CN202548479U - Liquid crystal module radiator and display device - Google Patents
Liquid crystal module radiator and display device Download PDFInfo
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- CN202548479U CN202548479U CN2012200530983U CN201220053098U CN202548479U CN 202548479 U CN202548479 U CN 202548479U CN 2012200530983 U CN2012200530983 U CN 2012200530983U CN 201220053098 U CN201220053098 U CN 201220053098U CN 202548479 U CN202548479 U CN 202548479U
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- heat
- liquid crystal
- crystal module
- heat sink
- backboard
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Abstract
The utility model relates to the technical field of radiation of display equipment, in particular to a liquid crystal module radiator with a good radiation function and a display device. The liquid crystal module radiator comprises a backboard and a radiating plate. The radiating plate has an L-shaped cross section. The backboard is positioned on the inner side of the radiating plate. A groove is formed in the radiating plate. A heat pipe unit with heat conductivity is arranged in the groove. On the basis of the conventional radiator structure, the heat pipe unit is arranged in the groove of the radiating plate, so that heat produced by a high-power light-emitting diode (LED) lamp can be quickly and uniformly dissipated under the condition of cost saving, the phenomenon of non-uniform heating of the two ends of the radiator is maximally alleviated, the thermal deformation influence of non-uniform heat on an optical film is effectively weakened, the thermal light leak phenomenon, which is caused by the radiation of the LED lamp, of a liquid crystal module is avoided, the image display quality of the liquid crystal module is improved, and the service lives of the LED lamp and a liquid crystal module part are maximally prolonged.
Description
Technical field
The utility model relates to the heat dissipation technology field of display device, particularly a kind of liquid crystal module heating radiator and display device with good heat radiating function.
Background technology
In recent years; Development along with microelectric technique and package technique; Modern electronic equipment becomes by High Density Packaging, the formed height integrated system of little assembling just day by day, and the heat flow density of electronic equipment also improves day by day simultaneously, and its life-span and its working temperature have direct relation.Thermograde in the actual application can produce thermal stress and thermal deformation, finally causes the product fatigue failure.This shows that it is the major reason that causes modern electronic product to lose efficacy that thermal design is dealt with improperly.
As shown in Figure 1, be liquid crystal module structural representation in the prior art.This liquid crystal module comprises: backboard 1 and the heat sink 3 that is used to conduct heat; This heat sink is processed by aluminium alloy extrusions; This backboard 1 and heat sink 3 are connected through screw, and LED lamp bar 4 is connected with the heat sink 3 same screws that adopt, and LED lamp (figure does not show) is installed on this LED lamp bar 4.In addition, this liquid crystal module also comprises the parts that are typically provided with in the liquid crystal module, is specially: be provided with reflector plate 5, LGP 7, optical diaphragm group 8 and display panels 9 on backboard 1 bottom successively, LGP 7 is provided with the reflection site 6 that is used for the light reflection.The process of the heat transferred of the liquid crystal module of this structure is: when LED lamp operate as normal, will produce great amount of heat; This heat is delivered on the aluminium alloy heat sink through LED lamp bar; Heat loss through conduction effect through the aluminium alloy heat sink; And then with heat transferred to backboard 1, through backboard 1 heat is distributed.
As shown in Figure 2, for internal heat between prior art liquid crystal module structure dorsulum and the aluminium alloy heat sink is transmitted synoptic diagram.Behind the power ascension of LED lamp (0.4-0.8W or higher); Area of dissipation for guarantor unit's power needs; The length that needs this aluminium alloy heat sink of lengthening; Because two end A of this aluminium alloy heat sink and B do not wait from the distance of LED lamp, cause the temperature contrast of this aluminium alloy heat sink right ends A and B big especially, the feasible heat that is distributed on the aluminium alloy heat sink is very inhomogeneous.For example: when environment temperature is 25 ℃, the power of LED lamp is 45W, and when the width of aluminium alloy heat sink was 150mm, when adopting said structure to dispel the heat, the temperature difference of this aluminium alloy heat sink both ends A and B can be up to 12 ℃, and LED lamp junction temperature is 95 ℃.Because aluminium alloy heat sink of the prior art is generally the aluminium alloy extrusions of extruding; When the temperature difference of its ends A and B is big; Can produce bigger thermograde; It is inhomogeneous and then cause that the wave warpage appears in blooming piece that this tangible thermograde will cause the aluminium alloy heat sink to reject heat to heat distribution on the backboard, causes liquid crystal module the problem of heat leak light to occur.
