CN203351648U - White-light LED - Google Patents
White-light LED Download PDFInfo
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- CN203351648U CN203351648U CN 201320324910 CN201320324910U CN203351648U CN 203351648 U CN203351648 U CN 203351648U CN 201320324910 CN201320324910 CN 201320324910 CN 201320324910 U CN201320324910 U CN 201320324910U CN 203351648 U CN203351648 U CN 203351648U
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Abstract
The utility model discloses a white-light LED. The LED relates to the technical field of semiconductor illuminating devices. The LED comprises an LED chip that completes die bonding and linkage technology. In a direction far away from the LED chip, more than two phosphor glue lines are fixed on the surface of the LED chip with different kinds of phosphors and mixture radios. The layered method is that all the excitation spectra and emission spectra of the phosphors used for white-light LEDs are analyzed. Layering is carried out according to capability that each phosphor absorbs emitted light of other phosphors. The phosphor having the strongest absorbing capability is packaged in the innermost layer. According to other phosphor emitted light absorbing capability from strong to weak, the phosphors are successively packaged outward. The phosphor that is most easily absorbed is packaged in the outermost layer. The phosphors having similar absorbing capability can be packaged in the same layer. In the premise of no material cost raise, the white-light LED manufactured by using the above-mentioned method achieves a higher color rendering index, higher luminous efficiency and smaller color tolerance.
Description
Technical field
The utility model relates to semiconductor lighting device technical field.
Background technology
The white-light LED encapsulation technology mainly contains following three kinds of modes at present: the one, and the LED hybrid package of several glow colors, as formed white light with three kinds of chip packages of red, green, blue in same device; The 2nd, the red, yellow, and green light that the blue light that the fluorescent material such as red, yellow, and green of the certain proportioning of coating are launched by chip on blue chip and fluorescent material excite etc. is compounded to form white light; The 3rd, apply the fluorescent material such as red, yellow, green, blue of certain proportioning by the synthesize white lights such as red, yellow, green, blue light that excite on the ultraviolet chip.At present, the most frequently used mode is to apply the fluorescent material synthesize white lights such as red, yellow, and green of certain proportioning on blue chip, and structure as illustrated in Figures 5 and 6.But along with the application of white light LEDs is more and more ripe, the user has proposed more and more higher requirement to aobvious finger, light efficiency and the color tolerance of white light LEDs are poor, and each LED encapsulation enterprise is all making great efforts to improve these technical indicators.
The utility model content
Technical problem to be solved in the utility model is to provide a kind of white light LEDs, has realized that higher aobvious finger, higher light efficiency and less color tolerance are poor.
For solving the problems of the technologies described above, technical solution adopted in the utility model is: a kind of white light LEDs, comprise the LED chip that completes die bond and bonding technology, it is characterized in that being provided with more than two-layer in the direction away from LED chip the fluorescent material glue-line that is fixed on described LED chip surface.
Preferably: in the outside of outermost fluorescent material glue-line or the inboard of innermost layer fluorescent material glue-line, be provided with transparent resin layer.
The beneficial effect that adopts technique scheme to produce is: described white light LEDs, according to absorbing the radiative energy of other fluorescent material force stratification, the strongest fluorescent powder packaging of absorbability is in innermost layer, absorb other fluorescent material utilizing emitted light ability from encapsulating to skin successively to weak by force, the most absorbable fluorescent powder packaging is at outermost layer; The approaching fluorescent material of absorbability can be encapsulated in same layer.Directly outgoing of emission spectrum, the loss of each wavelength emergent light all seldom, has guaranteed the continuity of outgoing spectrum, so can guarantee higher color rendering index and outgoing efficiency.Described method is carried out the layering encapsulation according to the different qualities of fluorescent material, no matter in the fluorescent powder colloid process of setting, how relevant parameter changes, also can guarantee different qualities fluorescent material correct hierarchical relationship up and down on physical structure, avoided the photochromic discreteness that in the process of setting, fluorescent material sedimentation staggered floor degree difference causes, the color tolerance that has reduced batch LED product is poor.
The accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Fig. 1 is the first structural representation of the utility model embodiment mono-;
Fig. 2 is the second structural representation of the utility model embodiment mono-;
Fig. 3 is the first structural representation of the utility model embodiment bis-;
Fig. 4 is the second structural representation of the utility model embodiment bis-;
Fig. 5 is the first structural representation of prior art;
Fig. 6 is the second structural representation of prior art;
Fig. 7 is the excitation spectrum of aluminate yellow fluorescent powder;
Fig. 8 is the emission spectrum of aluminate yellow fluorescent powder;
Fig. 9 is the excitation spectrum of nitride orange red fluorescent powder;
Figure 10 is the emission spectrum of nitride orange red fluorescent powder;
Figure 11 is the excitation spectrum of the blue light fluorescent powder of burst of ultraviolel;
Figure 12 is the emission spectrum of the blue light fluorescent powder of burst of ultraviolel;
Figure 13 is the excitation spectrum of the green light fluorescent powder of burst of ultraviolel;
Figure 14 is the emission spectrum of the green light fluorescent powder of burst of ultraviolel;
Figure 15 is the LED chip structural representation that has completed die bond and bonding technology;
Figure 16 is nitride garnet fluorescent powder excitation spectrum;
Figure 17 is nitride garnet fluorescent powder emission spectrum;
Figure 18 is silicate orange red fluorescence powder excitation spectrum;
Figure 19 is silicate orange red fluorescence powder emission spectrum;
Figure 20 is lutetium aluminate green fluorescent powder excitation spectrum;
Figure 21 is lutetium aluminate green fluorescent powder emission spectrum;
Figure 22 is the area source structural representation of embodiment mono-;
Figure 23 is the area source structural representation of embodiment bis-;
Wherein: 1, LED chip 2, fluorescent material glue-line 3, transparent resin layer 4, mixed fluorescent powder glue-line 5, encapsulation cavity.
Embodiment
For LED fluorescent material glue-line, excitation spectrum and emission spectrum to each component fluorescent material in the fluorescent material proportioning are done careful research, by mutually exciting between the analysis of fluorescence powder, mutual absorbing state, to reduce radiative mutual absorption, the outgoing efficiency that improves whole light extraction efficiency or improve certain wavelength light is principle, determine and the most reasonably encapsulate layered scheme and hierarchical sequence, allocate respectively the phosphor gel of every layer according to definite layering encapsulation scheme, successively encapsulation, two-layer or the two-layer above fluorescent material glue-line structure of final formation, structure is the form of point-source of light as Figure 1-4, as Figure 22-23 are depicted as the form of area source.
A kind of white light LEDs, comprise the LED chip that completes die bond and bonding technology, as shown in figure 15, be provided with more than two-layer the monochromatic fluorescent material glue-line that is fixed on described LED chip surface in the direction away from LED chip, preferably firm for overall structure, be provided with transparent resin layer in the outside of outermost fluorescent material glue-line or the inboard of the most inboard fluorescent material glue-line.
A kind of method for packing of white light LEDs comprises the following steps:
(1) LED chip is carried out to die bond and bonding technology;
(2) layered approach that is specified for which layer for each kind fluorescent material on white light LED part has two kinds: the one, and can force stratification according to absorbing that other fluorescent material is radiative, the strongest fluorescent powder packaging of absorbability is at nexine, absorb other fluorescent material utilizing emitted light ability from encapsulating to skin successively to weak by force, the most absorbable fluorescent powder packaging is at outermost layer; The approaching fluorescent material of absorbability can be encapsulated in same layer.The 2nd, according to the emission wavelength layering of fluorescent material, emission wavelength is longer the closer to the nexine encapsulation, and emission wavelength is shorter to be encapsulated the closer to skin; Permission by emission wavelength the fluorescent powder packaging in same color region at same layer.
Be encapsulated in innermost layer by after absorbing monochrome that other fluorescent material utilizing emitted light ability is the strongest or multicolor phosphor and transparent resin fully mixing, by absorb other fluorescent material utilizing emitted light ability from by force to weak order by monochrome or multicolor phosphor with from internal layer, to skin, encapsulate successively transparent resin fully mixes, the most absorbable monochrome or multicolor phosphor be encapsulated in outermost layer after transparent resin fully mixes.
Can also comprise step (3) corresponding to the described method of structure, solidify the layer of transparent resin bed in the outside of outermost fluorescent material glue-line by curing process, or solidify the layer of transparent resin in the inboard of the most inboard fluorescent material glue-line by curing process before carrying out step (2).The mixture thickness of fluorescent material and transparent resin is 100um-4mm; The proportioning of fluorescent material and transparent resin is generally between 0.1:100-20:100.
Embodiment mono-: adopt the aluminate yellow fluorescent powder (1# fluorescent material) of spectrum as shown in Fig. 7-10 commonly used at present and the LED integrated packaging power source module of nitride orange red fluorescent powder (2# fluorescent material) encapsulation 3000K colour temperature.
At first be ready to 100 LED module semi-finished product as shown in figure 15, these semi-finished product have adopted the chip of 455～457.5nm wavelength, and have completed the die bond of LED chip and the technique of bonding.
