CN216210853U - Active computer cooling system - Google Patents

Abstract

The utility model discloses an active computer cooling system.A monolithic heat insulation case comprises an outer case body, a heat insulation layer and an inner case body, wherein a hot air channel is formed between the inner case body and the heat insulation layer; the inner machine box is internally divided into a computer part mounting area and a cold air channel, a primary heat exchanger is arranged in the cold air channel, a secondary heat exchanger is arranged in the computer part mounting area, a fan is arranged at the primary heat exchanger, and the hot air channel is communicated with the cold air channel through the primary heat exchanger; the refrigerating compressor is internally provided with a compressor, a refrigerant storage tank and a refrigerant circulating pump, the secondary heat exchanger is communicated with the refrigerant storage tank through a high-temperature refrigerant pipeline, and the compressor is communicated with the primary heat exchanger through a low-temperature refrigerant pipeline after passing through the refrigerant circulating pump. The integral heat insulation case is connected with the refrigeration compressor through a liquid pipeline, so that the thermodynamic cycle of a low-temperature refrigerant is realized, all parts of a computer host are subjected to active integral heat dissipation, and the allowable temperature rise range of the computer parts is greatly improved.

Description

Active computer cooling system

Technical Field

The utility model relates to the technical field of computer heat dissipation, in particular to an active computer heat dissipation system.

Background

The existing desktop-level computer cooling system (without considering the server level) is mainly air-cooled and water-cooled, the cooling power of the air-cooled cooling system is within 200W, and the cooling power of the water-cooled cooling system is within 300W. The cold source of the two heat dissipation systems is ambient atmosphere, and even under the condition that the thermal resistance of the system is extremely low, the limit temperature which can be reached is the ambient temperature. The temperature of the electronic component is limited by the ambient temperature, and the cold source can exceed 30 ℃ in high temperature in summer, so that the allowable temperature rise range of the electronic component is reduced.

A novel active cooling system dominated by Intel adopts semiconductor active refrigeration, and can reduce a cold source below the ambient temperature. In consideration of the problem of supercooled water condensation, the minimum temperature is 15 ℃ lower than the ambient temperature, and a set of accurate temperature and humidity detection and control system is required and is expensive.

For a high-performance desktop computer platform (high end desktop, hedt), the desktop computer platform has an ultra-many cores, more memory channels, more display cards, and has a higher specification in aspects such as hard disk speed. The hedt platform is more suitable for the requirements of productivity work such as video coding, 3D modeling and rendering and the like, and compared with a common computer, the method can greatly reduce the waiting time on output and rendering and improve the working efficiency. While the peak processor power consumption of the hedt platform has exceeded 400W, it is simply not affordable by existing heat dissipation systems. Meanwhile, a plurality of display cards and a high-speed hard disk can generate a large amount of heat, so that an integral heat dissipation system is considered for a computer system.

For the continuous progress of the current X86 series processors, the energy efficiency ratio is not greatly improved, the computing power is continuously and explosively enhanced, the power consumption is greatly increased, and the high-performance graphics card also faces the same problem. The peak power consumption of a recently released Intel twelve-generation processor exceeds 400W, the peak power consumption of a 30-series display card also exceeds 450W, the frequency is reduced under the condition of overheating, the working efficiency is influenced, and even the visible blockage and calculation errors are generated, so that a high-power integral heat dissipation system is urgently needed.

Disclosure of Invention

The purpose of the utility model is as follows: the utility model aims to provide an active computer cooling system aiming at the defects of the prior art, wherein a cold and hot circulating air duct is arranged in an integral heat insulation case, a refrigeration compressor generates low-temperature refrigerants, the refrigeration compressor is connected with the integral heat insulation case through a liquid pipeline, the thermodynamic cycle of the low-temperature refrigerants is realized, all parts of a computer host are subjected to active integral cooling, and the allowable temperature rise range of the computer parts is greatly improved.

