CN203117610U - Light-emitting diode (LED) backlit liquid crystal display device - Google Patents
Light-emitting diode (LED) backlit liquid crystal display device Download PDFInfo
- Publication number
- CN203117610U CN203117610U CN2013200611063U CN201320061106U CN203117610U CN 203117610 U CN203117610 U CN 203117610U CN 2013200611063 U CN2013200611063 U CN 2013200611063U CN 201320061106 U CN201320061106 U CN 201320061106U CN 203117610 U CN203117610 U CN 203117610U
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- Prior art keywords
- heat
- liquid crystal
- led
- backboard
- heat pipe
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- Expired - Lifetime
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- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract description 31
- 238000001704 evaporation Methods 0.000 claims abstract description 16
- 230000008020 evaporation Effects 0.000 claims description 15
- 238000009833 condensation Methods 0.000 claims description 9
- 230000005494 condensation Effects 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 239000011889 copper foil Substances 0.000 claims description 7
- 230000000694 effects Effects 0.000 description 11
- 230000005855 radiation Effects 0.000 description 9
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000004087 circulation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007799 cork Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the field of liquid crystal display, and provides a light-emitting diode (LED) backlit liquid crystal display device. The LED backlit liquid crystal display device comprises a liquid crystal main body and a back plate which is arranged on the back face of the liquid crystal main body. A radiating panel and an LED light bar arranged on the radiating panel are fixedly arranged on the edge of the back plate, the back plate is provided with a plurality of grooves, heat pipes are arranged inside all the grooves, and the evaporating end of each heat pipe is contacted with the radiating panel. According to the LED backlit liquid crystal display device, the grooves are arranged in the back plate, the heat pipes which are contacted with the radiating panel are further arranged in the grooves, heat emitted by the LED light bar is directly conducted to the radiating panel, the radiating panel enables part of heat to be conducted to the contacting area of the back plate and the radiating panel directly and enables the other part of heat to be conducted to the nearby area of the grooves of the back plate through the heat pipes, and thus the heat radiating area of the back plate is effectively expanded. Furthermore, the heat conduction efficiency of the heat pipes is high, and the heat on the radiating panel can be transferred rapidly. Therefore, the environment temperature of the LED light bar can be stabilized, the service life of the device is guaranteed, and meanwhile the structure can not affect the strength of the back plate.
Description
Technical field
The utility model relates to field of liquid crystal display, relates in particular to the liquid crystal indicator that adopts the LED-backlit technology.
Background technology
Backlight technology has a wide range of applications in field of liquid crystal display, and it relies on backlight can increase the brightness of LCDs.Cold-cathode tube is adopted in the traditional backlight source mostly, and still along with the continuous development of LED technology, LED is because of characteristics such as low-power consumption, lower calorific value, brightness height and life-span length, and it will replace the traditional backlight source step by step.
When LED-backlit was worked, LED changed into luminous energy by electric energy, can produce certain heat simultaneously, and the entire backlight system is in a relative sealed space, if heat constantly accumulates, finally will make the too high damage of led chip Yin Wendu, influence the serviceable life of product further.At present the cooling system backlight of main flow is that LED lamp bar is attached on the heat radiation aluminum strip by heat-conducting glue, re-uses the screw aluminum strip that will dispel the heat and is fixed on the backboard.The heat that LED lamp bar produces passes to the heat radiation aluminum strip by heat-conducting glue, is passed to backboard by the heat radiation aluminum strip then, thereby reaches the effect of heat radiation.But the cooling system of this structure, the heat radiation aluminum strip width and thickness limited, it can only be passed to heat the part of backboard, radiating effect is not good, and if widen the heat radiation aluminum strip, then will the intensity of backboard be exerted an influence.
The utility model content
The purpose of this utility model is to overcome the defective of prior art, and a kind of LED-backlit formula liquid crystal indicator of good heat dissipation effect is provided.
