CN203232907U - LED support - Google Patents

LED support Download PDF

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Publication number
CN203232907U
CN203232907U CN 201320099168 CN201320099168U CN203232907U CN 203232907 U CN203232907 U CN 203232907U CN 201320099168 CN201320099168 CN 201320099168 CN 201320099168 U CN201320099168 U CN 201320099168U CN 203232907 U CN203232907 U CN 203232907U
Authority
CN
China
Prior art keywords
leg
led
negative pole
weld zone
anodal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201320099168
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Chinese (zh)
Inventor
刘云
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DONGGUAN JINTONG ELECTRONIC TECHNOLOGY Co Ltd
Original Assignee
DONGGUAN JINTONG ELECTRONIC TECHNOLOGY Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by DONGGUAN JINTONG ELECTRONIC TECHNOLOGY Co Ltd filed Critical DONGGUAN JINTONG ELECTRONIC TECHNOLOGY Co Ltd
Priority to CN 201320099168 priority Critical patent/CN203232907U/en
Application granted granted Critical
Publication of CN203232907U publication Critical patent/CN203232907U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

The utility model relates to the technical filed of LED luminaires, especially to an LED support. The LED support includes a support body, and a plurality of support single bodies formed at intervals on the support body by coining. Each support single body includes a heat radiation substrate and electrode supporting feet, wherein the heat radiation substrate is provided with a specular LED chip mounting position and a positive electrode welding zone and a negative electrode welding zone are disposed around the LED chip mounting position. The heat radiation substrate is also provided with an insulated plastic dam which surrounds the LED chip mounting position, the positive electrode welding zone and the negative electrode welding zone. The electrode supporting feet include positive electrode supporting feet and negative electrode supporting feet. One end of each positive electrode supporting feet is connected with the positive electrode welding zone, and the other end penetrates the insulated plastic dam, stretches outside, and connects to the support body. One end of each negative electrode supporting feet is connected with the negative electrode welding zone, and the other end penetrates the insulated plastic dam, stretches outside, and connects to the support body. The LED support has advantages of simple structure and low cost.