The technical scheme is as follows: the active computer cooling system comprises an integral heat insulation case and a refrigeration compressor; the integral heat insulation case comprises an outer case body, a heat insulation layer arranged along the inner wall of the outer case body and an inner case body arranged in the inner space of the heat insulation layer, wherein a hot air channel is formed in the space between the inner case body and the heat insulation layer; the inner machine box is internally divided into a computer part mounting area and a cold air channel, a primary heat exchanger is arranged in the cold air channel, a secondary heat exchanger is arranged in the computer part mounting area, a fan is arranged at the primary heat exchanger, and the hot air channel is communicated with the cold air channel through the primary heat exchanger; the refrigerating compressor is internally provided with a compressor, a refrigerant storage box and a refrigerant circulating pump, the compressor is respectively communicated with the refrigerant storage box and the refrigerant circulating pump, the secondary heat exchanger is communicated with the refrigerant storage box through a high-temperature refrigerant pipeline, and the compressor is communicated with the primary heat exchanger through a low-temperature refrigerant pipeline after passing through the refrigerant circulating pump.

Further perfecting the technical scheme, a control system is arranged in the refrigeration compressor; the temperature detector is arranged in the hot air channel, the power detector is arranged in the computer component mounting area, the input end of the control system is connected with the temperature detector and the power detector, and the output end of the control system is respectively connected with the compressor and the refrigerant circulating pump.

Further, an air cooling radiator is further arranged in the refrigeration compressor, and the output end of the control system is connected with the air cooling radiator.

Further, the secondary heat exchanger and the low-temperature refrigerant pipeline are respectively connected with two ends of the primary heat exchanger.

Further, pure water or antifreeze is filled in the refrigerant storage box.

Has the advantages that: compared with the prior art, the utility model has the advantages that: this product comprises integral thermal-insulated quick-witted case, compressor and intelligence control system: the computer host is arranged in the integral heat insulation case, the cold-hot circulation air duct is arranged in the integral heat insulation case, the whole components of the computer host are subjected to integral heat dissipation, the refrigeration compressor generates a low-temperature refrigerant, and the refrigerant can be pure water or antifreeze according to the temperature requirement.

The integral heat insulation case is isolated from the outside heat, an independent air channel is arranged in the heat insulation case, and the heat insulation case can simultaneously dissipate heat of electrical brain parts such as a processor, a display card, a mainboard power supply and a hard disk, so that the use efficiency of a refrigerant is improved, the electric power of 200W can generate the refrigeration power of 600W, the Carnot cycle efficiency is close, and the problem that the traditional heat dissipation system is out of consideration is avoided; the heat insulation case prevents moisture in ambient air from entering, can break through the limit of the temperature of condensed water, and can work below 0 ℃ when antifreeze is used; the heat insulation case also prevents dust in the ambient air from entering, and prevents dust of a traditional heat dissipation system from depositing inside the host machine and needing to be cleaned regularly.

According to the utility model, the independent refrigeration compressor is added, the temperature of a cold source in an active refrigeration mode is greatly lower than the ambient temperature, the allowable temperature rise range of computer components is greatly improved, the heat dissipation power reaches 600W, and the operation efficiency and stability of a high-performance computer platform are greatly improved; the control system is responsible for detecting temperature, humidity and power parameters and intelligently controls the temperature, humidity and power parameters according to parameter changes, and the refrigeration compressor adopts an intelligent detection and control system, so that the refrigeration compressor can be used after being started and does not need manual adjustment.

Drawings

FIG. 1 is a schematic structural view of the present invention;

fig. 2 is a diagram of the duct inside the cabinet.

Detailed Description

The technical solution of the present invention is described in detail below with reference to the accompanying drawings, but the scope of the present invention is not limited to the embodiments.

The active computer cooling system shown in fig. 1 includes an integral heat-insulating cabinet 1, a refrigeration compressor 8, and a control system 13. An air-cooled radiator 10, a compressor 11, a refrigerant circulating pump 12, and a refrigerant storage tank 9 are provided in the refrigeration compressor 8, and the compressor 11 is communicated with the refrigerant storage tank 9 and the refrigerant circulating pump 12, respectively. The integral heat insulation case comprises an outer case 3, a heat insulation layer 4 arranged along the inner wall of the outer case 3 and an inner case 7 arranged in the inner space of the heat insulation layer 4, wherein a hot air channel A is formed in the space between the inner case 7 and the heat insulation layer 4; the inner case 7 is internally divided into a computer component mounting area 5 and a cold air channel B, a primary heat exchanger 1 is arranged in the cold air channel B, and a secondary heat exchanger 6 is arranged in the computer component mounting area.

