CN203273326U

CN203273326U - LED (light emitting diode) illuminating device

Info

Publication number: CN203273326U
Application number: CN2013200359142U
Authority: CN
Inventors: 朱晓飚
Original assignee: ZHEJIANG ZHONGZHOU LIGHTING TECHNOLOGY CO LTD
Current assignee: ZHEJIANG ZHONGZHOU LIGHTING TECHNOLOGY CO LTD
Priority date: 2013-01-22
Filing date: 2013-01-22
Publication date: 2013-11-06
Anticipated expiration: 2023-01-22

Abstract

The utility model relates to the field of LED (light emitting diode) illumination and particularly provides an LED illuminating device. The LED illuminating device comprises a transparent case, an LED luminous device and a support frame, wherein the transparent case and the support frame form a sealed cavity, and the LED luminous device is positioned inside the cavity and is fixedly arranged on the support frame. The LED illuminating device is characterized in that inert gas is filled in the cavity, and the heat generated by the LED luminous device is conducted to the outside of the transparent case. The LED illuminating device provided by the utility model has the advantages that through the inert gas filled in the cavity, the heat generated by the LED luminous device can be conducted to the outside of the LED illuminating device without adopting a heat radiation body, so the shape, the size and the weight of the LED illuminating device can not be limited by the heat radiation body, and further, the properties of aesthetic performance, safety and installation convenience and speed of the LED illuminating device can be enhanced.

Description

A kind of LED lighting device

Technical field

The utility model relates to the LED lighting field, is specifically related to a kind of LED lighting device.

Background technology

In recent years, along with the trend of energy-conserving and environment-protective is more and more significant, the alternative trend of the high power light sources such as LED lighting device replace incandescent and fluorescent lamp or even iodine-tungsten lamp, high-pressure mercury lamp has begun development from the topical application field, especially at lighting field, the LED lighting device is more and more widely used especially, and is regarded as one of principal light source of following illumination.Yet, the light output quantity of existing LED lighting device only accounts for its energy-producing 20%-30%, the energy of remaining 70%-80% all is used for producing heat and fails to be utilized, and, the light of output can not produce a large amount of heat in the inside of LED lighting device, this not only causes reduce the service life of LED lighting device, but also can make the LED lighting device because adopting larger power to limit its application function.

for this reason, for the internal temperature that suppresses the LED lighting device too high, usually the heat that by radiator, the LED luminescent device that is arranged in the LED lighting device is produced conducts to the outside of LED lighting device, yet, the size that depends on its surface area due to the radiating efficiency of radiator, that is: the surface area of radiator is larger, its radiating efficiency is higher, otherwise, lower, therefore, the volume of radiator tends to limit the shape of LED lighting device, size and weight, especially when the LED lighting device need to adopt relatively high power, because its inner heat that produces is more, this makes the volume of radiator also must correspondingly increase, thereby cause the LED lighting device to be compared with the conventional illuminator of incandescent lamp etc., not only both profile differs larger, and the LED lighting device exists size large, the defectives such as Heavy Weight, and then reduced the aesthetic property of LED lighting device, security and installation convenience.

The utility model content

For addressing the above problem, the utility model provides a kind of LED lighting device, it is by by the inert gas that is filled in cavity, can need not to adopt radiator just can realize the heat that the LED luminescent device produces is conducted to the outside of LED lighting device, thereby shape, size and the weight that can make the LED lighting device no longer are subject to the restriction of radiator, and then can improve aesthetic property, the security of LED lighting device and convenience is installed.

For this reason, the utility model provides a kind of LED lighting device, comprises transparent outer cover, LED luminescent device and support, and wherein, described transparent outer cover and described support form the cavity of sealing; Described LED luminescent device is positioned at described inside cavity, and is fixed on described support, it is characterized in that, is filled with the inert gas that conducts to the outside of described transparent outer cover for the heat that described LED luminescent device is produced in described cavity.

Wherein, being provided with being used for of being connected with described cavity on described support is filled with air-filled pore in described cavity with described inert gas.

Preferably, the whole inner surface at described transparent outer cover is formed with transparent fluorescence coating.

Wherein, described LED luminescent device comprises: the LED lighting means, and it comprises the LED wafer and energy is omnibearing luminous; Encapsulating structure spare, it is the transparent body and the periphery that is coated on described LED lighting means; And pair of electrodes, itself and described LED lighting means are electrically connected and extend to the outside of described encapsulating structure spare.

Wherein, described LED lighting means also comprises a plurality of LED wafers of carrier and electric connection, and wherein said carrier is the transparent body, and described LED wafer is arranged on the loading end of described carrier; In described a plurality of LED wafers, the LED wafer that is in current delivery upstream/downstream respectively with the corresponding connection of positive electrode/negative electrode in described pair of electrodes; And between described a plurality of LED wafer, and the LED wafer that is in current delivery upstream/downstream in described a plurality of LED wafers respectively with described pair of electrodes in positive electrode/negative electrode between be electrically connected to by wire.

Wherein, be formed with the first transparent adhesive layer between the faying face of the loading end of described carrier and described LED wafer, in order to described LED wafer is fixed on the loading end of described carrier; And/or be formed with the second transparent adhesive layer on non-binding of described LED wafer.

Wherein, described LED lighting means also comprises a plurality of LED wafers of carrier and electric connection, and wherein said carrier is the transparent body, is provided with conductor on the loading end of described carrier; Described a plurality of LED wafer adopts the mode of eutectic weldering to be electrically connected to described conductor, to realize the electric connection between a plurality of described LED wafers; And in described a plurality of LED wafers, the LED wafer that is in current delivery upstream/downstream respectively with described pair of electrodes in positive electrode/negative electrode between adopt the corresponding electrical connection of mode of eutectic weldering by described conductor.

