CN203356805U - Automatic surface mount and welding device for conducting strip - Google Patents
Automatic surface mount and welding device for conducting strip Download PDFInfo
- Publication number
- CN203356805U CN203356805U CN 201320421218 CN201320421218U CN203356805U CN 203356805 U CN203356805 U CN 203356805U CN 201320421218 CN201320421218 CN 201320421218 CN 201320421218 U CN201320421218 U CN 201320421218U CN 203356805 U CN203356805 U CN 203356805U
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- conducting strip
- diode
- surface mount
- guide rail
- automatic
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Abstract
The utility model discloses an automatic surface mount and welding device for a conducting strip. The automatic surface mount and welding device for the conducting strip comprises a feed system, a preprocessing system, a surface mount system and a post processing system, the conducting strip is fed by the feed system, then subjected to preprocessing and surface mount processes and finally post processed, the feed system comprises an automatic conducting strip feed system and a tubular packaged component supplying system, and the surface mount system is formed by an automatic conducting strip surface mount system. During operation, the conducting strip in a supplying cylinder is delivered to a conveyor belt after manual filling, pre-tinned and then subjected to adhesive dispensing through a conducting strip adhesive dispensing system; while the conducting strip is fed, a diode is supplied and delivered to the automatic conducting strip surface mount system through a diode delivering system to finish surface mount, and reflow soldering can be finally performed. The systems apply logicalized parameters of a programmable logic controller (PLC) to perform controlling, the reliability is high, the immunity from interference is high, individual process systems are simpler in structures than those of original devices, and the controlling is more accurate.
Description
Technical field
The utility model belongs to the paster welding technology field of conducting strip and diode, especially relates to a kind of conducting strip automatic chip mounting welder.
Background technology
In the prior art, the paster welding procedure of conducting strip and diode is mainly first conducting strip to be carried out going up in advance tin to process, and subsequently conducting strip is carried out to a glue, place diode and with the conducting strip paster, finally metallic conduction sheet diode is carried out to Reflow Soldering.But in this process, many places need manually-operated, are difficult to reach automation process completely, and this has a great impact for production efficiency.And many process procedures, because used parts are complicated and be of little use on market, will be difficult to find the coupling part to be changed once go wrong.
Summary of the invention
In order to solve the problems of the technologies described above, the utility model provides a kind of conducting strip automatic chip mounting welder, thereby reaches the purpose of automation technolo.
Adopt following technical scheme, a kind of conducting strip automatic chip mounting welder, comprise feed system, pretreatment system, patch system and rear system of processing for this reason, by the feed system charging, passes through respectively afterwards pretreatment and paster technique, machines after final; It is characterized in that: described feed system comprises conducting strip automatic feed system and tubular wrapping components and parts feeding system; The conducting strip automatic feed system is comprised of upper barrel and feeding platform, have guide rail on feeding platform, upper barrel is arranged on guide rail and by guide rail and drives displacement, has the conveyer belt of a conducting strip below guide rail, upper barrel has the base with through hole, and described through hole is over against the conveyer belt top; Described tubular wrapping components and parts feeding system is comprised of diode material loading base and tubulose bundle groove, and tubulose bundle groove is arranged on diode material loading base, vertically stacks the diode package bundle of tubulose between tubulose bundle groove; The feeding system of diode also comprises the diode induction system, by guide supporting base, rail brackets and diode guide rail, formed, the diode rail brackets is arranged on the guide supporting base, is flexibly connected the diode guide rail on rail brackets, is provided with the secondary tube seat on the diode guide rail;
Described pretreatment system comprises that the conducting strip busbar goes up the tin system in advance, is arranged on the top of conveyer belt, comprises pre-upper tin seat and upper tin syringe; Pretreatment system also comprises conducting strip point colloid system, a packing element pedestal, some packing element and positioning seat, consists of, and in the conveyor belt side of conducting strip, is provided with cylinder, and described cylinder is connected with positioning seat;
Described patch system is comprised of conducting strip automatic chip mounting system, comprise a frame, frame is arranged on the conveyer belt top of conducting strip, and the horizontal support of frame is provided with the displacement cylinder, be provided with magnetic valve and vacuum suction pipe on the displacement cylinder, described vacuum suction pipe passes through solenoid control;
Described rear system of processing is comprised of conducting strip diode reflow soldering system, comprises a solder reflow operation platform.
