CN203065570U - Inline multi-target magnetron sputtering coating device - Google Patents
Inline multi-target magnetron sputtering coating device Download PDFInfo
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- CN203065570U CN203065570U CN 201320097577 CN201320097577U CN203065570U CN 203065570 U CN203065570 U CN 203065570U CN 201320097577 CN201320097577 CN 201320097577 CN 201320097577 U CN201320097577 U CN 201320097577U CN 203065570 U CN203065570 U CN 203065570U
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Abstract
The utility model provides an inline multi-target magnetron sputtering coating device and relates to the technical field of sputtering coating. Rectangular sputtering targets with length-width ratio of more than 3 are adopted; more than three rectangular sputtering targets are coaxially arranged in parallel in one line in a box type vacuum chamber; the width directions of all the targets are parallel with long sides of the vacuum chamber; and the space between the targets is less than twice of the width of the rectangular targets. A linear motion structure is arranged above the rectangular sputtering targets; a substrate frame and a substrate heater are fixed on a linear motion mechanism and are driven by a stepping motor to do linear reciprocating motion along the long sides of the vacuum chamber; and the starting point, the termination point and the motion speed of the linear reciprocating motion are programmed by a controller, so that preparation of single-layer, multi-layer and periodical repetition structure films is realized. A multi-target magnetron sputtering platform has the characteristics that the sizes of the vacuum chamber and the targets are small and the uniform area of the prepared films is large, and also has other advantages of high air suction speed, high coating efficiency and the like.
Description
Technical field
The utility model relates to the sputter coating technical field, is specifically related to a kind of multi-target magnetic control sputtering film coating apparatus.
Background technology
Magnetron sputtering technique is widely used in films such as the various optics of preparation, electronics, machinery, in actual applications, the film of required preparation often multilayer or even (as: superlattice film) periodic arrangement, need finish in the condition of not destroying vacuum next time.Therefore, many targets sputtering system is arisen at the historic moment, and it is equipped with the appropriate exercise of workpiece plate by place a plurality of targets in some way in vacuum chamber, can realize sputter successively or even the cosputtering of a plurality of target position.But, a plurality of targets are installed in same vacuum chamber, also increased the volume of vacuum chamber inevitably, need to adopt more bigbore vacuum pump, the cost of equipment increases greatly.
The most geometric configuration that adopt circular vacuum chamber and rotary substrate frame of existing many targets sputtering unit, target is generally 2～4, and mostly is the planar rondure target, can be divided into following a few class by structure:
1) planetary motion type: a plurality of circular are evenly distributed on the same circumference of vacuum chamber base plate top, 1～6 circular substrate (also can have certain eccentricity) and carry out planetary motion (being that public affairs-rotation is synchronized with the movement) above this circumference, referring to document Multilayer optical coating fabrication by dc magnetron reactive sputtering, SPIE, 678:134,1986.
2) public affairs-rotation substep is campaign-styled: the geometric layout of target and substrate is identical with planetary motion type, just revolution motion and the spinning motion of substrate frame separate, namely begin only to revolve round the sun, so that substrate transposition and aim at certain sputtering target, sputter procedure substrate thereafter only carries out rotation.
3) the fixing rotation type of substrate: substrate be installed on the base plate center directly over, substrate only carry out from then unjust the commentaries on classics.A plurality of circular sputtering targets are installed on the base plate or sidewall of vacuum chamber, are certain pitch angle and make the target alignment substrate.The maximum characteristics of this kind structure are conveniently to carry out many target co-sputterings.Referring to document: the development of many targets direct magnetic control co-sputtering system, vacuum electronic technology, 1997, No.2:29.
4) sidewall-cylinder substrate frame revolution formula: a plurality of circles or rectangular target are positioned on the sidewall of circular vacuum chamber, and a columnar substrate frame is arranged in the vacuum chamber, and the cylinder rotation makes the substrate deposition on it go up corresponding film by sputtering target.Referring to document: Multilayer growth in the APS rotary deposition system, SPIE, 6705,2007.The non-balance magnetically controlled sputter platform that is made of four target symmetric configurations also adopts this structure more, referring to document: High-rate deposition of optical coatings by closed-field magnetron sputtering, SPIE, 5963,2005.