Then adopt and first encapsulate the scheme that the 2# phosphor powder layer encapsulates the 1# phosphor powder layer again by analysis confirmation.Ratio by 2# fluorescent material and transparent silica gel according to 0.6:100 mixes, and is coated in above above-mentioned half-finished chip, and adjusting coating adhesive amount to product X chromaticity coordinates is 0.280,, then by curing process, the ground floor fluorescent powder colloid is solidified; At this moment by 1# fluorescent material and transparent silica gel, the ratio according to 8.5:100 mixes, be coated on the above-mentioned semi-finished product that applied the 2# fluorescent powder colloid, adjusting coating adhesive amount to product X chromaticity coordinates is 0.434, again by curing process, second layer fluorescent powder colloid is solidified.While adopting different chips and fluorescent material, ratio, coordinate values are understood different.The structure encapsulated as shown in Figure 1.
Record the final colour temperature of product between 2975K～3045K, aobvious finger is greater than 85, light efficiency more than 130lm/W, color tolerance poor according to the test of Energy Star 3000K reference colour coordinate all in 3SDCM.
Embodiment bis-: the LED integrated packaging power source module that adopts nitride orange red fluorescent powder (2# fluorescent material), aluminate green fluorescent powder (3# fluorescent material) and aluminate blue fluorescent powder (4# fluorescent material) the encapsulation 3000K colour temperature of spectrum as shown in Fig. 9-14.
At first be ready to 100 LED module semi-finished product as shown in figure 15, these semi-finished product have adopted the chip of 380～385nm wavelength, and have completed the die bond of LED chip and the technique of bonding.
Then adopt and first encapsulate the 2# phosphor powder layer and encapsulate again the scheme that the 3# phosphor powder layer finally encapsulates the 4# phosphor powder layer by analysis confirmation.Ratio by 2# fluorescent material and transparent silica gel according to 0.6:100 mixes, and is coated in above above-mentioned half-finished chip, and product X chromaticity coordinates accomplishes 0.624,, then by curing process, the ground floor fluorescent powder colloid is solidified; At this moment by 3# fluorescent material and transparent silica gel, the ratio according to 8.5:100 mixes, be coated on the above-mentioned semi-finished product that applied the 2# fluorescent powder colloid, adjusting coating adhesive amount to product X chromaticity coordinates is 0.484, again by curing process, second layer fluorescent powder colloid is solidified; Finally by 4# fluorescent material and transparent silica gel, the ratio according to 0.4:50 mixes, be coated on the semi-finished product of the above-mentioned fluorescent powder colloid of applied in two coats, adjusting coating adhesive amount to product X chromaticity coordinates is 0.4338, continuation solidifies the 3rd layer of fluorescent powder colloid by curing process, and while adopting different fluorescent material, ratio, coordinate values are understood different.The product structure encapsulated as shown in Figure 3.
Record the final colour temperature of product between 2975K～3045K, aobvious finger is greater than 90, light efficiency more than 100lm/W, color tolerance poor according to the test of Energy Star 3000K reference colour coordinate all in 3SDCM.
Embodiment tri-, the white light LEDs of the nitride garnet fluorescent powder of spectrum shown in aluminate yellow fluorescent powder, lutetium aluminate green fluorescent powder mixed powder (5# fluorescent material) and Figure 16,17,18,19 of employing spectrum as shown in Fig. 7,8,20,21, silicate orange red fluorescence powder mixed powder (6# fluorescent material) encapsulation 4000K colour temperature.
At first be ready to 100 LED module semi-finished product as shown in figure 15, these semi-finished product have adopted the chip of 455～457.5nm wavelength, and have completed die bond and the bonding technology of LED chip.
Then adopt and first encapsulate the scheme that the 6# phosphor powder layer encapsulates the 5# phosphor powder layer again by analysis confirmation.Ratio by 6# fluorescent material and transparent silica gel according to 0.5:100 mixes, and is coated in above above-mentioned half-finished chip, and adjusting coating adhesive amount to product X chromaticity coordinates is 0.215, then by curing process, the ground floor fluorescent powder colloid is solidified; At this moment by 5# fluorescent material and transparent silica gel, the ratio according to 6.5:100 mixes, be coated on the above-mentioned semi-finished product that applied the 2# fluorescent powder colloid, adjusting coating adhesive amount to product X chromaticity coordinates is 0.380, again by curing process, second layer fluorescent powder colloid is solidified.While adopting different chips and fluorescent material, ratio, coordinate values are understood different.The structure encapsulated as shown in Figure 1.
Record the final colour temperature of product between 3900K～4100K, aobvious finger is greater than 90, light efficiency more than 125lm/W, color tolerance poor according to the test of IEC F4000 reference colour coordinate all in 3SDCM.
