CN203276886U - Transparent conductive film - Google Patents
Transparent conductive film Download PDFInfo
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- CN203276886U CN203276886U CN 201320307318 CN201320307318U CN203276886U CN 203276886 U CN203276886 U CN 203276886U CN 201320307318 CN201320307318 CN 201320307318 CN 201320307318 U CN201320307318 U CN 201320307318U CN 203276886 U CN203276886 U CN 203276886U
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Abstract
Provided is a transparent conductive film. The transparent conductive film comprises a substrate and a first conductive layer. The substrate comprises a first surface, a second surface which is opposite to the first surface, and first grid grooves arranged in the first surface of the substrate; bottoms of the first grid grooves are of non-planar structures; the first conductive layer comprises first conductive grids which are formed by conductive materials filled in the first grid grooves; and when the liquid state conductive materials are filled in the first grid grooves, because of the uneven bottoms of the first grid grooves, the tension of the liquid state conductive materials is released when the liquid state conductive materials contact the bottoms of the first grid grooves, so the liquid state conductive materials are prevented from shrinking to be of a plurality of spherical or near-spherical structures due to excessive tension, the probability that the conductive materials are of a plurality of the mutually-separated spherical or near-spherical structures after being sintered is reduced, the connectivity of inner parts of the sintered conductive materials is increased, and the conductivity of the transparent conductive film is ensured.
Description
Technical field
The utility model relates to electronic technology field, particularly relates to a kind of nesa coating.
Background technology
Nesa coating is a kind of good conductivity that has, and the film that has high transmission rate at visible light wave range, is widely used in flat panel display, photovoltaic device, contact panel and electromagnetic shielding etc., has the extremely wide market space.
At present, existing nesa coating generally can be divided into non-graphical and graphical.The former often needs the multiple working procedures such as exposure, video picture, etching and cleaning to carry out graphical treatment to nesa coating in such as application such as touch-screens.And the latter goes out groove by imprinting moulding, after the electric conducting material of liquid state is filled in groove, gets final product through sintering solid-state flexible membrane line structure into, has saved the graphical technique of complexity and contaminated environment, is the main development direction of nesa coating.
Yet, when being filled in groove, this electrically conductive liquid material easily is punctured into the structure of some spherical or almost sphericals, after sintering electric conducting material easily be some apart from one another by spherical or almost spherical, cause the poor connectivity of electric conducting material inside, affect the electric conductivity of nesa coating.
The utility model content
Based on this, being necessary affects the problem of the electric conductivity of nesa coating for the poor connectivity between electric conducting material inside, and a kind of nesa coating is provided.
A kind of nesa coating comprises:
Substrate comprises first surface and the second surface that is oppositely arranged with described first surface; And
The first grid groove is opened in the first surface of described substrate, and described the first grid bottom portion of groove is nonplanar structure;
The first conductive layer comprises the first conductive grid that is formed by the electric conducting material that is filled in described the first grid groove.
Therein in embodiment, the shape of described nonplanar structure comprises at least a in V-arrangement or circular arc.
In embodiment, described substrate comprises substrate and the first hypothallus therein, and described first surface is positioned at described the first hypothallus away from the surface of described substrate.
Therein in embodiment, comprise the second conductive layer, the second surface of described substrate offers the second grid groove, and described the second grid bottom portion of groove is nonplanar structure, and described the second conductive layer comprises the second conductive grid that is formed by the electric conducting material that is filled in described the second grid groove.
therein in embodiment, comprise the second conductive layer, described substrate comprises the first hypothallus, substrate and the second hypothallus, described the first hypothallus and described the second hypothallus be stacked is arranged at described substrate homonymy, described first surface is positioned at described the first hypothallus away from the surface of described substrate, described the second hypothallus is attached to described first surface, described the second hypothallus offers the second grid groove away from the surface of described the first hypothallus, described the second grid bottom portion of groove is nonplanar structure, described the second conductive layer comprises the second conductive grid that is formed by the electric conducting material that is filled in described the second grid groove.
therein in embodiment, comprise the second conductive layer, described substrate comprises the first hypothallus, substrate and the second hypothallus, described substrate is between described the first hypothallus and described the second hypothallus, described first surface is positioned at described the first hypothallus away from the surface of described substrate, described the second hypothallus is attached to described substrate away from the surface of described the first hypothallus, described the second hypothallus offers the second grid groove away from the surface of described substrate, described the second grid bottom portion of groove is nonplanar structure, described the second conductive layer comprises the second conductive grid that is formed by the electric conducting material that is filled in described the second grid groove.
