CN203250790U - Light emitting diode equipped with binding posts - Google Patents
Light emitting diode equipped with binding posts Download PDFInfo
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- CN203250790U CN203250790U CN 201320148607 CN201320148607U CN203250790U CN 203250790 U CN203250790 U CN 203250790U CN 201320148607 CN201320148607 CN 201320148607 CN 201320148607 U CN201320148607 U CN 201320148607U CN 203250790 U CN203250790 U CN 203250790U
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- electrode layer
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- female seat
- emitting diode
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Abstract
The utility model provides a light emitting diode equipped with binding posts, relates to the field of applications of diodes, and overcomes the problems caused by that LEDs and external circuit elements are connected by welding in prior art, wherein the problems may be deformations of plastic cement of LEDs, damages of LED elements, denaturations of packaging materials of LEDs, or even disengaging of chips from bottoms and fracture of chips from connecting leads, and safety problems also exist. The light emitting diode equipped with binding post includes a heat-dissipation substrate, an electrode layer, plastic glue, liquid chip-fixing glue, a chip, connection leads and binding posts; each of the binding posts includes a nut base and a screw, the top of the nut base is provided with a post internal threaded hole, the side of the nut base is provided with a post nut-base through hole, the bottom of the nut base is provided with a post fixing column with an external thread; and each nut base is fixed on the the electrode layers via the post fixing column and the corresponding internal threaded hole of the electrode layer, and the screw is screwed in the post internal threaded hole tightly when a lead is inserted in the post nut-base through hole. The light emitting diode equipped with binding posts provided by the utility model can be connected with external circuits by employing the binding posts, deformation of plastic glue caused by high temperature during welding is prevented, and reliability of products is raised.
Description
Technical field
The utility model relates to the application of diode, is specifically related to the binding post of LED.
Background technology
In existing traditional great power LED application process, all adopt the mode of soldering tin bar (welding wire) welding to connect driving, the instrument that it uses and raw material are electric welding iron or similar means, raw material are tin bar, and its operation principle is to make tin bar (silk) fusing be bonded in the LED weld zone to wire afterwards after electric welding iron is warmed to its fusing point to tin bar (silk).The tin bar fusing point is between 200 ℃-300 ℃, therefore the temperature of electric welding needs greater than tin bar (silk) fusing point, temperature need be heated to 260 ℃-350 ℃.The tradition great power LED is made of plastic material, heat radiation copper billet and conductive copper layer etc., thereby in use has following hidden danger.One, (deformation temperature) TG point of the plastic cement of traditional great power LED is lower than 260 ℃, therefore plastic cement can be out of shape under this processing temperature, thereby causes the great power LED components and parts to damage.Two, the radiating block of traditional great power LED has good heat dispersion, in operation process, can import to LED inside to the heat of electric iron, thereby make LED inside cause great internal stress, make the encapsulating material sex change of LED, such as glue, fluorescent material, even can cause wafer and bottom to break away from, the problems such as the connecting line fracture of wafer and support occur.Three, under the high-temperature operation environment, the employee easily is burned, thereby the industrial injury of causing has reduced the coefficient of safety in the course of work, has reduced efficient.
The utility model content
The utility model is connected the employing welding manner for solving existing LED with external circuit elements, thereby cause plastic deformed, the LED component wear of LED and the encapsulating material sex change that causes LED, even cause wafer and bottom break away from, with the connecting line fracture etc., and have safety problem, a kind of light-emitting diode with binding post is provided.
A kind of light-emitting diode with binding post, comprise heat-radiating substrate, electrode layer, plastic cement, liquid crystal-bonding adhesive, wafer and connection wire be connected Described heat-radiating substrate is provided with a plurality of through holes, is provided with a through hole in the middle of the electrode layer, and the heat-radiating substrate that exposes is as the die bond functional areas; The two ends of electrode layer arrange respectively internal thread hole, electrode layer is arranged on heat-radiating substrate top and separates with heat-radiating substrate, plastic cement injects through a plurality of through holes of heat-radiating substrate, the described plastic cement of plastic cement parcel electrode layer is with electrode layer and heat-radiating substrate is fixed is integrated, wafer is fixed in the die bond functional areas by liquid crystal-bonding adhesive, by connecting wire with the electrode electric connection at wafer and electrode layer two ends, the wafer top applies one deck fluorescent adhesive layer; Also comprise binding post, described binding post comprises female seat and screw, and the top of described female seat is provided with the terminal internal thread hole, and the side of female seat is provided with terminal female seat through hole, and the female seat bottom is provided with externally threaded terminal fixed leg; Female seat is fixed on the electrode layer by the internal thread hole of terminal fixed leg and electrode layer, and behind the wire inserting end son and mother seat through hole, screw and terminal internal thread hole screw.
The beneficial effects of the utility model:
One, in new scheme, passes through to change the connected mode of traditional LED and external circuit, adopt the terminal method of attachment, LED and external circuit are reached exempt to weld and be connected, thereby avoid because the high temperature that occurs in the welding process makes plastic deformed, the LED quality is caused damage, interior thermal stress makes the risk of wafer connecting line fracture to the raw material sex change that the LED components and parts bring.Improved the reliability of product.
