CN206863402U - A kind of display module - Google Patents

A kind of display module Download PDF

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Publication number
CN206863402U
CN206863402U CN201720843330.6U CN201720843330U CN206863402U CN 206863402 U CN206863402 U CN 206863402U CN 201720843330 U CN201720843330 U CN 201720843330U CN 206863402 U CN206863402 U CN 206863402U
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metal frame
upper metal
display module
heat
module according
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付常露
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Truly Semiconductors Ltd
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Truly Semiconductors Ltd
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Abstract

本实用新型公开了一种显示模组,包括上金属架和设置在所述上金属架内的背光源及显示面板,所述上金属架包括具有视窗开口的顶面和四个侧面;所述显示面板靠近所述上金属架顶面的一面上绑定有驱动IC;所述上金属架的顶面内侧上设置有导热层。该显示模组能够将驱动IC产生的热量均匀地传导到上金属架的表面,有利于提高上金属架的散热效率。

The utility model discloses a display module, which comprises an upper metal frame, a backlight source and a display panel arranged in the upper metal frame, and the upper metal frame includes a top surface with a window opening and four side surfaces; the A drive IC is bound on the side of the display panel close to the top surface of the upper metal frame; a heat conduction layer is arranged on the inner side of the top surface of the upper metal frame. The display module can evenly conduct the heat generated by the driving IC to the surface of the upper metal frame, which is beneficial to improving the heat dissipation efficiency of the upper metal frame.

Description

一种显示模组a display module

技术领域technical field

本实用新型涉及显示技术,尤其涉及一种显示模组。The utility model relates to a display technology, in particular to a display module.

背景技术Background technique

随着汽车工业的蓬勃发展,欧系车厂对车载显示模组的尺寸要求越来越大,绑定在液晶显示面板上的驱动IC的数量和功耗也在不断增加,导致驱动IC的发热越来越明显,过高的温度容易导致驱动IC的功能退化和寿命衰减,因此,驱动IC的散热问题引起了广泛关注。With the vigorous development of the automobile industry, the size requirements of European car manufacturers for vehicle display modules are getting larger and larger, and the number and power consumption of driver ICs bound to LCD panels are also increasing, resulting in more heat generation of driver ICs. It is becoming more and more obvious that an excessively high temperature will easily lead to functional degradation and lifetime attenuation of the driver IC. Therefore, the problem of heat dissipation of the driver IC has attracted widespread attention.

实用新型内容Utility model content

为了解决上述现有技术的不足,本实用新型提供一种显示模组。该显示模组能够将驱动IC产生的热量均匀地传导到上金属架的表面,有利于提高上金属架的散热效率。In order to solve the above-mentioned deficiencies in the prior art, the utility model provides a display module. The display module can evenly conduct the heat generated by the driving IC to the surface of the upper metal frame, which is beneficial to improving the heat dissipation efficiency of the upper metal frame.

本实用新型所要解决的技术问题通过以下技术方案予以实现:The technical problem to be solved by the utility model is realized through the following technical solutions:

一种显示模组,包括上金属架和设置在所述上金属架内的背光源及显示面板,所述上金属架包括具有视窗开口的顶面和四个侧面;所述显示面板靠近所述上金属架顶面的一面上绑定有驱动IC;所述上金属架的顶面内侧上设置有导热层。A display module, comprising an upper metal frame, a backlight source and a display panel arranged in the upper metal frame, the upper metal frame includes a top surface with a window opening and four sides; the display panel is close to the A drive IC is bound on one side of the top surface of the upper metal frame; a heat conduction layer is arranged on the inner side of the top surface of the upper metal frame.

进一步地,所述导热层为石墨片、纳米碳铜箔、纳米铝箔或导热管中的一种。Further, the heat conduction layer is one of graphite sheet, nano-carbon copper foil, nano-aluminum foil or heat pipe.

进一步地,所述导热管包括吸热端和散热端,所述吸热端设置在对应于所述驱动IC的位置上,所述散热端设置在远离所述驱动IC的位置上。Further, the heat pipe includes a heat absorption end and a heat dissipation end, the heat absorption end is arranged at a position corresponding to the driver IC, and the heat dissipation end is arranged at a position away from the driver IC.