The utility model content
Goal of the invention
The goal of the invention of the utility model provides a kind of liquid crystal module heating radiator and display device; To solve under the powerful effect of LED lamp; Because two end region temperature differences of aluminium alloy heat sink are big; The heat inequality that causes passing over because of aluminium alloy extrusions on the backboard produces uneven Temperature Distribution gradient, causes optical diaphragm group thermal deformation takes place easily, and then cause the problem of liquid crystal module generation heat leak light.
Technical scheme
In order to realize the foregoing invention purpose; The utility model provides a kind of liquid crystal module heating radiator on the one hand; Comprise: backboard and heat sink, the xsect of said heat sink are L shaped, and said backboard is positioned at the inboard of heat sink; Have groove on the said heat sink, placement has the heat pipe unit of heat-conductive characteristic in the said groove.
On the other hand, the utility model also provides a kind of display device, comprises above-mentioned liquid crystal module heat spreader structures.
Beneficial effect
The utlity model has following advantage or beneficial effect: be employed on the basis of heat sink original structure; Heat pipe unit is placed in the groove of heat sink; Guarantee that under cost-effective situation the heat that makes high-powered LED lamp distribute can fast, evenly distribute and come, farthest alleviated the heating radiator two ends uneven phenomenon of being heated; Effectively having weakened inhomogeneous heat influences the thermal deformation that optical diaphragm group caused; Avoided the liquid crystal module heat leak optical phenomenon that causes by LED heating, improved the quality of liquid crystal module display image, and farthest prolonged the serviceable life of LED lamp and liquid crystal module parts.
Description of drawings
Fig. 1 is a prior art liquid crystal module structural representation;
Fig. 2 is that prior art liquid crystal module dorsulum and cooling plate structure concern synoptic diagram;
Fig. 3 is a cooling plate structure synoptic diagram in the liquid crystal module heating radiator of the utility model embodiment one;
Fig. 4 is the liquid crystal module heat spreader structures synoptic diagram of the utility model embodiment two;
Fig. 5 is the liquid crystal module heat spreader structures synoptic diagram of the utility model embodiment three.
Among the figure: 1, backboard; 2, heat pipe unit; 3, heat sink; 4, LED lamp bar; 5, reflector plate; 6, reflection site; 7, LGP; 8, optical diaphragm group, 9, display panels; 11, heat insulation; 12, air; 13, convexity.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the embodiment of the utility model is described in further detail.Following examples are used to explain the utility model, but are not used for limiting the scope of the utility model.
Embodiment one
As shown in Figure 3, be the utility model liquid crystal module heat spreader structures synoptic diagram.This liquid crystal module heating radiator comprises backboard 1 and heat sink 3; The xsect of heat sink 3 is L shaped, need to prove, the cross section main body of this heating radiator is L-shaped; But in order to cooperate the equipment of miscellaneous part in the liquid crystal module; This L shaped horizontal component has some trickle variations, for example can on the position of needs, be provided with little bending or some other trickle variation, and the cross section of in order to express easily adopting this heating radiator is L shaped this describing mode.The material of this backboard 1 can be selected steel plate, aluminium sheet, aluminium alloy plate, resin or other known materials for use.This backboard 1 is positioned at the inboard of heat sink 3, has groove on this heat sink 3, places in this groove to have the heat pipe unit 2 of heat-conductive characteristic.Be specially, this heat pipe unit 2 adopts heat pipe of the prior art, can be single heat pipe, perhaps can be the hot plate that many heat pipes compose in parallel.No matter be single heat pipe or all have high thermal conductivity preferably by the hot plate that many heat pipes compose in parallel, the fluid thermal capacitance is big, and its adopting heat pipes for heat transfer efficient is with more than 100 times of volume aluminium; Therefore; Heat pipe unit 2 is set in the groove of heat sink, and the heat that can make LED produce is able to rapid balanced distribution on heating radiator, has delayed the aging of diaphragm material and electronic component; Increase the life-span and the security of product, improved the appearance of problems such as " heat leak light ".
