CN202663707U - Heat radiator of electronic element - Google Patents
Heat radiator of electronic element Download PDFInfo
- Publication number
- CN202663707U CN202663707U CN 201220279239 CN201220279239U CN202663707U CN 202663707 U CN202663707 U CN 202663707U CN 201220279239 CN201220279239 CN 201220279239 CN 201220279239 U CN201220279239 U CN 201220279239U CN 202663707 U CN202663707 U CN 202663707U
- Authority
- CN
- China
- Prior art keywords
- fin
- matrix
- electronic component
- radiator
- heat radiation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The utility model provides a heat radiator of an electronic element. The heat radiator comprises a base body and heat radiation sheets; the base body is connected with more than one electronic element; and more than two groups of the heat radiation sheets are further arranged on the base body. According to the heat radiator of the electronic element provided by the utility model, the surface of one side of the base body is connected with the electronic element for absorbing and conducting heat, and a plurality of heat radiation sheets are vertically arranged on the surface of the other side of the base body. The heat radiation sheets are in various shapes; the cross sections of the heat radiation sheets can be selected to be cylindrical, conical, wave-shaped, and branch-shaped or in a mixed shape of the shapes according to the specific conditions in a working process of the electronic element. The surfaces of the two sides of the heat radiation sheets can be selected to be a smooth surface, a ripple surface, a saw-tooth surface or the mixing of the surfaces according to the heat radiation conditions. The heat radiator provided by the utility model has the advantages of high heat conduction efficiency, light weight, large heat radiation area, mature machining technique, high yield, convenience in installation and the like.
Description
Technical field
The utility model relates to a kind of radiator of electronic component, is mainly used in strengthening heat radiation with the protection electronic component.
Background technology
At present, along with developing rapidly of electronic industry, the power consumption of various electronic components also strengthens thereupon, also becomes the extremely urgent problem of electron trade and how to solve the huge heat that electronic component produces at work.In order to protect electronic component, prolong the useful life of electronic component, all can be provided with radiator in most of electric equipments.Radiator is a kind of device that easy heat-generating electronic elements in the electrical equipment is dispelled the heat.With respect to air-cooled (fluid class) technology and silicon refrigeration technique, as heat conduction and the heat radiation main body radiator have higher efficient and superiority of effectiveness.General radiator all is by contact with electronic component, and the fin that passes through strip or piece with dissipation of heat in air.This type of heat radiating fin structure is single, inefficiency.Therefore, be necessary to make further improvements.
The utility model content
The purpose of this utility model aims to provide the radiator under the maximum temperature that a kind of working temperature that guarantees electronic component maintains its permission, to overcome the deficiencies in the prior art part.
Press the radiator of a kind of electronic component of this purpose design, comprise matrix and fin, electronic component is connected with matrix, and its architectural feature is that matrix is connected with more than one electronic component, at the fin that also is provided with on the matrix more than two groups.
Described matrix comprises the first outer surface and the second outer surface, and the first outer surface is the installed surface that is connected with electronic component; The second outer surface is the installed surface of fin, and two groups of above fin are installed on the second outer surface.
The second outer surface of described matrix is plane, arc, stairstepping, waveform, or above-mentioned several shape blending setting.
What described fin was upright is arranged on the second outer surface, and the cross section of fin is cylindrical, taper, waveform, dendriform, or above-mentioned several shape blending setting.
Described fin is fan-shaped array on matrix, and what perhaps be parallel to each other is arranged on the matrix.
Described fin comprises the first side and the second side, and its surface configuration comprises shiny surface, corrugated surface, serrated face, or setting is mixed on above-mentioned several surface.
Described matrix and fin are one-body molded, and its material comprises aluminium alloy, copper alloy or metalloid alloy.
The radiator of electronic component of the present utility model, the surface of matrix one side is connected with electronic component, is used for absorbing and the conduction heat; Uprightly be provided with a plurality of fin on the surface of opposite side.Fin has a plurality of shapes, the concrete condition when working according to electronic component, and can select the cross section is taper, waveform, dendriform, or the fin of above-mentioned several shape blendings.The surface of the both sides of fin can be selected to be set to shiny surface, corrugated surface, serrated face according to the heat radiation situation, or the mixing on above-mentioned several surfaces.The design have the thermal conductivity height, lightweight, area of dissipation is large, processing technology is ripe, output capacity is high, the advantage such as easy for installation.