Description

A kind of led support
Technical field
The utility model relates to the LED technical field of lamps, relates in particular to a kind of led support.
Background technology
The LED illumination is the new industry of semiconductor and the combination of traditional lighting industry, is to have one of high-tech industry of development prospect most; High power LED semiconductor illumination has distinguishing features such as long-life, energy-conservation, environmental protection, rich color, microminiaturization as new and effective solid light source, and is widely used in lighting field.Usually led chip is fixedly installed on the led support and uses.Traditional led support comprises LED mount pad, thermal column, insulation plastic cement box dam and electrode leg, also needs to install reflector when led chip is installed.This traditional supporting structure is comparatively complicated, and cost is higher.
The utility model content
The purpose of this utility model be to provide at the deficiencies in the prior art a kind of simple in structure, be convenient to adopt mechanization to carry out encapsulated LED support in enormous quantities.
A kind of led support, comprise rack body, and several support monomers that the interval punching out forms on rack body, described support monomer comprises heat-radiating substrate and electrode leg, described heat-radiating substrate is provided with the led chip installation position of minute surface, is provided with anodal weld zone and negative pole weld zone around the described led chip installation position; Insulation plastic cement box dam also is installed on the described heat-radiating substrate, and described insulation plastic cement box dam surrounds led chip installation position, anodal weld zone and negative pole weld zone; Described electrode leg comprises anodal leg and negative pole leg, described anodal leg one end is connected with anodal weld zone, the anodal leg other end penetrates the insulation protruding heat-radiating substrate of plastic cement box dam and is connected with rack body, described negative pole leg one end is connected with the negative pole weld zone, and the negative pole leg other end penetrates the insulation protruding heat-radiating substrate of plastic cement box dam and is connected with rack body.
Wherein, described heat-radiating substrate is a kind of in copper coin, aluminium sheet, ceramic wafer, the graphite cake.
Wherein, described led chip installation position is shaped as circle.
Wherein, surface, described led chip installation position is coated with the plating silver layer of minute surface.
Wherein, described anodal weld zone and negative pole weld zone are provided with the conductive layer through the turmeric PROCESS FOR TREATMENT.
Wherein, described rack body is provided with location hole.
Wherein, described location hole is arranged at the side of rack body.
Wherein, the quantity of described anodal leg is 2, and the quantity of negative pole leg is 2.
Wherein, described support monomer is provided with the polarity identification sign.
The beneficial effects of the utility model are: led support of the present utility model directly is installed on led chip on the heat-radiating substrate, has reduced parts; And the led chip installation position is minute surface, except led chip is installed, also has the effect of reflector, and it is comparatively even that the minute surface installation position makes that light efficiency distributes, and light efficiency is better; This led support is simple in structure, with low cost.
Description of drawings
Fig. 1 is the structural representation of led support of the present utility model.
Fig. 2 is the structural representation of support monomer of the present utility model.
Fig. 3 is along the cross-sectional view of A-A line among Fig. 2.
Reference numeral comprises:
1-rack body; 2-support monomer; 3-heat-radiating substrate; 31-led chip installation position;
32-anodal weld zone; 33-negative pole weld zone; 41-anodal leg; 42-negative pole leg;
5-insulation plastic cement box dam; 7-location hole; 8-polarity identification sign.
Embodiment
For the ease of those skilled in the art's understanding, below in conjunction with embodiment and accompanying drawing the utility model is further described, the content that execution mode is mentioned not is to restriction of the present utility model.
As shown in Figure 1 to Figure 3, a kind of led support, comprise rack body 1, and several support monomers 2 that the interval punching out forms on rack body 1, described support monomer 2 comprises heat-radiating substrate 3 and electrode leg, described heat-radiating substrate 3 is provided with the led chip installation position 31 of minute surface, is provided with anodal weld zone 32 and negative pole weld zone 33 around the described led chip installation position 31; Insulation plastic cement box dam 5 also is installed on the described heat-radiating substrate 3, and described insulation plastic cement box dam 5 surrounds led chip installation position 31, anodal weld zone 32 and negative pole weld zone 33; Described electrode leg comprises anodal leg 41 and negative pole leg 42, described anodal leg 41 1 ends are connected with anodal weld zone 32, anodal leg 41 other ends penetrate insulation plastic cement box dam 5 protruding heat-radiating substrates 3 and are connected with rack body 1, described negative pole leg 42 1 ends are connected with negative pole weld zone 33, and negative pole leg 42 other ends penetrate insulation plastic cement box dam 5 protruding heat-radiating substrates 3 and are connected with rack body 1.
The led support of this buried electrode leg directly is installed on led chip on the heat-radiating substrate 3, has reduced parts; And led chip installation position 31 is minute surface, except led chip is installed, also has the effect of reflector, and it is comparatively even that the minute surface installation position makes that light efficiency distributes, and light efficiency is better; This led support is simple in structure, with low cost.
Wherein, described heat-radiating substrate 3 is a kind of in copper coin, aluminium sheet, ceramic wafer, the graphite cake.
Wherein, described led chip installation position 31 is shaped as circle.Circular led chip installation position 3131 can guarantee that the luminous wide-angle of led chip is bigger, and light efficiency is better.
Wherein, 31 surfaces, described led chip installation position are coated with the plating silver layer of minute surface.Electroplate silver layer and can prevent oxidation, guarantee the safety of circuit.
Wherein, described anodal weld zone 32 and negative pole weld zone 33 are provided with the conductive layer through the turmeric PROCESS FOR TREATMENT.Conductive layer through the turmeric PROCESS FOR TREATMENT can effectively prevent corrosion, and conductivity is better, and stability is stronger.
Wherein, described rack body 1 is provided with location hole 7.The setting of location hole 7 is convenient in the process of encapsulation led chip installation position 31 and insulation plastic cement box dam 5 accurately be located, and guarantees the precision of encapsulation, improves package quality.
Wherein, described location hole 7 is arranged at the side of rack body 1.
Wherein, the quantity of described anodal leg 41 is 2, and the quantity of negative pole leg 42 is 2.
Wherein, described support monomer 2 is provided with polarity identification sign 8.Accuracy when polarity identification sign 8 is conducive to install prevents the damage that causes because of the wrong circuit.
Led support of the present utility model can adopt mechanization to carry out the batch encapsulation, can enhance productivity, and realizes working continuously of encapsulation, improves package quality.
Should be noted that at last; above embodiment only is used for the explanation the technical solution of the utility model but not to the restriction of the utility model protection range; although with reference to preferred embodiment the utility model has been done detailed description; those of ordinary skill in the art is to be understood that; can make amendment or be equal to replacement the technical solution of the utility model, and not break away from essence and the scope of technical solutions of the utility model.

