CN203276887U - Conductive film - Google Patents
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- CN203276887U CN203276887U CN 201320307329 CN201320307329U CN203276887U CN 203276887 U CN203276887 U CN 203276887U CN 201320307329 CN201320307329 CN 201320307329 CN 201320307329 U CN201320307329 U CN 201320307329U CN 203276887 U CN203276887 U CN 203276887U
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Abstract
Provided is a conductive film. The conductive film comprises a transparent substrate and a first conductive layer; the transparent substrate comprises a hard layer and an accommodation layer connected with the hard layer; and the hardness of a part near the hard layer of the accommodation layer is lower than that of the hard layer, so the transparent substrate is provided with enough hardness and good flexibility and is difficult to damage when being reeled. A traditional glass substrate is replace by the reelable transparent substrate, and a reel-to-reel manufacture mode can be used during the manufacturing of the conductive film, so the conductive film can be manufactured highly efficiently and easily.
Description
Technical field
The utility model relates to the touch screen technology field, particularly relates to a kind of conducting film.
Background technology
Touch-screen is the inductive arrangement that can receive the input signals such as touch.Touch-screen has given information interaction brand-new looks, is extremely attractive brand-new information interaction equipment.The development of touch screen technology has caused the common concern of domestic and international information medium circle, has become the Chaoyang new high-tech industry that the photoelectricity industry is a dark horse.
Nesa coating is to have satisfactory electrical conductivity, and has a kind of film of high transmission rate at visible light wave range.Nesa coating has been widely used in the fields such as flat panel display, photovoltaic device, contact panel and electromagnetic shielding at present, has the extremely wide market space.
Traditional touch-screen conducting film is take glass as substrate, forms conductive layer and other structures at glass surface, and this touch-screen can only adopt the plane production method to make, and make efficiency is low, is not easy to produce.
The utility model content
Based on this, be necessary to provide a kind of conducting film that is easy to produce.
A kind of conducting film comprises: the transparency carrier that can roll up, comprise hard layer and the layer of accommodating that is connected described hard layer, and the described part hardness of layer close described hard layer of accommodating is lower than the hardness of described hard layer; The first conductive layer comprises the first conductive pattern, and described the first conductive pattern is embedded at the described layer of accommodating away from a side of described hard layer, and described the first conductive pattern is intersected to form by conductive thread.
Therein in embodiment, the described layer of accommodating comprises flexible layer and the first hypothallus, described flexible layer is connected with described hard layer, the hardness of described flexible layer is lower than the hardness of described hard layer, described the first hypothallus is arranged at described flexible layer away from a side of described hard layer, and described the first conductive pattern is embedded at described the first hypothallus away from a side of described flexible layer.
therein in embodiment, described the first conductive layer comprises the first lead-in wire, described flexible layer comprises first area and the second area that arranges around described first area away from a side of described hard layer, described the first conductive pattern is embedded at described the first hypothallus away from a side of described flexible layer, and the position corresponding with the first area of described flexible layer, described the first lead-in wire is arranged at the first hypothallus away from a side of described flexible layer, and the position corresponding with the second area of described flexible layer, described the first lead-in wire is electrically connected to the conductive thread of described the first conductive pattern.
In embodiment, comprise light shield layer therein, described light shield layer is arranged at the second area of described flexible layer, and described the first hypothallus covers described light shield layer.
In embodiment, comprise the second hypothallus and the second conductive layer therein,
Described the second hypothallus is arranged at described the first hypothallus away from a side of described flexible layer, and covers described the first conductive layer;
Described the second conductive layer comprises the second conductive pattern, described the second conductive pattern is embedded at described the second hypothallus away from a side of described the first hypothallus, and the position corresponding with the first area of described flexible layer, described the second conductive pattern is intersected to form by conductive thread.
Therein in embodiment, described the second conductive layer comprises the second lead-in wire, described the second lead-in wire is arranged at described the second hypothallus away from a side of described the first hypothallus, and the position corresponding with the second area of described flexible layer, described the second lead-in wire is electrically connected to the conductive thread of described the second conductive pattern.
In embodiment, described the first lead-in wire and the second lead-in wire are convex grid or channel form grid therein.
Therein in embodiment, the conductive thread of described the first conductive pattern intersects to form a plurality of the first conductive grids, the conductive thread of described the second conductive pattern intersects to form a plurality of the second conductive grids, and described the first conductive grid and the second conductive grid are regular grid or random grid.