进一步地,所述显示面板包括相对设置的上基板和下基板,所述上基板和下基板之间设置有液晶层;所述驱动IC绑定在所述下基板靠近所述上金属架顶面的一面上。Further, the display panel includes an upper substrate and a lower substrate oppositely arranged, and a liquid crystal layer is arranged between the upper substrate and the lower substrate; the driving IC is bound on the lower substrate close to the top surface of the upper metal frame on one side.

进一步地,所述背光源包括下金属架、设置在所述下金属架内的导光板,以及设置在所述导光板入光面的灯条;所述下金属架的侧面和所述上金属架的侧面相扣合。Further, the backlight includes a lower metal frame, a light guide plate arranged in the lower metal frame, and a light bar arranged on the light incident surface of the light guide plate; the side surface of the lower metal frame and the upper metal frame The sides of the shelf snap together.

进一步地,所述导光板的入光面上设置有至少一光学膜。Further, at least one optical film is provided on the light incident surface of the light guide plate.

进一步地,所述导光板远离出光面的一面上设置有反射片。Further, a reflective sheet is provided on the side of the light guide plate away from the light-emitting surface.

进一步地,所述导光板和下金属架之间还设置有胶架,所述胶架上设置有遮光片,所述显示面板通过所述遮光片和所述背光源粘贴在一起。Further, a glue frame is provided between the light guide plate and the lower metal frame, and a light-shielding sheet is arranged on the glue frame, and the display panel is pasted together with the backlight through the light-shielding sheet.

本实用新型具有如下有益效果:该显示模组在所述上金属架的顶面内侧设置一层导热层,能够将所述驱动IC产生的热量均匀地传导到所述上金属架的表面,不仅有李云提高所述上金属架的散热效率,而且能够防止所述驱动IC产生的热量在局部区域聚积,以免显示模组功能障碍。The utility model has the following beneficial effects: the display module is provided with a layer of heat conduction layer inside the top surface of the upper metal frame, which can evenly conduct the heat generated by the drive IC to the surface of the upper metal frame, not only Li Yun improves the heat dissipation efficiency of the upper metal frame, and can prevent the heat generated by the driver IC from accumulating in a local area, so as to avoid the malfunction of the display module.

附图说明Description of drawings

图1为本实用新型提供的显示模组的示意图;Fig. 1 is the schematic diagram of the display module provided by the utility model;

图2为图1所示的背光源的导热层的示意图;FIG. 2 is a schematic diagram of a heat conducting layer of the backlight shown in FIG. 1;

图3为图1所示的背光源的导热管的示意图一;Fig. 3 is a schematic diagram 1 of the heat pipe of the backlight shown in Fig. 1;

图4为图1所示的背光源的导热管的示意图二。FIG. 4 is a second schematic diagram of the heat pipe of the backlight shown in FIG. 1 .

具体实施方式Detailed ways

下面结合附图和实施例对本实用新型进行详细的说明。Below in conjunction with accompanying drawing and embodiment the utility model is described in detail.

如图1和2所示,一种显示模组,包括上金属架1和设置在所述上金属架1内的背光源及显示面板,所述上金属架1包括具有视窗开口的顶面和四个侧面;所述显示面板包括相对设置的上基板21和下基板22,所述上基板21和下基板22之间设置有液晶层;所述背光源包括下金属架31、设置在所述下金属架31内的导光板32,以及设置在所述导光板32入光面的灯条33;所述下金属架31的侧面和所述上金属架1的侧面相扣合。As shown in Figures 1 and 2, a display module includes an upper metal frame 1 and a backlight source and a display panel arranged in the upper metal frame 1, and the upper metal frame 1 includes a top surface with a window opening and Four sides; the display panel includes an upper substrate 21 and a lower substrate 22 oppositely arranged, and a liquid crystal layer is arranged between the upper substrate 21 and the lower substrate 22; the backlight source includes a lower metal frame 31, which is arranged on the The light guide plate 32 inside the lower metal frame 31 , and the light bar 33 arranged on the light incident surface of the light guide plate 32 ;

所述上金属架1的顶面内侧上设置有导热层4。A heat conducting layer 4 is arranged on the inside of the top surface of the upper metal frame 1 .