Wherein, be formed with the heat dissipating layer of transparent and heat conduction between the faying face of the loading end of described carrier and described LED wafer.

Wherein, described encapsulating structure spare coat described carrier loading end and on the described LED wafer fixed; Perhaps described encapsulating structure spare coats respectively the fringe region of the both side surface of the surface that deviates from described loading end of the loading end of described carrier and described LED wafer fixed thereon, described carrier and described carrier; Perhaps in the cross section perpendicular to the bearing of trend of described pair of electrodes, described encapsulating structure spare coats respectively the surface that deviates from described loading end of loading end and described LED wafer fixed thereon and the described carrier of described carrier on circumferential direction take central angle as the coating angle of 180 °; Perhaps in the cross section perpendicular to the bearing of trend of described pair of electrodes, described encapsulating structure spare coats described carrier and described LED wafer on circumferential direction fully take the coating angle of central angle as 360 °.

Wherein, described pair of electrodes is the pair of metal electrodes sheet, each described metal electrode film comprises department of assembly and the connecting portion that is connected as a single entity, wherein at the two ends of described carrier and be positioned on its loading end and be provided with position limiting structure, described department of assembly is positioned on described carrier by means of described position limiting structure; The end shape away from described department of assembly of described connecting portion is different; Perhaps, on described connecting portion and the zone that is positioned at the outside of described encapsulating structure spare be provided with the mark that is used to indicate metal electrode film polarity.

With respect to prior art, the utlity model has following beneficial effect:

The LED lighting device that the utility model provides, its by be filled in by transparent outer cover and support form the sealing cavity in inert gas, can need not to use radiator just the heat that the LED luminescent device produces can be conducted to the outside of transparent outer cover, thereby shape, size and the weight that can make the LED lighting device no longer are subject to the restriction of radiator, and then can improve aesthetic property, the security of LED lighting device and convenience is installed.

In a preferred embodiment of the LED lighting device that the utility model provides, LED lighting means in the LED luminescent device can be omnibearing luminous, and the encapsulating structure spare that is coated on the periphery of this LED lighting means is the transparent body, therefore this LED luminescent device can realize that multidimensional is luminous, this not only can improve the light extraction efficiency of LED lighting device, and can reduce in prior art and produce a large amount of bad phenomenon such as heat because the light output quantity is few, thereby improve this LED lighting device reliability, extend its service life.

Description of drawings

The structural representation of a kind of LED lighting device that Figure 1A provides for the utility model the first embodiment;

The structural representation of the another kind of LED lighting device that Figure 1B provides for the utility model the first embodiment;

The structural representation of another LED lighting device that Fig. 1 C provides for the utility model the first embodiment;

The front view of the LED luminescent device of the LED lighting device that Fig. 2 A provides for the utility model the first embodiment;

Fig. 2 B is the cutaway view of the carrier of LED luminescent device in Fig. 2 A;

The top view of the LED luminescent device of the LED lighting device that Fig. 2 C provides for the utility model the first embodiment;

Fig. 2 D is the index path of LED luminescent device in Fig. 2 A;

Fig. 2 E is the front view of the another kind of encapsulating structure spare of LED luminescent device in Fig. 2 A;

The structural representation of the LED lighting device that Fig. 3 provides for the utility model the second embodiment;

The front view of the LED luminescent device of the LED lighting device that Fig. 4 A provides for the utility model the 3rd embodiment;

The side view of the LED luminescent device of the LED lighting device that Fig. 4 B provides for the utility model the 3rd embodiment;

Fig. 4 C is the top view of the annexation of the LED wafer of LED luminescent device in Fig. 4 A and carrier;

Fig. 4 D is the top view of LED luminescent device before assembling LED wafer in Fig. 4 C;

Fig. 4 E is the schematic diagram of faying face of the LED wafer of LED luminescent device in Fig. 4 C;

Fig. 4 F is the top view of the annexation of the pair of electrodes of LED luminescent device in Fig. 4 A and carrier;

Fig. 4 G is the electrode of LED luminescent device in Fig. 4 F and the view in transverse section of the annexation between carrier;

Fig. 4 H is the structural representation of the pair of electrodes of LED luminescent device in Fig. 4 F;

Fig. 4 I is the index path of LED luminescent device in Fig. 4 B;

Fig. 5 A is the front view of the another kind of encapsulating structure spare of LED luminescent device in Fig. 4 A; And

Fig. 5 B is the top view of the another kind of conductor of LED luminescent device in Fig. 4 C.

The specific embodiment

For making those skilled in the art understand better the technical solution of the utility model, further describe for implementing optimal way of the present utility model below in conjunction with accompanying drawing.But embodiment shown below is to specialize for the technical thought of the LED lighting device that the utility model is provided, and is not for utility model thinking of the present utility model is limited.And, each member size shown in the drawings and position relationship etc., just be only that explanation is more clear and definite amplifies exaggeration to some extent in order to make, and be not for limiting actual member size and proportionate relationship.

The first embodiment

See also Figure 1A to Fig. 1 C, wherein show the structure of the LED lighting device that the utility model the first embodiment provides, the LED lighting device 200 in the present embodiment comprises transparent outer cover 20, LED luminescent device 100 and support 21.Wherein, transparent outer cover 20 has adopted the shell structure similar with traditional incandescent lamp shell, and support 21 forms with transparent outer cover 20 cavity that seals.Particularly, support 21 comprises pillar 21a and base 21b, and wherein, base 21b is arranged in cavity and is positioned at the bottom of transparent outer cover 20, and the cavity of base 21b and transparent outer cover 20 formation sealings; Pillar 21a is arranged on the upper surface of base 21b, and be provided with supporting wire 22 on pillar 21a, be positioned at the LED luminescent device 100 of inside cavity in order to support, and at LED luminescent device 100 when being a plurality of, a plurality of LED luminescent devices 100 are arranged by reservation shape in transparent outer cover 20, and supporting wire 22 is electrically connected to the positive electrode/negative electrode of LED luminescent device 100.In actual applications, as long as transparent outer cover 20 can hold LED luminescent device 100 and support 21, and needn't limit its structure and shape.And, as long as support 21 can form the cavity of sealing and can support the LED luminescent device 100 that is positioned at cavity with transparent outer cover 20, and structure that needn't limit bracket 21.