In embodiment, the degree of depth of described the first grid groove and the ratio of width are not less than 1, and/or the ratio of the degree of depth of described the second grid groove and width is not less than 1 therein.
In embodiment, the degree of depth of described the first grid groove and/or described the second grid groove is 2 μ m～6 μ m therein, and the width of described the first grid groove and/or described the second grid groove is 0.2 μ m～5 μ m.
In embodiment, the mesh shape of described the first conductive grid and/or described the second conductive grid is regular grid or random grid therein.
Therein in embodiment, the conductive grid of described the first conductive grid and/or described the second conductive grid is at least a in metal type conductive grid, carbon nano tube type conductive grid, Graphene ink reservoir conductive grid and conducting polymer composite formula conductive grid.
Above-mentioned nesa coating is offered the first grid groove at the first surface of substrate, electric conducting material is filled in the first grid groove forms the first conductive grid, consists of the first conductive layer, and the first grid bottom portion of groove is nonplanar structure.So, when the electric conducting material with liquid state is filled in the first grid groove, bottom out-of-flatness because of the first grid groove, be conducive to decompose the liquid tension force of electric conducting material when contacting with the first grid bottom portion of groove, liquid electric conducting material is shunk be the structure of some spherical or almost sphericals, minimizing electric conducting material after sintering be some apart from one another by the probability of spherical or almost spherical, the connectedness of electric conducting material inside after the raising sintering, the electric conductivity of assurance nesa coating.
Description of drawings
Fig. 1 is the structural representation of the nesa coating of an execution mode;
Fig. 2 is the structural representation of the nesa coating of embodiment one;
Fig. 3 is the structural representation of the nesa coating of embodiment two;
Fig. 4 is the structural representation of the nesa coating of embodiment three;
Fig. 5 is the structural representation of the nesa coating of embodiment four;
Fig. 6 is the structural representation of the nesa coating of embodiment five;
Fig. 7 is the structural representation of the first conductive grid of an execution mode;
Fig. 8 is the structural representation of the first conductive grid of another execution mode.
Embodiment
For above-mentioned purpose, the feature and advantage that make nesa coating can become apparent more, be described in detail below in conjunction with the embodiment of accompanying drawing to nesa coating.A lot of details have been set forth in the following description so that fully understand nesa coating.But nesa coating can be implemented much to be different from alternate manner described here, and those skilled in the art can be in the situation that do similar improvement without prejudice to the utility model intension, so nesa coating is not subjected to the restriction of following public concrete enforcement.
Unless otherwise defined, all technology of using of this paper are identical with the implication that the those skilled in the art that belong to nesa coating understand usually with scientific terminology.The term that uses in the specification of nesa coating herein is not intended to be the restriction nesa coating just in order to describe the purpose of specific embodiment.Term as used herein " and/or " comprise one or more relevant Listed Items arbitrarily with all combinations.
Below in conjunction with the drawings and specific embodiments, nesa coating is described further.
As shown in Figure 1, a kind of nesa coating comprises substrate 110, the first conductive layer 120.Substrate 110, comprise first surface 112 and the second surface 114 that is oppositely arranged with first surface 112, the first surface 112 of substrate 110 offers the first grid groove 116, the first grid groove 116 bottoms are nonplanar structure, and the first conductive layer 120 comprises the first conductive grid 122 that is formed by the electric conducting material that is filled in the first grid groove 116.The first grid groove 116 can form by using with the first conductive grid 122 graph of a correspondence impression formboard impressions.