该显示模组在所述上金属架1的顶面内侧设置一层导热层4,能够将所述驱动IC23产生的热量均匀地传导到所述上金属架1的表面,不仅有李云提高所述上金属架1的散热效率,而且能够防止所述驱动IC 23产生的热量在局部区域聚积,以免显示模组功能障碍。The display module is provided with a layer of heat conduction layer 4 inside the top surface of the upper metal frame 1, which can evenly conduct the heat generated by the driver IC 23 to the surface of the upper metal frame 1. The heat dissipation efficiency of the above-mentioned metal frame 1 can also prevent the heat generated by the driver IC 23 from accumulating in a local area, so as to avoid the malfunction of the display module.

所述导热层4优选为平面导热性能良好的材料,比如石墨片、纳米碳铜箔、纳米铝箔或较薄的导热管等中的一种。The heat conduction layer 4 is preferably a material with good planar heat conduction performance, such as one of graphite sheet, nano-carbon copper foil, nano-aluminum foil, or a thinner heat pipe.

若所述导热层4为导热管,则如图3和4所示,所述导热管包括分别位于两端吸热端和散热端,或者,包括位于中间的吸热端和两端的散热端;所述吸热端设置在对应于所述驱动IC 23的位置上,所述散热端设置在远离所述驱动IC 23的位置上。If the heat-conducting layer 4 is a heat-conducting pipe, as shown in Figures 3 and 4, the heat-conducting pipe includes heat-absorbing ends and heat-dissipating ends respectively located at both ends, or includes a heat-absorbing end located in the middle and heat-dissipating ends at both ends; The heat-absorbing end is arranged at a position corresponding to the driver IC 23 , and the heat-dissipating end is arranged at a position away from the driver IC 23 .

所述显示面板的下基板22在远离所述驱动IC 23的一面上设置有散热片5,从背面对所述驱动IC 23产生的热量进行散发;所述显示面板的下基板22在靠近所述驱动IC 23的一面上设置有主屏FPC 24,优选地,所述散热片5延伸并粘贴在所述主屏FPC 24上,进一步增加所述散热片5的散热面积。The lower substrate 22 of the display panel is provided with a heat sink 5 on the side away from the driver IC 23, and dissipates the heat generated by the driver IC 23 from the back; the lower substrate 22 of the display panel is close to the A main screen FPC 24 is arranged on one side of the driver IC 23 . Preferably, the heat sink 5 is extended and pasted on the main screen FPC 24 to further increase the heat dissipation area of the heat sink 5 .

所述散热片5优选具有良好平面导热性能的石墨片。The heat sink 5 is preferably a graphite sheet with good planar thermal conductivity.

所述导光板32的入光面上设置有至少一光学膜34,本实施例中,所述导光板32的出光面上依次设置有扩散膜、下增光膜和上增光膜,当然所述光学膜34的数量和类型可视需求而定,不应以此为限;所述导光板32远离出光面的一面上设置有反射片35;所述导光板32和下金属架31之间还设置有胶架36,所述胶架36上设置有遮光片37,所述显示面板通过所述遮光片37和所述背光源粘贴在一起。At least one optical film 34 is provided on the light incident surface of the light guide plate 32. In this embodiment, a diffusion film, a lower light enhancement film and an upper light enhancement film are sequentially provided on the light exit surface of the light guide plate 32. Of course, the optical The quantity and type of the film 34 can be determined according to the requirements, and should not be limited thereto; a reflective sheet 35 is arranged on the side of the light guide plate 32 away from the light-emitting surface; There is a glue frame 36 on which a light-shielding sheet 37 is arranged, and the display panel is pasted together with the backlight through the light-shielding sheet 37 .

以上所述实施例仅表达了本实用新型的实施方式,其描述较为具体和详细,但并不能因此而理解为对本实用新型专利范围的限制,但凡采用等同替换或等效变换的形式所获得的技术方案,均应落在本实用新型的保护范围之内。The above-mentioned embodiments only express the implementation manner of the present utility model, and its description is comparatively specific and detailed, but can not therefore be interpreted as the restriction to the patent scope of the present utility model, as long as adopt the form of equal replacement or equivalent transformation to obtain All technical solutions should fall within the protection scope of the present utility model.

