CN203429102U - Adhesive tape - Google Patents

Adhesive tape Download PDF

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Publication number
CN203429102U
CN203429102U CN201320450313.8U CN201320450313U CN203429102U CN 203429102 U CN203429102 U CN 203429102U CN 201320450313 U CN201320450313 U CN 201320450313U CN 203429102 U CN203429102 U CN 203429102U
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CN
China
Prior art keywords
adhesive tape
tack coat
layer
protective layer
substrate layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201320450313.8U
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Chinese (zh)
Inventor
赵定现
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BYD Co Ltd
Original Assignee
BYD Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BYD Co Ltd filed Critical BYD Co Ltd
Priority to CN201320450313.8U priority Critical patent/CN203429102U/en
Application granted granted Critical
Publication of CN203429102U publication Critical patent/CN203429102U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Adhesive Tapes (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

The utility model provides an adhesive tape. The adhesive tape comprises a base material layer, bonding layers and a protective layer, wherein the base material layer is used for bearing the adhesive tape; the bonding layers are arranged on the base material, are used for bonding the adhesive tape and are arranged in partial regions of the single side or double sides of the base material layer; the protective layer is arranged on the bonding layers and is used for protecting the bonding layers. The adhesive tape provided by the utility model can eliminate adhesive residues.

Description

A kind of adhesive tape
Technical field
The utility model belongs to PCB field, relates in particular to a kind of adhesive tape.
Background technology
In existing electronics, be nearly all provided with these parts of printed wiring; in electronic equipment internal; printed-wiring board (PWB) adopts reflow soldering process to be connected with electronic component conventionally; when reflow soldering process carries out, need to the coverings such as protective tapes be set on printed-wiring board (PWB) printed-wiring board (PWB) is protected simultaneously.
And existing protective tapes, when through reflow soldering process, on the circuit on printed-wiring board (PWB), often easily there is the phenomenon of cull in it; When there is cull phenomenon, need to remove the cull on printed-wiring board (PWB), in scale removal process, tend to printed-wiring board (PWB) to cause cut, printed-wiring board (PWB) is damaged, more serious meeting was lost efficacy printed-wiring board (PWB), cannot work.
While therefore needing a kind of reflow soldering process badly, can not produce the adhesive tape of cull phenomenon.
Summary of the invention
Technical problem to be solved in the utility model is: existing adhesive tape, when reflow soldering process finishes and remove, cull phenomenon can occur, and removes inconvenient technical problem.
, it comprises for carrying the substrate layer of adhesive tape; Be arranged on substrate layer for making the tack coat of adhesive tape bonding; Be arranged on tack coat, for the protection of the protective layer of tack coat; Described tack coat is arranged in the subregion of single or double of substrate layer.
Preferably, be provided with He Fei bond regions, bond regions on described substrate layer, described tack coat is arranged on described bond regions.
Preferably, protective layer all covers tack coat or whole covering substrates layer.
Preferably, protective layer is a kind of in PET protective layer or PTT protective layer.
Preferably, the thickness of protective layer and the Thickness Ratio of described adhesive tape are 0.20 ~ 0.47.
Preferably, the anti-electrostatic value of substrate layer is 10 6ohm ~ 10 9ohm.
Preferably, adhesive tape is integrated hot-forming structure.
Preferably, tack coat is high temperature resistant bonding layer.
Preferably, tack coat is a kind of in silicone based glue bond layer, Phenol aldehyde resin tack coat, urea-formaldehyde resin adhesive tack coat, heatproof epoxy glue bonding layer and polymeric amide glue bond layer.
Preferably, the thickness of tack coat is 0.055mm ~ 0.60mm.
Preferably, the thickness of tack coat and the Thickness Ratio of described adhesive tape are 0.37 ~ 0.40.
Preferably, the Thickness Ratio of tack coat and described substrate layer is 2.2 ~ 2.4.
The adhesive tape that the utility model provides, it comprise substrate layer, protective layer and be arranged on substrate layer and protective layer between tack coat, on substrate layer, comprise He Fei bond regions, bond regions, tack coat is arranged on bond regions.Adopt adhesive tape provided by the invention; can well protection circuit plate; when Reflow Soldering; adhesive tape can not occur to come off and finishes in Reflow Soldering; while tearing adhesive tape, can on printed-wiring board (PWB), not produce the phenomenon of cull, not need printed-wiring board (PWB) to carry out secondary cleaning; avoid printed-wiring board (PWB) to damage, extended the life-span of printed-wiring board (PWB).
Accompanying drawing explanation
Fig. 1 is the sectional view of the adhesive tape that provides of the utility model.
Fig. 2 is the schematic diagram of the adhesive tape that provides of the utility model.
Embodiment