During work, headed by advanced pedestrian's frock fill out, to in upper barrel, install conducting strip, first pass through the guide rail of conducting strip automatic feed system, conducting strip in upper barrel is transported on conveyer belt, is delivered to the conducting strip busbar by conveyer belt subsequently and goes up in advance the tin system, by upper tin syringe, carry out going up in advance tin, put colloid system by conducting strip afterwards, by a packing element, carry out a glue; In the conducting strip charging, diode carries out material loading through tubular wrapping components and parts feeding system by tubulose bundle groove, and by the diode induction system, by the secondary tube seat, diode is delivered to conducting strip automatic chip mounting system, conducting strip arrives below the frame of patch system on conveyer belt, by the vacuum suction pipe, diode is put on conducting strip, completes paster; Finally enter conducting strip diode reflow soldering system and carry out Reflow Soldering.
By such technical scheme, can greatly save manually, whole system, as long as an operator just can operate, has greatly reduced personnel demand; The parts of this system are on market ripe product, guarantee the stable and convertibility of whole equipment performance; System adopts programmable logic controller (PLC) logic parameter to be controlled, and reliability is high, and antijamming capability is strong, has effectively controlled the beat of each operation, guarantees that each operation is ruly to carry out; It is simpler that indivedual working procedure systemses are compared original device structure, makes to control precision more.
The accompanying drawing explanation
The process flow diagram that Fig. 1 is the present embodiment.
The structural representation that Fig. 2 is the present embodiment.
The specific embodiment
Referring to accompanying drawing.The present embodiment comprises feed system, pretreatment system, patch system and rear system of processing, by the feed system charging, after pretreatment and paster technique are final, machines respectively afterwards; Described feed system comprises conducting strip automatic feed system and tubular wrapping components and parts feeding system; The conducting strip automatic feed system is comprised of upper barrel 1 and feeding platform 2, there is guide rail 21 on feeding platform 2, upper barrel 1 is arranged on guide rail 21 and by guide rail and drives displacement, the conveyer belt 3 that there is a conducting strip below guide rail 21, upper barrel 1 has the base with through hole, and described through hole is over against conveyer belt 3 tops; Described tubular wrapping components and parts feeding system is comprised of diode material loading base 4 and tubulose bundle groove 41, and tubulose bundle groove 41 is arranged on diode material loading base 4,41 diode package bundles 42 of vertically stacking tubulose of tubulose bundle groove; The feeding system of diode also comprises the diode induction system, by guide supporting base 5, rail brackets 51 and diode guide rail 52, formed, diode rail brackets 51 is arranged on guide supporting base 52, be flexibly connected diode guide rail 53 on rail brackets 51, be provided with secondary tube seat 54 on the diode guide rail; Described pretreatment system comprises that the conducting strip busbar goes up the tin system in advance, is arranged on the top of conveyer belt, comprises pre-upper tin seat 61 and upper tin syringe 62; Pretreatment system also comprises conducting strip point colloid system, a packing element pedestal 71, some packing element 72 and positioning seat 73, consists of, and in the conveyor belt side of conducting strip, is provided with cylinder 74, and described cylinder 74 is connected with positioning seat 73; Described patch system is comprised of conducting strip automatic chip mounting system, comprise a frame 81, frame is arranged on conveyer belt 3 tops of conducting strip, the horizontal support of frame 81 is provided with displacement cylinder 82, be provided with magnetic valve 83 and vacuum suction pipe 84 on displacement cylinder 82, described vacuum suction pipe 84 is controlled by magnetic valve 83; Described rear system of processing is comprised of conducting strip diode reflow soldering system, comprises a solder reflow operation platform 9.
During work, headed by advanced pedestrian's frock fill out, to in upper barrel 1, install conducting strip, first pass through the guide rail 21 of conducting strip automatic feed system, conducting strip in upper barrel is transported on conveyer belt 3, is delivered to the conducting strip busbar by conveyer belt 3 subsequently and goes up in advance the tin system, by upper tin syringe 62, carry out going up in advance tin, put colloid system by conducting strip afterwards, by a packing element 72, carry out a glue; In the conducting strip charging, diode carries out material loading through tubular wrapping components and parts feeding system by tubulose bundle groove 41, and by the diode induction system, by secondary tube seat 54, diode is delivered to conducting strip automatic chip mounting system, conducting strip arrives below the frame 81 of patch system on conveyer belt, by vacuum suction pipe 84, diode is put on conducting strip, completes paster; Finally enter conducting strip diode reflow soldering system and carry out Reflow Soldering.