Description of drawings
Fig. 1 is that the second outer surface of the utility model one embodiment matrix is step-like structural representation.
Fig. 2 is that the second outer surface of the second embodiment matrix is the structural representation on plane.
Fig. 3 is that the 3rd embodiment matrix the second outer surface is that stairstepping mixes the structural representation that arranges with arc.
Fig. 4 is the 4th embodiment taper heat radiating fin structure schematic diagram.
Fig. 5 is the structural representation of the 5th embodiment corrugated fin.
Fig. 6, Fig. 7 are that taper fin and corrugated fin mix the structural representation that arranges.
Fig. 8 is that the 8th embodiment fin is the fan-shaped structural representation that is arranged on the matrix.
Fig. 9 is that the 9th embodiment dendriform fin and taper fin mix the structural representation that arranges.
Figure 10-Figure 14 is that the side of the tenth embodiment fin is the structural representation of corrugated surface.
Figure 15 is that the first side of the 11 embodiment fin is that corrugated surface, the second side are the structural representation of shiny surface.
Figure 16 is that the 12 embodiment fin side is the structural representation of serrated face.
Figure 17, Figure 18 are that the fin side is that serrated face and shiny surface mix the structural representation that arranges.
Figure 19 is that the side of the fin of the fan-shaped setting of the 15 embodiment is the structural representation of serrated face.
Figure 20, Figure 21 are that shape and the side of fin is the structural representation that mixes setting.
Among the figure: 1 is matrix, and 1.1 is the first outer surface, and 1.2 is the second outer surface, and 2 is fin, and 2.1 is the first side, and 2.2 is the second side.
Embodiment
Below in conjunction with drawings and Examples the utility model is further described.
The first embodiment
Referring to Fig. 1, a kind of radiator of electronic component comprises the matrix 1 and the fin 2 that are wholely set.The first outer surface 1.1 of matrix 1 is connected with electronic component, the heat that produces when being used for the work of absorption and conduction electron element; The second outer surface 1.2 of matrix 1 is the stairstepping setting, uprightly is provided with eight groups of corrugated fin 2 on the second outer surface 1.2.What fin was parallel to each other is evenly distributed on the matrix 1.The side of fin 2 is the contact area that corrugated, corrugated side can increase fin 2 and air, to accelerate radiating rate.If need to further increase/subtract the radiating rate of radiator, thickness that can also be by thickening matrix 1 and/or increase fin 2 area of dissipations increasing caloric value, to reduce the electronic component working temperature, thereby guarantees reliability and the useful life of electronic component; And/or with fin 2 excision of part, to reduce the radiating rate of radiator.The design have the thermal conductivity height, lightweight, area of dissipation is large, processing technology is ripe, output capacity is high, the advantage such as easy for installation.
The second embodiment
Referring to Fig. 2, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is the plane, and eight groups of corrugated fin 2 are uprightly arranged on the second outer surface 1.2.All the other do not state the same embodiment of part.
The 3rd embodiment
Referring to Fig. 3, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is that stairstepping and arc mix setting, and eight groups of corrugated fin 2 are uprightly arranged on the second outer surface 1.2.All the other do not state the same embodiment of part.
The 4th embodiment
Referring to Fig. 4, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is the plane, and the fin 2 of 11 groups of tapers is uprightly arranged on the second outer surface 1.2.All the other do not state the same embodiment of part.
The 5th embodiment
Referring to Fig. 5, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is stairstepping, and eight groups of corrugated fin 2 are uprightly arranged on the second outer surface 1.2.All the other do not state the same embodiment of part.
The 6th embodiment
Referring to Fig. 6, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is stairstepping, and 8 groups of corrugated fin 2 are uprightly arranged on the second outer surface 1.2, also respectively is provided with the fin 2 of a taper at the two ends of corrugated fin.All the other do not state the same embodiment of part.
The 7th embodiment
Referring to Fig. 7, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is stairstepping, mixes being provided with taper and corrugated fin on the second outer surface 1.2.All the other do not state the same embodiment of part.
The 8th embodiment
Referring to Fig. 8, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is stairstepping, and the fin 2 of taper is fan-shaped and is arranged on the second outer surface 1.2.All the other do not state the same embodiment of part.
The 9th embodiment
Referring to Fig. 9, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is stairstepping, uprightly has the two ends of organizing dendriform fin 2, the second outer surfaces 1.2 also respectively to be provided with the fin 2 of a taper on the second outer surface 1.2 more.All the other do not state the same embodiment of part.