This heat pipe unit 2 can directly be pressed in the groove of heat sink 3; Make couple together easy firmly; In addition, heat pipe unit 2 also can use viscose glue to stick in the groove of heating radiator, perhaps adopts the mode of screw lock to be fixed in the groove of heat sink; Certainly also can adopt other fixed method well known in the prior art, heat pipe unit 2 is fixed in the groove of heat sink 3 and get final product.These heat pipe unit 2 no extra power consumption do not need power supply, volume compact, and security performance is good.
Wherein, this heat sink is for to be processed by the aluminium alloy extruded section bar that forms, and self has good performance of heat dissipation.The utility model is employed on the basis of heat sink original structure; Heat pipe unit is placed in the groove of heat sink; Learn that through a large amount of experimental datas the temperature difference of heat sink both ends A and B can be reduced to below 3 ℃, guarantee under cost-effective situation; Guarantee farthest that heat that the LED lamp distributes can fast, evenly distribute and come; Effectively alleviated the heat sink two ends uneven phenomenon of being heated, effectively weakened inhomogeneous heat, avoided the liquid crystal module heat leak optical phenomenon that causes by the LED heating the thermal deformation influence that optical diaphragm group caused; Improve the quality of liquid crystal module display image, and farthest prolonged the serviceable life of LED lamp and liquid crystal module parts.
Embodiment two
As shown in Figure 4, the difference of present embodiment and embodiment one is: the horizontal component of L shaped heat sink 3 is provided with a plurality of protrudingly 13 in the present embodiment, and this backboard 1 is positioned at protruding 13 tops.Because protruding 13 can support backboard 1; Therefore; Fill by air 12 between this adjacent convexity 13 and between the convexity 13 of vertical part of heat sink and vicinity, make backboard 1 and heat sink 3 play certain barriering effect, the heat on this heat sink 3 can give out a part through air; And then make the heat that is delivered on the backboard 1 be able to reduce; The minimizing heat helps to reduce the temperature on the backboard 1 to the transmission of backboard 1, and then reduces this heat to the thermal deformation influence that optical diaphragm group caused, and has avoided the liquid crystal module heat leak optical phenomenon that is caused by the LED heating; Improve the quality of liquid crystal module display image, and farthest prolonged the serviceable life of LED lamp and liquid crystal module parts.
Embodiment three
As shown in Figure 5; The difference of present embodiment and embodiment two is: filled by heat insulation 11 between this adjacent convexity 13 and between the convexity 13 of the vertical part of L shaped heat sink and vicinity, the common material heat insulation, insulation effect that plays gets final product in the material employing prior art of this heat insulation.This heat insulation 11 is separated backboard 1 and heat sink 3; Heat on this heat sink 3 intercepts through heat insulation 11 and comes; Make the heat that is delivered on the backboard 1 be able to reduce; The minimizing heat helps to reduce the temperature on the backboard 1 to the transmission of backboard 1, and then reduces this heat to the thermal deformation influence that optical diaphragm group caused, and has avoided the liquid crystal module heat leak optical phenomenon that is caused by the LED heating; Improve the quality of liquid crystal module display image, and farthest prolonged the serviceable life of LED lamp and liquid crystal module parts.
In order to make heat sink have better heat radiating effect, one deck heat radiation coating can be set at the outside surface of heat sink, strengthen the radiating effect of this heat sink self.The heat radiation coating selects for use in the prior art material that can play thermolysis that adopts usually get final product, for example can adopt the high molecular polymer that contains coolant, can use technologies such as injection or the stickup coating of will dispelling the heat to be arranged on the outside surface of heat sink.Wherein, play the coolant that is of thermolysis, and high molecular polymer just plays the effect of carrying this coolant.Coolant in the present embodiment can adopt that existing coolant gets final product in the prior art.
In addition, the utility model also provides a kind of display device, and it comprises the liquid crystal module heating radiator among embodiment one, embodiment two or the embodiment three.
In practical application, this display device specifically can be electronic display units such as LCD TV, LCD, panel computer.The liquid crystal module heating radiator that comprises in this display device; Be employed on the basis of heat sink original structure, heat pipe unit placed in the groove of heat sink, guarantee under cost-effective situation; The heat that makes high-powered LED lamp distribute can fast, evenly distribute and come; Farthest alleviated the heating radiator two ends uneven phenomenon of being heated, effectively weakened inhomogeneous heat, avoided the liquid crystal module heat leak optical phenomenon that causes by the LED heating the thermal deformation influence that optical diaphragm group caused; Improve the quality of liquid crystal module display image, and farthest prolonged the serviceable life of liquid crystal module parts.