Clearer for technical problem, technical scheme and beneficial effect that the utility model is solved, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein is only in order to explain the utility model, and be not used in restriction the utility model.
Describe embodiment of the present utility model below in detail, the example of described embodiment is shown in the drawings, and wherein same or similar label represents same or similar element or has the element of identical or similar functions from start to finish.Below by the embodiment being described with reference to the drawings, be exemplary, only for explaining the utility model, and can not be interpreted as restriction of the present utility model.
In description of the present utility model, it will be appreciated that, term " " center ", " longitudinally ", " laterally ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end ", " interior ", orientation or the position relationship of indications such as " outward " are based on orientation shown in the drawings or position relationship, only the utility model and simplified characterization for convenience of description, rather than device or the element of indication or hint indication must have specific orientation, with specific orientation structure and operation, therefore can not be interpreted as restriction of the present utility model.In addition, term " first ", " second " be only for describing object, and can not be interpreted as indication or hint relative importance.
In description of the present utility model, it should be noted that, unless otherwise clearly defined and limited, term " installation ", " being connected ", " connection " should be interpreted broadly, and for example, can be to be fixedly connected with, and can be also to removably connect, or connect integratedly; Can be mechanical connection, can be to be also electrically connected to; Can be to be directly connected, also can indirectly be connected by intermediary, can be the connection of two element internals.For the ordinary skill in the art, can particular case understand the concrete meaning of above-mentioned term in the utility model.
Below in conjunction with drawings and Examples, the utility model is described further.
As shown in Figure 1 and 2, a kind of adhesive tape, it comprises for carrying the substrate layer 3 of adhesive tape; Be arranged on substrate layer 3 for making the tack coat 2 of adhesive tape bonding; Be arranged on tack coat 2, for the protection of the protective layer 3 of tack coat 2; Described tack coat 2 parts are arranged on the one side of substrate layer 1 or two-sided.
The utility model is not done particular requirement to the shape of adhesive tape; can can be also circle for square, concrete shape be determined according to printed-wiring board (PWB) shape; as long as tape portion covers or covers printed-wiring board (PWB) completely, can make like this printed-wiring board (PWB) completely protected firmly.
Substrate layer 1, preferably, it is polyimide base material layer, according to practical situation, can select black or dark brown, adopts the high temperature that the adhesive tape of these two kinds of colors can resistance to 240 ~ 280; Wherein substrate layer 1 anti-electrostatic value is 10 6ohm ~ 10 9ohm; The thickness of further preferred substrate layer 1 is 0.025mm ~ 0.030mm; Adopt the substrate layer of this thickness can carry the tack coat 2 on adhesive tape, play the effect of support, when through reflow soldering process, protect tack coat 2, prevent that tack coat 2 lost efficacy, also can protect tack coat 2, prevent that it from coming off when printed-wiring board (PWB) is carried out to reflow soldering process simultaneously; And after reflow soldering process finishes, can be easy to tear.
Substrate layer 1 surface is divided into 11He Fei bond regions, bond regions 12, described tack coat 2 is arranged on bond regions 11, the 11Yu Fei bond regions, bond regions 12 of the utility model definition refers to: on general printed-wiring board (PWB), comprise line areas and logicalnot circuit district, line areas refers to the part with circuit, and logicalnot circuit district refers to the substrate zone that there is no circuit; Tape sticker is attached on printed-wiring board (PWB), and what corresponding with line areas is 12，Yu logicalnot circuit district, non-bond regions was corresponding is bond regions 11; When tape sticker is attached on printed-wiring board (PWB), bond regions 11 contacts bonding with the substrate zone of printed-wiring board (PWB), and the non-bond regions 12 of base material contacts non-bonding with the line areas of printed-wiring board (PWB), so both can be so that tape sticker had been attached on printed-wiring board (PWB); Simultaneously owing to not contacting with tack coat on the line areas on printed-wiring board (PWB), when removing adhesive tape, can guarantee to there will not be on the line areas on printed-wiring board (PWB) the phenomenon of cull, do not need follow-uply to there being the line areas of cull to carry out clean on printed-wiring board (PWB), avoid printed-wiring board (PWB) to cause damage yet; And when reflow soldering process, can protect printed-wiring board (PWB), its removal is simple and convenient; Further preferably, tack coat 2 is 2.2 ~ 2.4 with the Thickness Ratio of substrate layer 1; Further preferred, one side or the two-sided tack coat 2 that is provided with at substrate layer 1, when when substrate layer two-sided is provided with tack coat, it is five-layer structure, and concrete is: the first protective layer-the first tack coat-substrate layer-the second tack coat-the second protective layer (not shown); Can make like this range of application of adhesive tape wider, make can use under different condition.