Above-mentioned nesa coating is offered the first grid groove 116 at the first surface 112 of substrate 110, electric conducting material is filled in the first grid groove 116 forms the first conductive grids 122, and consisting of the first conductive layer 120, the first grid groove 116 bottoms is nonplanar structure.So, when the electric conducting material with liquid state is filled in the first grid groove 116, bottom out-of-flatness because of the first grid groove 116, be conducive to decompose the tension force of liquid electric conducting material when contacting with the first grid groove 116 bottoms, liquid electric conducting material is shunk be the structure of some spherical or almost sphericals, minimizing electric conducting material after sintering be some apart from one another by the probability of spherical or almost spherical, the connectedness of electric conducting material inside after the raising sintering, the electric conductivity of assurance nesa coating.
See also Fig. 1, therein in embodiment, the shape of the first grid groove 116 bottom nonplanar structures comprises at least a in V-arrangement or circular arc.when the electric conducting material with liquid state is filled in the first grid groove 116, when flowing to the first grid groove 116 bottom, electric conducting material can fill according to the shape of nonplanar structure, the shape of design nonplanar structure comprises at least a in V-arrangement or circular arc, and V-arrangement or circular arc form certain angle, can make the tension force of this electric conducting material part cancel out each other to reduce the tension force on electric conducting material surface, also can make simultaneously electric conducting material form a downward power, being conducive to liquid electric conducting material better contacts with the surface of the first grid groove 116, avoid liquid electric conducting material to shrink being the structure of some spherical or almost sphericals, minimizing electric conducting material after sintering be some apart from one another by the probability of spherical or almost spherical, the connectedness of electric conducting material inside after the raising sintering, further guarantee the electric conductivity of nesa coating.
Particularly, the shape of nonplanar structure can be single V-arrangement or single circular arc, the shape of nonplanar structure also can be the regular zigzag of a plurality of V-arrangement combinations, the nonplanar structure of the wavy or V-arrangement of a plurality of circular arc combinations and circular arc combination etc., certainly nonplanar structure can also be other shape, as long as guarantee the first grid groove 116 bottom out-of-flatnesses.
Wherein, the degree of depth of the first grid groove 116 and width all are in micron level, in order to guarantee when the nonplanar structure of the first grid groove 116 bottoms is improving the connectedness of electric conducting material inside after sintering, do not affect the electric conductivity of nesa coating yet, therefore the fluctuating range of nonplanar structure rationally is set to 500nm～1000nm, so the height of nonplanar structure is in Nano grade, can't the degree of depth and the width of the first grid groove 116 be impacted on whole numerical value, further guaranteed the electric conductivity of nesa coating.
See also Fig. 3, in embodiment two, substrate 110 comprises substrate 113 and the first hypothallus 115, and first surface 112 is positioned at the first hypothallus 115 away from the surface of substrate 110.At substrate 110 surface-coated the first hypothalluses 115, by using and the surface formation first grid groove 116 of first conductive grid 122 graph of a correspondence impression formboard impression the first hypothalluses 115 away from substrate 110, the filled conductive material forms the first conductive grid 122 in the first grid groove 116, consists of the first conductive layer 120.This first hypothallus 115 can be used for insulation and moulding.It is pointed out that in other embodiments, embodiment one as shown in Figure 2, transparent substrates 110 can only comprise that substrate 113, the first grid grooves 116 directly are opened in substrate 113 1 surfaces, so the first hypothallus 115 is not necessarily.
Wherein, the material of the first hypothallus 115 can be for solidifying glue, impression glue or Merlon, the material of substrate 113 can be poly terephthalic acid class plastics (Polyethylene terephthalate, PET), Merlon (Polycarbonate, PC), polymethyl methacrylate (polymethylmethacrylate, PMMA) or glass.In the present embodiment, the material of substrate 113 is Polyethyleneglycol Terephthalate, take transparent insulation material as good.