In embodiment, comprise protective clear layer therein, described protective clear layer is arranged at described the second hypothallus away from a side of described the first hypothallus, and covers described the second conductive layer.
Therein in embodiment, described the first hypothallus is away from a side of described flexible layer, and the position corresponding with the first area of described flexible layer be provided with the first groove, and described the first conductive pattern is contained in described the first groove; Described the second hypothallus is away from a side of described the first hypothallus, and the position corresponding with the first area of described flexible layer is provided with the second groove, described the second conductive pattern is contained in described the second groove, the degree of depth of described the second groove is less than the thickness of described the second hypothallus, and the depth-to-width ratio of described the first groove and/or the second groove is greater than 1.
In embodiment, the width of described the first groove and/or the second groove is 0.2 micron to 5 microns therein, and the degree of depth is 2 microns to 6 microns.
In embodiment, the bottom of described the first groove and/or the second groove is nonplanar structure therein.
Therein in embodiment, the described layer of accommodating comprises flexible layer, described the first conductive layer comprises the first lead-in wire, described flexible layer comprises first area and the second area that arranges around described first area away from a side of described hard layer, described the first conductive pattern is embedded at the first area of described flexible layer, described the first lead-in wire is arranged at the second area of described flexible layer, and is electrically connected to the conductive thread of described the first conductive pattern.
In embodiment, comprise light shield layer therein, described light shield layer is arranged at the second area of described flexible layer, and described the first lead-in wire is arranged at described light shield layer away from a side of described flexible layer.
In embodiment, comprise the second hypothallus and the second conductive layer therein,
Described the second hypothallus is arranged at described flexible layer away from a side of described hard layer, and covers described the first conductive layer;
Described the second conductive layer comprises the second conductive pattern, and described the second conductive pattern is embedded at described the second hypothallus away from a side of described flexible layer, and the position corresponding with the first area of described flexible layer, and described the second conductive pattern is intersected to form by conductive thread.
Therein in embodiment, described the second conductive layer comprises the second lead-in wire, described the second lead-in wire is arranged at described the second hypothallus away from a side of described flexible layer, and the position corresponding with the second area of described flexible layer, described the second lead-in wire is electrically connected to the conductive thread of described the second conductive pattern.
In embodiment, comprise protective clear layer therein, described protective clear layer is arranged at described the second hypothallus away from a side of described flexible layer, and covers described the second conductive layer.
Above-mentioned conducting film, comprise transparency carrier and the first conductive layer, transparency carrier comprises hard layer and the layer of accommodating that is connected hard layer, accommodate the part hardness of layer close hard layer lower than the hardness of hard layer, transparency carrier is also had flexible preferably when having enough hardness, not fragile when curling.Owing to adopting the transparency carrier that can roll up to replace traditional substrate of glass, can utilize the volume to volume mode of production when making conducting film, make efficiency is high, is easy to produce.
Description of drawings
Fig. 1 is the structure chart of conducting film in an embodiment;
Fig. 2 is the structure chart of conducting film in another embodiment;
Fig. 3 is the structure chart of conducting film in another embodiment;
Fig. 4 is the structure chart of conducting film in another embodiment.
Embodiment
For the ease of understanding the utility model, the below is described more fully the utility model with reference to relevant drawings.Provided first-selected embodiment of the present utility model in accompanying drawing.But the utility model can be realized in many different forms, is not limited to embodiment described herein.On the contrary, providing the purpose of these embodiment is to make to disclosure of the present utility model more thoroughly comprehensively.
Need to prove, when element is called as " being fixedly arranged on " another element, can directly can there be element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may have simultaneously centering elements.Term as used herein " vertical ", " level ", " left side ", " right side " and similar statement are just for illustrative purposes.
Unless otherwise defined, all technology of using of this paper and scientific terminology are with to belong to the implication that those skilled in the art of the present utility model understand usually identical.The term that uses in specification of the present utility model herein is not intended to be restriction the utility model just in order to describe the purpose of specific embodiment.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
A kind of conducting film comprises the transparency carrier that can roll up, and the first conductive layer.Transparency carrier comprises hard layer and accommodate layer, and hard layer can be polymethyl methacrylate layers.Accommodate layer and be connected with hard layer, and accommodate the part hardness of layer close hard layer lower than the hardness of hard layer.The first conductive layer comprises the first conductive pattern, and the first conductive pattern is embedded at accommodates layer away from a side of hard layer, and the first conductive pattern is intersected to form by conductive thread.The conductive thread of the first conductive pattern can be at least a in metal wire, metal alloy wire, carbon nano tube line, Graphene line and conducting polymer composite line.In the present embodiment, conductive thread is the argent material, can improve the electric conductivity of conducting film.Conductive thread intersect to consist of a plurality of the first conductive grids, and the first conductive grid can be regular grid, and as square, rectangle, triangle, rhombus or polygon, respectively first conductive grid shape is can be all identical, part is identical or all not identical.The first conductive grid is made regular grid can be convenient to unified production control.The first conductive grid also can be random grid in other embodiments, and namely it is shaped as irregular.