For solving the problems of the technologies described above, the technical solution of the utility model is: a kind of LED-backlit formula liquid crystal indicator is provided, comprise the liquid crystal main body and be located at backboard on the described liquid crystal main body back side, heat sink is fixedly arranged on the edge of described backboard and place LED striation on the described heat sink, described backboard has some grooves, each described groove all is built-in with heat pipe, and the evaporation ends of each described heat pipe all contacts with described heat sink.
Further, described heat pipe has along its evaporation ends to its condensation end and following supreme pitch angle.
Particularly, described pitch angle is the 3-15 degree.
Further, also be provided with for the radiator structure that the heat balance on the described heat pipe is conducted to described backboard in described groove.
Particularly, described radiator structure is some viscosity Copper Foils of being located on the described heat pipe, each described viscosity Copper Foil and described backboard adhesion, and perhaps described radiator structure is for detachably to be installed on the described heat pipe and the radiating fin that contacts with described backboard.
Further, each described groove is located on the described backboard at interval.
Further, the evaporation ends of described heat pipe is located between described heat sink and the described backboard.
Further, be provided with soft heat-conducting layer between described heat sink and the described heat pipe.
Particularly, each described heat pipe all has the turning of conveniently stretching between described heat sink and the described backboard.
Particularly, the xsect of described heat pipe is flat.
The utlity model has following technique effect:
Be provided with some grooves at backboard in the utility model, and then be provided with the heat pipe that contacts with heat sink in groove, the heat that distributes when LED lamp bar is worked is like this spread out of by heat sink, and through each heat pipe heat is conducted on the backboard.Compare and traditional only in the limitation scope of backboard, conduct heat, heat can be directly conducted to and the backboard contact area through heat sink, can also conduct to the grooved area of backboard through heat pipe, strengthened backboard heat radiation scope, radiating effect is very good, and Heat Transfer of Heat Pipe on Heat Pipe efficient is than higher, can be rapidly the heat of heat sink be conducted, so can stablize the working temperature of LED lamp bar well, in the serviceable life of assurance device, this radiator structure can not influence backboard intensity simultaneously.
Description of drawings
Fig. 1 is the utility model preferred embodiment structural representation;
Fig. 2 is radiation fin structure synoptic diagram among the utility model embodiment;
Fig. 3 is the utility model embodiment side view;
Fig. 4 is A place enlarged drawing among Fig. 3.
Embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the utility model, and be not used in restriction the utility model.
Referring to Fig. 1, the utility model embodiment provides a kind of LED-backlit formula liquid crystal indicator, comprise liquid crystal main body (not shown) and backboard 1, backboard 1 is located on the back side of liquid crystal main body, and be located on the heat sink 2 as the backlight LED striation (not shown) of this device, and heat sink 2 is screwed on backboard 1, on the plane of backboard 1, have some grooves 11, and the heat pipe 3 that all has been sticked in each groove 11, and the evaporation ends 31 of each heat pipe 3 all directly contacts with heat sink 2.Heat sink 2 can be thermal diffusivity aluminum strip preferably in the present embodiment, the heat that distributes during the work of LED striation directly conduction is given heat sink 2, and heat sink 2 directly contacts with backboard 1 and heat pipe 3 respectively, part heat can be directly conducted to backboard 1, the heat of another part then conducts to the near zone of each groove 11 of backboard 1 through heat pipe 3, the heat of LED striation no longer just conducts to the subrange that backboard 1 contacts with heat sink 2 like this, but according to the position of groove 11, heat can conduct to other zones of backboard 1, it is more comprehensive to dispel the heat, and the heat conduction efficiency of heat pipe 3 is very high, heat on the heat sink 2 can be conducted fast, environment temperature around in the time of so just can stablizing the work of LED striation, thereby serviceable life that can assurance device, and this radiator structure, can not influence backboard 1 intensity, backboard 1 is connected and fixed by this dismountable connected mode of lock screw with heat sink 2 simultaneously, even occurred the situation that LED lamp bar damages later on, also can become flexible screw and very like a cork the light-emitting component of LED lamp bar be changed.