5) sidewall-cylinder substrate frame planetary motion type: a plurality of rectangular targets are positioned on the sidewall of circular vacuum chamber, and the substrate frame of a plurality of columns is done planetary motion in vacuum chamber, compare with sidewall-cylinder substrate frame revolution formula, can lay more substrate.Referring to document: Dependence of microstructure and hardness of TiAlN/VN hard coatings on the type of substrate rotation, Vacuum, 86:699-702,2007.
Above multi-target magnetic control sputtering film coating apparatus exists following deficiency:
1) shape of magnetron sputtering target mostly is planar rondure, is unfavorable for improving the homogeneity of film and obtains large-area uniform thin film.
For any magnetron sputtering film device, uniformity of film all is an important general character index.Though can obtain film more uniformly by the area that increases target, this is to increase the target cost even equipment cost is cost, spends too big.
The shape of plane magnetic controlled sputtering target mainly contains circular and two kinds in rectangle., the atom that spills of circular distributes center and peripheral place widely different because being concentric(al) circles in the space.For for the onesize substrate of target, conventional sputtering technology prepared film can reach 30-40% in the thickness difference of substrate center and edge.
And rectangular target has the sputter runway of two straightsided shapes, therefore spills atom and is the strip distribution in the space, and namely the distribution that spills atom of the corresponding area of space of straight flange is very approaching.Therefore, only need substrate parallel is placed and made substrate along the inswept target surface of short side direction straight line of target in rectangular target, can obtain large-area uniform thin film.The uniform width of film is slightly less than the straight flange of rectangular target, and length direction is not subjected to the limitation of size of target.So, for circular and the rectangular target with homalographic, because the length of straight flange of rectangular target much larger than the diameter of circular, therefore can obtain bigger uniformity of film.
2) the 4th of above-mentioned many targets Sputting film-plating apparatus the, 5 kind, substrate frame is round shape or cylindrical, although can lay a lot of little substrates, the efficient of plated film is very high, can't satisfy the needs of big substrate coating.
3) the 1st of above-mentioned many targets Sputting film-plating apparatus the, 4,5 kind, on the substrate frame a plurality of substrates can be installed, the production efficiency height all is for reaching the design of the industrial coating equipment that volume production carries out.But when scientific experiment, often only needing plated film on a substrate so no matter, is planetary or the substrate frame of drum-type, and substrate is in the time that public affairs circle, and for once chance can plate film, and plated film efficient is very low.
Summary of the invention
Problem to be solved in the utility model is: how a kind of novel many targets Sputting film-plating apparatus is provided, to be different from vacuum chamber structure and the substrate mode of motion of existing many targets Sputting film-plating apparatus, make and in one is tried one's best little vacuum chamber, a plurality of sputtering targets can be installed, to realize large-area uniformity of film, improve the efficient of plated film, and have the characteristics that vacuum chamber volume is little, the speed of evacuation is fast simultaneously.
The technical problem that the utility model proposes is to solve like this:
A kind of multi-target magnetic control sputtering film coating apparatus in upright arrangement as shown in Figure 1, 2, comprises 1 vacuum chamber, is provided with n rectangle sputtering target 3,1 substrate frame, 1 substrate heater, 1 straight-line motion mechanism in the vacuum chamber, and vacuum chamber has 1 stepper-motor outward; It is characterized in that described vacuum chamber is the box type vacuum chamber, n rectangle sputtering target is parallel to each other and coaxial forming a line, and the target spacing is less than 2 times of the rectangular target width, and the width of all rectangle sputtering targets all is parallel to the long limit of vacuum chamber; Rectangle sputtering target top is provided with a structure of linear motion, substrate frame and substrate heater are fixed on the straight-line motion mechanism, and under the driving of stepper-motor, can do straight reciprocating motion along the long limit of vacuum chamber, the starting point of straight reciprocating motion, terminating point and movement velocity are by the setting of programming of a controller, and its range has covered all rectangle sputtering targets.