In addition, be filled with inert gas in cavity, conduct to the outside of transparent outer cover 20 in order to the heat that LED luminescent device 100 is produced, in the present embodiment, the mode that inert gas is filled with in cavity is specially: be provided with the air-filled pore 27 that is connected with cavity on support 21, inert gas is filled with in cavity via this air-filled pore 27.In actual applications, inert gas can comprise that helium, neon etc. have the gas of high thermal conductivity, and, as long as the LED lighting device that the utility model provides can be filled with inert gas in its cavity, and needn't limit the filling mode of inert gas.

In the LED lighting device that the present embodiment provides, by the inert gas that is filled in cavity, can need not to use radiator just the heat that the LED luminescent device produces can be conducted to the outside of transparent outer cover, thereby shape, size and the weight that can make the LED lighting device no longer are subject to the restriction of radiator, and then can improve aesthetic property, the security of LED lighting device and convenience is installed.

In the present embodiment, LED lighting device 200 with the concrete connected mode that the power supply that electric energy is provided to it is electrically connected to is: LED lighting device 200 just also including/and negative electricity polar curve 23, power supply driver 24, power connection 26 and power connection connector 25.Wherein, an end of just/negative electricity polar curve 23 is electrically connected to supporting wire 22, and the other end is electrically connected to an end of power supply driver 24; The other end of power supply driver 24 is electrically connected to power connection 26; One end of power connection 26 is fixedly connected with transparent shell 20 by power connection connector 25; The other end of power connection 26 is electrically connected to the power supply (not shown), thereby realizes that power supply provides electric energy to LED lighting device 200.In actual applications, as long as power supply can provide electric energy to the LED lighting device, get final product to realize that the LED luminescent device is luminous, and needn't limit the connected mode that LED lighting device 200 is electrically connected to power supply.

Need to prove, in the present embodiment, LED luminescent device 100 is a plurality of, and the projection of shape on the cross section of transparent shell 20 (that is, the cross section that obtains perpendicular to the paper direction) is approximately semicircle, and is omnibearing luminous to realize, as shown in Figure 1A.but, the utility model is not limited to this, in actual applications, also can according to specific needs a plurality of LED luminescent devices 100 be arranged as other shapes, for example, a plurality of LED luminescent devices 100 can be arranged in following shape, that is: in the longitudinal section of transparent shell 20 (namely, be parallel to the cross section that the paper direction obtains) on projection of shape for " X " shape, perhaps " eight " font, as shown in Figure 1B and Fig. 1 C, this shape can make each LED luminescent device 100 phase complementary light, thereby can realize on omnibearing luminous basis, make the LED lighting device 200 can be luminous equably.

In the LED lighting device that the present embodiment provides, the LED luminescent device comprises following assembly: comprise LED wafer and LED lighting means that can be omnibearing luminous, be coated on the transparent encapsulating structure spare of this LED lighting means periphery and be electrically connected and extend to the pair of electrodes of encapsulating structure spare outside with this LED lighting means.And the quantity of the LED wafer in the LED lighting means can be for one or more.

Wherein, the LED lighting means can comprise a plurality of LED wafers of electric connection, and in a plurality of LED wafers, be in the LED wafer of current delivery upstream and be connected with positive electrode in above-mentioned pair of electrodes, be in the LED wafer in current delivery downstream and be connected with negative electrode in above-mentioned pair of electrodes.The LED wafer that what is called is in current delivery upstream refers to that LED wafer that at first electric current flows through in these LED wafers; The LED wafer that what is called is in current delivery downstream refers to that LED wafer that electric current is flowed through at last in these LED wafers.In fact, be in LED wafer and the LED wafer setting position physically and inconsistent in current delivery upstream/downstream, that is, in these LED wafers, the LED wafer that geographically is in two ends may not be the upstream/downstream on current delivery.Only have when a plurality of LED wafers are electrically connected by wire successively according to its setting position, the LED wafer that is in the LED wafer of current delivery upstream and is in current delivery downstream just is those two wafers that are in the end in described a plurality of LED wafers.And above-mentioned electrode can be wire, stick electrode, shape electrode (referred to as electrode slice) in the form of sheets etc., as long as can realize that LED wafer in the LED lighting means and the conductor of the electric connection between power supply just can adopt, and needn't limit its shape.

In actual applications, the LED lighting means also comprises transparent carrier, and one or more LED wafers that the LED lighting means comprises are arranged on the loading end of this carrier.So-called loading end refers to the surface that is used for arranging the LED wafer on this carrier.Preferably, the surface of carrier is formed with through roughening treatment the alligatoring reflecting layer that is concaveconvex structure, is translucent from the appearance with the carrier in the alligatoring reflecting layer of concaveconvex structure.

Because the LED lighting means can be omnibearing luminous, and the encapsulating structure spare that is coated on the periphery of this LED lighting means is the transparent body, therefore this LED luminescent device can realize that multidimensional is luminous, light extraction efficiency (in fact, the light extraction efficiency of the LED lighting device that provides of the utility model exceeds 30%-50% than the light extraction efficiency of existing LED lighting device) of LED lighting device not only can be provided for this; And can reduce and produce a large amount of bad phenomenon such as heat because the light output quantity is few, thereby can improve this LED lighting device reliability, extend its service life.