Further, heat pipe 3 is not conventional straight pipe type, but the direction along its evaporation ends 31 to condensation end 32 has necessarily pitch angle from the bottom to top, and the scope at pitch angle is generally the 3-15 degree.Even when this device is kept flat, liquid in the heat pipe 3 is heated the vaporization back to condensation end 32 circulations at evaporation ends 31, and be liquid in condensation end 32 liquefaction, again because heat pipe 3 32 has the pitch angle along evaporation ends 31 to condensation end, liquid can be back to evaporation ends 32, thereby avoided heat pipe 3 boosters, the pitch angle can not be excessive certainly, in order to avoid the condensation end 32 of heat pipe 3 protrudes backboard 1 surface.Certainly heat pipe 3 also can be designed as straight pipe type, and be provided with bond plies layer (not shown) between heat pipe 3 and the groove 11, and the bond plies layer thickness of condensation end 32 is greater than evaporation ends 31, so also can 32 directions have the pitch angle so that heat pipe 3 is along evaporation ends 31 to condensation end, booster when avoiding heat pipe 3 work.
Referring to Fig. 1 and Fig. 2, further, can also be provided with radiator structure 33 at the groove of heat pipe 3, this radiator structure 33 can conduct to the heat balance on the heat pipe 3 on the backboard 1.Particularly, radiator structure 33 can be for being located at the some viscosity Copper Foil 33a above the heat pipe, the both ends of viscosity Copper Foil 33a then can be bonded on the backboard 1, in heat conducting process, a part of heat of heat pipe 3 can conduct to backboard 1 via viscosity Copper Foil 33a, strengthen heat conducting speed, enlarged the radiating surface of backboard 1 simultaneously further, be beneficial to the equilibrium conduction of heat.Radiator structure 33 can also be for being set in the radiating fin 33b on the heat pipe 3 on the other hand, and extension 33b1 and the backboard 1 of radiating fin 33b directly are sticked, by radiating fin 33b heat is conducted to backboard 1, so also can reach the effect of balanced conduction, for removably connecting, this has also made things convenient for later on its replacing or maintenance between certain radiating fin 33b and the heat pipe 3.
Further, each groove 11 compartment of terrain on backboard 1 distributes, and can obtain bigger backboard 1 area of dissipation with less heat pipe 3.Single is example with 42 cun liquid crystal display lists light of growing into, and can offer 3 grooves 11 in the compartment of terrain on backboard 1, that is to say that 3 heat pipes 3 are installed in the compartment of terrain on backboard 1, and the overwhelming majority that just heat can be conducted to backboard 1 is regional, reaches the effect of comprehensive heat radiation.
Further referring to Fig. 1, Fig. 3 and Fig. 4, also the evaporation ends 31 of heat pipe 3 can be folded between heat sink 2 and the backboard 1, contact area between heat pipe 3 and heat sink 2 and the backboard 1 is all bigger like this, can increase heat conducting speed, and opposite heat tube 3 has also formed certain fixed effect.For heat pipe 3 evaporation ends 31 are located at this situation between heat sink 2 and the backboard 1, then between heat sink 2 and heat pipe 3, also have additional soft heat-conducting layer 4.Usually heat pipe 3 is to adopt copper material to make, in heat conducting process, after being heated, heat pipe 3 can exist certain heat to rise, if heat pipe 3 directly contacts with heat sink 2, be easy to cause the extruding of 3 pairs of heat sinks 2 of heat pipe, and then the fixing of heat sink 3 and both profiles impacted, and after cooling, heat pipe 3 shrinkages, has certain clearance between heat sink 2 and the heat pipe 3, later heat conduction is produced disadvantageous effect, and add soft heat-conducting layer 4, neither influence the thermal conduction effect between heat sink 2 and the heat pipe 3, heat that can also opposite heat tube 3 rises and has certain buffer action, guarantee the fastness between heat sink 2 and the backboard 1, also can not make heat pipe 3 and heat sink 2 crimps, strengthened the serviceable life of this device.
