CN203349772U - Wafer warpage measuring instrument - Google Patents
Wafer warpage measuring instrument Download PDFInfo
- Publication number
- CN203349772U CN203349772U CN 201320404135 CN201320404135U CN203349772U CN 203349772 U CN203349772 U CN 203349772U CN 201320404135 CN201320404135 CN 201320404135 CN 201320404135 U CN201320404135 U CN 201320404135U CN 203349772 U CN203349772 U CN 203349772U
- Authority
- CN
- China
- Prior art keywords
- frame
- base plate
- measuring instrument
- scaleplate
- silicon wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- A Measuring Device Byusing Mechanical Method (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model discloses a wafer warpage measuring instrument, including a base plate, a left side frame, a right side frame, a scale plate and a covering plate. The base plate is a flat plate. Lower ends of the left side frame and the right frame are fixed on the base plate, and the axes of the left side frame and the right frame are vertical to the base plate. The scale plate is fixed among the base plate, the left side frame and the right frame. The scale plate is a transparent material, and a plurality of scale marks parallel to the base plate are formed on the scale plate. The right side of the left side frame and the left side of the right side frame are respectively provided with a groove along the axial direction. The covering plate is an opaque material. The left side and the right side of the covering plate are respectively embedded in the grooves in the right side of the left side frame and the left side of the right side frame and can move up and down along the grooves. The wafer warpage measuring instrument is simple in structure, low in cost and convenient to operate.
Description
Technical field
The utility model relates to semiconductor manufacturing facility, particularly a kind of silicon wafer warpage measuring instrument.
Background technology
In the machining process of wafer, wafer at wafer processing (as WJ 1000H, a kind of wafer processing name of product of Watkins Johnson company) transmission path is: wafer is placed in film magazine, be loaded onto on platform, then mechanical arm removes in film magazine to get wafer, by the inner wafer travelling belt of the wafer feed arrangement of getting, processed, wafer after processing is sent to the equipment afterbody by travelling belt, by mechanical arm, is taken out, and puts back to film magazine.
Due to present increasing semiconductor product require to grind cut down thin, and grind cut after wafer (wafer) can deliquescing, in wafer lies in film magazine (carrier), in various degree sagging can occur due to gravity in wafer, if the sagging situation to the wafer in film magazine is not judged, directly by mechanical arm, from film magazine, extracted wafer, mechanical arm is easy to strike the dip portion of wafer, causes the wafer fragment.Therefore, before mechanical arm is got wafer from film magazine, need be measured the angularity of the wafer in film magazine, warpage serious wafer separate out, the special disposal.
The utility model content
The technical problems to be solved in the utility model is to provide a kind of silicon wafer warpage measuring instrument, simple structure, and cost is low, easy and simple to handle.
For solving the problems of the technologies described above, the silicon wafer warpage measuring instrument that the utility model provides, comprise base plate, left frame, right frame, scaleplate, covering plate;
Described base plate is a flat board;
The lower end of described left frame, right frame is separately fixed on described base plate, and the axis of described left frame, right frame is perpendicular to described base plate;
Described scaleplate, be fixed between described base plate, left frame, right frame, and scaleplate is transparent material, is formed with many scale marks that are parallel to described base plate on scaleplate;
The right side of described left frame and the left side of described right frame are formed with respectively groove along axis direction;
Described covering plate, be transparent materials, and the covering plate left and right sides is embedded into respectively the groove in described left frame right side and described right frame left side, and can slide up and down along described groove.
Preferably, be formed with 26 to 30 equally spaced scale marks on described scaleplate.
Preferably, the silicon wafer warpage measuring instrument, also comprise upper ledge;
The groove in the right side of described left frame and the left side of described right frame is positioned at the place ahead of described scaleplate;
Described upper ledge, be positioned at the place ahead of described covering plate, and the axis of described upper ledge is parallel to described base plate, and the two ends of described upper ledge are separately fixed at the upper end of left frame and right frame.
Preferably, the two ends of described upper ledge, be screwed in respectively the upper end of left frame, right frame.
Preferably, the middle part of described upper ledge, be provided with adjustable screw, an end of described adjustable screw can with the rotation of adjustable screw against or leave described covering plate.
Preferably, described base plate, left frame, right frame or upper ledge, be stainless steel;
Described scaleplate is the transparent organic glass material.
