water tank, and the inlet of water pump water tank and water pump is communicated with.
3. the cooling device of computer microprocessor as claimed in claim 2, is characterized in that: the liquid level of described large water tank and little water tank is higher than the liquid level of water pump water tank.
4. the cooling device of computer microprocessor as claimed in claim 2, is characterized in that: the bottom of described large water tank offers heat conduction mouthful, and the top of described heat conducting device is conducted mouth by heat and contacted with the liquid coolant in large water tank.
5. the cooling device of computer microprocessor as claimed in claim 4, is characterized in that: also comprise O-ring seal, the inner side of described heat conduction mouthful bottom is provided with for placing the recess of O-ring seal, and described heat conducting device and O-ring seal are pressed abd fixed on large water tank.
6. the cooling device of computer microprocessor as claimed in claim 1 or 2, it is characterized in that: described semiconductor cooling device comprises semiconductor chilling plate, heat radiator and radiator fan, the hot junction of described semiconductor chilling plate and the laminating of the top of heat radiator, radiator fan is fixed on the bottom of heat radiator, and the cold junction of semiconductor chilling plate and the laminating of the bottom of described heat conducting device are fixing.
7. the cooling device of computer microprocessor as claimed in claim 6, is characterized in that: the surrounding of described semiconductor chilling plate is wrapped up by heat-preservation cotton.
8. the cooling device of computer microprocessor as claimed in claim 1, it is characterized in that: described control module is 12V five pin relays, the control end of described 12V five pin relays is connected with computer CPU fan power supply, common port is connected with the negative pole of 12V direct supply, and input end is connected with the positive pole of 12V direct supply; One end of described liquid-circulating cooling device is connected with the common port of 12V five pin relays, and the other end is connected with the input end of 12V five pin relays; One end of described semiconductor cooling device is connected with the common port of 12v electrical equipment, and the other end is connected with the output terminal of often opening of 12V five pin relays.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320640692.7U CN203502895U (en) | 2013-10-17 | 2013-10-17 | Cooling device for computer microprocessor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320640692.7U CN203502895U (en) | 2013-10-17 | 2013-10-17 | Cooling device for computer microprocessor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203502895U true CN203502895U (en) | 2014-03-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320640692.7U Expired - Fee Related CN203502895U (en) | 2013-10-17 | 2013-10-17 | Cooling device for computer microprocessor |
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| CN (1) | CN203502895U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107461978A (en) * | 2016-06-02 | 2017-12-12 | 中国科学院沈阳自动化研究所 | A kind of semiconductor refrigeration temperature control case |
-
2013
- 2013-10-17 CN CN201320640692.7U patent/CN203502895U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107461978A (en) * | 2016-06-02 | 2017-12-12 | 中国科学院沈阳自动化研究所 | A kind of semiconductor refrigeration temperature control case |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140326 Termination date: 20171017 |
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| CF01 | Termination of patent right due to non-payment of annual fee |