In one of them embodiment, as shown in Figure 1, accommodate layer and comprise flexible layer 122, flexible layer 122 is connected with hard layer 110, and the hardness of flexible layer 122 is lower than the hardness of hard layer 110, and in the present embodiment, flexible layer 122 can be layer of polycarbonate.The first conductive pattern 132 is embedded at flexible layer 122 away from a side of hard layer 110.Particularly, can be provided with away from a side of hard layer 110 at flexible layer 122 and accommodate groove, the first conductive pattern 132 is contained in accommodates in groove, can solidify and obtain by being filled in the conducting solution of accommodating groove.Accommodate the depth-to-width ratio of groove in the present embodiment greater than 1, assurance is contained in the ratio of thickness and width of conductive thread of first conductive pattern 132 of accommodating groove greater than 1, be that the width of conductive thread is less than its thickness, can also guarantee the electric conductivity of conducting film in the light transmittance that does not affect conducting film, also can adjust according to actual conditions the resistance of conductive thread in conducting film is manufactured.
Particularly, the width of accommodating groove can be 0.2 micron to 5 microns, and guaranteeing neither can because of the too wide light transmittance that affects conducting film of conductive thread, can not affect because conductive thread is too narrow the electric conductivity of conducting film yet.The degree of depth of accommodating groove can be 2 microns to 6 microns, and guaranteeing neither can be because of the too thin electric conductivity that affects conducting film of conductive thread, also can be because of the too thick thickness that increases conducting film of conductive thread.The bottom of accommodating groove can be set to nonplanar structure, can be specifically " V " font, " W " font, arc or waveform etc., accommodating groove filled conductive solution, when solidifying to form the first conductive pattern 132, can reduce to accommodate the tension force of bottom portion of groove both sides, when avoiding solidifying, the conductive thread of the first conductive pattern 132 disconnects.
In another embodiment, as shown in Figure 2, accommodate layer and also can comprise the first hypothallus 124, the first hypothallus 124 is arranged at flexible layer 122 away from a side of hard layer 110, the first conductive pattern 132 is embedded at 124 layers of side away from flexible layer 122 of the first matrix, and the first hypothallus 124 can be UV glue-line, impression glue-line or layer of polycarbonate.Particularly, can be provided with the first groove away from a side of flexible layer 122 at the first hypothallus 124, the first conductive pattern 132 is contained in the first groove, can be solidified by the conducting solution that is filled in the first groove obtain.In like manner, the depth-to-width ratio of the first groove can be set greater than 1, width can be 0.2 micron to 5 microns, the degree of depth can be 2 microns to 6 microns, the bottom of the first groove can be set to nonplanar structure, and the beneficial effect of these features and the aforementioned groove of accommodating are similar, and therefore not to repeat here.
Above-mentioned conducting film, comprise transparency carrier and the first conductive layer, transparency carrier comprises hard layer 110 and the layer of accommodating that is connected hard layer 110, accommodate the part hardness of layer close hard layer 110 lower than the hardness of hard layer 110, transparency carrier is also had flexible preferably when having enough hardness, not fragile when curling.Owing to adopting the transparency carrier that can roll up to replace traditional substrate of glass, can utilize the volume to volume mode of production when making conducting film, make efficiency is high, is easy to produce.
Be illustrated in figure 3 as and accommodate the embodiment that layer only comprises flexible layer 122, the first conductive layer can comprise the first lead-in wire 134, flexible layer 122 comprises first area and the second area that arranges around the first area away from a side of hard layer 110, the first conductive pattern 132 is embedded at the first area of flexible layer 122, namely accommodates the first area that groove is arranged at flexible layer 122.The first lead-in wire 134 is arranged at the second area of flexible layer 122, and is electrically connected to the conductive thread of the first conductive pattern 132.The first lead-in wire 134 can be convex grid or channel form grid, and in the present embodiment, the first lead-in wire 134 is the convex grid, can make by inkjet printing, and is easy and simple to handle, quick.
