CN203157254U - High-flexibility structural copper-clad plate - Google Patents
High-flexibility structural copper-clad plate Download PDFInfo
- Publication number
- CN203157254U CN203157254U CN 201320146932 CN201320146932U CN203157254U CN 203157254 U CN203157254 U CN 203157254U CN 201320146932 CN201320146932 CN 201320146932 CN 201320146932 U CN201320146932 U CN 201320146932U CN 203157254 U CN203157254 U CN 203157254U
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- Prior art keywords
- layer
- prepreg
- clad plate
- copper
- polyester fiber
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- Expired - Fee Related
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Abstract
The utility model discloses a high-flexibility structural copper-clad plate, and relates to the technical field of circuit boards. The high-flexibility structural copper-clad plate comprises a glass fiber cloth enhanced prepreg (1), a non-woven cloth prepreg (2), a copper foil (3), a carbon fiber cloth layer (4), a cotton fabric layer (5), an insulation layer (6) and a polyester fiber layer (7), wherein the carbon fiber cloth layer (4) is arranged on the upper side of the glass fiber cloth enhanced prepreg (1); the cotton fabric layer (5) is arranged on the upper side of the carbon fiber cloth layer (4); the insulation layer (6) is arranged on the upper side of the cotton fabric layer (5); the non-woven cloth prepreg (2) is arranged on the lower side of the glass fiber cloth enhanced prepreg (1); the polyester fiber layer (7) is arranged on the lower side of the non-woven cloth prepreg (2); and the copper foil (3) is arranged on the lower side of the polyester fiber layer (7). According to the high-flexibility structural copper-clad plate, the flexibility and impact resistance of a product are improved, the service life is prolonged, the electric performance, the chemical corrosion resistance and the damp resistance are improved, and the service life is prolonged.
Description
Technical field:
The utility model relates to the wiring board technical field, is specifically related to a kind of high tenacity structure copper-clad plate.
Background technology:
Copper-clad plate has another name called base material, and supporting material is soaked with resin, and one or both sides are coated with Copper Foil, and a kind of board-like material through hot pressing forms is called copper-clad laminate.It is the stock of being PCB, often is base material.When it is used for multi-layer sheet production, also be central layer.
Copper-clad plate is the basic material of electronics industry, is mainly used in the processing and manufacturing printed circuit board (pcb), extensively is used in electronic products such as television set, radio, computer, computer, mobile communication.
Its toughness and the impact resistance of existing copper-clad plate are poor, can not reach instructions for use, and its electrical property, chemical resistance, moisture resistance are relatively poor, have shortened service life.
The utility model content:
The purpose of this utility model provides a kind of high tenacity structure copper-clad plate, and it has improved toughness and the impact resistance of product, increases the service life, and has improved electrical property, chemical resistance, moisture resistance, has prolonged service life.
In order to solve the existing problem of background technology, the utility model is to adopt following technical scheme: it comprises glass cloth and strengthens prepreg 1, nonwoven prepreg 2, Copper Foil 3, it also comprises carbon fibre cloth layer 4, bafta layer 5, insulating barrier 6, layer of polyester fiber 7, the upside that glass cloth strengthens prepreg 1 is provided with carbon fibre cloth layer 4, the upside of carbon fibre cloth layer 4 is provided with bafta layer 5, the upside of bafta layer 5 is provided with insulating barrier 6, the downside that glass cloth strengthens prepreg 1 is provided with nonwoven prepreg 2, the downside of nonwoven prepreg 2 is provided with layer of polyester fiber 7, and the downside of layer of polyester fiber 7 is provided with Copper Foil 3.
The utility model adopts carbon fibre cloth layer 4 to improve toughness and the impact resistance of product, increases the service life, and it has improved electrical property, chemical resistance, moisture resistance to adopt layer of polyester fiber 7, has improved the quality of product, has prolonged service life.
Description of drawings:
Fig. 1 is structural representation of the present utility model.
The specific embodiment:
Referring to Fig. 1, this specific embodiment adopts following technical scheme: it comprises glass cloth and strengthens prepreg 1, nonwoven prepreg 2, Copper Foil 3, it also comprises carbon fibre cloth layer 4, bafta layer 5, insulating barrier 6, layer of polyester fiber 7, the upside that glass cloth strengthens prepreg 1 is provided with carbon fibre cloth layer 4, the upside of carbon fibre cloth layer 4 is provided with bafta layer 5, the upside of bafta layer 5 is provided with insulating barrier 6, the downside that glass cloth strengthens prepreg 1 is provided with nonwoven prepreg 2, the downside of nonwoven prepreg 2 is provided with layer of polyester fiber 7, and the downside of layer of polyester fiber 7 is provided with Copper Foil 3.
This specific embodiment adopts carbon fibre cloth layer 4 to improve toughness and the impact resistance of product, increases the service life, and it has improved electrical property, chemical resistance, moisture resistance to adopt layer of polyester fiber 7, has improved the quality of product, has prolonged service life.
Claims (1)
1. high tenacity structure copper-clad plate, it comprises glass cloth and strengthens prepreg (1), nonwoven prepreg (2), Copper Foil (3), it is characterized in that it also comprises carbon fibre cloth layer (4), bafta layer (5), insulating barrier (6), layer of polyester fiber (7), the upside that glass cloth strengthens prepreg (1) is provided with carbon fibre cloth layer (4), the upside of carbon fibre cloth layer (4) is provided with bafta layer (5), the upside of bafta layer (5) is provided with insulating barrier (6), the downside that glass cloth strengthens prepreg (1) is provided with nonwoven prepreg (2), the downside of nonwoven prepreg (2) is provided with layer of polyester fiber (7), and the downside of layer of polyester fiber (7) is provided with Copper Foil (3).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201320146932 CN203157254U (en) | 2013-03-28 | 2013-03-28 | High-flexibility structural copper-clad plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201320146932 CN203157254U (en) | 2013-03-28 | 2013-03-28 | High-flexibility structural copper-clad plate |
Publications (1)
Publication Number | Publication Date |
---|---|
CN203157254U true CN203157254U (en) | 2013-08-28 |
Family
ID=49018470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 201320146932 Expired - Fee Related CN203157254U (en) | 2013-03-28 | 2013-03-28 | High-flexibility structural copper-clad plate |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN203157254U (en) |
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2013
- 2013-03-28 CN CN 201320146932 patent/CN203157254U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Guixi Huatai Copper Co.,Ltd. Assignor: Jiangxi Kaian Copper Co., Ltd. Contract record no.: 2014360000250 Denomination of utility model: High-flexibility structural copper-clad plate Granted publication date: 20130828 License type: Exclusive License Record date: 20141226 |
|
LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130828 Termination date: 20140328 |