CN203300621U - Heating seat and heating device for a wire bond process - Google Patents
Heating seat and heating device for a wire bond process Download PDFInfo
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- CN203300621U CN203300621U CN201320230075XU CN201320230075U CN203300621U CN 203300621 U CN203300621 U CN 203300621U CN 201320230075X U CN201320230075X U CN 201320230075XU CN 201320230075 U CN201320230075 U CN 201320230075U CN 203300621 U CN203300621 U CN 203300621U
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- thermal conductivity
- bothrium
- intermediate thermal
- top board
- base
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Abstract
Disclosed are a heating seat and a heating device for a wire bond process. The heating seat includes a base with a recess part formed on a surface of the base, an intermediate heat-conducting plate which is arranged in the recess part and is provided with at least one vacuum suction slot, and a top plate which is arranged in the recess part and is correspondingly attached on the intermediate heat-conducting plate and is provided with a plurality of micro adsorption holes which are correspondingly communicated with the vacuum suction slots of the intermediate heat-conducting plate. The intermediate heat-conducting plate between the base and the top plate enables heat energy to be evenly dispersed so that the top plate is evenly heated and a stable heating environment is provided. Therefore, stability of wire bond work is helped to be improved.
Description
Technical field
The utility model relates to a kind of heated seats and heater of routing technique, particularly relates to a kind of fixing heater and heated seats thereof that reaches heating one package carrier of provisional carrying that be used for during packaging and routing technique.
Background technology
In existing manufacturing processes of semiconductor package, usually first semiconductor crystal wafer is cut into several semiconductor chips, subsequently each semiconductor chip is cemented on lead frame (leadframe) or substrate (substrate), to carry out routing, engages (wire bonding) program.Finally, the recycling adhesive material coats the part surface of semiconductor chip, wire and lead frame or substrate, so can roughly complete the semi-finished product of semiconductor packaging structure.
In general, during the routing splice program, can first provide heat energy to one heated seats, then, conductive wire frame strip (or substrate) is placed on described heated seats, make the pin of the described conductive wire frame strip of described heated seats heating.Then, recycling several wires (as gold thread or copper cash) is electrically connected the weld pad of the semiconductor chip on conductive wire frame strip and corresponding pin, the high temperature that wherein said heat block provides can increase the temperature of described pin, thereby the eutectic effect while improving the described wire of welding, easily join on described pin described wire to.
Yet, the metal derby that the heated seats that the present heater that is used for routing technique uses all is formed in one and makes, when described heated seats receives the heat energy of its below one heating source, the central part of its close heating source, away from the edge of heating source, will have relatively high temperature compared to.Therefore, described heated seats generally, in the temperature differences that can exist between central part and edge between 15 degree～30 degree, that is to say, described heated seats can't provide a uniform heating environment, and then stability and consistency while affecting wire connection operation.
Therefore, be necessary to provide a kind of heated seats and heater of routing technique, to solve the existing problem of prior art.
The utility model content
Main purpose of the present utility model is to provide a kind of heated seats and heater of routing technique, so that a uniform heating environment effectively to be provided, and then stability and consistency when keeping wire and connecting operation.
For reaching aforementioned purpose, the utility model one embodiment provides a kind of heated seats of routing technique, and it comprises: a base, and its surface is formed with a depressed part; One intermediate thermal conductivity plate, be arranged in described depressed part and have at least one vacuum bothrium and a through hole, and described through hole is communicated with described at least one vacuum bothrium; An and top board, being arranged at the interior also correspondence of described depressed part is attached on described intermediate thermal conductivity plate, and the edge of described intermediate thermal conductivity plate is connected with the edge seal of the edge of described depressed part and described top board, and described top board has the corresponding vacuum bothrium that is communicated with described intermediate thermal conductivity plate of a plurality of little adsorption holes, and the thermal conductivity of wherein said intermediate thermal conductivity plate is respectively higher than the thermal conductivity of described top board and base.
In an embodiment of the present utility model, the edge of the edge of described intermediate thermal conductivity plate and the edge of described depressed part and described top board links together by a laser welding road.