Two, owing to adopting the connected mode of exempting to weld, avoid the working link of electric iron, also just avoided the high-temperature operation environment, improved the job safety coefficient, avoided operator to be burned the generation of accident, improved operating efficiency.Because the welding operation, raw material have been saved in the application of having saved tin bar (tin silk), reduce cost.
Three, the utility model is by connecting the wire of external circuit elements, one end stretches in the through hole of binding post side, screw the screw of binding post, screw is descended block wire, thereby wire and terminal female seat are combined closely, and terminal bottom and the conductive electrode then hole of the internal thread by conductive electrode combine, thereby reach wire and the LED luminescent wafer consists of conducting, thereby avoided the weld job flow process, and avoided the bad and hidden danger that the LED components and parts caused because of in the welding process.
Description of drawings
Fig. 1 is the overall schematic of a kind of light-emitting diode with binding post described in the utility model;
Fig. 2 is the C-C profile of Fig. 1;
Fig. 3 is Fig. 1 side view;
Fig. 4 is the internal thread hole partial enlarged drawing repeatedly of terminal fixed leg and electrode layer among Fig. 3;
Fig. 5 is the female seat of a kind of light-emitting diode middle connecting terminal with binding post of the present invention and the combination schematic diagram of screw;
Fig. 6 is of the present invention a kind of with wire in the light-emitting diode of binding post and binding post connection layout.
Among the figure: 1, fluorescent adhesive layer, 2, location hole, 3, plastic cement, 4, binding post, 5, heat-radiating substrate, 6, electrode layer, 7, the internal thread hole of electrode layer, 8, internal thread hole, 9, the female seat through hole, 10, female seat, 11, the terminal fixed leg; 12, screw, 13, wafer connects wire, 14, liquid crystal-bonding adhesive, 15, wafer, 16, the die bond functional areas, 17, wire, 18, core.
Embodiment
Embodiment one, in conjunction with Fig. 1 to Fig. 6 present embodiment is described, the described LED of present embodiment has a heat-radiating substrate 5, and this heat-radiating substrate 5 is the material of good heat conductivity, can be metal material, such as silver, copper, aluminium, iron also can be aluminium oxide ceramics, aluminium nitride ceramics etc.Be provided with location hole 2 on the described heat-radiating substrate 5, the location when being used for the external circuit elements connection; Be designed with several through holes on the heat-radiating substrate 5, an electrode layer 6 is arranged on this heat-radiating substrate 5, the electrode layer material can be sheet metal such as copper sheet, iron plate, the conductive materials such as aluminium flake, this electrode layer 6 is on the upper strata of heat-radiating substrate 5, separate with heat-radiating substrate 5, reach the effect that electric heating separates.Part has a through hole in the middle of electrode layer 6, expose heat-radiating substrate 5 as die bond functional areas 16, respectively there is an internal thread hole 7 that contains internal thread at horizontal direction upper electrode layer 6 two ends in Fig. 1, also has a binding post 4 at this electrode layer 6, the internal thread hole 7 of the terminal fixed leg 11 of this binding post 4 by the binding post bottom and electrode layer 6 is in conjunction with being fixed on the electrode layer 6, and is fixed on behind the electrode layer 6 between this binding post 4 and heat-radiating substrate 5 in addition one section space length.Also contain 3 layers in plastic cement among this LED, plastic cement 3 by the through hole on the heat-radiating substrate 5 as gum-injecting port, and heat-radiating substrate 5 and plastic cement 3 are closely linked, plastic cement 3 combines electrode layer 6 by parcel electrode layer 6, makes heat-radiating substrate 5, electrode layer 6 be consolidated into as a whole.And this plastic layer exposes the electrode terminal of die bond functional areas 16 and two end electrodes layer 6, and plastic cement 3 floods the terminal fixed leg 11 that covers the binding post bottom, highly be no more than the position, through hole 9 lower edge on these binding post 4 female seats 10, further strengthen the combination of binding post 4 and electrode layer 6.By liquid crystal-bonding adhesive 14 wafer 15 is bonded at and is fixed in the die bond functional areas 16, solidify by making crystal-bonding adhesive after the baking, reach wafer and be fixed in the die bond functional areas 16.By connecting wire 13 die bond electrode and electrode layer 6 are coupled together, be electrically connected with wafer 15 thereby reach electrode layer 6.Then above wafer 15, cover one deck glue, if can require to mix by the root a tree name in the glue, but as do white light doping fluorescent powder particles as fluorescent adhesive layer 1.
In conjunction with Fig. 4 present embodiment is described, stretches into after wire 17 front end insulating protective layers remove on the binding post female seat in the through hole 9, by rotary screw 12, wire 17 is under pressure and combines with binding post 4 to reach conducting effect with external circuit.
