CN203434144U - IGBT element radiator - Google Patents

IGBT element radiator Download PDF

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Publication number
CN203434144U
CN203434144U CN201320432972.9U CN201320432972U CN203434144U CN 203434144 U CN203434144 U CN 203434144U CN 201320432972 U CN201320432972 U CN 201320432972U CN 203434144 U CN203434144 U CN 203434144U
Authority
CN
China
Prior art keywords
heat
conducting plate
igbt element
radiating fins
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201320432972.9U
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Chinese (zh)
Inventor
童小飞
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KUNSHAN YINGFAN PRECISION METAL Co Ltd
Original Assignee
KUNSHAN YINGFAN PRECISION METAL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KUNSHAN YINGFAN PRECISION METAL Co Ltd filed Critical KUNSHAN YINGFAN PRECISION METAL Co Ltd
Priority to CN201320432972.9U priority Critical patent/CN203434144U/en
Application granted granted Critical
Publication of CN203434144U publication Critical patent/CN203434144U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The utility model provides an IGBT element radiator, including a heat-conducting plate which is provided with insert slots inserted with radiating fins, insert slots is provided with a brazing filler metal, and radiating fins is connected with the heat-conducting plate by the brazing filler metal. The IGBT element radiator is provided with insert slots on the heat-conducting plate and radiating fins in insert slots, the heat-conducting plate and radiating fins can be processed separately in order to break the limitation of a module and a machine stand and make processing more conveniently. The heat-conducting plate and radiating fins are formed the integrative structure connected by the brazing filler metal, which can effectively reduce a thermal resistance and improve a thermal conductivity of a radiator making the efficiency of heat conduction more faster, therefore the IGBT element can be reached a better radiation effect.