In an embodiment of the present utility model, described base has at least one vacuum sucker, the vacuum sucker of wherein said base runs through between the lower surface of the surface of the depressed part that is formed at described base and described base, and the vacuum bothrium of the described intermediate thermal conductivity plate of through hole connection by described intermediate thermal conductivity plate.
In an embodiment of the present utility model, described base material is iron, aluminium, nickel or its alloy; Described intermediate thermal conductivity plate is a copper coin; Described top board material is iron, aluminium, nickel or its alloy.
In an embodiment of the present utility model, the vacuum bothrium of described intermediate thermal conductivity plate comprises at least one rectangular vertical bothrium and at least one rectangular horizontal bothrium; The described vertical bothrium of described horizontal bothrium vertical connection, wherein said horizontal bothrium or the corresponding vacuum sucker that is communicated with described base of vertical bothrium.
In an embodiment of the present utility model, the vacuum bothrium of described intermediate thermal conductivity plate is helical form or concentric circles.
In an embodiment of the present utility model, described top plate portion protrudes from the upper surface of described base; The aperture of little adsorption hole of described top board is between 0.15 millimeter～0.25 millimeter.
Moreover another embodiment of the utility model provides a kind of heater of routing technique, and it comprises: a heated seats comprises a base, an intermediate thermal conductivity plate and a top board; Described susceptor surface is formed with a depressed part; Described intermediate thermal conductivity plate is arranged in described depressed part and has at least one vacuum bothrium and a through hole, and described through hole is communicated with described at least one vacuum bothrium; Described top board is arranged in described depressed part and correspondence is attached on described intermediate thermal conductivity plate, and the edge of described intermediate thermal conductivity plate is connected with the edge seal of the edge of described depressed part and described top board, and described top board has the corresponding vacuum bothrium that is communicated with described intermediate thermal conductivity plate of a plurality of little adsorption holes, and the thermal conductivity of wherein said intermediate thermal conductivity plate is respectively higher than the thermal conductivity of described top board and base; And a pressing plate, be disposed at the top of described heated seats, with the corresponding package carrier that compresses from top, described package carrier is held between described heated seats and described pressing plate.
In an embodiment of the present utility model, described pressing plate has the routing window of a hollow, and the routing window of described pressing plate exposes described package carrier to the open air and wants to carry out the position of routing operation.
In an embodiment of the present utility model, described base lower surface is provided with at least one heating component.
The heated seats of routing technique of the present utility model and heater are by the thermal conductive resin of the described intermediate thermal conductivity plate between described base and described top board, make the heat energy that described base transmission comes up just be transmitted to described top board after dispersed, allow central temperature and the lip temperature difference of described top board dwindle, and then the heating environment of a stable and uniform is provided.
Description of drawings
Fig. 1 is the STRUCTURE DECOMPOSITION schematic diagram of heater of the routing technique of the utility model one embodiment.
Fig. 2 is the cutaway view of heated seats of the routing technique of the utility model one embodiment.
Fig. 3 is the cutaway view of operating process of heater of the routing technique of the utility model one embodiment.
Fig. 4 is the heat conduction schematic diagram of the heated seats of routing technique of the present utility model.
Embodiment
For allowing the utility model above-mentioned purpose, feature and advantage become apparent, the utility model preferred embodiment cited below particularly, and coordinate accompanying drawing, be described in detail below.Moreover, the direction term that the utility model is mentioned, such as " on ", D score, 'fornt', 'back', " left side ", " right side ", " interior ", " outward ", " side " etc., be only the direction with reference to annexed drawings.Therefore, the direction term of use is in order to illustrate and to understand the utility model, but not in order to limit the utility model.
Please refer to shown in Figure 1ly, Fig. 1 is the STRUCTURE DECOMPOSITION schematic diagram of heater of the routing technique of the utility model one embodiment.The heater of routing technique of the present utility model is mainly used in being used for the fixing and package carriers such as heating one lead frame (leadframe) or substrate (substrate) of provisional carrying during packaging and routing technique, the quality that engages to improve routing.In Fig. 1, the heater of the routing technique that the utility model discloses comprises a heated seats 1 and a pressing plate 2.