Conducting film also can comprise light shield layer 140, and light shield layer 140 is arranged at the second area of flexible layer 122, and the first lead-in wire 134 is arranged at light shield layer 140 away from a side of flexible layer 122.Light shield layer 140 is used for blocking the first lead-in wire 134, and in the present embodiment, light shield layer 140 can be ink lay, and is easy to make and cost is low, specifically can be black ink layer or colored ink layer, as long as satisfy opaque.The width of light shield layer 140 can be 1 millimeter to 5 millimeters, can adjust according to the physical length of the first lead-in wire 134, guarantees that further the first lead-in wire 134 can not expose.
Continuation is with reference to Fig. 3, and conducting film also can comprise the second hypothallus 150 and the second conductive layer, and the second hypothallus 150 is arranged at flexible layer 122 away from a side of hard layer 110, and covers the first conductive layer.The second hypothallus 150 can be also UV glue-line, impression glue-line or layer of polycarbonate.The second conductive layer comprises that the second conductive pattern 162, the second conductive patterns 162 are embedded at the second hypothallus 150 away from a side of flexible layer 122, and the position corresponding with the first area of flexible layer 122, and the second conductive pattern 162 is intersected to form by conductive thread.The conductive thread of the second conductive pattern 162 can be at least a in metal wire, metal alloy wire, carbon nano tube line, Graphene line and conducting polymer composite line equally.In the present embodiment, conductive thread is the argent material, can improve the electric conductivity of conducting film.Conductive thread intersect to consist of a plurality of the second conductive grids, and the second conductive grid can be regular grid, and as square, rectangle, triangle, rhombus or polygon, respectively second conductive grid shape is can be all identical, part is identical or all not identical.The second conductive grid is made regular grid can be convenient to unified production control.The second conductive grid also can be random grid in other embodiments, and namely it is shaped as irregular.
Particularly, can be in the side of the second hypothallus 150 away from flexible layer 122, and the position corresponding with the first area of flexible layer 122 is provided with the second groove, and the second conductive pattern 162 is contained in the second groove, can be solidified by the conducting solution that is filled in the second groove to obtain.The degree of depth of the second groove contacts with the first conductive pattern 132 to avoid the second conductive pattern 162 less than the thickness of the second hypothallus 150.In like manner, the depth-to-width ratio of the second groove also can be set greater than 1, width can be 0.2 micron to 5 microns, and the degree of depth can be 2 microns to 6 microns, and the bottom of the second groove can be set to nonplanar structure.
The second conductive layer can comprise that the second lead-in wire 164, the second lead-in wires 164 are arranged at the second hypothallus 150 away from a side of flexible layer 122, and the position corresponding with the second area of flexible layer 122, and the second lead-in wire 164 is electrically connected to the conductive thread of the second conductive pattern 162.Light shield layer 140 can block the second lead-in wire 164 equally, the second lead-in wire 164 can be equally also convex grid or channel form grid, in the present embodiment, the second lead-in wire 164 is the channel form grid, can be in the side of the second hypothallus 150 away from flexible layer 122, and the position corresponding with the second area of flexible layer 122 arranges the lead-in wire groove, the curing of filled conductive solution obtains the second lead-in wire 164 in the lead-in wire groove, the second lead-in wire 164 can form simultaneously with the second conductive pattern 162, reduce production process, reduce costs.
Conducting film also can comprise protective clear layer 170, and protective clear layer 170 is arranged at the second hypothallus 150 away from a side of flexible layer 122, and covers the second conductive layer.Protective clear layer 170 prevents the second conductive pattern 162 and the second lead-in wire 164 oxidations or is scratched for the protection of the second conductive layer.Protective clear layer 170 can be equally also UV glue-line, impression glue-line or layer of polycarbonate.
Be illustrated in figure 4 as and accommodate the embodiment that layer comprises flexible layer 122 and the first hypothallus 124, the first conductive layer can comprise the first lead-in wire 134.Flexible layer 122 comprises first area and the second area that arranges around the first area away from a side of hard layer 110, the first conductive pattern 132 is embedded at the first hypothallus 124 away from a side of flexible layer 122, and the position corresponding with the first area of flexible layer 122, namely the first groove is arranged at the first hypothallus 124 away from a side of flexible layer 122, and the position corresponding with the first area of flexible layer 122.The first lead-in wire 134 is arranged at the first hypothallus 124 away from a side of flexible layer 122, and the position corresponding with the second area of flexible layer 122, and the first lead-in wire 134 is electrically connected to the conductive thread of the first conductive pattern 132.The first lead-in wire 134 can be convex grid or channel form grid, in the present embodiment, the first lead-in wire 134 is the channel form grid, can be in the side of the first hypothallus 124 away from flexible layer 122, and the position corresponding with the second area of flexible layer 122 arranges the lead-in wire groove, the curing of filled conductive solution obtains the first lead-in wire 134 in the lead-in wire groove, the first lead-in wire 134 can form simultaneously with the first conductive pattern 132, reduces production process, reduces costs.