Claims (9)

1. led support, comprise rack body, and several support monomers that the interval punching out forms on rack body, it is characterized in that: described support monomer comprises heat-radiating substrate and electrode leg, described heat-radiating substrate is provided with the led chip installation position of minute surface, is provided with anodal weld zone and negative pole weld zone around the described led chip installation position; Insulation plastic cement box dam also is installed on the described heat-radiating substrate, and described insulation plastic cement box dam surrounds led chip installation position, anodal weld zone and negative pole weld zone; Described electrode leg comprises anodal leg and negative pole leg, described anodal leg one end is connected with anodal weld zone, the anodal leg other end penetrates the insulation protruding heat-radiating substrate of plastic cement box dam and is connected with rack body, described negative pole leg one end is connected with the negative pole weld zone, and the negative pole leg other end penetrates the insulation protruding heat-radiating substrate of plastic cement box dam and is connected with rack body.
2. a kind of led support according to claim 1 is characterized in that: described heat-radiating substrate is a kind of in copper coin, aluminium sheet, ceramic wafer, the graphite cake.
3. a kind of led support according to claim 1 is characterized in that: described led chip installation position be shaped as circle.
4. a kind of led support according to claim 1, it is characterized in that: surface, described led chip installation position is coated with the plating silver layer of minute surface.
5. a kind of led support according to claim 1, it is characterized in that: described anodal weld zone and negative pole weld zone are provided with the conductive layer through the turmeric PROCESS FOR TREATMENT.
6. a kind of led support according to claim 1, it is characterized in that: described rack body is provided with location hole.
7. a kind of led support according to claim 6, it is characterized in that: described location hole is arranged at the side of rack body.
8. a kind of led support according to claim 1, it is characterized in that: the quantity of described anodal leg is 2, the quantity of negative pole leg is 2.
9. a kind of led support according to claim 1 is characterized in that: described support monomer is provided with the polarity identification sign.
CN 201320099168 2013-03-05 2013-03-05 LED support Expired - Fee Related CN203232907U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320099168 CN203232907U (en) 2013-03-05 2013-03-05 LED support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320099168 CN203232907U (en) 2013-03-05 2013-03-05 LED support

Publications (1)

Publication Number Publication Date
CN203232907U true CN203232907U (en) 2013-10-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201320099168 Expired - Fee Related CN203232907U (en) 2013-03-05 2013-03-05 LED support

Country Status (1)

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CN (1) CN203232907U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105957787A (en) * 2016-06-17 2016-09-21 深圳市槟城电子有限公司 Assembly for gas discharge tube, gas discharge tube and integrated part of gas discharge tube

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105957787A (en) * 2016-06-17 2016-09-21 深圳市槟城电子有限公司 Assembly for gas discharge tube, gas discharge tube and integrated part of gas discharge tube
CN105957787B (en) * 2016-06-17 2024-03-29 深圳市槟城电子股份有限公司 Assembly for gas discharge tube, gas discharge tube and integrated piece thereof

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20131009

Termination date: 20140305