Please in the lump with reference to Fig. 1, Fig. 2 and shown in Figure 3, the heated seats 1 of the utility model one embodiment is to carry a package carrier 3, and described heated seats 1 is a multiple layer metal structure, and it comprises a base 10, an intermediate thermal conductivity plate 11 and a top board 12.Described package carrier 3 can be substrate strip (substrate strip) or conductive wire frame strip (leadframe strip), described substrate strip or have respectively several base board units or lead frame unit above conductive wire frame strip.
Described base 10 is en plaque or bulk, and its material can be iron, aluminium, nickel or its alloy (as stainless steel), and 10 surfaces of base described in the present embodiment are formed with a depressed part 100, and described depressed part 100 has two relative sidewall 101 openings relative with two.Described base 10 separately has at least one vacuum sucker 102, and described vacuum sucker 102 runs through between the lower surface of the surface of the depressed part 100 that is formed at described base 10 and described base 10.Moreover described base 10 can add and be provided with at least one heating component (not illustrating) at its lower surface, and to provide heat energy to described base 10 by heating component, perhaps described base 10 inside can be buried a heating component underground.
Described intermediate thermal conductivity plate 11 is arranged in described depressed part 100, and can be to form a laser welding bead with the edge of described intermediate thermal conductivity plate 11 and the seamless link of described depressed part frontside edge together by laser welding process, guarantee intermediate thermal conductivity plate 11 and described depressed part 100 in conjunction with after air-tightness, follow-up evacuation can effectively be carried out.Described intermediate thermal conductivity plate 11 can be a for example copper coin, the thermal conductivity of described intermediate thermal conductivity plate 11 is relatively higher than the thermal conductivity of described base 10, therefore described intermediate thermal conductivity plate 11 can will evenly spread apart from the heat energy of base 10 by its good thermal conduction characteristic, described intermediate thermal conductivity plate 11 has at least one vacuum bothrium 110 and a through hole 111, described through hole 111 is communicated with described at least one vacuum bothrium, and at least one described vacuum bothrium 110 is communicated with the vacuum sucker 102 of described base 10 by described through hole 111.Described vacuum bothrium 110 comprises at least one rectangular vertical bothrium 110a and at least one rectangular horizontal bothrium 110b in the present embodiment, and is for example shown in Figure 1, and described vacuum bothrium 110 comprises vertical bothrium 110a and the two horizontal bothrium 110b of many parallel arrangements; The described vertical bothrium 110a of described horizontal bothrium 110b vertical connection, wherein said horizontal bothrium 110b or vertical bothrium 110a are communicated with the vacuum sucker 102 of described bases 10 by described through hole 111.In the present embodiment, described horizontal bothrium 110b may extend to the edge of described intermediate thermal conductivity plate 11, and then the sidewall 101 of the described depressed part 100 of butt.The vacuum bothrium 110 of described intermediate thermal conductivity plate 11 is except strip, also can be other shapes, for example helical form, concentric circles (radial bothrium is used in collocation) all can, as long as described vacuum bothrium 110 is by the vacuum sucker 102 of the described through hole 111 described bases 10 of connection.
Described top board 12 is arranged in described depressed part 100 and correspondence is attached on described intermediate thermal conductivity plate 11, and can be the upper surface that part protrudes from described base 10, described top board 12 can be to form edge seamless link that a laser welding bead makes its edge and described depressed part 100 and intermediate thermal conductivity plate 11 together by laser welding process equally, guarantee the air-tightness of described top board 12, intermediate thermal conductivity plate 11 and described depressed part 100 combinations, so that follow-up evacuation can effectively be carried out.In addition, the edge of the edge of described intermediate thermal conductivity plate and the edge of described depressed part and described top board is for being tightly connected, but the process that is not limited to above-mentioned laser welding realizes, as long as reach the effect that is tightly connected, for example the edge of the edge of the edge of described intermediate thermal conductivity plate and described depressed part and described top board also can use high temperature resistant colloid to stick together to be connected.Described top board 12 materials can be iron, aluminium, nickel or its alloy (as stainless steel), and the thermal conductivity of described top board 12 is relatively lower than the thermal conductivity of described intermediate thermal conductivity plate 11, and can be same as the thermal conductivity of described base 10.
