CN203465029U - High-reliable sensor chip - Google Patents
High-reliable sensor chip Download PDFInfo
- Publication number
- CN203465029U CN203465029U CN201320503756.9U CN201320503756U CN203465029U CN 203465029 U CN203465029 U CN 203465029U CN 201320503756 U CN201320503756 U CN 201320503756U CN 203465029 U CN203465029 U CN 203465029U
- Authority
- CN
- China
- Prior art keywords
- chip
- copper
- clad plate
- welded
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Landscapes
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
Abstract
The utility model provides a high-reliable sensor chip and belongs to the electronic component field. The chip comprises a NTC thermosensitive chip, a lead wire, a lead, a copper-clad plate and an encapsulating insulation layer used to encapsulate and insulate the NTC thermosensitive chip. One end of the lead wire is welded on the NTC thermosensitive chip and the other end is welded on the copper-clad plate. One end of the lead is welded on the copper-clad plate. By using the high-reliable sensor chip provided in the utility model, stability of internal structures of a thermistor and a temperature sensor are enhanced and simultaneously fastness of a pin of the thermosensitive chip is increased; welding difficulty is greatly reduced; open circuit, short circuit and poor welding conditions during chip pin welding are reduced; generation of defective products and wastes is effectively reduced too; a generation probability of a degraded product is decreased.
Description
Technical field
The utility model relates to a kind of highly reliable sensor chip, belongs to electronic devices and components field.
Background technology
By NTC temperature-sensitive chip as core component, thermistor and the temperature sensor of taking different packing forms to form are widely used in various temperature sensings, temperature compensation, temperature-control circuit, it plays the central role that the variable of temperature is changed into required electronic signal in circuit, development along with electronic technology, the further multifunction of various electronics and intellectuality, NTC temperature-sensitive chip need to be surveyed temperature various, control, the application of the occasions such as compensation increases day by day, requirement to the fastness of the production high efficiency of all kinds of thermistors and temperature sensor and inside thereof is also more and more higher.
As shown in Figure 1, in prior art, generally that one end of lead-in wire 3 is welded on NTC temperature-sensitive chip 1, then directly wire 4 is connected with the other end of lead-in wire 3, then NTC temperature-sensitive chip 1 is sealed to insulation, the thermistor after making is when chips welding, bag insulation course, three steps of welding lead, because the factors such as pressure, manpower can cause short circuit, open circuit, failure welding etc., and welding difficulty, thus substandard products waste product produced, bring waste that processing cost is increased.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of highly reliable sensor chip, when strengthening the stability of thermistor and temperature sensor inner structure, increase temperature-sensitive chip pin fastness, greatly reduce welding difficulty, open circuit, short circuit, failure welding while reducing chip pin welding, effectively reduce the generation of defective products, waste product, reduce the generation probability of substandard products.
For solving above technical matters, the utility model has adopted following technical scheme:
A kind of highly reliable sensor chip, comprise NTC temperature-sensitive chip, lead-in wire, wire, copper-clad plate and by the insulation course of sealing of described NTC temperature-sensitive chip package insulation, described lead-in wire one end is welded on NTC temperature-sensitive chip, and the other end is welded in copper-clad plate, and one end of described wire is welded in copper-clad plate.
Further, described copper-clad plate is high temperature copper-clad plate, can be high temperature resistant.
Further, described NTC temperature-sensitive chip is square piece type.
Adopt above technical scheme, the obtained beneficial effect of the utility model is:
The highly reliable sensor chip that the utility model provides, when strengthening the stability of thermistor and temperature sensor inner structure, increase temperature-sensitive chip pin fastness, greatly reduce welding difficulty, open circuit, short circuit, failure welding while reducing chip pin welding, effectively reduce the generation of defective products, waste product, reduce the generation probability of substandard products.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, technology of the present utility model is described in further detail:
Fig. 1 is the structural drawing of the sensor chip of prior art;
Fig. 2 is the structural drawing of the highly reliable sensor chip of the utility model.
Embodiment
As shown in Figure 2, the highly reliable sensor chip of the utility model comprise NTC temperature-sensitive chip 1, at least one lead-in wire 3, wire 4, copper-clad plate 5 and described NTC temperature-sensitive chip 1 is sealed to insulation seal insulation course 2, described lead-in wire 3 one end are welded on NTC temperature-sensitive chip 1, the other end is welded in copper-clad plate 5, and one end of described wire 4 is welded in copper-clad plate 5.In the present embodiment, going between 3 is two, and copper-clad plate 5 is high temperature copper-clad plate, and NTC temperature-sensitive chip 1 is square piece type.Adopt this kind of structure, will go between 3 and wire 4 by copper-clad plate 5, weld, can greatly increase temperature-sensitive chip pin fastness, reduce welding difficulty, 100% open circuit while reducing chip pin welding, short circuit, failure welding, effectively reduce the generation of defective products, waste product.