The tenth embodiment
Referring to Figure 10-Figure 14, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is stairstepping, and many group fin 2 are uprightly arranged on the second outer surface 1.2, and the side of fin is corrugated surface.All the other do not state the same embodiment of part.
The 11 embodiment
Referring to Figure 15, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is stairstepping, uprightly has the two ends of 8 groups of corrugated fin 2, the second outer surfaces 1.2 also respectively to be provided with the fin of a taper on the second outer surface 1.2.The first side 2.1 of fin 2 is corrugated surface, and the second side 2.2 is shiny surface.All the other do not state the same embodiment of part.
The 12 embodiment
Referring to Figure 16, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is the plane, is provided with the fin 2 of taper at the second outer surface 1.2, and the side of fin is serrated face.All the other do not state the same embodiment of part.
The 13 embodiment
Referring to Figure 17, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is the plane, and corrugated fin 2 is uprightly arranged on the second outer surface 1.2.The first side 2.1 of fin 2 is serrated face, and the second side 2.2 is shiny surface.All the other do not state the same embodiment of part.
The 14 embodiment
Referring to Figure 18, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is the plane, and corrugated fin 2 is uprightly arranged on the second outer surface 1.2.The first side 2.1 that is arranged on two groups of fin on the second outer surface 1.2 tops is serrated face, and the second side 2.2 is shiny surface; The second side 2.1 that is arranged on two groups of fin of the second outer surface 1.2 bottoms is serrated face, and the first side 2.2 is shiny surface.All the other do not state the same embodiment of part.
The 15 embodiment
Referring to Figure 19, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is stairstepping, and the fin 2 of taper is fan-shaped and is arranged on the second outer surface 1.2.The side of fin 2 is serrated face.All the other do not state the same embodiment of part.
The 16 embodiment
Referring to Figure 20, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is the plane, mixes the fin 2 that is provided with waveform and taper at the second outer surface 1.2.The first side 2.1 that is arranged on two groups of corrugated fin on the second outer surface 1.2 tops is serrated face, and the second side 2.2 is shiny surface; The second side 2.1 that is arranged on two groups of corrugated fin 2 of the second outer surface 1.2 bottoms is serrated face, and the first side 2.2 is shiny surface; The side of fin 2 that is arranged on the taper at the second outer surface 1.2 middle parts is serrated face.All the other do not state the same embodiment of part.
The 17 embodiment
Referring to Figure 21, a kind of radiator of electronic component comprises matrix 1 and fin 2.The second outer surface 1.2 of matrix 1 is the plane, mixes the fin 2 that is provided with waveform and taper at the second outer surface 1.2.The side of the fin 2 of corrugated fin 2 and part taper is corrugated surface, and the side of the fin 2 of remaining taper is shiny surface.All the other do not state the same embodiment of part.
Claims (7)
1. the radiator of an electronic component comprises matrix (1) and fin (2), and electronic component is connected with matrix, it is characterized in that matrix (1) is connected with more than one electronic component, also is provided with the fin (2) more than two groups on matrix (1).
2. the radiator of electronic component according to claim 1 is characterized in that described matrix (1) comprises the first outer surface (1.1) and the second outer surface (1.2), and the first outer surface (1.1) is the installed surface that is connected with electronic component; The second outer surface (1.2) is the installed surface of fin (2), and two groups of above fin (2) are installed on the second outer surface (1.2).
3. the radiator of electronic component according to claim 2 is characterized in that second outer surface (1.2) of described matrix (1) is plane, arc, stairstepping, waveform, or above-mentioned several shape blending setting.
4. the radiator of each described electronic component according to claim 1-3, it is characterized in that upright being arranged on the second outer surface (1.2) of described fin (2), the cross section of fin (2) is cylindrical, taper, waveform, dendriform, or above-mentioned several shape blending setting.
5. the radiator of electronic component according to claim 4 is characterized in that described fin (2) is fan-shaped array on matrix (1), and what perhaps be parallel to each other is arranged on the matrix (1).
6. the radiator of electronic component according to claim 5 is characterized in that described fin (2) comprises the first side (1.1) and the second side (1.2), and its surface configuration comprises shiny surface, corrugated surface, serrated face, or setting is mixed on above-mentioned several surface.