Refer again to Fig. 1 particularly, each heat pipe 3 all has one and is the circular-arc turning 34 of 90 degree.Usually, heat sink 2 is provided in a side of the edge of backboard 1, and only occupy about 1/10th of backboard 1 surface, when if heat pipe 3 directly vertically stretches between backboard 1 and the heat sink 2 like this, the length that heat pipe 3 is established by both folders is shorter, the width size of having only heat sink 2 at most, just heat pipe 3 is less with the contact area of heat sink 2, be unfavorable for heat conduction between the two, and after the turning 34 of one 90 degree was set at heat pipe 3, heat pipe 3 no longer was vertically to stretch between backboard 1 and the heat sink 2, heat pipe 3 some can be parallel with the length direction of heat sink 2, so just can increase contact area between the two greatly, strengthen heat conduction efficiency.
Particularly, the xsect of heat pipe 3 can be designed to flat, can strengthen between heat pipe 3 and the backboard 1 so effectively and the contact area between heat pipe 3 and the heat sink 2, be very beneficial for the conduction of velocity of heat between this three, and this flat structure, can not make that heat pipe 3 protrudes the surface of backboard 1 easily, influences the globality of backboard 1 yet.This flat can be ellipse, also can be rectangle, all is beneficial to the heat conduction.
Particularly, LED lamp bar can be attached on the heat sink 2 by heat-conducting glue, and heat-conducting glue both can play the effect of fixed L ED lamp bar, and the heat that distributes in the time of can also rapidly LED lamp bar being worked conducts to heat sink 2.
The above only is the utility model preferred embodiment; its structure is not limited to the above-mentioned shape of enumerating; all any modifications of within spirit of the present utility model and principle, doing, be equal to and replace and improvement etc., all should be included within the protection domain of the present utility model.
Claims (10)
1. LED-backlit formula liquid crystal indicator, comprise the liquid crystal main body and be located at backboard on the described liquid crystal main body back side, fixedly there is heat sink at the edge of described backboard and places LED striation on the described heat sink, it is characterized in that: described backboard has some grooves, each described groove all is built-in with heat pipe, and the evaporation ends of each described heat pipe all contacts with described heat sink.
2. LED-backlit formula liquid crystal indicator as claimed in claim 1, it is characterized in that: described heat pipe has pitch angle from the bottom to top along its evaporation ends to its condensation end.
3. LED-backlit formula liquid crystal indicator as claimed in claim 2, it is characterized in that: described pitch angle is the 3-15 degree.
4. LED-backlit formula liquid crystal indicator as claimed in claim 1 is characterized in that: also be provided with for the radiator structure that the heat balance on the described heat pipe is conducted to described backboard in described groove.
5. LED-backlit formula liquid crystal indicator as claimed in claim 4, it is characterized in that: described radiator structure is some viscosity Copper Foils of being located on the described heat pipe, each described viscosity Copper Foil and described backboard adhesion, perhaps described radiator structure is for detachably to be installed on the described heat pipe and the radiating fin that contacts with described backboard.
6. as each described LED-backlit formula liquid crystal indicator of claim 1-5, it is characterized in that: each described groove is located on the described backboard at interval.
7. as each described LED-backlit formula liquid crystal indicator of claim 1-5, it is characterized in that: the evaporation ends of described heat pipe is located between described heat sink and the described backboard.
8. LED-backlit formula liquid crystal indicator as claimed in claim 7 is characterized in that: be provided with soft heat-conducting layer between described heat sink and the described heat pipe.
9. LED-backlit formula liquid crystal indicator as claimed in claim 7, it is characterized in that: each described heat pipe all has the turning of conveniently stretching between described heat sink and the described backboard.