Processing installation steps are as follows:
1, by one end of lead-in wire 3 and 1 welding of NTC temperature-sensitive chip;
2, the other end of lead-in wire 3 is welded in copper-clad plate 5;
3, NTC temperature-sensitive chip 1 is sealed to insulation, and detect;
4, wire 4 is welded in copper-clad plate 5.
The highly reliable sensor chip that the utility model provides, when strengthening the stability of thermistor and temperature sensor inner structure, increase temperature-sensitive chip pin fastness, greatly reduce welding difficulty, open circuit, short circuit, failure welding while reducing chip pin welding, effectively reduce the generation of defective products, waste product, reduce the generation probability of substandard products.
Finally it should be noted that: these are only preferred embodiment of the present utility model; be not limited to the utility model; although the utility model is had been described in detail with reference to embodiment; for a person skilled in the art; its technical scheme that still can record aforementioned each embodiment is modified; or part technical characterictic is wherein equal to replacement; but all within spirit of the present utility model and principle; any modification of doing, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (3)
1. a highly reliable sensor chip, it is characterized in that: comprise NTC temperature-sensitive chip, at least one lead-in wire, wire, copper-clad plate and by the insulation course of sealing of described NTC temperature-sensitive chip package insulation, described lead-in wire one end is welded on NTC temperature-sensitive chip, the other end is welded in copper-clad plate, and one end of described wire is welded in copper-clad plate.
2. highly reliable sensor chip according to claim 1, is characterized in that: described copper-clad plate is high temperature copper-clad plate.
3. highly reliable sensor chip according to claim 1, is characterized in that: described NTC temperature-sensitive chip is square piece type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320503756.9U CN203465029U (en) | 2013-08-16 | 2013-08-16 | High-reliable sensor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320503756.9U CN203465029U (en) | 2013-08-16 | 2013-08-16 | High-reliable sensor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203465029U true CN203465029U (en) | 2014-03-05 |
Family
ID=50177383
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320503756.9U Expired - Lifetime CN203465029U (en) | 2013-08-16 | 2013-08-16 | High-reliable sensor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203465029U (en) |
-
2013
- 2013-08-16 CN CN201320503756.9U patent/CN203465029U/en not_active Expired - Lifetime
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104579158B (en) | The processing method of solar electrical energy generation assembly terminal box | |
| CN203536467U (en) | LED device having transition substrate | |
| CN102970831B (en) | The vacuum suction of a kind of IC-card electronic chip and flexible circuit board connects and binds technique | |
| CN202041316U (en) | Transparent packaging thermistor temperature sensor | |
| CN203465029U (en) | High-reliable sensor chip | |
| CN103531550B (en) | The encapsulating structure of the small-space plastic package improved and method for packing | |
| CN207450440U (en) | Packing case case sealing detection device | |
| CN207466265U (en) | A kind of automotive tyre pressure monitoring sensor | |
| CN203277499U (en) | LED module group | |
| CN202633053U (en) | Multi-core-set ceramic capacitor | |
| CN203674199U (en) | Insulation packaged lead frame | |
| CN203895272U (en) | Tantalum capacitor | |
| CN203465026U (en) | Double-probe high-precision body surface temperature sensor | |
| CN202350944U (en) | Integrated injection temperature sensor | |
| CN206181544U (en) | Touch -control structure | |
| CN204713655U (en) | A kind of moistureproof clip chain bag with same | |
| CN207150940U (en) | A kind of PCBA board of encapsulating processing | |
| CN202616258U (en) | Pouring sealant type junction box photovoltaic component | |
| CN102386270A (en) | Method of utilizing photoelectric coupler packaging length to increase inner insulating distance | |
| CN205406572U (en) | Inside encapsulating battery | |
| CN202425043U (en) | Packaging structure of silicon capacitance microphone | |
| CN201956279U (en) | Thermal fuse | |
| CN204010868U (en) | The highly reliable temperature-sensitive chip of a kind of anti-cracking | |
| CN204115885U (en) | A kind of packaging structure of temperature sensor | |
| CN203387594U (en) | Refrigeration sealing structure for embedded-type camera system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140305 |
|
| CX01 | Expiry of patent term |