It is pointed out that so-called omnibearing luminous referring to, this LED lighting means itself is made the as a whole light that can be sent by its LED wafer that comprises to all directions output.That is to say, when the LED lighting means does not comprise carrier, the so-called omnibearing luminous light that is directly sent to all directions by the LED wafer that refers to; When the LED lighting means comprises carrier, so-called omnibearing luminous refer to the light that is directly sent to all directions by the LED wafer and sent by the LED wafer and see through carrier and the light exported.

The concrete structure of the LED luminescent device of the LED lighting device that the present embodiment is provided below in conjunction with accompanying drawing 2A to 2E describes in detail.

Particularly, LED luminescent device 100 comprises: carrier 11, a plurality of LED wafer 12, encapsulating structure spare 13 and pair of metal electrodes sheet (17a, 17b).Wherein, carrier 11 is the transparent body, and it can adopt wherein a kind of material in glass, pottery, plastic or other material or the mixing of multiple material to make.The surface of carrier 11 forms the alligatoring reflecting layer 110 with concaveconvex structure through roughening treatment, this makes carrier 11 body that is translucent from the appearance, as shown in Fig. 2 B.And in 110 the longitudinal section in the alligatoring reflecting layer (that is, the cross section that obtains perpendicular to the paper direction), the shape of the bossing in concaveconvex structure can be semicircle, ellipse, zigzag, triangle etc.The light that LED wafer 12 sends can be reflected by the alligatoring reflecting layer 110 with concaveconvex structure, and carry out the light beam mutual coupling, so that the light of these LED luminescent device 100 outputs is evenly soft.In actual applications, can be according to the ray structure of different LED wafer 12, in various degree alligatoring is carried out on the surface of carrier 11, make it have different concaveconvex structure shapes, the recessed degree of depth and height of projection etc.In actual applications, can be to four sides of carrier 11, namely, carry out in various degree alligatoring perpendicular to four surfaces of paper direction in Fig. 2 B, also can be only in various degree alligatoring be carried out on the surface that deviates from its loading end of the loading end of carrier 11 and carrier 11, can also be only in above-mentioned four sides of carrier 11 except its loading end with deviate from two sides the surface of this loading end and carry out in various degree alligatoring.

In the present embodiment, a plurality of LED wafers 12 are realized being electrically connected by wire 14.Particularly, as shown in Fig. 2 A, be formed with the first transparent adhesive layer 15 between the faying face of the loading end of carrier 11 and LED wafer 12.Particularly, in the zone that fits with a plurality of LED wafers 12 on the loading end in alligatoring reflecting layer 110, and/or apply the first binding agent in the zone that fits with alligatoring reflecting layer 110 on a plurality of LED wafers 12, and make a plurality of LED wafers 12 and alligatoring reflecting layer 110 fit and realize fixing of LED wafer 12.Be appreciated that, be formed with the alligatoring reflecting layer 110 with concaveconvex structure due to the surface of carrier 11, therefore the first adhesive layer 15 can be filled in the recess in alligatoring reflecting layer 110, thereby can strengthen the snap-in force between the first adhesive layer 15 and carrier 11, and then the adhesion between increase LED wafer 12 and carrier 11, strengthen the reliability of these LED luminescent device 100 integral body with this.In addition, in the non-fit area on the loading end in alligatoring reflecting layer 110 and be coated with the second adhesive layer 16 in the non-fit area on LED wafer 12 surfaces.Wherein, the first adhesive layer 15 and the second adhesive layer 16 both mix by transparent adhesive tape and fluorescent material, and both the material of selected transparent adhesive tape and mixing ratio etc. can be identical or different.

In actual applications, when LED luminescent device 100 is the light-emitting device of ordinary monochromatic light, a plurality of LED wafers 12 are all corresponding common monochromatic LED wafer 12, and for example, a plurality of LED wafers 12 are all the blue light wafer or are all blue light arbitrary visible light wafer in addition.When LED luminescent device 100 is the luminescent device of high light efficiency, high color rendering index (CRI), a plurality of LED wafers 12 comprise the LED wafer 12a of blue light and the LED wafer 12b of redness (or yellow) light, and between red (or yellow) LED wafer 12b of light and the LED wafer 12a of blue light apart from one another by and distribution equably, for example shown in Fig. 2 C, the LED wafer 12b of a redness (or yellow) light is set, to realize sufficient mixed light at interval of the LED wafer 12a of two continuous blue lights.Refer to regular distribution this so-called evenly distribution, for example, two, an interval blue led wafer and redness (or yellow) light LED wafer is set; And so-called regular distribution is not limited to above-mentioned distribution and interval mode, but can adjust and set according to actual conditions.

In addition, for more accurate, more quickly metal electrode film (17a, 17b) is positioned and assembles, can be provided at the two ends of carrier 11 spacing position limiting structure, for example, can and be positioned on its loading end at the two ends of carrier 11 and form limited impression, one end of metal electrode film (17a, 17b) is fixed in this limited impression by binding agent, and metal electrode film (17a, 17b) is connected with the LED wafer electric that is connected current delivery downstream by wire and the LED wafer that is in current delivery upstream.By means of limited impression, not only can be more accurate, more quickly metal electrode film (17a, 17b) is positioned and assembles, but also can make binding agent coat the outer surface of the metal electrode film (17a, 17b) that is positioned at limited impression, thereby can increase the connection reliability between metal electrode film (17a, 17b) and carrier 11.Easily understand, above-mentioned limited impression can also be arranged on the end of metal electrode film (17a, 17b), and the two ends of carrier 11 are fixed in this limited impression by binding agent, so that binding agent coats the outer surface of the carrier 11 that is positioned at limited impression.

