CN203266962U - 用于切割半导体工件的线锯 - Google Patents
用于切割半导体工件的线锯 Download PDFInfo
- Publication number
- CN203266962U CN203266962U CN201220511767.7U CN201220511767U CN203266962U CN 203266962 U CN203266962 U CN 203266962U CN 201220511767 U CN201220511767 U CN 201220511767U CN 203266962 U CN203266962 U CN 203266962U
- Authority
- CN
- China
- Prior art keywords
- line
- scroll saw
- pulley
- microns
- spool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 57
- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 229910003460 diamond Inorganic materials 0.000 claims description 31
- 239000010432 diamond Substances 0.000 claims description 31
- 238000000576 coating method Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 208000019300 CLIPPERS Diseases 0.000 description 3
- 239000003082 abrasive agent Substances 0.000 description 3
- 208000021930 chronic lymphocytic inflammation with pontine perivascular enhancement responsive to steroids Diseases 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000010438 granite Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000004913 activation Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000002860 competitive effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 210000001015 abdomen Anatomy 0.000 description 1
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 1
- 229910001573 adamantine Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/EP2011/066499 WO2013041140A1 (en) | 2011-09-22 | 2011-09-22 | Method and apparatus for cutting semiconductor workpieces |
EPPCT/EP2011/066499 | 2011-09-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203266962U true CN203266962U (zh) | 2013-11-06 |
Family
ID=44654146
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201220511767.7U Expired - Fee Related CN203266962U (zh) | 2011-09-22 | 2012-09-24 | 用于切割半导体工件的线锯 |
CN2012103765186A Pending CN103286863A (zh) | 2011-09-22 | 2012-09-24 | 用于切割半导体工件的方法及设备 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2012103765186A Pending CN103286863A (zh) | 2011-09-22 | 2012-09-24 | 用于切割半导体工件的方法及设备 |
Country Status (2)
Country | Link |
---|---|
CN (2) | CN203266962U (zh) |
WO (1) | WO2013041140A1 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103286863A (zh) * | 2011-09-22 | 2013-09-11 | 应用材料瑞士有限责任公司 | 用于切割半导体工件的方法及设备 |
CN107052452A (zh) * | 2014-04-30 | 2017-08-18 | 硅电子股份公司 | 由工件同时切割出许多特别是均匀厚度的切片的方法 |
CN107364021A (zh) * | 2017-06-27 | 2017-11-21 | 云南蓝晶科技有限公司 | 晶棒线切割机 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013219468B4 (de) | 2013-09-26 | 2015-04-23 | Siltronic Ag | Verfahren zum gleichzeitigen Trennen einer Vielzahl von Scheiben von einem Werkstück |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2860862A (en) | 1957-04-12 | 1958-11-18 | Fletcher Co H E | Methods and apparatus for wire sawing |
DE3446564A1 (de) * | 1984-12-20 | 1986-07-03 | Heliotronic Forschungs- und Entwicklungsgesellschaft für Solarzellen-Grundstoffe mbH, 8263 Burghausen | Verfahren zum herstellen von klingenpaketen fuer das zertrennen von kristallstaeben in scheiben |
JPH1158212A (ja) * | 1997-08-22 | 1999-03-02 | Tokyo Seimitsu Co Ltd | 固定砥粒ワイヤソーの運転方法 |
US6881131B2 (en) | 2001-05-03 | 2005-04-19 | The Trustees Of Princeton University | Method and apparatus for diamond wire cutting of metal structures |
JP2003260652A (ja) * | 2002-03-06 | 2003-09-16 | Sumitomo Mitsubishi Silicon Corp | ワイヤソー |
JP4525353B2 (ja) * | 2005-01-07 | 2010-08-18 | 住友電気工業株式会社 | Iii族窒化物基板の製造方法 |
JP4820108B2 (ja) * | 2005-04-25 | 2011-11-24 | コマツNtc株式会社 | 半導体ウエーハの製造方法およびワークのスライス方法ならびにそれらに用いられるワイヤソー |
WO2008047446A1 (fr) * | 2006-10-20 | 2008-04-24 | Mitsubishi Electric Corporation | Suspension épaisse pour découpe de lingot de silicium et procédé de découpe de lingots de silicium avec celle-ci |
CN101514488B (zh) * | 2009-03-04 | 2012-12-05 | 江西赛维Ldk光伏硅科技有限公司 | 一种用于生长多晶硅棒的硅芯及其制备方法 |
CN102049816B (zh) * | 2009-10-28 | 2013-09-11 | 上海日进机床有限公司 | 无压力传感器的恒张力控制数控式多线切方机 |
JP2011177849A (ja) * | 2010-03-02 | 2011-09-15 | Toyo Advanced Technologies Co Ltd | ワイヤソー |
WO2013041140A1 (en) * | 2011-09-22 | 2013-03-28 | APPLIED MATERIALS SWITZERLAND SàRL | Method and apparatus for cutting semiconductor workpieces |
-
2011
- 2011-09-22 WO PCT/EP2011/066499 patent/WO2013041140A1/en active Application Filing
-
2012
- 2012-09-24 CN CN201220511767.7U patent/CN203266962U/zh not_active Expired - Fee Related
- 2012-09-24 CN CN2012103765186A patent/CN103286863A/zh active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103286863A (zh) * | 2011-09-22 | 2013-09-11 | 应用材料瑞士有限责任公司 | 用于切割半导体工件的方法及设备 |
CN107052452A (zh) * | 2014-04-30 | 2017-08-18 | 硅电子股份公司 | 由工件同时切割出许多特别是均匀厚度的切片的方法 |
CN107052452B (zh) * | 2014-04-30 | 2019-10-15 | 硅电子股份公司 | 由工件同时切割出许多特别是均匀厚度的切片的方法 |
CN107364021A (zh) * | 2017-06-27 | 2017-11-21 | 云南蓝晶科技有限公司 | 晶棒线切割机 |
Also Published As
Publication number | Publication date |
---|---|
WO2013041140A1 (en) | 2013-03-28 |
CN103286863A (zh) | 2013-09-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160510 Address after: American California Patentee after: Applied Materials Inc. Address before: Lausanne Patentee before: Applied Materials Switzerland Sarl |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20161026 Address after: Hiroshima County, Japan Patentee after: Toyo Advanced Machine Tool Co., Ltd. Address before: American California Patentee before: Applied Materials Inc. |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131106 Termination date: 20170924 |