Described top board 12 can want to carry out in order to carry described package carrier 3 position (for example semiconductor chip and pin) of routing operation, it has a plurality of little adsorption holes 120 that run through its upper and lower surface, the corresponding vacuum bothrium 110 that is communicated with described intermediate thermal conductivity plate 11 of described little adsorption hole 120, therefore, little adsorption hole 120 of described top board 12 is by the vacuum sucker 102 of vacuum bothrium 110 and the through hole 111 described bases 10 of indirect communication of described intermediate thermal conductivity plate 11.The suction device (not illustrating) that connects an outside when the vacuum sucker 102 of described base 10, just can produce a pull of vacuum on the surface of described top board 12, in order to the lower surface that provides a temporary bed knife to hold described package carrier 3, in order to described package carrier 3 temporarily is fixed on described heated seats 1.The aperture of little adsorption hole 120 of described top board 12 can be for example between 0.15 millimeter～0.25 millimeter, the spacing between little adsorption hole 120 can be for example 3.25 millimeters or below, but not subject to the limits.
Described pressing plate 2 is disposed at the top of described heated seats 1, and its central authorities have the routing window 20 of a hollow.As shown in Figure 3, described pressing plate 2 is used for the described package carrier 3 of corresponding compression from top, and described package carrier 3 is held between described heated seats 1 and described pressing plate 2.And the routing window 20 of described pressing plate 2 exposes the position that described package carrier 3 wants to carry out the routing operation to the open air, so that the follow-up routing program of carrying out.
At the heater of routing technique of the present utility model when carrying out the packaging and routing process, outside suction device can be from the action of bleeding of the vacuum sucker 102 of the base 10 of described heated seats 1, produce a pull of vacuum, the temporary lower surface that holds described package carrier 3 with the surface at described top board 12; The heating component that while described base 10 inside are buried underground or outside additional heating component start to provide heat energy to arrive described base 10, the heat energy that described top board 12 namely obtains from described base 10 by described intermediate thermal conductivity plate 11, heat with the position of described package carrier 3 being wanted carry out the routing operation.
please refer to shown in Figure 4, Fig. 4 summary discloses the heat conduction schematic diagram of the heated seats of routing technique of the present utility model, although the central part of described base 10 has higher temperature because approach the heating component 4 of below, but the relation due to the thermal conductive resin of the described intermediate thermal conductivity plate 11 between described base 10 and described top board 12, can make described base 10 transmit the heat energy that comes up and just be transmitted to described top board 12 after dispersed, allow central temperature and the lip temperature difference of described top board 12 dwindle, and then can roughly provide described package carrier 3 to want to carry out the heating environment of the position of routing operation (for example weld pad of a semiconductor chip and pin) stable and uniform, simultaneously also can relatively enlarge the position of routing operation, make the routing window 20 of described pressing plate 2 can be extended to 72 millimeters * 60 millimeters.Therefore, when described pressing plate 2 fixing described package carrier 3, described routing window 20 can expose the chip of greater number to the open air, to carry out more routing number of times, therefore can be relative to reducing the number of times that periodically move, fix described package carrier 3, and then relatively accelerate the routing operation.
In sum, heater compared to existing routing technique uses integrated heated seats to have the uneven problem of being heated, the heated seats of the heater of routing technique of the present utility model is made by multi-layer metal structure, utilize the intermediate thermal conductivity plate between base and top board to make the dispersed of heat energy, make top board be heated evenly, control centre's temperature and lip temperature difference in 5 degree, help to promote the stability of routing operation.
The utility model is described by above-mentioned related embodiment, yet above-described embodiment is only for implementing example of the present utility model.Must be pointed out that, published embodiment does not limit scope of the present utility model.On the contrary, being contained in the spirit of claims and modification and impartial setting of scope is included in scope of the present utility model.
Claims (10)
1. the heated seats of a routing technique, it is characterized in that: described heated seats comprises:
One base, its surface is formed with a depressed part;
One intermediate thermal conductivity plate, be arranged in described depressed part and have at least one vacuum bothrium and a through hole, and described through hole is communicated with described at least one vacuum bothrium; And
One top board, being arranged at the interior also correspondence of described depressed part is attached on described intermediate thermal conductivity plate, and the edge of described intermediate thermal conductivity plate is connected with the edge seal of the edge of described depressed part and described top board, and described top board has the corresponding vacuum bothrium that is communicated with described intermediate thermal conductivity plate of a plurality of little adsorption holes;
The thermal conductivity of wherein said intermediate thermal conductivity plate is respectively higher than the thermal conductivity of described top board and base.