See also Fig. 4, in embodiment three, nesa coating is double-decker, comprise the first conductive layer 120 and the second conductive layer 130, the second surface 114 of substrate 110 offers the second grid groove 118, the second grid groove 118 bottoms are nonplanar structure, and the second conductive layer 130 comprises the second conductive grid 132 that is formed by the electric conducting material that is filled in the second grid groove 118.In same substrate 110, two conductive layers is set, can reduces the thickness of nesa coating, save cost, improve the light transmittance of nesa coating.The second grid groove 118 bottom nonplanar structures are on 26S Proteasome Structure and Function, and are all identical with the first grid groove 116 bottom nonplanar structure roles, as mentioned above, therefore do not repeat them here.The second grid groove 118 can form by using with the second conductive grid 132 graph of a correspondence impression formboard impressions.
see also Fig. 5, in embodiment four, nesa coating is double-decker, comprise the first conductive layer 120 and the second conductive layer 130, substrate 110 comprises the first hypothallus 115, substrate 113 and the second hypothallus 117, stacked substrate 113 homonymies that are arranged at of the first hypothallus 115 and the second hypothallus 117, and first surface 112 is positioned at the first hypothallus 115 away from the surface of substrate 113, the second hypothallus 117 is attached to first surface 112, the second hypothallus 117 offers the second grid groove 118 away from the surface of the first hypothallus 115, the second grid groove 118 bottoms are nonplanar structure, the second conductive layer 130 comprises the second conductive grid 132 that is formed by the electric conducting material that is filled in the second grid groove 118.This first hypothallus 115 and the second hypothallus 117 all can be used for insulation and moulding.In same substrate 110, two conductive layers is set, can reduces the thickness of nesa coating, save cost, improve the light transmittance of nesa coating.The second grid groove 118 bottom nonplanar structures are on 26S Proteasome Structure and Function, and are all identical with the first grid groove 116 bottom nonplanar structure roles, as mentioned above, therefore do not repeat them here.The first grid groove 116 is by using and the first conductive grid 122 graph of a correspondence impression formboard impression first surfaces 112 formation, and the second grid groove 118 can be by using and the surface formation of second conductive grid 132 graph of a correspondence impression formboard impression the second hypothalluses 117 away from the first hypothallus 115.It is pointed out that in other embodiments, transparent substrates 110 can only comprise substrate 113, and the second grid groove 118 directly is opened in substrate 113 away from the surface of the first conductive layer 120, so the second hypothallus 117 not necessarily.Wherein, the material of the first hypothallus 115 and the second hypothallus 117 all can be for solidifying glue, impression glue or Merlon.
see also Fig. 6, in embodiment five, nesa coating is double-decker, comprise the first conductive layer 120 and the second conductive layer 130, substrate 110 comprises the first hypothallus 115, substrate 113 and the second hypothallus 117, substrate 113 is between the first hypothallus 115 and the second hypothallus 117, and first surface 112 is positioned at the first hypothallus 115 away from the surface of substrate 113, the second hypothallus 117 is attached to substrate 113 away from the surface of the first hypothallus 115, the second hypothallus 117 offers the second grid groove 118 away from the surface of substrate 113, the second grid groove 118 bottoms are nonplanar structure, the second conductive layer 130 comprises the second conductive grid 132 that is formed by the electric conducting material that is filled in the second grid groove 118.This first hypothallus 115 and the second hypothallus 117 all can be used for insulation and moulding.In same substrate 110, two conductive layers is set, can reduces the thickness of nesa coating, save cost, improve the light transmittance of nesa coating.The second grid groove 118 bottom nonplanar structures are on 26S Proteasome Structure and Function, and are all identical with the first grid groove 116 bottom nonplanar structure roles, as mentioned above, therefore do not repeat them here.The first grid groove 116 is by using and the first conductive grid 122 graph of a correspondence impression formboard impression first surfaces 112 formation, and the second grid groove 118 can be by using and the surface formation of second conductive grid 132 graph of a correspondence impression formboard impression the second hypothalluses 117 away from substrate 113.It is pointed out that in other embodiments, transparent substrates 110 can only comprise substrate 113, and the second grid groove 118 directly is opened in substrate 113 away from the surface of the first conductive layer 120, so the second hypothallus 117 not necessarily.Wherein, the material of the first hypothallus 115 and the second hypothallus 117 all can be for solidifying glue, impression glue or Merlon.