In the present embodiment, encapsulating structure spare 13 is arranged on the loading end side in the alligatoring reflecting layer 110 of carrier 11, is used for the loading end of carrier 11 and LED wafer 12 fixed thereon are enveloped.Encapsulating structure spare 13 is the transparent body, and its material can be one or more in the materials such as silica gel, silicones, epoxy resin and modified resin, and it is can be for semicircle, oval, square etc. perpendicular to the cross sectional shape on electrode slice (17a, 17b) bearing of trend.

in the present embodiment, as shown in Fig. 2 D, owing to being coated with the first adhesive layer 15 that comprises transparent adhesive tape and fluorescent material in the zone that fits in a plurality of LED wafers 12 and alligatoring reflecting layer 110, and in the non-fit area on the loading end in alligatoring reflecting layer 110 and be coated with the second adhesive layer 16 that comprises transparent adhesive tape and fluorescent material in the non-fit area on LED wafer 12 surfaces, therefore, a part of light 100a that LED wafer 12 sends can see through the first transparent adhesive layer 15 and carrier 11 and output to the outside of this LED luminescent device 100, and another part light 100b that LED wafer 12 sends can see through the second transparent adhesive layer 16 and encapsulating structure spare 13 and output to the outside of this LED luminescent device 100, thereby realize that multidimensional is luminous, and when LED wafer 12 is the blue-ray LED wafer, adopt above-mentioned encapsulating structure, can make each blue-ray LED wafer 12 around be coated with equably the mixed layer of transparent adhesive tape and fluorescent material, and its a part of light 100a that sends is by seeing through the first adhesive layer 15 and exciting fluorescent material in the first adhesive layer 15, and outwards export white light through carrier 11, another part light 100b that it sends is by seeing through the second adhesive layer 16 and exciting fluorescent material in the second adhesive layer 16, and outwards export white light through encapsulating structure spare 13, thereby can outwards export uniform white light.

need to prove, in the present embodiment, encapsulating structure spare 13 is not for containing the transparent body of fluorescent material, and is formed with the first adhesive layer 15 that is mixed by transparent adhesive tape and fluorescent material between the faying face of the loading end of carrier 11 and LED wafer 12, apply the second adhesive layer 16 that is mixed by transparent adhesive tape and fluorescent material in non-fit area on the loading end in alligatoring reflecting layer 110 and in the non-fit area on LED wafer 12 surfaces, but, the utility model is not limited to this, in actual applications, the material of encapsulating structure spare 13 also can be the mixture of transparent adhesive tape and fluorescent material, and, also can be only in the zone that fits with a plurality of LED wafers 12 on the loading end in alligatoring reflecting layer 110, and/or coating the first adhesive layer 15 in the zone that fits with alligatoring reflecting layer 110 on a plurality of LED wafers 12, and not in the non-fit area on the loading end in alligatoring reflecting layer 110 and/or apply again the second adhesive layer 16 in the non-fit area on LED wafer 12 surfaces.

And, encapsulating structure spare 13 also is not limited in the present embodiment the only loading end of coated carrier 11 and LED wafer 12 fixed thereon, in actual applications, encapsulating structure spare 13 also can be in the plane perpendicular to electrode slice (17a, 17b) bearing of trend, with the coverage of 360 ° of central angles (namely, take the coating angle of central angle as 360 degree) carrier 11 and LED wafer 12 are coated on circumferential direction fully, as shown in Fig. 2 E, this can make equally when LED wafer 12 is the blue-ray LED wafer, can outwards export uniform white light.In addition, the shape in the cross section that above-mentioned encapsulating structure spare 13 edges obtain perpendicular to electrode slice (17a, 17b) bearing of trend is except the circle as shown in Fig. 2 E, this encapsulating structure spare 13 can also be other arbitrary shapes such as square, oval, rhombus, as long as can the coverage with 360 ° of central angles coat carrier 11 and LED wafer 12 fully in perpendicular to the plane of electrode slice (17a, 17b) bearing of trend.

The second embodiment

See also Fig. 3, wherein show the structure of the LED lighting device that the utility model the second embodiment provides, be similar to aforementioned the first embodiment, the LED lighting device 200 that the second embodiment provides comprises transparent outer cover 20, LED luminescent device 100 and support 21 equally.Wherein, the structure of transparent outer cover 20 and support 21 and shape and fill the concrete structure of the mode of inert gas, mode that LED lighting device 200 is electrically connected to power supply, LED luminescent device 100 and the arrangement mode of a plurality of LED luminescent devices 100 in transparent outer cover 20 etc. all is similar to aforementioned the first embodiment in the cavity that both forms do not repeat them here.The below describes the part that the second embodiment is different from the first embodiment in detail.

In a second embodiment, whole inner surface at transparent outer cover 20 is formed with transparent fluorescence coating 28, this fluorescence coating 28 adopts the material that is mixed by transparent binding agent and fluorescent material to make, and wherein, the material of binding agent comprises one or more in silica gel, epoxy glue, silicones and modified resin.when LED luminescent device 100 is high light efficiency, during the luminescent device of high color rendering index (CRI), a plurality of LED wafers 12 are blue light, the combination of the combination of blue light and ruddiness or blue light and orange light, apply yellow fluorescent powder or yellow by the whole inner surface at transparent outer cover 20 this moment, green and the red fluorescent material that mixes, can make LED wafer 12 outwards export white light because of its this fluorescent material of optical excitation of sending, and, because the whole inner surface at transparent outer cover 20 is coated with fluorescence coating 28, this makes and need not to add fluorescent material in the material of carrier 11 and/or encapsulating structure spare 13 etc., and then can simplify the manufacturing process of LED lighting device 200.

The 3rd embodiment

Be similar to aforementioned first, second embodiment, the LED lighting device 200 that the 3rd embodiment provides comprises transparent outer cover 20, LED luminescent device 100 and support 21 equally.Wherein, the structure of transparent outer cover 20 and support 21 and shape and fill the concrete structure of the mode of inert gas, mode that LED lighting device 200 is electrically connected to power supply, LED luminescent device 100 and the arrangement mode of a plurality of LED luminescent devices 100 in transparent outer cover 20 etc. all is similar to aforementioned first, second embodiment in the cavity that both forms do not repeat them here.The below describes the part that the 3rd embodiment is different from first, second embodiment in detail.