Tack coat 2 can be in silicone based glue bond layer, Phenol aldehyde resin tack coat, urea-formaldehyde resin adhesive tack coat, heatproof epoxy glue bonding layer and polymeric amide glue bond layer a kind of; Also can be wherein several combinations; The material of tack coat 2 is conventionally known to one of skill in the art, does not repeat them here.Preferably, tack coat 2 is high temperature bond layer, can guarantee that like this printed-wiring board (PWB) that is pasted with adhesive tape is when carrying out multi-reflow Welding, tack coat 2 on adhesive tape can not lose efficacy, adhesive tape can not come off, avoid situation about cannot protect printed-wiring board (PWB) because adhesive tape comes off to occur, guaranteed the security that adhesive tape is used; Further preferably, bond 2 thickness is 0.055mm ~ 0.060mm; Adopt this thickness, both can guarantee that adhesive tape has enough cohesiveness, can guarantee again the thickness of adhesive tape, make it be unlikely to too thick; Further preferred, the thickness of tack coat 2 and the Thickness Ratio of adhesive tape are 0.37 ~ 0.40; This set, makes the globality of adhesive tape better, both can make the thickness of adhesive tape integral body be guaranteed well, also can avoid the integral thickness of adhesive tape thicker, and the phenomenon that is not easy to attach occurs.
Adhesive tape also comprises the protective layer 3 that is arranged on the other side of tack coat, the utility model is not done particular requirement to the material of protective layer 3, as long as can protect tack coat being unkitted before being attached to printed-wiring board (PWB) not damagedly, it can be PET protective layer or PTT protective layer; Protective layer can 3 only to cover tack coat, also can cover whole substrate layer; When 3 of protective layers cover tack coat 2, can save material; When protective layer 3 covers whole substrate layer 1, can better protect tack coat, it can not exposed easily; Further preferably, the thickness of protective layer 3 and the Thickness Ratio of adhesive tape are 0.20 ~ 0.47; Adopt this thickness, can in protection tack coat 2, can guarantee again the integral thickness of adhesive tape, avoid protective layer 3 blocked up, can save material; Wherein, material PET, the PTT of PET protective layer or PTT protective layer are material known in those skilled in the art, do not repeat them here.
The adhesive tape that the utility model provides, preferably, it is integrated hot-forming structure; That is, substrate layer 1, tack coat 2 and protective layer 3 are superposeed and put in hot-press equipment successively, integrated hot pressing formed; Can guarantee the precision of adhesive tape like this, avoid making being offset between this three-decker, and then produce the phenomenon generation of waste product, improve the yield of product.
Existing high temperature gummed tape, when it is attached on printed-wiring board (PWB), it is that integral plaster is attached on printed-wiring board (PWB), regardless of line areas and logicalnot circuit district; When reflow soldering process finishes, the adhesive tape of tearing, a part of glue on it can stick on the line areas of printed-wiring board (PWB), causes cull phenomenon, makes the line areas on printed-wiring board (PWB) become dirty; At this moment need printed-wiring board (PWB) to clean, when clean, can cause cut equivalent damage to the line areas on printed-wiring board (PWB), serious meeting damages printed-wiring board (PWB), cannot work, and causes wiring board to be scrapped.
The adhesive tape that the utility model provides, it comprises substrate layer 1, tack coat 2 and the protective layer 3 of stack successively, and substrate layer 1 comprises 11He Fei bond regions, bond regions 12, and tack coat 1 is arranged on bond regions 11; When tape sticker is attached on printed-wiring board (PWB), its bond regions 11 is corresponding with the logicalnot circuit district of printed-wiring board (PWB), and its non-bond regions 12 is corresponding with the line areas of printed-wiring board (PWB); When through reflow soldering process, tear adhesive tape; Because the tack coat of adhesive tape does not bond with line areas, so just avoided occurring on line areas the phenomenon of cull, do not need follow-up wiring board to be cleaned, reduced the hurtful situation of printed-wiring board (PWB) to occur, just avoided the situation that printed-wiring board (PWB) lost efficacy to occur yet; Extended its life-span.
The adhesive tape that the utility model provides, it is simple in structure, easy to use, tears the phenomenon that cull occurs Shi Buhui, has avoided the line areas on printed-wiring board (PWB) to cause the generation of the ill effect such as dirty.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all any modifications of doing within spirit of the present utility model and principle, be equal to and replace and improvement etc., within all should being included in protection domain of the present utility model.

