CN203859129U

CN203859129U - Photovoltaic module

Info

Publication number: CN203859129U
Application number: CN201420284492.7U
Authority: CN
Inventors: 陈晓华; 景昌忠; 王毅
Original assignee: Yangzhou Yangjie Electronic Co Ltd
Current assignee: Yangzhou Yangjie Electronic Co Ltd
Priority date: 2014-05-29
Filing date: 2014-05-29
Publication date: 2014-10-01
Anticipated expiration: 2024-05-29
Also published as: JP3195564U

Abstract

A photovoltaic module provided by the utility model is simple in structure, good in temperature balance and high in product stability. The photovoltaic module comprises copper sheets I-IV, chips I-III and a plurality of jumpers. Uniform intervals exist among the copper sheets. The copper sheet I is provided with the chip I. The copper sheet II is provided with the chip II. The chip I and the chip II are identical in polarity. The chip III is arranged on the copper sheet IV. The polarity of the chip III is opposite to that of the chip I and the chip II. And then, the chip III is connected with the copper sheet III through one jumper. According to the utility model, the welding structure in the module and the welding positions of the chips are adjusted, and one of the chips is converted in position, so that the heat energy produced by the chip is far away from the next chip and the middle position of the product, the middle part of the product is protected against heat accumulation, the chips are protected against temperature rising, and the integral performance of the product is further improved.

Description

A kind of photovoltaic module

Technical field

The utility model relates to photovoltaic module series products used for solar batteries, relates in particular to the improvement of photovoltaic diode integration module.

Background technology

In photovoltaic industry, the object of semiconductor discrete component encapsulation is that the high reliability under uniformity and high temperature to temperature rise has very important requirement in order to make semiconductor chip function offer user and reach certain usability with form easily.Wherein, the welding manner of chip directly has influence on thermal resistance and the temperature rise effect of product.

Along with developing rapidly of semicon industry, client is more and more higher to the requirement of discrete component, and in photovoltaic industry, require that temperature rise reduction, chip size reduce, cost also requires to get more and more, make in limited inner space, to improve the thermal diffusivity of product, how to make full use of the thermal diffusivity of copper part, under the prerequisite that does not reduce properties of product, meet client's requirement, become the technical barrier of this area.

Prior art as shown in Fig. 5-6, three chips (being chip 1, chip 2 22 and chip 3 23) series connection and all adopt same surface towards technique (be P and face up, or N faces up); Do like this us and find the very large heat of meeting " accumulation " on copper sheet 2 12 in four copper sheets (copper sheet 1, copper sheet 2 12, copper sheet 3 13, copper sheet 4 14) and copper sheet 3 13, main cause is that the heat of chip 2 22 and chip 3 23 has intensively been stacked on copper sheet 2 12 in middle part, copper sheet 3 13.This can cause the temperature rise of the product middle part after encapsulation large, and the temperature equalization of product entirety is poor.

Utility model content

The utility model, for above problem, provides a kind of simple in structure, and temperature equalization is good, and then impels the photovoltaic module that product stability is high.

The technical solution of the utility model is: comprise copper sheet one ~ tetra-, chip one ~ tri-and some wire jumpers, copper sheet one ~ tetra-leaves uniform gap each other, is provided with chip one on copper sheet one, and copper sheet two is provided with chip two, and chip one is identical with the polarity of chip two; Described chip three is located on described copper sheet four, and the polarity of described chip three is contrary with described chip one, two, then, then is connected with described copper sheet three by wire jumper.

Described chip one is located at the front of copper sheet one, the front that chip two is located at copper sheet two, the front that chip three is located at copper sheet four.

The P of described chip one and chip two faces up, and the N of described chip three faces up.

The N of described chip one and chip two faces up, and the P of described chip three faces up.

The utility model is adjusted the welding position of inside modules Welding Structure and chip, " transposition " carried out in the position of a chip wherein, the heat energy that so just makes this chip is away from next chip, away from the centre position of finished product, avoid piling up heat at the middle part of product, cause chip temperature rise; And then make the performance improvement of product entirety.

Brief description of the drawings

Fig. 1 is structural representation of the present utility model,

Fig. 2 is the cutaway view of A-A face in Fig. 1,

Fig. 3 is the cutaway view of B-B face in Fig. 1,

Fig. 4 is working state figure of the present utility model,

Fig. 5 is structural representation of the prior art,

Fig. 6 is the cutaway view of C-C face in Fig. 5;

In figure, 10 is packaging bodies, the 11st, and copper sheet one, 12nd, copper sheet two, 13rd, copper sheet three, 14th, copper sheet four, 21st, chip one, 22nd, chip two, 23rd, chip three, 24th, P face, the 25th, N face, the 3rd, wire jumper.

Embodiment

The utility model as Figure 1-4, comprise copper sheet one ~ tetra-(being copper sheet 1, copper sheet 2 12, copper sheet 3 13 and copper sheet 4 14), chip one ~ tri-(being chip 1, chip 2 22 and chip 3 23) and some wire jumpers 3, copper sheet one ~ tetra-leaves uniform gap each other, on copper sheet 1, be provided with chip 1, copper sheet 2 12 is provided with chip 2 22, and chip one is identical with the polarity of chip two; Described chip 3 23 is located on described copper sheet 4 14, and the polarity of described chip three is contrary with described chip one, two, then, then is connected with described copper sheet three by wire jumper.

Described chip 1 is located at the front of copper sheet 1, the front that chip 2 22 is located at copper sheet 2 12, the front that chip 3 23 is located at copper sheet 4 14.

As Figure 2-3, upward, the N face 25 of described chip 3 23 upward for the P face 24 of described chip 1 and chip 2 22.

At work, the outside of copper sheet, chip and wire jumper encapsulates by packaging body 10 the utility model; After inside modules is adjusted, meet electric current and flow into from "+", the requirement that "-" flows out, has increased the middle heat-dissipating space of product, effectively reduces temperature rise, has improved product quality and working life.

Claims

1. a photovoltaic module, comprises copper sheet one ~ tetra-, chip one ~ tri-and some wire jumpers, and copper sheet one ~ tetra-leaves uniform gap each other, is provided with chip one on copper sheet one, and copper sheet two is provided with chip two, and chip one is identical with the polarity of chip two; It is characterized in that, described chip three is located on described copper sheet four, and the polarity of described chip three is contrary with described chip one, two, then, then is connected with described copper sheet three by wire jumper.

2. a kind of photovoltaic module according to claim 1, is characterized in that, described chip one is located at the front of copper sheet one, the front that chip two is located at copper sheet two, the front that chip three is located at copper sheet four.

3. a kind of photovoltaic module according to claim 2, is characterized in that, the P of described chip one and chip two faces up, and the N of described chip three faces up.

4. a kind of photovoltaic module according to claim 2, is characterized in that, the N of described chip one and chip two faces up, and the P of described chip three faces up.