See also Fig. 4 A to Fig. 4 I, wherein show the concrete structure of the LED luminescent device of the LED lighting device that the utility model the 3rd embodiment provides.The 3rd embodiment compares with first, second embodiment, and its difference is: be provided with conductor 30 on the loading end of carrier 11, a plurality of LED wafers 12 adopt the mode of eutectic weldering to be electrically connected to this conductor 30, to realize the electric connection between a plurality of LED wafers 12.And, in a plurality of LED wafers 12, the LED wafer 12 that is in current delivery upstream/downstream respectively with pair of electrodes sheet (17a, 17b) in positive electrode/negative electrode between adopt the corresponding electrical connection of mode of eutectics weldering by conductor 30.

Particularly, the quantity of LED wafer 12 is N, and be provided with N+1 conductor 30 on the loading end of carrier 11, and N is the integer greater than 1, and N LED wafer 12 is along metal electrode film (17a, 17b) bearing of trend and N+1 the alternate setting of conductor 30, that is, at interval of being provided with a LED wafer 12 between two continuous conductors 30, as shown in Fig. 4 C.And, at the two ends of each LED wafer 12 and be positioned at and be provided with wafer solder joint 41 on its faying face, as shown in Fig. 4 E, be provided with circuit solder joint 31 at the two ends of two conductors 30 adjacent with this LED wafer 12 accordingly, as shown in Fig. 4 D, and wafer solder joint 41 is corresponding with the shape of circuit solder joint 31.The faying face of so-called LED wafer 12 refers on LED wafer 12 for the surface that combines with the loading end of carrier 11.Each LED wafer 12 and with it adjacent two conductors 30 be electrically connected to by adopting the mode of eutectics weldering to weld above-mentioned wafer solder joint 41 and circuit solder joint 31, thereby make N LED wafer 12 realize electric connections, for example, series, parallel or series-parallel connection.

in addition, because LED wafer 12 is to weld together by wafer solder joint 41 and circuit solder joint 31 to be fixed on carrier 11, namely, LED wafer 12 is positioned on conductor 30 at the strong point on carrier 11, this tends to cause have the gap between the loading end of the faying face of LED wafer 12 and carrier 11, in other words, LED wafer 12 is unsettled above the loading end of carrier 11, thereby be unfavorable for the heat radiation of LED wafer 12, for this reason, be formed with the heat dissipating layer 42 of transparent and heat conduction between the faying face of the loading end of carrier 11 and LED wafer 12, in order to carry out heat exchange with LED wafer 12, thereby the heat that LED wafer 12 is produced conducts to the outside of LED luminescent device 100 via heat dissipating layer 42 and carrier 11.The material of heat dissipating layer 42 can comprise one or more in silica gel, epoxy glue, silicones and modified resin.

In the present embodiment, pair of electrodes sheet (17a, 17b) as LED luminescent device 100 just/negative electrode, be separately positioned on carrier 11 two ends and with the two ends that are arranged on carrier 11 on LED wafer 12 at a distance of 0.5mm at least, as shown in Fig. 4 H, metal electrode film (17a, 17b) comprises department of assembly 176 and the connecting portion (175a, 175b) that is connected as a single entity.Wherein, 176 the end away from connecting portion (175a, 175b) is provided with limited impression in the department of assembly, the two ends of carrier 11 are fixed in this limited impression by the binding agent (19a, 19b) of conduction, and binding agent (19a, 19b) adopts the mode of eutectic weldering, Reflow Soldering or hot setting to be electrically connected to corresponding conductor 30, that is, be electrically connected to conductor 30 on the two ends that are arranged on carrier 11.Binding agent (19a, 19b) can adopt the conductive material of the elargol of tin cream or high heat conduction high adhesion etc. to make.By means of limited impression, not only can be more accurate, more quickly metal electrode film (17a, 17b) is positioned and assembles, but also can make binding agent 19 coat the whole outer surface of the carrier 11 that is positioned at limited impression, namely, four sides perpendicular to the paper direction of carrier 11 in Fig. 4 G, thus connection reliability between metal electrode film (17a, 17b) and carrier 11 can be increased.

And, in order to identify the polarity at LED luminescent device 100 two ends, the end shape away from department of assembly 176 of two connecting portions (175a, 175b) of above-mentioned pair of metal electrodes sheet (17a, 17b) is designed to different shapes, with the polarity mark as LED luminescent device 100 two ends, as shown in Fig. 4 H.In actual applications, the end shape away from department of assembly 176 of two connecting portions (175a, 175b) can be different arbitrary shapes, does not do concrete restriction at this.In addition, preferably, the width of department of assembly 176 is greater than the width of connecting portion (175a, 175b), and this more is conducive to the assembling of metal electrode film (17a, 17b).

need to prove, although in the present embodiment, limited impression be arranged on department of assembly 176 away from connecting portion (175a, end 175b), but the utility model is not limited to this, in actual applications, limited impression can also be arranged on two ends of carrier 11 and be positioned on its loading end, in this case, department of assembly 176 away from connecting portion (175a, end 175b) is fixed in limited impression by above-mentioned binding agent, and binding agent coats the outer surface of the department of assembly 176 that is positioned at limited impression, it is more accurate that this can realize equally, more quickly to metal electrode film (17a, 17b) position and assemble, and increase metal electrode film (17a, 17b) and the connection reliability between carrier 11.