Claims (1)
1. a conducting strip automatic chip mounting welder, comprise feed system, pretreatment system, patch system and rear system of processing, by the feed system charging, passes through respectively afterwards pretreatment and paster technique, machines after final; It is characterized in that: described feed system comprises conducting strip automatic feed system and tubular wrapping components and parts feeding system; The conducting strip automatic feed system is comprised of upper barrel and feeding platform, have guide rail on feeding platform, upper barrel is arranged on guide rail and by guide rail and drives displacement, has the conveyer belt of a conducting strip below guide rail, upper barrel has the base with through hole, and described through hole is over against the conveyer belt top; Described tubular wrapping components and parts feeding system is comprised of diode material loading base and tubulose bundle groove, and tubulose bundle groove is arranged on diode material loading base, vertically stacks the diode package bundle of tubulose between tubulose bundle groove; The feeding system of diode also comprises the diode induction system, by guide supporting base, rail brackets and diode guide rail, formed, the diode rail brackets is arranged on the guide supporting base, is flexibly connected the diode guide rail on rail brackets, is provided with the secondary tube seat on the diode guide rail;
Described pretreatment system comprises that the conducting strip busbar goes up the tin system in advance, is arranged on the top of conveyer belt, comprises pre-upper tin seat and upper tin syringe; Pretreatment system also comprises conducting strip point colloid system, a packing element pedestal, some packing element and positioning seat, consists of, and in the conveyor belt side of conducting strip, is provided with cylinder, and described cylinder is connected with positioning seat;
Described patch system is comprised of conducting strip automatic chip mounting system, comprise a frame, frame is arranged on the conveyer belt top of conducting strip, and the horizontal support of frame is provided with the displacement cylinder, be provided with magnetic valve and vacuum suction pipe on the displacement cylinder, described vacuum suction pipe passes through solenoid control;
Described rear system of processing is comprised of conducting strip diode reflow soldering system, comprises a solder reflow operation platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320421218 CN203356805U (en) | 2013-07-16 | 2013-07-16 | Automatic surface mount and welding device for conducting strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320421218 CN203356805U (en) | 2013-07-16 | 2013-07-16 | Automatic surface mount and welding device for conducting strip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203356805U true CN203356805U (en) | 2013-12-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320421218 Expired - Fee Related CN203356805U (en) | 2013-07-16 | 2013-07-16 | Automatic surface mount and welding device for conducting strip |
Country Status (1)
| Country | Link |
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| CN (1) | CN203356805U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105479175A (en) * | 2016-01-30 | 2016-04-13 | 杨金芝 | Automatic conducting strip sticking, welding and bending equipment and machining technology thereof |
| CN105592680A (en) * | 2014-10-24 | 2016-05-18 | 富鼎电子科技(嘉善)有限公司 | Automatic mounting machine |
| CN106392322A (en) * | 2016-05-30 | 2017-02-15 | 安徽柯力电气制造有限公司 | Full-automatic patch gluing device |
| CN108323152A (en) * | 2018-01-24 | 2018-07-24 | 宁波禹泰自动化科技有限公司 | Point tin cream chip mounter |
| CN112453613A (en) * | 2020-11-24 | 2021-03-09 | 杨金平 | Welding process for diode production |
-
2013
- 2013-07-16 CN CN 201320421218 patent/CN203356805U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105592680A (en) * | 2014-10-24 | 2016-05-18 | 富鼎电子科技(嘉善)有限公司 | Automatic mounting machine |
| CN105592680B (en) * | 2014-10-24 | 2018-09-25 | 富鼎电子科技(嘉善)有限公司 | Automatic placement equipment |
| CN105479175A (en) * | 2016-01-30 | 2016-04-13 | 杨金芝 | Automatic conducting strip sticking, welding and bending equipment and machining technology thereof |
| CN106392322A (en) * | 2016-05-30 | 2017-02-15 | 安徽柯力电气制造有限公司 | Full-automatic patch gluing device |
| CN108323152A (en) * | 2018-01-24 | 2018-07-24 | 宁波禹泰自动化科技有限公司 | Point tin cream chip mounter |
| CN108323152B (en) * | 2018-01-24 | 2024-01-23 | 宁波禹泰自动化科技有限公司 | Point tin cream chip mounter |
| CN112453613A (en) * | 2020-11-24 | 2021-03-09 | 杨金平 | Welding process for diode production |
| CN112453613B (en) * | 2020-11-24 | 2022-01-28 | 江苏宝浦莱半导体有限公司 | Welding process for diode production |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131225 Termination date: 20210716 |
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| CF01 | Termination of patent right due to non-payment of annual fee |