Claims (8)

1.一种显示模组,包括上金属架和设置在所述上金属架内的背光源及显示面板,所述上金属架包括具有视窗开口的顶面和四个侧面;所述显示面板靠近所述上金属架顶面的一面上绑定有驱动IC;其特征在于:所述上金属架的顶面内侧上设置有导热层。1. A display module, comprising an upper metal frame and a backlight and a display panel arranged in the upper metal frame, the upper metal frame includes a top surface and four sides with a window opening; the display panel is close to A driver IC is bound on one side of the top surface of the upper metal frame; the feature is that: a heat conduction layer is arranged on the inner side of the top surface of the upper metal frame. 2.根据权利要求1所述的显示模组,其特征在于:所述导热层为石墨片、纳米碳铜箔、纳米铝箔或导热管中的一种。2. The display module according to claim 1, wherein the heat conduction layer is one of graphite sheet, nano-carbon copper foil, nano-aluminum foil or heat pipe. 3.根据权利要求2所述的显示模组,其特征在于:所述导热管包括吸热端和散热端,所述吸热端设置在对应于所述驱动IC的位置上,所述散热端设置在远离所述驱动IC的位置上。3. The display module according to claim 2, wherein the heat pipe includes a heat-absorbing end and a heat-dissipating end, the heat-absorbing end is arranged at a position corresponding to the driver IC, and the heat-dissipating end Set at a position away from the driver IC. 4.根据权利要求1所述的显示模组,其特征在于:所述显示面板包括相对设置的上基板和下基板,所述上基板和下基板之间设置有液晶层;所述驱动IC绑定在所述下基板靠近所述上金属架顶面的一面上。4. The display module according to claim 1, wherein the display panel comprises an upper substrate and a lower substrate oppositely arranged, and a liquid crystal layer is arranged between the upper substrate and the lower substrate; fixed on the side of the lower substrate close to the top surface of the upper metal frame. 5.根据权利要求1所述的显示模组,其特征在于:所述背光源包括下金属架、设置在所述下金属架内的导光板,以及设置在所述导光板入光面的灯条;所述下金属架的侧面和所述上金属架的侧面相扣合。5. The display module according to claim 1, wherein the backlight source comprises a lower metal frame, a light guide plate arranged in the lower metal frame, and a lamp arranged on the incident surface of the light guide plate strip; the side of the lower metal frame is buckled with the side of the upper metal frame. 6.根据权利要求5所述的显示模组,其特征在于:所述导光板的入光面上设置有至少一光学膜。6. The display module according to claim 5, wherein at least one optical film is disposed on the light incident surface of the light guide plate. 7.根据权利要求5所述的显示模组,其特征在于:所述导光板远离出光面的一面上设置有反射片。7. The display module according to claim 5, wherein a reflective sheet is arranged on the side of the light guide plate away from the light-emitting surface. 8.根据权利要求5所述的显示模组,其特征在于:所述导光板和下金属架之间还设置有胶架,所述胶架上设置有遮光片,所述显示面板通过所述遮光片和所述背光源粘贴在一起。8. The display module according to claim 5, characterized in that: a glue frame is arranged between the light guide plate and the lower metal frame, and a light-shielding sheet is arranged on the glue frame, and the display panel passes through the The shading sheet and the backlight are pasted together.
CN201720843330.6U 2017-07-12 2017-07-12 A kind of display module Expired - Fee Related CN206863402U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112180632A (en) * 2020-10-22 2021-01-05 武汉华星光电技术有限公司 Chip heat radiation structure and liquid crystal display device
CN116661195A (en) * 2022-10-26 2023-08-29 惠科股份有限公司 Backlight module and display device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112180632A (en) * 2020-10-22 2021-01-05 武汉华星光电技术有限公司 Chip heat radiation structure and liquid crystal display device
CN112180632B (en) * 2020-10-22 2021-10-08 武汉华星光电技术有限公司 Chip heat radiation structure and liquid crystal display device
WO2022082849A1 (en) * 2020-10-22 2022-04-28 武汉华星光电技术有限公司 Chip heat dissipation structure and liquid crystal display device
US11789199B2 (en) 2020-10-22 2023-10-17 Wuhan China Star Optoelectronics Technology Co., Ltd. Chip heat dissipation structure and liquid crystal display device
CN116661195A (en) * 2022-10-26 2023-08-29 惠科股份有限公司 Backlight module and display device

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Granted publication date: 20180109