Continuation is with reference to Fig. 4, and conducting film can comprise light shield layer 140, and the second area that light shield layer 140 is arranged at flexible layer 122 covers light shield layer 140 to block the first lead-in wire 134, the first hypothalluses 124.
Conducting film can comprise that also the second hypothallus 150, the second conductive layer and protective clear layer 170, the second conductive layers comprise the second conductive pattern 162, also can comprise the second lead-in wire 164.The second hypothallus 150 is arranged at the first hypothallus 124 away from a side of flexible layer 122, and covers the first conductive layer.In the side of the second hypothallus 150 away from the first hypothallus 124, and the position corresponding with the first area of flexible layer 122 arranges the second groove, the second conductive pattern 162 is contained in the second groove, the degree of depth of the second groove contacts with the first conductive pattern 132 to avoid the second conductive pattern 162 less than the thickness of the second hypothallus 150.The second lead-in wire 164 is arranged at the second hypothallus 150 away from a side of the first hypothallus 124, and the position corresponding with the second area of flexible layer 122, the second lead-in wire 164 is electrically connected to the conductive thread of the second conductive pattern 162, and light shield layer 140 can block the second lead-in wire 164 equally.Protective clear layer 170 is arranged at the second hypothallus 150 away from a side of the first hypothallus 124, and covers the second conductive layer.
Similar for the optional embodiment of the conductive thread of light shield layer 140, the second hypothallus 150, the second groove, the second conductive pattern 162, the second lead-in wire 164 and protective clear layer 170 and beneficial effect thereof and embodiment shown in Figure 3, therefore not to repeat here.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.Should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (17)
1. a conducting film, is characterized in that, comprising:
The transparency carrier that can roll up comprises hard layer and the layer of accommodating that is connected described hard layer, and the described part hardness of layer close described hard layer of accommodating is lower than the hardness of described hard layer;
The first conductive layer comprises the first conductive pattern, and described the first conductive pattern is embedded at the described layer of accommodating away from a side of described hard layer, and described the first conductive pattern is intersected to form by conductive thread.
2. conducting film according to claim 1, it is characterized in that, the described layer of accommodating comprises flexible layer and the first hypothallus, described flexible layer is connected with described hard layer, the hardness of described flexible layer is lower than the hardness of described hard layer, described the first hypothallus is arranged at described flexible layer away from a side of described hard layer, and described the first conductive pattern is embedded at described the first hypothallus away from a side of described flexible layer.
3. conducting film according to claim 2, it is characterized in that, described the first conductive layer comprises the first lead-in wire, described flexible layer comprises first area and the second area that arranges around described first area away from a side of described hard layer, described the first conductive pattern is embedded at described the first hypothallus away from a side of described flexible layer, and the position corresponding with the first area of described flexible layer, described the first lead-in wire is arranged at the first hypothallus away from a side of described flexible layer, and the position corresponding with the second area of described flexible layer, described the first lead-in wire is electrically connected to the conductive thread of described the first conductive pattern.
4. conducting film according to claim 3, is characterized in that, comprises light shield layer, and described light shield layer is arranged at the second area of described flexible layer, and described the first hypothallus covers described light shield layer.
5. conducting film according to claim 3, is characterized in that, comprises the second hypothallus and the second conductive layer,
Described the second hypothallus is arranged at described the first hypothallus away from a side of described flexible layer, and covers described the first conductive layer;
Described the second conductive layer comprises the second conductive pattern, described the second conductive pattern is embedded at described the second hypothallus away from a side of described the first hypothallus, and the position corresponding with the first area of described flexible layer, described the second conductive pattern is intersected to form by conductive thread.
6. conducting film according to claim 5, it is characterized in that, described the second conductive layer comprises the second lead-in wire, described the second lead-in wire is arranged at described the second hypothallus away from a side of described the first hypothallus, and the position corresponding with the second area of described flexible layer, described the second lead-in wire is electrically connected to the conductive thread of described the second conductive pattern.