Silicon wafer warpage measuring instrument of the present utility model, mainly comprise transparent scaleplate and opaque covering plate, simple structure, and equipment is small and exquisite, and the precision equipment that cost of manufacture is measured the silicon wafer warpage degree than other is much lower; Can cover the scaleplate zone also do not checked by opaque covering plate in checking process, the handled easily personnel are by piece angularity of inspection wafer, the misjudgment of avoiding dim eyesight to cause, easy and simple to handle, can measure rapidly and accurately the warpage degree of the wafer in film magazine, be applicable to the site operation personnel and use, increase work efficiency, reduce the mechanical arm seriously caused because of silicon wafer warpage and hit the sheet problem.
The accompanying drawing explanation
In order to be illustrated more clearly in the technical solution of the utility model, below the accompanying drawing of the required use of the utility model is briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is the front view of silicon wafer warpage measuring instrument one embodiment of the present utility model;
Fig. 2 is the right side view of silicon wafer warpage measuring instrument one embodiment of the present utility model;
Fig. 3 utilizes silicon wafer warpage measuring instrument of the present utility model to measure the silicon wafer warpage degree front schematic view in film magazine;
Fig. 4 utilizes silicon wafer warpage measuring instrument of the present utility model to measure the silicon wafer warpage degree side schematic view in film magazine.
Embodiment
Below in conjunction with accompanying drawing, the technical scheme in the utility model is carried out to clear, complete description, obviously, described embodiment is a part of embodiment of the present utility model, rather than whole embodiment.Embodiment based in the utility model, all other embodiment that those of ordinary skills obtain under the prerequisite of not making creative work, belong to the scope that the utility model is protected.
Embodiment mono-
The silicon wafer warpage measuring instrument, as shown in Figure 1 and Figure 2, comprise base plate 10, left frame 11, right frame 12, scaleplate 20, covering plate 30;
Described base plate 10 is a flat board;
The lower end of described left frame 11, right frame 12 is separately fixed on described base plate, and the axis of described left frame 11, right frame 12 is perpendicular to described base plate 10;
Described scaleplate 20, be fixed between described base plate 10, left frame 11, right frame 12, and scaleplate 20 is transparent material, is formed with many scale marks 21 that are parallel to described base plate 10 on scaleplate 20;
The left side of the right side of described left frame 11 and described right frame 12 is formed with respectively groove along axis direction;
Described covering plate 30, be transparent materials, and covering plate 30 left and right sides are embedded into respectively the groove in described left frame 11 right sides and described right frame 12 left sides, and can slide up and down along described groove.
When the silicon wafer warpage in the silicon wafer warpage measuring instrument measurement film magazine of employing embodiment mono-is spent, as shown in Figure 3, Figure 4, at first film magazine 50 is placed on the base plate 10 at rear of silicon wafer warpage measuring instrument, make the wafer 60 in film magazine 50 consistent with the scale mark 21 maintenance levels on described scaleplate 20, and make film magazine 50 openings near described scaleplate 20, in order to see through the situation that the described scaleplate 20 of transparent material is seen the wafer 60 in film magazine 50.During formal the measurement, on draw opaque described covering plate 30, making described scaleplate 20 avoid gradually from top to bottom described covering plate 30 blocks, thereby the wafer 60 in the film magazine 50 of operating personnel on the base plate 10 that can observe in silicon wafer warpage measuring instrument the place ahead the rear that is placed on the silicon wafer warpage measuring instrument through the described scaleplate 20 of transparent material, by the scale mark 21 on described scaleplate 20, operating personnel can estimate the angularity of wafer 60, often check out 1 piece of wafer 60, just above draw opaque covering plate 30 to check 1 piece of top wafer 60, until all wafers 60 check complete.
The silicon wafer warpage measuring instrument of embodiment mono-, mainly comprise transparent scaleplate and opaque covering plate, simple structure, and equipment is small and exquisite, and the precision equipment that cost of manufacture is measured the silicon wafer warpage degree than other is much lower; Can cover the scaleplate zone also do not checked by opaque covering plate in checking process, the handled easily personnel are by piece angularity of inspection wafer, the misjudgment of avoiding dim eyesight to cause, easy and simple to handle, can measure rapidly and accurately the warpage degree of the wafer in film magazine, be applicable to the site operation personnel and use, increase work efficiency, reduce the mechanical arm seriously caused because of silicon wafer warpage and hit the sheet problem.
Embodiment bis-
Silicon wafer warpage measuring instrument based on embodiment mono-, be formed with 26 to 30 equally spaced scale marks on described scaleplate.