therein in embodiment, because electric conducting material belongs to the three-dimensional anisotropic material that has, show as the thermal coefficient of expansion that is parallel to bedding angle much smaller than perpendicular to bedding angle, so when electric conducting material being filled in the grid groove and carrying out sintering, if the grid depth of groove is less than width, can make electric conducting material excessive and cause Materials Fracture perpendicular to the bedding angle tension stress, therefore the degree of depth of the first grid groove 116 and the ratio of width can rationally be set to be not less than 1, the degree of depth of the second grid groove 118 and the ratio of width can rationally be set to be not less than 1, after guaranteeing that electric conducting material is filled in groove, through fracture not in the process of sinter molding, guarantee the electrically conducting transparent Film conductivity.For convenience, the grid groove represents the first grid groove 116 and the second grid groove 118.
In embodiment, the degree of depth of the first grid groove 116 and/or the second grid groove 118 rationally is set to 2 μ m～6 μ m therein, and the reasonable wide of the first grid groove 116 and/or the second grid groove 118 is set to 0.2 μ m～5 μ m.In the present embodiment, the depth capacity of groove is 3 μ m, and Breadth Maximum is 2.2 μ m.
As shown in Figure 8, the mesh shape of the first conductive grid 122 and/or the second conductive grid 132 is regular grid.The first conductive grid 122 comprises a plurality of the first grid cells, the second conductive grid 132 comprises a plurality of the second grid cells, the mesh shape of the first conductive grid 122 and/or the second conductive grid 132 is regular grid, namely the grid cycle of the first all grid cells and/or the second grid cell is all identical, the grid cycle refers to the size of each grid cell, and namely the mesh shape of the first conductive grid 122 and/or the second conductive grid 132 is regular grid.So, with nesa coating and the applying of other display unit the time, particularly for the less display unit of display screen, the phenomenon that can avoid Shows Picture gets muddled.
As shown in Figure 7, the mesh shape of the first conductive grid 122 and/or the second conductive grid 132 is random grid.So, with nesa coating and the applying of other display unit the time, generation for fear of Moire fringe, the mesh shape of the first conductive grid 122 and/or the second conductive grid 132 is random grid, namely the grid cycle of at least two the first grid cells and/or at least two the second grid cells not identical, be distributed with the first grid cell and the second grid cell in all angles of nesa coating.Wherein, the grid cycle is the size of each grid cell.Moire fringe is a kind of optical phenomena, it is the visual results that interferes with constant angle and frequency between two lines or two objects, when human eye can't be differentiated these two lines or two objects, can only see the decorative pattern of interference, this optical phenomena is exactly Moire fringe.Wherein, the shape of the first grid cell and the second grid cell all can be rhombus, rectangle, parallelogram, curvilinear boundary quadrilateral or polygon, and curvilinear boundary quadrilateral has four bent limits, and two relative bent limits are of similar shape and the curve trend.
Therein in embodiment, the electric conducting material of the first conductive grid 122 and/or the second conductive grid 132 is at least a in metal, carbon nano-tube, Graphene ink and conducting polymer composite.Metal can comprise simple substance gold, silver, copper, aluminium, nickel, zinc or a kind of at least both alloy wherein.In the present embodiment, electric conducting material is the Nano Silver ink, and the solid content 35% of silver-colored ink is filled in the first grid groove 116 and also is the silver-colored line of solid-state flexibility after sintering, and sintering temperature can be selected 150 degrees centigrade.The material that is appreciated that preparation the first conductive layer 120 and the second conductive layer 130 can be realized corresponding function for the conductor of electricity.
The above embodiment has only expressed several execution mode of the present utility model, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the utility model the scope of the claims.Should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise utility, can also make some distortion and improvement, these all belong to protection range of the present utility model.Therefore, the protection range of the utility model patent should be as the criterion with claims.