Above embodiment only is used to explain the utility model; And be not the restriction to the utility model; The those of ordinary skill in relevant technologies field under the situation of spirit that does not break away from the utility model and scope, can also be made various variations and modification; Therefore all technical schemes that are equal to also belong to the category of the utility model, and the scope of patent protection of the utility model should be defined by the claims.
Claims (9)
1. a liquid crystal module heating radiator is characterized in that, comprising:
Backboard and heat sink, the xsect of said heat sink are L shaped, and said backboard is positioned at the inboard of heat sink, have groove on the said heat sink, place in the said groove to have the heat pipe unit of heat-conductive characteristic.
2. liquid crystal module heating radiator as claimed in claim 1 is characterized in that, said heat pipe unit is single heat pipe.
3. liquid crystal module heating radiator as claimed in claim 2 is characterized in that, the said heat pipe unit hot plate that many heat pipes compose in parallel of serving as reasons.
4. liquid crystal module heating radiator as claimed in claim 1 is characterized in that the horizontal component of said L shaped heat sink is provided with a plurality of convexities, and said backboard is positioned at protruding top.
5. liquid crystal module heating radiator as claimed in claim 4 is characterized in that, also comprises heat insulation, and said heat insulation is located on the heat sink between at least one group of adjacent convexity; And/or,
Said heat insulation is located between the convexity of vertical part of heat sink and vicinity.
6. liquid crystal module heating radiator as claimed in claim 1 is characterized in that the outside surface of said heat sink is provided with the heat radiation coating.
7. liquid crystal module heating radiator as claimed in claim 1 is characterized in that, the material of said backboard is steel plate, aluminium sheet, aluminium alloy plate or resin.
8. liquid crystal module heating radiator as claimed in claim 1 is characterized in that, said heat radiation coating comprises the high molecular polymer that contains coolant.
9. a display device is characterized in that, comprises each described liquid crystal module heating radiator of claim 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200530983U CN202548479U (en) | 2012-02-17 | 2012-02-17 | Liquid crystal module radiator and display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012200530983U CN202548479U (en) | 2012-02-17 | 2012-02-17 | Liquid crystal module radiator and display device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202548479U true CN202548479U (en) | 2012-11-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012200530983U Expired - Lifetime CN202548479U (en) | 2012-02-17 | 2012-02-17 | Liquid crystal module radiator and display device |
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| Country | Link |
|---|---|
| CN (1) | CN202548479U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104848186A (en) * | 2015-04-24 | 2015-08-19 | 东莞市闻誉实业有限公司 | Radiator |
| CN112400234A (en) * | 2019-06-13 | 2021-02-23 | 高创(苏州)电子有限公司 | Display device, electronic apparatus, and apparatus mounting member |
| CN112422861A (en) * | 2020-11-05 | 2021-02-26 | 重庆惠科金渝光电科技有限公司 | Backplate subassembly, display screen and TV set |
| CN114879420A (en) * | 2022-04-22 | 2022-08-09 | 惠科股份有限公司 | Display device |
-
2012
- 2012-02-17 CN CN2012200530983U patent/CN202548479U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104848186A (en) * | 2015-04-24 | 2015-08-19 | 东莞市闻誉实业有限公司 | Radiator |
| CN112400234A (en) * | 2019-06-13 | 2021-02-23 | 高创(苏州)电子有限公司 | Display device, electronic apparatus, and apparatus mounting member |
| CN112400234B (en) * | 2019-06-13 | 2024-04-09 | 高创(苏州)电子有限公司 | Display device, electronic apparatus, and apparatus mounting member |
| CN112422861A (en) * | 2020-11-05 | 2021-02-26 | 重庆惠科金渝光电科技有限公司 | Backplate subassembly, display screen and TV set |
| CN114879420A (en) * | 2022-04-22 | 2022-08-09 | 惠科股份有限公司 | Display device |
| CN114879420B (en) * | 2022-04-22 | 2023-12-22 | 惠科股份有限公司 | display device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 266555 Qingdao economic and Technological Development Zone, Shandong, Hong Kong Road, No. 218 Patentee after: Hisense Video Technology Co.,Ltd. Address before: 266555 Qingdao economic and Technological Development Zone, Shandong, Hong Kong Road, No. 218 Patentee before: HISENSE ELECTRIC Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121121 |
|
| CX01 | Expiry of patent term |