10. as each described LED-backlit formula liquid crystal indicator of claim 1-5, it is characterized in that: the xsect of described heat pipe is flat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200611063U CN203117610U (en) | 2013-01-31 | 2013-01-31 | Light-emitting diode (LED) backlit liquid crystal display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013200611063U CN203117610U (en) | 2013-01-31 | 2013-01-31 | Light-emitting diode (LED) backlit liquid crystal display device |
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| Publication Number | Publication Date |
|---|---|
| CN203117610U true CN203117610U (en) | 2013-08-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013200611063U Expired - Lifetime CN203117610U (en) | 2013-01-31 | 2013-01-31 | Light-emitting diode (LED) backlit liquid crystal display device |
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| CN (1) | CN203117610U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015074287A1 (en) * | 2013-11-19 | 2015-05-28 | 深圳市华星光电技术有限公司 | Heat dissipation loop pipe and backlight module using heat dissipation loop pipe |
| CN105636400A (en) * | 2014-10-27 | 2016-06-01 | 奇鋐科技股份有限公司 | Display module heat dissipation structure and electronic device |
| US9366484B2 (en) | 2013-11-19 | 2016-06-14 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Heat dissipation pipe loop and backlight module using same |
| EP3176503A4 (en) * | 2014-07-30 | 2018-04-18 | Shenzhen Tcl New Technology Co., Ltd | Heat sink, backlight module and display module |
| WO2020248195A1 (en) * | 2019-06-13 | 2020-12-17 | 京东方科技集团股份有限公司 | Display apparatus and electronic device |
-
2013
- 2013-01-31 CN CN2013200611063U patent/CN203117610U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015074287A1 (en) * | 2013-11-19 | 2015-05-28 | 深圳市华星光电技术有限公司 | Heat dissipation loop pipe and backlight module using heat dissipation loop pipe |
| US9366484B2 (en) | 2013-11-19 | 2016-06-14 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Heat dissipation pipe loop and backlight module using same |
| EP3176503A4 (en) * | 2014-07-30 | 2018-04-18 | Shenzhen Tcl New Technology Co., Ltd | Heat sink, backlight module and display module |
| CN105636400A (en) * | 2014-10-27 | 2016-06-01 | 奇鋐科技股份有限公司 | Display module heat dissipation structure and electronic device |
| WO2020248195A1 (en) * | 2019-06-13 | 2020-12-17 | 京东方科技集团股份有限公司 | Display apparatus and electronic device |
| CN112514545A (en) * | 2019-06-13 | 2021-03-16 | 高创(苏州)电子有限公司 | Display device and electronic apparatus |
| US11428976B2 (en) | 2019-06-13 | 2022-08-30 | K-Tronics (Suzhou) Technology Co., Ltd. | Display device and electronic device |
| CN112514545B (en) * | 2019-06-13 | 2023-10-27 | 高创(苏州)电子有限公司 | Display device and electronic apparatus |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: QILIN ELECTRONICS (SHENZHEN) CO., LTD. CO., LTD. Free format text: FORMER OWNER: CREATE THE DIMENSIONAL PLANE AND REVEAL SCIENCE TECHNOLOGIES CO., LTD. IN GUANGZHOU Effective date: 20141029 |
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| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 510530 GUANGZHOU, GUANGDONG PROVINCE TO: 518110 SHENZHEN, GUANGDONG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20141029 Address after: 518110 Guangdong city of Shenzhen province Baoan District Guanlan street Zhangkeng diameter Lake neighborhood community Alan Road No. 214 Patentee after: UNICORN ELECTRIC (SHENZHEN) CO.,LTD. Address before: Science City Kaida Road Development Zone Guangzhou 510530 Guangdong province No. 99 Patentee before: GUANGZHOU SKYWORTH FLAT DISPLAY TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20130807 |
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| CX01 | Expiry of patent term |