in addition, in actual applications, can be not yet at the two ends of the loading end of carrier 11 or department of assembly 176 away from connecting portion (175a, end 175b) arranges limited impression, and only by the binding agent (19a that conducts electricity, 19b) with metal electrode film (17a, 17b) be fixed on the loading end of carrier 11, and adopt the eutectic weldering, the mode of Reflow Soldering or hot setting is electrically connected to corresponding conductor 30, perhaps, can also and be positioned at the position limiting structure that square step or terraced steps etc. are set on its loading end at the two ends of carrier 11, department of assembly 176 is positioned on carrier 11 by means of this position limiting structure, with more accurate, quickly to metal electrode film (17a, 17b) position.

also need to prove, although the present embodiment is by with two connecting portion (175a, the end shape away from department of assembly 176 175b) is designed to the polarity that different shapes is identified LED luminescent device 100 two ends, but, the utility model is not limited to this, in actual applications, can also make two connecting portion (175a, the end shape away from department of assembly 176 175b) is identical, and at two connecting portion (175a, front 175b) and/or the back side are provided with the positive pole sign that is labeled as "+" and the negative pole sign that is labeled as "-", this can identify the polarity at LED luminescent device 100 two ends equally.

in the present embodiment, as shown in Fig. 4 A, encapsulating structure spare 13 is the transparent body, and formed by transparent adhesive tape and phosphor mixture material, and encapsulating structure spare 13 is loading end and the LED wafer 12 fixed thereon of coated carrier 11 respectively, the fringe region of the surface that deviates from loading end of carrier 11 and the both side surface of carrier 11, particularly, encapsulating structure spare 13 adopts and is approximately semicircular two parts by two shape of cross sections and forms: first 131 be used for the surface that deviates from loading end of coated carrier 11 and carrier 11 both side surface fringe region (namely, the upper surface of carrier 11 and the upper area of two adjacent sides with it in Fig. 4 A), second portion is used for the fringe region (that is, the lower surface of carrier 11 and the lower area of two adjacent sides with it in Fig. 4 A) of the both side surface of the loading end of coated carrier 11 and LED wafer 12 fixed thereon and carrier 11.In actual applications, encapsulating structure spare 13 is can be for semicircle, oval, square etc. perpendicular to the cross sectional shape on metal electrode film (17a, 17b) bearing of trend.

Due to LED luminescent device 100 by enveloping by the fringe region of the encapsulating structure spare 13 that is formed by transparent adhesive tape and phosphor mixture material with the both side surface of carrier 11, this can prevent a part of light that LED wafer 12 sends directly from the fringe region output of the both side surface of carrier 11, thereby when causing LED wafer 12 for blue light or red-light LED wafer, its light that sends from this fringe region is blue light or ruddiness, and then guarantees that LED luminescent device 100 can be to the uniform white light of each orientation output.And, because LED luminescent device 100 does not envelope by all surfaces of encapsulating structure spare 13 with carrier 11, but the central area of the both side surface of carrier 11 is exposed to outside encapsulating structure spare 13, this is conducive to the heat radiation of LED wafer 12, thereby can make LED wafer 12 can be applicable to larger drive current, thereby not only can improve the light output quantity of single led wafer 12, but also can reduce the manufacturing cost of light-emitting device.

In addition, because encapsulating structure spare 13 is formed by transparent adhesive tape and phosphor mixture material, therefore, as shown in Fig. 4 I, a part of light 50b that LED wafer 12 sends can output to through transparent heat dissipating layer 42, carrier 11 and encapsulating structure spare 13 outside of this LED luminescent device 100, and another part light 50a that LED wafer 12 sends can output to through encapsulating structure spare 13 outside of this LED luminescent device 100, thereby realizes that multidimensional is luminous; And when LED wafer 12 was the blue-ray LED wafer, its a part of light 50b that sends was by seeing through heat dissipating layer 42, carrier 11 and encapsulating structure spare 13, and the fluorescent material in excite encapsulated structural member 13 and outwards export white light; Another part light 50a that it sends outwards exports white light by seeing through the fluorescent material in encapsulating structure spare 13 and excite encapsulated structural member 13, thereby can outwards export uniform white light.

Need to prove, in the present embodiment, encapsulating structure spare 13 is the fringe region of the both side surface of the surface that deviates from loading end of the loading end of coated carrier 11 and LED wafer 12 fixed thereon, carrier 11 and carrier 11 respectively, but the utility model is not limited to this, in actual applications, also can be similar with aforementioned first, second embodiment, encapsulating structure spare 13 coverage with 360 ° of central angles in perpendicular to the plane of metal electrode film (17a, 17b) bearing of trend is coated carrier 11 and LED wafer 12 fully.

in addition, as shown in Fig. 5 A, can also make encapsulating structure spare 13 perpendicular to metal electrode film (17a, 17b) in the cross section of bearing of trend, be the coating angle of 180 ° loading end of coated carrier 11 and the surface that deviates from loading end of LED wafer 12 fixed thereon and carrier 11 respectively along the circumferencial direction of carrier 11 take central angle, namely, the both side surface of carrier 11 is exposed to outside encapsulating structure spare 13 fully, this not only can further improve the radiating efficiency of LED wafer 12, and only need the surface that deviates from loading end of loading end and LED wafer 12 fixed thereon and the carrier 11 of coated carrier 11 due to encapsulating structure spare 13, this has simplified the structure of encapsulating structure spare 13 to a certain extent, thereby can simplify the manufacturing process of encapsulating structure spare 13, and then can reduce to a certain extent the processing cost of LED lighting device 200.