Preferably, the spacing of the scale mark 21 formed on described scaleplate 20 equals the spacing of each wafer draw-in groove of film magazine 50, and when film magazine 50 is placed on the base plate 10 at rear of silicon wafer warpage measuring instrument, the bottom of each wafer draw-in groove that corresponds respectively to film magazine 50 of each scale mark 21.
The silicon wafer warpage measuring instrument of embodiment bis-, when measuring silicon wafer warpage in film magazine and spending, at first be placed into sheet 50 boxes on the base plate 10 at rear of silicon wafer warpage measuring instrument the bottom of each wafer draw-in groove that corresponds respectively to film magazine of each scale mark on scaleplate 20.During formal the measurement, on draw opaque covering plate 30, the wafer 60 that exposes film magazine 50 bottommosts is compared with the scale mark on transparent scaleplate 20, if wafer 60 degree of sag have exceeded the position of article one scale mark of its wafer draw-in groove below, place, judge that the angularity of this piece of wafer 60 exceeds specification.
Embodiment tri-
Silicon wafer warpage measuring instrument based on embodiment mono-, also comprise upper ledge 13;
The groove in the left side of the right side of described left frame 11 and described right frame 12 is positioned at the place ahead of described scaleplate 20, thereby described covering plate 30 slides up and down along described groove in described scaleplate 20 fronts;
Described upper ledge 13, be positioned at the place ahead of described covering plate, and the axis of described upper ledge 13 is parallel to described base plate 10, and the two ends of described upper ledge 13 are separately fixed at the upper end of left frame 11 and right frame 12.
Preferably, the two ends of described upper ledge 13 are fixed on respectively the upper end of left frame 11, right frame 12 by screw 40.
Preferably, the middle part of described upper ledge 13 is provided with adjustable screw 41, an end of described adjustable screw 41 can with the rotation of adjustable screw against or leave described covering plate 30;
Preferably, base plate 10, left frame 11, right frame 12 or upper ledge 13 are stainless steel, and scaleplate 20 is the transparent organic glass material.
The silicon wafer warpage measuring instrument of embodiment tri-, can fix the residing positions of described covering plate by upper ledge 13 and adjustable screw 41, thereby allow operating personnel observe more easily the angularity of wafer.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all within spirit of the present utility model and principle, any modification of making, be equal to replacement, improvement etc., within all should being included in the scope of the utility model protection.
Claims (6)
1. a silicon wafer warpage measuring instrument, is characterized in that, comprises base plate, left frame, right frame, scaleplate, covering plate;
Described base plate is a flat board;
The lower end of described left frame, right frame is separately fixed on described base plate, and the axis of described left frame, right frame is perpendicular to described base plate;
Described scaleplate, be fixed between described base plate, left frame, right frame, and scaleplate is transparent material, is formed with many scale marks that are parallel to described base plate on scaleplate;
The right side of described left frame and the left side of described right frame are formed with respectively groove along axis direction;
Described covering plate, be transparent materials, and the covering plate left and right sides is embedded into respectively the groove in described left frame right side and described right frame left side, and can slide up and down along described groove.
2. silicon wafer warpage measuring instrument according to claim 1, is characterized in that,
Be formed with 26 to 30 equally spaced scale marks on described scaleplate.
3. silicon wafer warpage measuring instrument according to claim 1, is characterized in that,
The silicon wafer warpage measuring instrument, also comprise upper ledge;
The groove in the right side of described left frame and the left side of described right frame is positioned at the place ahead of described scaleplate;
Described upper ledge, be positioned at the place ahead of described covering plate, and the axis of described upper ledge is parallel to described base plate, and the two ends of described upper ledge are separately fixed at the upper end of left frame and right frame.
4. silicon wafer warpage measuring instrument according to claim 3, is characterized in that,
The two ends of described upper ledge, be screwed in respectively the upper end of left frame, right frame.
5. silicon wafer warpage measuring instrument according to claim 3, is characterized in that,
The middle part of described upper ledge, be provided with adjustable screw, an end of described adjustable screw can with the rotation of adjustable screw against or leave described covering plate.