Description

IGBT element radiating device
Technical field
The utility model relates to a kind of heat abstractor, particularly relates to a kind of device for IGBT element is dispelled the heat.
Background technology
IGBT a kind ofly controls transistorized novel power transistor with MOS, has the features such as voltage is high, electric current is large, frequency is high, conducting resistance is little, is widely used in the inverter circuit of frequency converter.Along with IGBT element is to high-power future development, the caloric value of IGBT element can be increasing, the corresponding rising of temperature meeting of IGBT element, will affect to the use of IGBT element like this, particularly when temperature reaches certain numerical value, can cause the decay of IGBT element conversion performance.So it is more and more important keep IGBT to work under low-temperature environment for a long time becoming, so people also more and more pay close attention to high power IGBT radiating mode and device.
The radiating mode of existing IGBT element is at pyrotoxin place device aluminium extruded type fin mostly, and heat is conducted on aluminium extruded type fin or inserted sheet type fin naturally, is reached for the object of IGBT heat radiation.But there is certain shortcoming in current aluminium extruded type fin: first, along with the increase of power, the aluminium extruded shape heat abstractor that use will be larger, and larger section bar mold cannot be outputed; In addition in order to reach good heat transfer radiating effect, so require fin thin thickness and comparatively intensive. with increasing heat radiation area on effective space. and heavy section heat radiation is limited to the factor of mould and board. and the sheet of fin is thick conventionally all thicker. and its pitch of fins also has certain requirement. cannot arbitrarily increase area of dissipation.Because existing fin exists the problems referred to above, will limit like this IGBT to the development of high-power direction.
Utility model content
The shortcoming of prior art in view of the above, the purpose of this utility model is to provide a kind of thermal diffusivity good and without the IGBT element radiating device that can process by mould and large-scale board.
For achieving the above object and other relevant objects, the utility model provides a kind of IGBT element radiating device, comprise heat-conducting plate, described heat-conducting plate is provided with several inserted slots, in described inserted slot, be fitted with radiating fin, in described inserted slot, be provided with solder, described radiating fin is connected by solder with described heat-conducting plate.
Preferably, described radiating fin is provided with radiator fan.
Preferably, described heat-conducting plate is aluminium sheet, and described radiating fin is aluminium flake.
As mentioned above, IGBT element radiating device of the present utility model has following beneficial effect: this IGBT element radiating device arranges inserted slot on heat-conducting plate, and radiating fin is installed in inserted slot, heat-conducting plate and radiating fin can separate machined, so just cast aside the restriction of mould and board, it is more convenient that processing is got up; Heat-conducting plate is connected by solder with radiating fin, can make heat-conducting plate and radiating fin connect as one structure, can effectively reduce thermal resistance like this, improve the conductive coefficient of heat abstractor, make heat conduction efficiency faster, thereby can play better radiating effect to IGBT element.
Accompanying drawing explanation
Fig. 1 is the perspective view of the utility model embodiment.
Fig. 2 is the front view of the utility model embodiment.
Element numbers explanation
1 Heat-conducting plate
2 Inserted slot
3 Radiating fin
Embodiment
By particular specific embodiment, execution mode of the present utility model is described below, person skilled in the art scholar can understand other advantages of the present utility model and effect easily by the disclosed content of this specification.
Refer to Fig. 1,2.Notice, appended graphic the illustrated structure of this specification, ratio, size etc., equal contents in order to coordinate specification to disclose only, for person skilled in the art scholar, understand and read, not in order to limit the enforceable qualifications of the utility model, therefore the technical essential meaning of tool not, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under the effect that the utility model can produce and the object that can reach, all should still drop on the technology contents that the utility model discloses and obtain in the scope that can contain.Simultaneously, in this specification, quote as " on ", the term of D score, " left side ", " right side ", " centre " and " " etc., also only for ease of understanding of narrating, but not in order to limit the enforceable scope of the utility model, the change of its relativeness or adjustment, under without essence change technology contents, when being also considered as the enforceable category of the utility model.
As shown in Figure 1, 2, the utility model provides a kind of IGBT element radiating device, and this IGBT element radiating device comprises a heat-conducting plate 1, is provided with several inserted slots 2 that be arranged in parallel on heat-conducting plate 1, interior equal plug-in mounting one radiating fin 3 of each inserted slot 2.In inserted slot 2, be also provided with solder, radiating fin 3 is connected by solder with heat-conducting plate 1.Heat-conducting plate 1 is set to aluminium sheet, and radiating fin 3 is set to aluminium flake, because both materials are identical, can be convenient to like this connect by solder, can play better heat-transfer effect simultaneously.In order to play better radiating effect, on radiating fin 3, generally radiator fan can be set.
This IGBT element radiating device in use, IGBT element is locked on heat-conducting plate 1, and smear super-high heat-conductive silicone grease between heat-conducting plate 1 and IGBT element, when IGBT element is worked, the heat that pyrotoxin sends will conduct on heat-conducting plate 1 by super-high heat-conductive silicone grease, by heat-conducting plate 1, via solder, conducted on radiating fin 3 again, then via radiator fan, heat is blowed in air along assigned direction.So, the heat of IGBT element will take away pyrotoxin endlessly by heat-conducting plate 1, thereby can play good thermolysis to IGBT element.
This IGBT element radiating device arranges inserted slot on heat-conducting plate, and radiating fin is installed in inserted slot, and heat-conducting plate and radiating fin can separate machined, so just cast aside the restriction of mould and board, and it is more convenient that processing is got up; Heat-conducting plate is connected by solder with radiating fin, can make heat-conducting plate and radiating fin connect as one structure, can effectively reduce thermal resistance like this, improve the conductive coefficient of heat abstractor, make heat conduction efficiency faster, thereby can play better radiating effect to IGBT element; This IGBT element radiating device can not increase because of the increase of power the volume of heat abstractor, the performance of performance IGBT element that therefore can be good.So the utility model has effectively overcome various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present utility model and effect thereof only, but not for limiting the utility model.Any person skilled in the art scholar all can, under spirit of the present utility model and category, modify or change above-described embodiment.Therefore, have in technical field under such as and conventionally know that the knowledgeable modifies or changes not departing from all equivalences that complete under spirit that the utility model discloses and technological thought, must be contained by claim of the present utility model.

Claims (3)

1. an IGBT element radiating device, it is characterized in that: it comprises a heat-conducting plate, described heat-conducting plate is provided with several inserted slots, in described inserted slot, is fitted with radiating fin, in described inserted slot, be provided with solder, described radiating fin is connected by solder with described heat-conducting plate.
2. IGBT element radiating device according to claim 1, is characterized in that: described radiating fin is provided with radiator fan.
3. IGBT element radiating device according to claim 1, is characterized in that: described heat-conducting plate is aluminium sheet, and described radiating fin is aluminium flake.
CN201320432972.9U 2013-07-19 2013-07-19 IGBT element radiator Expired - Fee Related CN203434144U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320432972.9U CN203434144U (en) 2013-07-19 2013-07-19 IGBT element radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320432972.9U CN203434144U (en) 2013-07-19 2013-07-19 IGBT element radiator

Publications (1)

Publication Number Publication Date
CN203434144U true CN203434144U (en) 2014-02-12

Family

ID=50063168

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320432972.9U Expired - Fee Related CN203434144U (en) 2013-07-19 2013-07-19 IGBT element radiator

Country Status (1)

Country Link
CN (1) CN203434144U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106455443A (en) * 2016-11-03 2017-02-22 常州热盛换热器有限公司 Radiator and forming process based on same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106455443A (en) * 2016-11-03 2017-02-22 常州热盛换热器有限公司 Radiator and forming process based on same

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140212

Termination date: 20150719

EXPY Termination of patent right or utility model