The maximum LED packaged type of application is to adopt the mode that applies the yellow fluorescent powder synthesize white light on blue-light LED chip at present, in the situation that aobvious, referring to require higher fluorescent material proportioning mode mostly to adopt emission wavelength is that the two or more fluorescent material that green-yellow light and emission wavelength are ruddiness mixes use.Shown in Fig. 7-10, be current a kind of aluminate yellow fluorescent powder commonly used and a kind of excitation spectrum and utilizing emitted light spectrogram of nitride orange red fluorescent powder.As seen from the figure, the excitation spectrum of aluminate fluorescent powder is very little when being greater than 500nm, is tending towards gradually 0, and emission spectrum has just had higher level at 500nm; And the excitation spectrum of Nitride phosphor is until 500nm also has the very high ability that is excited, emission spectrum from 550nm just from extremely low-level.
The method for packing of conventional fluorescent bisque is that these two kinds of fluorescent material are mixed to the outside that then is coated in LED chip with silica gel, when LED works, the Nitride phosphor mixed can be easy to absorb aluminate fluorescent powder and excited by blue chip and the blue green light of the shorter wavelength of outgoing, thereby generation secondary excitation, cause the energy loss of secondary excitation, and can reduce the shared ratio of blue green light of 500nm left and right in outgoing spectrum, cause the aobvious reduction referred to.
Take the method for monochromatic fluorescent material glue-line layering encapsulation of the present utility model, can by Nitride phosphor be coated in the LED chip outside after silica gel mixes, by aluminate fluorescent powder be coated in Nitride phosphor glue-line powder after silica gel mixes outside.Like this, when LED works, the spectrum that Nitride phosphor is gone out by the LED excitation-emission is through the aluminate fluorescent powder layer time, so seldom be not absorbed because the emission spectrum of Nitride phosphor meets the excitation spectrum of aluminate fluorescent powder basically, and aluminate fluorescent powder is because at skin, the directly outgoing of its emission spectrum, the loss of its each wavelength emergent light is all seldom, guaranteed the continuity of outgoing spectrum, so can guarantee higher color rendering index and outgoing efficiency.
The fluorescent material of different photochromic, different specific weights, different grain size or different-shape, if be mixed together the allotment fluorescent powder colloid, directly be potted in the LED chip top, can be because the phenomenon of each component fluorescent material sedimentation staggered floor of the inconsistent generation of sinking speed of fluorescent material, proportioning when ratio that fluorescent material exists on same aspect is mixed with fluorescent material produces deviation, causes the emission spectrum of LED product to produce the coordinate offset that solidifies front and back in encapsulation process.This coordinate offset phenomenon is more obvious in the mode of LED integrated optical source encapsulation.Again because the time that colloid is allocated each LED product embedding there are differences, environment temperature and humidity often can change, each batch of MODEL OF THE PHOSPHOR PARTICLE SIZE or pattern likely there are differences; these factors all can affect the degree of each component fluorescent material sedimentation staggered floor; and then have influence on the coordinate offset amount of LED product before and after solidifying in encapsulation process; cause the serious photochromic discreteness of LED product; make the color tolerance that the generation of LED product is larger in batches poor, be difficult to control.
At present in order to have addressed this is that methods such as adopt accelerating sedimentation process or long-time standing sedimentation, the purpose of these methods is all to make the fluorescent material of each LED all be deposited to the bottommost of fluorescent material glue-line, guarantees the consistency of fluorescent material sedimentation.But this method also exist some problems as: for large-sized integrated LED light source, also do not have suitable equipment to realize; Because fluorescent material all has been deposited to bottom, for the LED area source product that needs fluorescent material to float over the LED product surface, be not suitable for this process.
Method of the present utility model has adopted the method according to the different qualities layering encapsulation of fluorescent material, no matter in the fluorescent powder colloid process of setting, how relevant parameter changes, also can guarantee different qualities fluorescent material correct hierarchical relationship up and down on physical structure, avoided the photochromic discreteness that in the process of setting, fluorescent material sedimentation staggered floor degree difference causes, the color tolerance that has reduced batch LED product is poor.
Claims (2)
1. a white light LEDs, comprise the LED chip (1) that completes die bond and bonding technology, it is characterized in that being provided with more than two-layer in the direction away from LED chip the fluorescent material glue-line (2) that is fixed on described LED chip surface.
2. a kind of white light LEDs according to claim 1, is characterized in that being provided with transparent resin layer (3) in the outside of outermost fluorescent material glue-line (2) or the inboard of innermost layer fluorescent material glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320324910 CN203351648U (en) | 2013-06-06 | 2013-06-06 | White-light LED |
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201320324910 CN203351648U (en) | 2013-06-06 | 2013-06-06 | White-light LED |
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| CN203351648U true CN203351648U (en) | 2013-12-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103337584A (en) * | 2013-06-06 | 2013-10-02 | 河北神通光电科技有限公司 | White light LED and packaging method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103337584A (en) * | 2013-06-06 | 2013-10-02 | 河北神通光电科技有限公司 | White light LED and packaging method thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20131218 |