6. silicon wafer warpage measuring instrument according to claim 3, is characterized in that,
Described base plate, left frame, right frame or upper ledge are stainless steel;
Described scaleplate is the transparent organic glass material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320404135 CN203349772U (en) | 2013-07-08 | 2013-07-08 | Wafer warpage measuring instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320404135 CN203349772U (en) | 2013-07-08 | 2013-07-08 | Wafer warpage measuring instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203349772U true CN203349772U (en) | 2013-12-18 |
Family
ID=49749663
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320404135 Expired - Fee Related CN203349772U (en) | 2013-07-08 | 2013-07-08 | Wafer warpage measuring instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203349772U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107478171A (en) * | 2017-08-31 | 2017-12-15 | 长江存储科技有限责任公司 | The monitoring method and monitoring device of a kind of buckling deformations |
| CN111336914A (en) * | 2020-03-25 | 2020-06-26 | 长江存储科技有限责任公司 | Wafer warping degree measuring device and method |
| CN112050719A (en) * | 2020-08-31 | 2020-12-08 | 华虹半导体(无锡)有限公司 | Wafer warping degree detection device and method |
| CN113357991A (en) * | 2021-05-28 | 2021-09-07 | 艾华(无锡)半导体科技有限公司 | Detection tool for wafer carrier |
-
2013
- 2013-07-08 CN CN 201320404135 patent/CN203349772U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107478171A (en) * | 2017-08-31 | 2017-12-15 | 长江存储科技有限责任公司 | The monitoring method and monitoring device of a kind of buckling deformations |
| CN107478171B (en) * | 2017-08-31 | 2019-10-18 | 长江存储科技有限责任公司 | A kind of monitoring method and monitoring device of buckling deformations |
| CN111336914A (en) * | 2020-03-25 | 2020-06-26 | 长江存储科技有限责任公司 | Wafer warping degree measuring device and method |
| CN111336914B (en) * | 2020-03-25 | 2021-12-10 | 长江存储科技有限责任公司 | Wafer warping degree measuring device and method |
| CN112050719A (en) * | 2020-08-31 | 2020-12-08 | 华虹半导体(无锡)有限公司 | Wafer warping degree detection device and method |
| CN113357991A (en) * | 2021-05-28 | 2021-09-07 | 艾华(无锡)半导体科技有限公司 | Detection tool for wafer carrier |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203349772U (en) | Wafer warpage measuring instrument | |
| CN204021920U (en) | The self-propelled material transporter of coupling electric logging device equipment | |
| CN103481384A (en) | Cutting device | |
| CN205448998U (en) | Non -contact flatness detecting device | |
| CN104759418A (en) | Piston automatic detection sorting machine | |
| CN205981013U (en) | Length measuring device | |
| CN203471146U (en) | Automatic laser marking machine | |
| CN203611422U (en) | Material separating and receiving device for automatic injection molding machine | |
| CN204354117U (en) | A kind of cylinder center of circle fast-positioning device | |
| CN105619527A (en) | Multifunctional bench saw | |
| CN204902695U (en) | Angle steel angular surveying chi | |
| CN107855643A (en) | A kind of laser beam marking device for phone housing | |
| CN202317867U (en) | Precise optical detection equipment for workpiece dimension based on numerical control machining center | |
| CN202928512U (en) | Hard fiber product verticality detector | |
| CN104875538A (en) | Multifunctional machine for glass cutting, code-spurting, carving and thickness measurement | |
| CN104722497B (en) | A kind of compressor components automatic detection separator | |
| CN208679855U (en) | Electronic component packaging automatic detecting machine | |
| CN207407829U (en) | A kind of standard clearance device | |
| CN207373350U (en) | A kind of board cutting off machine | |
| CN203025121U (en) | Radiographic testing device for testing cracks of pipeline | |
| CN104374258A (en) | Cylindrical workpiece comprehensive measuring checking tool | |
| CN104259577B (en) | Quick positioning type angle cutter for V-shaped angle cutting of aluminum profile | |
| CN205441729U (en) | Laser marking automatic conveyor | |
| CN207536780U (en) | One kind is used to eliminate the undesirable device of cover-plate glass squareness | |
| CN205008645U (en) | Numerical control carving and milling machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANGHAI HUAHONG GRACE SEMICONDUCTOR MANUFACTURING Free format text: FORMER OWNER: HUAHONG NEC ELECTRONICS CO LTD, SHANGHAI Effective date: 20140212 |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 201203 PUDONG NEW AREA, SHANGHAI |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20140212 Address after: 201203 Shanghai city Zuchongzhi road Pudong New Area Zhangjiang hi tech Park No. 1399 Patentee after: Shanghai Huahong Grace Semiconductor Manufacturing Corporation Address before: 201206, Shanghai, Pudong New Area, Sichuan Road, No. 1188 Bridge Patentee before: Shanghai Huahong NEC Electronics Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131218 Termination date: 20150708 |
|
| EXPY | Termination of patent right or utility model |