In addition, as shown in Fig. 5 B, in order to prevent a part of light that LED wafer 12 sends directly from the fringe region output of the both side surface of carrier 11, so that the situation of colour cast appears in LED luminescent device 100 at this fringe region, two protuberances 32 that extend toward each other can be set on continuous two conductors 30 in interval, and the both sides of two protuberances 32 LED wafer 12 between continuous two conductors 30 in interval.By protuberance 32, can stop that a part of light that LED wafer 12 sends is directly from the fringe region output of the both side surface of carrier 11, but make a part of light and the protuberance 32 that LED wafer 12 sends refraction occur and export from other orientation, thereby can prevent that LED luminescent device 100 from colour cast occurring at the fringe region of the both side surface of carrier 11, and then can guarantee that LED lighting device 200 can be to the uniform light of each orientation output.Preferably, two protuberances 32 length between continuous two conductors 30 in interval can with under the contacted prerequisite of corresponding conductor 30 increase as far as possible, to stop that farthest LED wafer 12 is from the light of the fringe region output of the both side surface of carrier 11.In addition, in these cases, when LED wafer 12 is the blue-ray LED wafer, heat dissipating layer 42 should adopt by transparent adhesive tape and phosphor mixture material and make, take guarantee LED wafer 12 from the light of the fringe region output of the both side surface of carrier 11 as white light, thereby guarantee that LED lighting device 200 can be to the uniform white light of each orientation output.

Be understandable that, in actual applications, can determine whether according to actual needs to make in inner surface, each adhesive layer, encapsulating structure spare and/or the carrier of transparent outer cover to comprise fluorescent material.In addition, in this application, transparent outer cover and transparent heat dissipating layer, encapsulating structure spare and/or carrier refer to that the light that the LED wafer sends can penetrate transparent outer cover, heat dissipating layer, encapsulating structure spare and/or carrier.

Will also be appreciated that above embodiment is only the illustrative embodiments that adopts for principle of the present utility model is described, yet the utility model is not limited to this.For those skilled in the art, in the situation that do not break away from spirit of the present utility model and essence, can make various modification and improvement, these modification and improvement also are considered as protection domain of the present utility model.

Claims

1. a LED lighting device, comprise transparent outer cover, LED luminescent device and support, and wherein, described transparent outer cover and described support form the cavity of sealing; Described LED luminescent device is positioned at described inside cavity, and is fixed on described support, it is characterized in that, is filled with the inert gas that conducts to the outside of described transparent outer cover for the heat that described LED luminescent device is produced in described cavity.

2. LED lighting device according to claim 1, is characterized in that, is provided with being used for of being connected with described cavity described inert gas is filled with air-filled pore in described cavity on described support.

3. LED lighting device according to claim 1, is characterized in that, is formed with transparent fluorescence coating at the whole inner surface of described transparent outer cover.

4. according to claim 1-3 described LED lighting devices of any one claim, is characterized in that, described LED luminescent device comprises:

The LED lighting means, it comprises the LED wafer and energy is omnibearing luminous;

Encapsulating structure spare, it is the transparent body and the periphery that is coated on described LED lighting means; And

Pair of electrodes, itself and described LED lighting means are electrically connected and extend to the outside of described encapsulating structure spare.

5. LED lighting device according to claim 4, is characterized in that, described LED lighting means also comprises a plurality of LED wafers of carrier and electric connection, wherein

Described carrier is the transparent body, and described LED wafer is arranged on the loading end of described carrier;

In described a plurality of LED wafers, the LED wafer that is in current delivery upstream/downstream respectively with the corresponding connection of positive electrode/negative electrode in described pair of electrodes; And

Between described a plurality of LED wafer, and the LED wafer that is in current delivery upstream/downstream in described a plurality of LED wafers respectively with described pair of electrodes in positive electrode/negative electrode between be electrically connected to by wire.

6. LED lighting device according to claim 5, is characterized in that, is formed with the first transparent adhesive layer between the faying face of the loading end of described carrier and described LED wafer, in order to described LED wafer is fixed on the loading end of described carrier; And/or

Be formed with the second transparent adhesive layer on non-binding of described LED wafer.

7. LED lighting device according to claim 4, is characterized in that, described LED lighting means also comprises a plurality of LED wafers of carrier and electric connection, wherein

Described carrier is the transparent body, is provided with conductor on the loading end of described carrier;

Described a plurality of LED wafer adopts the mode of eutectic weldering to be electrically connected to described conductor, to realize the electric connection between a plurality of described LED wafers; And

In described a plurality of LED wafers, the LED wafer that is in current delivery upstream/downstream respectively with described pair of electrodes in positive electrode/negative electrode between adopt the corresponding electrical connection of mode of eutectic weldering by described conductor.

8. LED lighting device according to claim 7, is characterized in that, is formed with the heat dissipating layer of transparent and heat conduction between the faying face of the loading end of described carrier and described LED wafer.

9. LED lighting device according to claim 4, is characterized in that, described encapsulating structure spare coat described carrier loading end and on the described LED wafer fixed; Perhaps

Described encapsulating structure spare coats respectively the fringe region of the both side surface of the surface that deviates from described loading end of the loading end of described carrier and described LED wafer fixed thereon, described carrier and described carrier; Perhaps

In the cross section perpendicular to the bearing of trend of described pair of electrodes, described encapsulating structure spare coats respectively the surface that deviates from described loading end of loading end and described LED wafer fixed thereon and the described carrier of described carrier on circumferential direction take central angle as the coating angle of 180 °; Perhaps

In the cross section perpendicular to the bearing of trend of described pair of electrodes, described encapsulating structure spare coats described carrier and described LED wafer on circumferential direction fully take the coating angle of central angle as 360 °.

10. LED lighting device according to claim 4, is characterized in that, described pair of electrodes is the pair of metal electrodes sheet, and each described metal electrode film comprises department of assembly and the connecting portion that is connected as a single entity, wherein

At the two ends of described carrier and be positioned on its loading end and be provided with position limiting structure, described department of assembly is positioned on described carrier by means of described position limiting structure;

The end shape away from described department of assembly of described connecting portion is different; Perhaps, on described connecting portion and the zone that is positioned at the outside of described encapsulating structure spare be provided with the mark that is used to indicate metal electrode film polarity.