The secondary heat exchanger 6 is communicated with the refrigerant storage tank 9 through a high-temperature refrigerant pipe 15, the compressor 11 is communicated with the refrigerant circulating pump 12, and the refrigerant circulating pump 12 is communicated with the primary heat exchanger 1 through a low-temperature refrigerant pipe 14. The refrigeration compressor 8 is connected with the integral heat insulation case through a high-temperature refrigerant pipeline 15 and a low-temperature refrigerant pipeline 14, so that the thermodynamic cycle of a low-temperature refrigerant is realized; the fan 2 is arranged at the position of the primary heat exchanger 1, and the hot air channel A is communicated with the cold air channel B through the primary heat exchanger 1, so that the thermodynamic cycle of air is realized.

A temperature detector is arranged in the hot air channel A, a power detector is arranged in a computer component mounting area, a control system 13 is arranged in the refrigeration compressor 8, the input end of the control system 13 is connected with the temperature detector and the power detector, and the output end of the control system 13 is respectively connected with the air cooling radiator, the compressor 11 and the refrigerant circulating pump 12. The control system 13 is responsible for detecting temperature, humidity and power parameters and carrying out intelligent control according to parameter changes.

Low-temperature refrigerant thermal circulation path: the refrigeration compressor 8 generates low-temperature refrigerant, the low-temperature refrigerant is input into the primary heat exchanger 1 of the inner box body 7 to carry out primary heat exchange, then enters the computer component mounting area 5 to carry out secondary heat exchange with the secondary heat exchanger 6, and after absorbing heat, the refrigerant flows back to the refrigeration compressor 8 through the high-temperature refrigerant pipeline 15 to complete circulation.

Internal air thermal circulation path: as shown in fig. 2, the fan 2 sends the hot air flowing through the hot air channel a to the primary heat exchanger 1, and the hot air is heat-exchanged to generate cold air, the cold air is sent to the cold air channel B in the inner chassis 7, the cold air in the cold air channel B dissipates heat of each part of the computer, and the hot air after absorbing heat is discharged to the hot air channel a outside the inner chassis 7 to complete circulation.

The utility model adopts the precisely controlled multi-path thermodynamic cycle, improves the refrigeration power and efficiency, reduces the temperature of a cold source and improves the use efficiency of a computer platform.

Test data 1: intel server E5-1680V2 platform: a CPU: E5-1680V 2; mainboard: maso RAMPAGE IV BLACK edit; a display card: scholar GTX1080 Ti; power supply: andemic HCP 1200W; 8 cores and 16 threads, and the full core overtemperature is 4.9G and stably works for 4.8G. Standby power 160W, standby temperature 30 ℃; peak power 700W, peak temperature 70 degrees, allowing the maximum temperature to be 100 degrees. The frequency of the CPU is limited by the over-frequency limit of the CPU, and cannot be increased.

The traditional 420 water cooling system with the best heat dissipation can exceed the frequency to 4.8G, the peak temperature is 95 ℃, and the maximum temperature is close to the allowable maximum temperature; the traditional 360-degree water cooling system with good heat dissipation can overtake to 4.8G, and the peak temperature exceeds the allowable maximum temperature.

The traditional heat dissipation system can barely reach full-load operation, the operating temperature of a processor reaches the limit of 100 ℃, a computer mainboard and a display card do not have auxiliary heat dissipation, and the system is unstable in long-term operation. The heat dissipation system provided by the utility model can meet the requirement of full-load operation, the operating temperature of the processor does not exceed 70 ℃, the temperature is reduced by 30 ℃, other components of a computer have auxiliary heat dissipation, and the system works stably for a long time.