In conjunction with Fig. 5 and Fig. 6 present embodiment is described, described binding post 4 comprises that terminal female seat 10 and screw 12 consist of.Female seat 10 act as fixing cord, and makes wire 17 and electrode layer 6 consist of conductings, so female seat 10 materials are conductive material, and such as iron, copper, aluminium etc., shape can be made required form according to affiliated product difference, such as cylinder, prism etc.Terminal fixed leg 11 is the outstanding threaded cylinders in female seat 10 lower ends, and its diameter matches with internal thread hole 7 diameters of electrode layer.With terminal fixed leg 11 precession electrode layer internal thread holes 7, terminal female seat 10 is fixed on binding post 4 is contacted well with electrode layer 6.With the internal thread hole 7 of terminal fixed leg 11 precession electrode layers the time, note not contacting bottom heat radiation substrate 5, in order to avoid cause short circuit.Terminal female seat 10 sides are provided with through hole and are called terminal female seat through hole 9, and this hole shape can be made as required.In conjunction with Fig. 6, after wire 17 was removed outside foreskin, core 18 entered through hole 9, and is fixing by screw 12, and wire 17 is connected with binding post 4.One inboard threaded circular hole is arranged at female seat 10 tops, is called terminal internal thread hole 8, passes to female seat through hole 9, act as fixed screw 12.
Described screw 12 tops are nut, and " one " word or " ten " word swivelling chute are arranged on the nut, and convenient rotation is fixing.The nut below is cylinder shape belt screw thread cylinder, and the cylinder lower end is the plane, in order to contact tightr with wire.Screw diameter, length match with the terminal internal thread hole.
Claims (5)
1. the light-emitting diode with binding post comprises heat-radiating substrate (5), electrode layer (6), plastic cement (3), liquid crystal-bonding adhesive (14), wafer (15) and is connected wire (13); Described heat-radiating substrate (5) is provided with a plurality of through holes, is provided with a through hole in the middle of the electrode layer (6), and the heat-radiating substrate that exposes (5) is as die bond functional areas (16); The two ends of electrode layer (6) arrange respectively internal thread hole (7), electrode layer (6) is arranged on heat-radiating substrate (5) top and separates with heat-radiating substrate (5), plastic cement (3) injects through a plurality of through holes of heat-radiating substrate (5), plastic cement (3) the parcel described plastic cement of electrode layer (6) (3) is with electrode layer (6) and fixed being integrated of heat-radiating substrate (5), wafer (16) is fixed in the die bond functional areas (16) by liquid crystal-bonding adhesive (14), by connecting wire (13) electrode of wafer (15) with electrode layer (6) two ends is electrically connected, wafer (15) top applies one deck fluorescent adhesive layer (1);
It is characterized in that, also comprise binding post (4), described binding post (4) comprises female seat (10) and screw (12), the top of described female seat (10) is provided with terminal internal thread hole (8), the side of female seat (10) is provided with terminal female seat through hole (9), and female seat (10) bottom is provided with externally threaded terminal fixed leg (11); Female seat (10) is fixed on the electrode layer (6) by the internal thread hole (7) of terminal fixed leg (11) with electrode layer (6), and behind wire (17) the inserting end son and mother seat through hole (9), screw (12) screws with terminal internal thread hole (8).
2. a kind of light-emitting diode with binding post according to claim 1, it is characterized in that, flight pitch, the pore size of the internal thread hole (8) that the diameter of square body and female seat (10) top are provided with under the flight pitch on the described screw (12), the nut are complementary.
3. a kind of light-emitting diode with binding post according to claim 1 is characterized in that, the thickness of described plastic cement (3) is greater than the length of terminal fixed leg (11), and with female seat through hole (9) lower edge aligned in position.
4. a kind of light-emitting diode with binding post according to claim 1 is characterized in that, described female seat (10) be shaped as cylinder or prism.
5. a kind of light-emitting diode with binding post according to claim 1 is characterized in that, internal thread hole (7) the diameter coupling of the diameter of described terminal fixed leg (11) and electrode layer (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320148607 CN203250790U (en) | 2013-03-28 | 2013-03-28 | Light emitting diode equipped with binding posts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320148607 CN203250790U (en) | 2013-03-28 | 2013-03-28 | Light emitting diode equipped with binding posts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203250790U true CN203250790U (en) | 2013-10-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320148607 Expired - Fee Related CN203250790U (en) | 2013-03-28 | 2013-03-28 | Light emitting diode equipped with binding posts |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203250790U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114280108A (en) * | 2021-12-03 | 2022-04-05 | 电子科技大学长三角研究院(湖州) | Aluminum-based porous alumina film humidity-sensitive sensor and preparation method thereof |
-
2013
- 2013-03-28 CN CN 201320148607 patent/CN203250790U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114280108A (en) * | 2021-12-03 | 2022-04-05 | 电子科技大学长三角研究院(湖州) | Aluminum-based porous alumina film humidity-sensitive sensor and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131023 Termination date: 20160328 |