Claims (10)
1. a nesa coating, is characterized in that, comprising:
Substrate comprises first surface and the second surface that is oppositely arranged with described first surface; And
The first grid groove is opened in the first surface of described substrate, and described the first grid bottom portion of groove is nonplanar structure;
The first conductive layer comprises the first conductive grid that is formed by the electric conducting material that is filled in described the first grid groove.
2. nesa coating according to claim 1, is characterized in that, the shape of described nonplanar structure comprises at least a in V-arrangement or circular arc.
3. nesa coating according to claim 1, is characterized in that, described substrate comprises substrate and the first hypothallus, and described first surface is positioned at described the first hypothallus away from the surface of described substrate.
4. nesa coating according to claim 1, it is characterized in that, comprise the second conductive layer, the second surface of described substrate offers the second grid groove, described the second grid bottom portion of groove is nonplanar structure, and described the second conductive layer comprises the second conductive grid that is formed by the electric conducting material that is filled in described the second grid groove.
5. nesa coating according to claim 1, it is characterized in that, comprise the second conductive layer, described substrate comprises the first hypothallus, substrate and the second hypothallus, described the first hypothallus and described the second hypothallus be stacked is arranged at described substrate homonymy, described first surface is positioned at described the first hypothallus away from the surface of described substrate, described the second hypothallus is attached to described first surface, described the second hypothallus offers the second grid groove away from the surface of described the first hypothallus, described the second grid bottom portion of groove is nonplanar structure, described the second conductive layer comprises the second conductive grid that is formed by the electric conducting material that is filled in described the second grid groove.
6. according to nesa coating claimed in claim 1, it is characterized in that, comprise the second conductive layer, described substrate comprises the first hypothallus, substrate and the second hypothallus, described substrate is between described the first hypothallus and described the second hypothallus, described first surface is positioned at described the first hypothallus away from the surface of described substrate, described the second hypothallus is attached to described substrate away from the surface of described the first hypothallus, described the second hypothallus offers the second grid groove away from the surface of described substrate, described the second grid bottom portion of groove is nonplanar structure, described the second conductive layer comprises the second conductive grid that is formed by the electric conducting material that is filled in described the second grid groove.
7. the described nesa coating of according to claim 4 to 6 any one, is characterized in that, the degree of depth of described the first grid groove and the ratio of width are not less than 1, and/or the ratio of the degree of depth of described the second grid groove and width is not less than 1.
8. nesa coating according to claim 7, is characterized in that, the degree of depth of described the first grid groove and/or described the second grid groove is 2 μ m～6 μ m, and the width of described the first grid groove and/or described the second grid groove is 0.2 μ m～5 μ m.
9. the described nesa coating of according to claim 4 to 6 any one, is characterized in that, the mesh shape of described the first conductive grid and/or described the second conductive grid is regular grid or random grid.
10. the described nesa coating of according to claim 4 to 6 any one, it is characterized in that, the conductive grid of described the first conductive grid and/or described the second conductive grid is at least a in metal type conductive grid, carbon nano tube type conductive grid, Graphene ink reservoir conductive grid and conducting polymer composite formula conductive grid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320307318 CN203276886U (en) | 2013-05-30 | 2013-05-30 | Transparent conductive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320307318 CN203276886U (en) | 2013-05-30 | 2013-05-30 | Transparent conductive film |
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| CN203276886U true CN203276886U (en) | 2013-11-06 |
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| CN 201320307318 Expired - Fee Related CN203276886U (en) | 2013-05-30 | 2013-05-30 | Transparent conductive film |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113885251A (en) * | 2020-07-02 | 2022-01-04 | 苏州维业达触控科技有限公司 | LED light-emitting component, manufacturing method thereof, backlight module and liquid crystal display device |
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2013
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113885251A (en) * | 2020-07-02 | 2022-01-04 | 苏州维业达触控科技有限公司 | LED light-emitting component, manufacturing method thereof, backlight module and liquid crystal display device |
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