2. the heated seats of routing technique as claimed in claim 1, it is characterized in that: the edge of the edge of described intermediate thermal conductivity plate and the edge of described depressed part and described top board links together by a laser welding road.
3. the heated seats of routing technique as claimed in claim 1, it is characterized in that: described base has at least one vacuum sucker, the vacuum sucker of wherein said base runs through between the lower surface of the surface of the depressed part that is formed at described base and described base, and the vacuum bothrium of the described intermediate thermal conductivity plate of through hole connection by described intermediate thermal conductivity plate.
4. the heated seats of routing technique as claimed in claim 1, it is characterized in that: described base material is iron, aluminium, nickel or its alloy; Described intermediate thermal conductivity plate is a copper coin; Described top board material is iron, aluminium, nickel or its alloy.
5. the heated seats of routing technique as claimed in claim 1, it is characterized in that: the vacuum bothrium of described intermediate thermal conductivity plate comprises at least one rectangular vertical bothrium and at least one rectangular horizontal bothrium; The described vertical bothrium of described horizontal bothrium vertical connection, wherein said horizontal bothrium or the corresponding vacuum sucker that is communicated with described base of vertical bothrium.
6. the heated seats of routing technique as claimed in claim 5, it is characterized in that: the vacuum bothrium of described intermediate thermal conductivity plate is helical form or concentric circles.
7. the heated seats of routing technique as claimed in claim 6, it is characterized in that: described top plate portion protrudes from the upper surface of described base; The aperture of little adsorption hole of described top board is between 0.15 millimeter～0.25 millimeter.
8. the heater of a routing technique, it is characterized in that: described heater comprises:
One heated seats, comprise a base, an intermediate thermal conductivity plate and a top board; Described susceptor surface is formed with a depressed part; Described intermediate thermal conductivity plate is arranged in described depressed part and has at least one vacuum bothrium and a through hole, and described through hole is communicated with described at least one vacuum bothrium; Described top board is arranged in described depressed part and correspondence is attached on described intermediate thermal conductivity plate, and the edge of described intermediate thermal conductivity plate is connected with the edge seal of the edge of described depressed part and described top board, and described top board has the corresponding vacuum bothrium that is communicated with described intermediate thermal conductivity plate of a plurality of little adsorption holes, and the thermal conductivity of wherein said intermediate thermal conductivity plate is respectively higher than the thermal conductivity of described top board and base; And
One pressing plate, be disposed at the top of described heated seats, with the corresponding package carrier that compresses from top, described package carrier is held between described heated seats and described pressing plate.
9. the heater of routing technique as claimed in claim 8, it is characterized in that: described pressing plate has the routing window of a hollow, and the routing window of described pressing plate exposes described package carrier to the open air and wants to carry out the position of routing operation.
10. the heater of routing technique as claimed in claim 8, it is characterized in that: described base lower surface is provided with at least one heating component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320230075XU CN203300621U (en) | 2013-05-02 | 2013-05-02 | Heating seat and heating device for a wire bond process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320230075XU CN203300621U (en) | 2013-05-02 | 2013-05-02 | Heating seat and heating device for a wire bond process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203300621U true CN203300621U (en) | 2013-11-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320230075XU Expired - Fee Related CN203300621U (en) | 2013-05-02 | 2013-05-02 | Heating seat and heating device for a wire bond process |
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| Country | Link |
|---|---|
| CN (1) | CN203300621U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103258772A (en) * | 2013-05-02 | 2013-08-21 | 苏州日月新半导体有限公司 | Heating seat and heating device for wire bonding process |
-
2013
- 2013-05-02 CN CN201320230075XU patent/CN203300621U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103258772A (en) * | 2013-05-02 | 2013-08-21 | 苏州日月新半导体有限公司 | Heating seat and heating device for wire bonding process |
| CN103258772B (en) * | 2013-05-02 | 2016-02-10 | 苏州日月新半导体有限公司 | Heating seat and heating device for wire bonding process |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131120 Termination date: 20210502 |