7. the radiator of electronic component according to claim 6 is characterized in that described matrix (1) and fin (2) are one-body molded, and its material comprises aluminium alloy, copper alloy or metalloid alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220279239 CN202663707U (en) | 2012-06-13 | 2012-06-13 | Heat radiator of electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220279239 CN202663707U (en) | 2012-06-13 | 2012-06-13 | Heat radiator of electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202663707U true CN202663707U (en) | 2013-01-09 |
Family
ID=47458574
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220279239 Expired - Lifetime CN202663707U (en) | 2012-06-13 | 2012-06-13 | Heat radiator of electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202663707U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200805A (en) * | 2013-04-03 | 2013-07-10 | 张家港市华力电子有限公司 | Heat radiation structure of electronic devices in sealed shell |
| CN103791282A (en) * | 2014-01-25 | 2014-05-14 | 江苏雷立博光电有限公司 | Heat dissipation type led lamp |
| CN105377002A (en) * | 2015-12-04 | 2016-03-02 | 太仓陶氏电气有限公司 | Snowflake-shaped liquid radiator |
| CN107819373A (en) * | 2017-12-01 | 2018-03-20 | 丹阳荣嘉精密机械有限公司 | A kind of good electric machine casing of thermal diffusivity |
| CN110970547A (en) * | 2019-12-23 | 2020-04-07 | 陈元园 | LED packaging substrate and LED packaging structure |
-
2012
- 2012-06-13 CN CN 201220279239 patent/CN202663707U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103200805A (en) * | 2013-04-03 | 2013-07-10 | 张家港市华力电子有限公司 | Heat radiation structure of electronic devices in sealed shell |
| CN103791282A (en) * | 2014-01-25 | 2014-05-14 | 江苏雷立博光电有限公司 | Heat dissipation type led lamp |
| CN105377002A (en) * | 2015-12-04 | 2016-03-02 | 太仓陶氏电气有限公司 | Snowflake-shaped liquid radiator |
| CN105377002B (en) * | 2015-12-04 | 2018-07-06 | 太仓陶氏电气有限公司 | A kind of snowflake shape liquid radiator |
| CN107819373A (en) * | 2017-12-01 | 2018-03-20 | 丹阳荣嘉精密机械有限公司 | A kind of good electric machine casing of thermal diffusivity |
| CN110970547A (en) * | 2019-12-23 | 2020-04-07 | 陈元园 | LED packaging substrate and LED packaging structure |
| CN110970547B (en) * | 2019-12-23 | 2021-10-26 | 陈元园 | LED packaging substrate and LED packaging structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202663707U (en) | Heat radiator of electronic element | |
| CN105140194A (en) | Heat-superconducting radiator and manufacturing method thereof | |
| CN205104482U (en) | Superconductive radiator of heat | |
| CN205319657U (en) | Bus slot | |
| CN201859928U (en) | Novel cooling system for battery packs | |
| CN204598547U (en) | A kind of liquid cooling plate for electric motor car | |
| CN203014310U (en) | Heat resistant busway | |
| CN208505088U (en) | A kind of micro channel heat exchange plate with multiple dimensioned surface texture featur | |
| CN208046475U (en) | A kind of high-heat conductivity and large-power synchronous rectification module | |
| CN205488102U (en) | High -power plate thyristor heat pipe cooling ware for device | |
| CN204632885U (en) | A kind of lithium-ions battery | |
| CN203518758U (en) | Efficient circulating corrugated fin structure | |
| CN203416179U (en) | Vehicle sheet metal inversion restoration machine | |
| CN203859129U (en) | Photovoltaic module | |
| CN202712234U (en) | Solar cell module having heat-dissipation packaging structure | |
| CN106132181A (en) | There is the large power, electrically source apparatus of hot superconducting radiator | |
| CN205174294U (en) | High -power heat pipe cooling ware | |
| CN203435279U (en) | IGBT element radiating structure | |
| CN205017775U (en) | Copper and aluminium welding connects radiator | |
| CN203217475U (en) | Computer host power supply with excellent heat dissipation performance | |
| CN204578345U (en) | Semiconductor refrigeration type switch power module | |
| CN202523698U (en) | Air-cooling radiator for IGBT | |
| CN220672310U (en) | Self-cooling energy dissipation resistor | |
| CN202551588U (en) | Multi-tooth-peak cooling fin | |
| CN203369034U (en) | Heat conduction and dissipation device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130109 |