7. conducting film according to claim 6, is characterized in that, described the first lead-in wire and the second lead-in wire are convex grid or channel form grid.
8. conducting film according to claim 5, it is characterized in that, the conductive thread of described the first conductive pattern intersects to form a plurality of the first conductive grids, the conductive thread of described the second conductive pattern intersects to form a plurality of the second conductive grids, and described the first conductive grid and the second conductive grid are regular grid or random grid.
9. conducting film according to claim 5, is characterized in that, comprises protective clear layer, and described protective clear layer is arranged at described the second hypothallus away from a side of described the first hypothallus, and cover described the second conductive layer.
10. conducting film according to claim 5, it is characterized in that, described the first hypothallus is away from a side of described flexible layer, and the position corresponding with the first area of described flexible layer be provided with the first groove, and described the first conductive pattern is contained in described the first groove; Described the second hypothallus is away from a side of described the first hypothallus, and the position corresponding with the first area of described flexible layer is provided with the second groove, described the second conductive pattern is contained in described the second groove, the degree of depth of described the second groove is less than the thickness of described the second hypothallus, and the depth-to-width ratio of described the first groove and/or the second groove is greater than 1.
11. conducting film according to claim 10 is characterized in that, the width of described the first groove and/or the second groove is 0.2 micron to 5 microns, and the degree of depth is 2 microns to 6 microns.
12. conducting film according to claim 10 is characterized in that, the bottom of described the first groove and/or the second groove is nonplanar structure.
13. conducting film according to claim 1, it is characterized in that, the described layer of accommodating comprises flexible layer, described the first conductive layer comprises the first lead-in wire, described flexible layer comprises first area and the second area that arranges around described first area away from a side of described hard layer, described the first conductive pattern is embedded at the first area of described flexible layer, and described the first lead-in wire is arranged at the second area of described flexible layer, and is electrically connected to the conductive thread of described the first conductive pattern.
14. conducting film according to claim 13 is characterized in that, comprises light shield layer, described light shield layer is arranged at the second area of described flexible layer, and described the first lead-in wire is arranged at described light shield layer away from a side of described flexible layer.
15. conducting film according to claim 13 is characterized in that, comprises the second hypothallus and the second conductive layer,
Described the second hypothallus is arranged at described flexible layer away from a side of described hard layer, and covers described the first conductive layer;
Described the second conductive layer comprises the second conductive pattern, and described the second conductive pattern is embedded at described the second hypothallus away from a side of described flexible layer, and the position corresponding with the first area of described flexible layer, and described the second conductive pattern is intersected to form by conductive thread.
16. conducting film according to claim 15, it is characterized in that, described the second conductive layer comprises the second lead-in wire, described the second lead-in wire is arranged at described the second hypothallus away from a side of described flexible layer, and the position corresponding with the second area of described flexible layer, described the second lead-in wire is electrically connected to the conductive thread of described the second conductive pattern.
17. conducting film according to claim 15 is characterized in that, comprises protective clear layer, described protective clear layer is arranged at described the second hypothallus away from a side of described flexible layer, and covers described the second conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320307329 CN203276887U (en) | 2013-05-30 | 2013-05-30 | Conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320307329 CN203276887U (en) | 2013-05-30 | 2013-05-30 | Conductive film |
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| CN203276887U true CN203276887U (en) | 2013-11-06 |
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| CN 201320307329 Expired - Fee Related CN203276887U (en) | 2013-05-30 | 2013-05-30 | Conductive film |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103295669A (en) * | 2013-05-30 | 2013-09-11 | 南昌欧菲光科技有限公司 | Conductive film |
| CN106596657A (en) * | 2016-11-28 | 2017-04-26 | 中国电子科技集团公司第四十八研究所 | Embedded type flexible substrate thin film ablation sensor and preparation method of same |
-
2013
- 2013-05-30 CN CN 201320307329 patent/CN203276887U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103295669A (en) * | 2013-05-30 | 2013-09-11 | 南昌欧菲光科技有限公司 | Conductive film |
| CN103295669B (en) * | 2013-05-30 | 2016-05-04 | 南昌欧菲光科技有限公司 | Conducting film |
| CN106596657A (en) * | 2016-11-28 | 2017-04-26 | 中国电子科技集团公司第四十八研究所 | Embedded type flexible substrate thin film ablation sensor and preparation method of same |
| CN106596657B (en) * | 2016-11-28 | 2020-02-04 | 中国电子科技集团公司第四十八研究所 | Embedded flexible matrix film ablation sensor and preparation method thereof |
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