Claims (12)

1. an adhesive tape, is characterized in that: it comprises for carrying the substrate layer of adhesive tape; Be arranged on substrate layer for making the tack coat of adhesive tape bonding; Be arranged on tack coat, for the protection of the protective layer of tack coat; Described tack coat is arranged in the subregion of single or double of substrate layer.
2. adhesive tape as claimed in claim 1, is characterized in that: on described substrate layer, be provided with He Fei bond regions, bond regions, described tack coat is arranged on described bond regions.
3. adhesive tape as claimed in claim 1, is characterized in that: described protective layer all covers tack coat or whole covering substrates layer.
4. the adhesive tape as described in claim 1 or 3, is characterized in that: described protective layer is a kind of in PET protective layer or PTT protective layer.
5. the adhesive tape as described in claim 1 or 3, is characterized in that: the thickness of described protective layer and the Thickness Ratio of described adhesive tape are 0.20 ~ 0.47.
6. adhesive tape as claimed in claim 1, is characterized in that: the anti-electrostatic value of described substrate layer is 10 6ohm ~ 10 9ohm.
7. adhesive tape as claimed in claim 1, is characterized in that: described adhesive tape is integrated hot-forming structure.
8. adhesive tape as claimed in claim 1, is characterized in that: described tack coat is high temperature resistant bonding layer.
9. the adhesive tape as described in claim 1 or 8, is characterized in that: described tack coat is a kind of in silicone based glue bond layer, Phenol aldehyde resin tack coat, urea-formaldehyde resin adhesive tack coat, heatproof epoxy glue bonding layer and polymeric amide glue bond layer.
10. the adhesive tape as described in claim 1 or 8, is characterized in that: the thickness of described tack coat is 0.055mm ~ 0.60mm.
11. adhesive tapes as described in claim 1 or 8, is characterized in that: the thickness of described tack coat and the Thickness Ratio of described adhesive tape are 0.37 ~ 0.40.
12. adhesive tapes as described in claim 1 or 8, is characterized in that: the Thickness Ratio of described tack coat and described substrate layer is 2.2 ~ 2.4.
CN201320450313.8U 2013-07-26 2013-07-26 Adhesive tape Expired - Lifetime CN203429102U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201320450313.8U CN203429102U (en) 2013-07-26 2013-07-26 Adhesive tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201320450313.8U CN203429102U (en) 2013-07-26 2013-07-26 Adhesive tape

Publications (1)

Publication Number Publication Date
CN203429102U true CN203429102U (en) 2014-02-12

Family

ID=50058152

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201320450313.8U Expired - Lifetime CN203429102U (en) 2013-07-26 2013-07-26 Adhesive tape

Country Status (1)

Country Link
CN (1) CN203429102U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109263035A (en) * 2017-07-18 2019-01-25 施利福国际公司 For device, corresponding adhesive volume and the corresponding connection method by the way that sheath links together in internal applied adhesives

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109263035A (en) * 2017-07-18 2019-01-25 施利福国际公司 For device, corresponding adhesive volume and the corresponding connection method by the way that sheath links together in internal applied adhesives

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C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20140212

CX01 Expiry of patent term