In the above-mentioned multi-target magnetic control sputtering film coating apparatus in upright arrangement, the number n of described rectangle sputtering target 〉=3.
In the above-mentioned multi-target magnetic control sputtering film coating apparatus in upright arrangement, the length of described rectangle sputtering target is more than or equal to 3 times of the width of rectangular target.
In the above-mentioned multi-target magnetic control sputtering film coating apparatus in upright arrangement, the magnetron sputtering power supply of described n rectangle sputtering target is direct supply, radio-frequency power supply, intermediate frequency power supply or the pulse power, or the arbitrary combination of above several power supplys.
In the above-mentioned multi-target magnetic control sputtering film coating apparatus in upright arrangement, described straight-line motion mechanism is screw type or belt-type or chain-type.
The principal feature of the multi-target magnetic control sputtering film coating apparatus in upright arrangement that the utility model provides is that a plurality of rectangle sputtering targets are arranged in parallel in alignment along its short side direction, and allow substrate frame above this straight line, move back and forth, realizing sputter successively or the alternating sputtering of a plurality of targets, thereby finish the preparation of unitary film, multilayer film even periodicity emphasis complex structure film.The multi-target magnetic control sputtering film coating apparatus in upright arrangement of this kind structure not only can obtain large-area uniform thin film, and by compression target spacing, can effectively reduce the volume of vacuum chamber.Particularly when the sputtering target direct connection that adopts more than 5, and the long-width ratio of rectangle sputtering target is when big (as greater than 6), and the characteristics of the little vacuum chamber volume that many targets of this kind array Sputting film-plating apparatus has and big uniformity of film are just more outstanding.
Description of drawings
Fig. 1 is multi-target magnetic control sputtering film coating apparatus structural representation in upright arrangement of the present utility model (overlooking).
Fig. 2 is multi-target magnetic control sputtering film coating apparatus structural representation in upright arrangement of the present utility model (side-looking).
Among Fig. 1,2: 1 is bleeding point; 2 is polished rod; 3 is the rectangle sputtering target; 4 is leading screw; 5 is the sputter gas inlet mouth; 6 is substrate frame; 7 is substrate; 8 is stepper-motor; 9 is substrate heater; 10 is baffle plate.
Embodiment
Be further described below in conjunction with accompanying drawing and the utility model of embodiment.
Embodiment 1:
Fig. 1 is the vertical view of multi-target magnetic control sputtering film coating apparatus in upright arrangement of the present utility model, and Fig. 2 is its side-view.Vacuum chamber is rectangle, long 550mm, and wide 280mm, high 320mm is case structure, whole front panel is a whole door (not drawing among the figure).Adorned the rectangle sputtering target of three 180mm * 50mm in the vacuum chamber, middle one is the radio frequency target, and the left and right sides is the direct current target.Three target levels are installed on the vacuum chamber base plate and are arranged parallel to each other, and the minor face of three targets all is parallel to the long limit of vacuum chamber, and the target spacing is 80mm.Three rectangular targets have a baffle plate between any two respectively, and each baffle plate has two stations, block the rectangular target of a side respectively and expose the rectangular target of opposite side, and each baffle plate is independent controlled.The top of three rectangular targets is horizontally installed with three guide rails along the vacuum chamber long side direction, wherein before and after two be polished rod, the substrate frame frame is on these two polished rods and prevent that it from falling.Middle one is leading screw, is driven and is rotated by the outer stepper-motor of vacuum chamber.The engagement of a pair of grinding tooth and leading screw is arranged on the substrate frame, and the rotation of stepper-motor drives substrate frame and moves along the leading screw straight line, and stepper-motor can dextrorotation and derotation, and the drive substrate frame is done straight reciprocating motion along the vacuum chamber long side direction.The rotation of stepper-motor is controlled by PLC micro-chip (not drawing among the figure), make that the straight-line speed of substrate frame is adjustable in 0～60mm/min, the PLC micro-chip can arrange straight-line starting point and turn back a little, makes substrate frame carry out straight reciprocating motion between these 2.Reciprocating range is 430mm, across on three rectangular targets.Substrate frame with and on substrate heater be rectangle, be of a size of 110mm * 110mm, the maximum substrate dimensions that can install is 100mm * 100mm.The width of substrate (100mm) is slightly less than the long limit (120mm) of rectangular target, adds the mode of motion of the crosscut rectangular target that substrate adopts, can guarantee that the film heterogeneity of whole substrate is better than ± and 5%.