Test data 2: intel core X platform: a CPU: I9-10900X; mainboard: maso RAMPAGE VI APEX; a display card: scholar GTX1080 Ti; power supply: cool to 1200W; CPU master frequency 3.70 GHz, the Rui frequency 4.50 GHz, the Rui frequency accelerates 3.0 to reach 4.7GHz, 10 kernels 20 threads, the full kernel overclocking is to 5.2G, can work stably. AVX2.0 overclocking to 4.8G, AVX512 overclocking to 4.0G. Standby power is 180W, and standby temperature is 35 ℃; peak power 800W, peak temperature 75 degrees, allowing a maximum temperature of 105 degrees. Intel processors have seen explosive increases in power consumption and heat generation due to the addition of a high performance AVX512 instruction set. AVX is a vector calculation instruction set developed by intel corporation, and is subject to AVX1.0, AVX2.0, and AVX512 (version 3.0), and AVX is widely applied to video encoding, three-dimensional modeling rendering, image processing, and scientific calculation, and can greatly improve the calculation efficiency and increase the power consumption and heat generation of the processor. Therefore, intel corporation also proposed the technical specification for this purpose using AVX: the AVX512 full-core running speed does not exceed 3.5GHz, and a sufficient power supply and a powerful heat dissipation system are required.

The traditional heat dissipation 360 water cooling system can achieve an over-frequency of 4.8G, AVX2.0 closes AVX512 according to the Intel standard, and the peak temperature exceeds 100 ℃; and starting AVX512, and performing instant overtemperature crash or blue screen. When the operation of AVX512 is not started, the test effect is similar to that of the test data 1, the temperature rise is reduced by 30 ℃, and the system is stable; when the AVX512 operation is started, the conventional heat dissipation system cannot be fully operated.

The heat dissipation system provided by the utility model can completely meet the AVX use specification of Intel, achieves the full-core AVX512 over-frequency to 4.0GHz, ensures that the operating temperature of a processor does not exceed 75 ℃, assists in heat dissipation of other parts of a computer and has stable system work.

As noted above, while the present invention has been shown and described with reference to certain preferred embodiments, it is not to be construed as limited thereto. Various changes in form and detail may be made therein without departing from the spirit and scope of the utility model as defined by the appended claims.

Claims (5)

1. An active computer cooling system, comprising: comprises an integral heat insulation case and a refrigeration compressor; the integral heat insulation case comprises an outer case body, a heat insulation layer arranged along the inner wall of the outer case body and an inner case body arranged in the inner space of the heat insulation layer, wherein a hot air channel is formed in the space between the inner case body and the heat insulation layer; the inner machine box is internally divided into a computer part mounting area and a cold air channel, a primary heat exchanger is arranged in the cold air channel, a secondary heat exchanger is arranged in the computer part mounting area, a fan is arranged at the primary heat exchanger, and the hot air channel is communicated with the cold air channel through the primary heat exchanger; the refrigerating compressor is internally provided with a compressor, a refrigerant storage box and a refrigerant circulating pump, the compressor is respectively communicated with the refrigerant storage box and the refrigerant circulating pump, the secondary heat exchanger is communicated with the refrigerant storage box through a high-temperature refrigerant pipeline, and the compressor is communicated with the primary heat exchanger through a low-temperature refrigerant pipeline after passing through the refrigerant circulating pump.

2. The active computer cooling system of claim 1, wherein: a control system is arranged in the refrigeration compressor; the temperature detector is arranged in the hot air channel, the power detector is arranged in the computer component mounting area, the input end of the control system is connected with the temperature detector and the power detector, and the output end of the control system is respectively connected with the compressor and the refrigerant circulating pump.

3. The active computer cooling system of claim 2, wherein: an air cooling radiator is further arranged in the refrigeration compressor, and the output end of the control system is connected with the air cooling radiator.

4. The active computer cooling system of claim 1, wherein: and the secondary heat exchanger and the low-temperature refrigerant pipeline are respectively connected with two ends of the primary heat exchanger.

5. The active computer cooling system of claim 1, wherein: pure water or antifreeze is filled in the refrigerant storage box.

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