The maximum characteristics of this array multi-target magnetic control sputtering film coating apparatus are (550mm * 280mm * 320mm in is tried one's best little vacuum chamber, the circular vacuum chamber that is equivalent to Φ 440mm), target (180mm * the 50mm that adopts area to try one's best little, be equivalent to Φ 107mm circular), realized the large-area uniformity of film of 100mm * 100mm.Because vacuum chamber is less, adopt the molecular pump of F-250 type as main pump, can after 4 hours vacuum be extracted into 4 * 10 driving high valve
-4Pa.
And the multi-target magnetic control sputtering platform of other structures of introducing in the background technology is difficult to realize this technical indicator.As adopt conventional circular sputtering technology, if need to realize the film uniformity of 100mm * 100mm rectangular film (circular membrane that is equivalent to 141mm) reach ± 5%, the diameter of target at least should be more than 250mm (the sputter ring diameter is about 180mm), add the pedestal of target, the diameter of circular vacuum chamber is greater than 600mm.The area of target and the volume of vacuum chamber (height of vacuum chamber is constant) have increased 4.46 times and 0.86 times respectively.
Adopt configuration that circular vacuum chamber and rectangular target combine (referring to document: Pan Lei for another example, Deng, magnetically controlled sputter method prepares diameter 120mm high uniformity Mo/Si multilayer film, light laser and particle beam, 2010,22:1535), lay three rectangular targets of 180mm * 50mm, the diameter of vacuum chamber should be slightly larger than the vacuum chamber volume of present embodiment greater than 450mm at least.Because substrate frame adopted the planetary motion mode, although uniformity of film can improve to some extent than present embodiment, smaller (the Φ 100mm VS100mm * 100mm) of the area of prepared film.And this configuration also exists the inefficient problem of plated film, substrate inswept target surface of chance and plate film for once in the time that public affairs circle.Vacuum chamber with Φ 450mm is example, and the radius of substrate revolution is about 112.5mm, and the revolution girth is 707mm, and the width of target only is 50mm.So plated film efficient is about 50/707=7%.And multi-target magnetic control sputtering film coating apparatus in upright arrangement of the present utility model can be so that substrate scans back and forth repeatedly in the both sides of a target, the substrate inswept 50mm wide rectangular target long with present embodiment 100mm is example, plated film efficient is 50/(100+50)=33.3%, improved 3.75 times.More than be the situation that is coated with single thin film, many targets Sputting film-plating apparatus of the present utility model also can prepare double-deck and above repeat cycle film, the document that provides as Pan Lei etc.At this moment, the configuration that combines of circular vacuum chamber and rectangle sputtering target is 14% for the plated film efficient of double-deck period film.And in the present embodiment, plated film efficient is minimum to be to utilize two metallic targets of both sides to be coated with the double-deck film that repeats, because the centre accompanies a radio frequency target, the backlash of substrate motion is the longest.Even but like this, the efficient of plated film also is 2 * 50/(100+50 * 3+80 * 2)=24%.
Claims (5)
1. a multi-target magnetic control sputtering film coating apparatus in upright arrangement comprises 1 vacuum chamber, is provided with n rectangle sputtering target (3), 1 substrate frame, 1 substrate heater, 1 straight-line motion mechanism in the vacuum chamber, and vacuum chamber has 1 stepper-motor outward; It is characterized in that described vacuum chamber is the box type vacuum chamber, n rectangle sputtering target is parallel to each other and coaxial forming a line, and the target spacing is less than 2 times of the rectangular target width, and the width of all rectangle sputtering targets all is parallel to the long limit of vacuum chamber; Rectangle sputtering target top is provided with a structure of linear motion, substrate frame and substrate heater are fixed on the straight-line motion mechanism, and under the driving of stepper-motor, can do straight reciprocating motion along the long limit of vacuum chamber, the starting point of straight reciprocating motion, terminating point and movement velocity are by the setting of programming of a controller, and its range has covered all rectangle sputtering targets.
2. a kind of multi-target magnetic control sputtering film coating apparatus in upright arrangement according to claim 1 is characterized in that the number n of described rectangle sputtering target 〉=3.
3. a kind of multi-target magnetic control sputtering film coating apparatus in upright arrangement according to claim 1 is characterized in that, the length of described rectangular target is more than or equal to 3 times of the width of rectangular target.
4. a kind of multi-target magnetic control sputtering film coating apparatus in upright arrangement according to claim 1, it is characterized in that, the magnetron sputtering power supply of described n rectangle sputtering target is direct supply, radio-frequency power supply, intermediate frequency power supply or the pulse power, or the arbitrary combination of above several power supplys.
5. a kind of multi-target magnetic control sputtering film coating apparatus in upright arrangement according to claim 1 is characterized in that described straight-line motion mechanism is screw type, belt-type or chain-type.
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| CN 201320097577 CN203065570U (en) | 2013-03-04 | 2013-03-04 | Inline multi-target magnetron sputtering coating device |
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| CN 201320097577 CN203065570U (en) | 2013-03-04 | 2013-03-04 | Inline multi-target magnetron sputtering coating device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103147055A (en) * | 2013-03-04 | 2013-06-12 | 电子科技大学 | In-line multi-target magnetron sputtering coating device |
| CN103993275A (en) * | 2014-05-09 | 2014-08-20 | 浙江上方电子装备有限公司 | Quasi-static coating system and quasi-static coating method by utilization of quasi-static coating system |
| WO2021022965A1 (en) * | 2019-08-06 | 2021-02-11 | 北京科技大学 | Apparatus and method for high-throughput preparation of multi-component uniform film material |
| WO2021215953A1 (en) * | 2020-04-20 | 2021-10-28 | Акционерное Общество "Твэл" | Method of ion-plasma application of corrosion-resistant film coatings on articles made from zirconium alloys |
| CN114535742A (en) * | 2020-11-11 | 2022-05-27 | 马丁·施韦克哈特 | Method for operating a vacuum system and vacuum system |
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2013
- 2013-03-04 CN CN 201320097577 patent/CN203065570U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103147055A (en) * | 2013-03-04 | 2013-06-12 | 电子科技大学 | In-line multi-target magnetron sputtering coating device |
| CN103993275A (en) * | 2014-05-09 | 2014-08-20 | 浙江上方电子装备有限公司 | Quasi-static coating system and quasi-static coating method by utilization of quasi-static coating system |
| CN103993275B (en) * | 2014-05-09 | 2016-08-17 | 浙江上方电子装备有限公司 | A kind of quasistatic coating system and utilize its method carrying out quasistatic plated film |
| WO2021022965A1 (en) * | 2019-08-06 | 2021-02-11 | 北京科技大学 | Apparatus and method for high-throughput preparation of multi-component uniform film material |
| WO2021215953A1 (en) * | 2020-04-20 | 2021-10-28 | Акционерное Общество "Твэл" | Method of ion-plasma application of corrosion-resistant film coatings on articles made from zirconium alloys |
| CN113906154A (en) * | 2020-04-20 | 2022-01-07 | Tvel 股份公司 | Ion plasma method for sputtering rust-resistant film protective layer on zirconium alloy product |
| CN113906154B (en) * | 2020-04-20 | 2024-02-20 | Tvel 股份公司 | Ion plasma method for sputtering rust-resistant film protective layer on zirconium alloy product |
| CN114535742A (en) * | 2020-11-11 | 2022-05-27 | 马丁·施韦克哈特 | Method for operating a vacuum system and vacuum system |
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