CN203055902U - Packaging piece for lead framework with additional auxiliary pad pasting pins - Google Patents
Packaging piece for lead framework with additional auxiliary pad pasting pins Download PDFInfo
- Publication number
- CN203055902U CN203055902U CN2012206913768U CN201220691376U CN203055902U CN 203055902 U CN203055902 U CN 203055902U CN 2012206913768 U CN2012206913768 U CN 2012206913768U CN 201220691376 U CN201220691376 U CN 201220691376U CN 203055902 U CN203055902 U CN 203055902U
- Authority
- CN
- China
- Prior art keywords
- pad pasting
- pins
- auxiliary pad
- lead frame
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
- H01L2224/92—Specific sequence of method steps
- H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
- H01L2224/9222—Sequential connecting processes
- H01L2224/92242—Sequential connecting processes the first connecting process involving a layer connector
- H01L2224/92247—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a packaging piece for a lead framework with additional auxiliary pad pasting pins, which is mainly composed of the lead framework, chips, die bonding glue, bonding wires, plastic-sealed bodies, solder balls, a glue film, cutting lines and the auxiliary pad pasting pins. The lead framework is etched, and two and a half loops of auxiliary pad pasting pins are arranged besides a cutting channel of the lead frame; the lead framework is connected with the chips via the die bonding glue, solder joints on the chips are connected with the pins on the etched framework via the bonding wires, the packaging piece is packaged by the plastic-sealed bodies, and the solder balls are connected with the pins exposed from the lead framework whose back side is etched; and the glue film is adhered to the solder balls, and the covers all solder ball regions and the auxiliary pad pasting pins. According to the utility model, the auxiliary pad pasting pins are added to decrease the rejection rate, optimize secondary packaging quality, improve product performance and save the cost.
Description
Technical field
The utility model relates to the semiconductor packaging field, specifically is the packaging part that a kind of lead frame increases auxiliary pad pasting pin.
Background technology
Along with the continuous development of technology, Electronic Packaging not only will provide the protection of chip, also will satisfy requirements such as ever-increasing performance, reliability, heat radiation, power division under certain cost simultaneously, and this has proposed new requirement and challenge to encapsulation technology.Intense market competition is promoting the continuous progress of encapsulation technology, and plastic packaging is as one of key link of semiconductor packaging, also develop into the secondary plastic packaging by a plastic packaging, the quality of plastic packaging operation directly affects problems such as reliability of products and cost, performance.
At present, when carrying out the secondary plastic packaging, design according to diaphragm capsule, must be unit with single Block during pad pasting on the tin ball of the whole piece framework back side, according to common frame pin design, the product behind the pad pasting carries out having following problem behind the secondary plastic packaging: discontented problem appears sealing in (1) secondary plastic packaging.When the tin ball on the frame-generic is carried out pad pasting, if the glued membrane cutting is excessive, then the coverage rate of glued membrane has surpassed tin ball zone, glued membrane may stick on the plastic-sealed body of tin ball periphery like this, when the secondary plastic packaging, because the bonding of glued membrane and peripheral plastic-sealed body may be blocked flowing of plastic packaging material, and makes the secondary plastic packaging discontented problem occur sealing; (2) the defective problem of profile of each Block outmost turns product.When if glued membrane press the big or small cutting in tin ball zone and pad pasting, when behind the secondary plastic packaging product cut, do not influence properties of product in order to guarantee cutting, cutting position must keep certain distance with outer rim tin ball, yet, because glued membrane is big or small regional consistent with the tin ball during pad pasting,
Plastic-sealed body between peripheral tin ball and the line of cut is not owing to be subjected to the glued membrane limitation in height, and this regional plastic-sealed body height may be inconsistent with the plastic-sealed body height around the tin ball in the glued membrane, can occur the defective problem of profile of each Block outmost turns product like this.Be example with each Block with 4 * 4 packaging bodies, will scrap 12 products behind common each Block secondary plastic packaging that etches partially Frame Design.
The utility model content
In order to overcome the problem that above-mentioned frame-generic pin design exists, the utility model provides a kind of lead frame to increase the packaging part of auxiliary pad pasting pin, purpose is to optimize current AAQFN to etch partially Frame Design, around each Block that etches partially framework, increase by two circle pins and assist back side pad pasting, guarantee the quality of secondary plastic packaging.
The technical solution of the utility model is: a kind of lead frame increases the packaging part of auxiliary pad pasting pin and mainly is made up of lead frame, chip, bonding die glue, bonding wire, plastic-sealed body, tin ball, glued membrane, line of cut, auxiliary pad pasting pin; Described lead frame is etch processes, two circles, half auxiliary pad pasting pin is arranged beyond its Cutting Road, described lead frame is by bonding die glue and die bonding, solder joint on the described bonding wire connection chip and the pin on the etched frame, described packaging part is by plastic-sealed body and sealing, described tin ball links to each other with the pin that the lead frame of back etched exposes, and described glued membrane sticks on the tin ball, and glued membrane covers all tin ball zone and auxiliary pad pasting pins.
A kind of lead frame increases the manufacture craft of the packaging part of auxiliary pad pasting pin and carries out according to following steps: framework etches partially, goes up core, pressure welding, plastic packaging, a framework back etched, plant ball and tin cream backflow, pad pasting and secondary plastic packaging, take off film, cutting and separate.
The beneficial effects of the utility model are: because glued membrane has covered tin ball auxiliary pin in addition, the product cutting position is between peripheral tin ball and auxiliary pin, because peripheral auxiliary pin is to the support of glued membrane, what cause thereby the glued membrane that has occurred when having avoided the normal pins design to seal adheres to plastic-sealed body seals discontented problem, on the other hand, also avoided because the defective problem of profile of each Block outmost turns product that product cutting back occurs owing to peripheral plastic-sealed body height is inconsistent.In addition, framework increases auxiliary pad pasting pin design and has also reduced the product rejection problem, optimizes secondary plastic packaging quality, has improved properties of product, saves cost.
Figure of description
Fig. 1 integral product profile;
The frame pin deisgn product profile that Fig. 2 is common;
Fig. 3 lead frame profile;
Product profile behind the core on Fig. 4;
Product profile after Fig. 5 pressure welding;
Product profile behind plastic packaging of Fig. 6;
Product profile behind Fig. 7 framework back etched;
Fig. 8 brushes product section after the tin cream Reflow Soldering;
Pad pasting product profile before Fig. 9 secondary plastic packaging;
Product profile behind Figure 10 secondary plastic packaging;
Figure 11 finished product profile.
Among the figure, 1 is that lead frame, 2 is that chip, 3 is that bonding die glue, 4 is that bonding wire, 5 and 8 is that plastic-sealed body, 6 is that tin ball, 7 is that glued membrane, 9 is that line of cut, 10 is to assist the pad pasting pin.
Embodiment
Below in conjunction with accompanying drawing the utility model is done and to be described in further detail.
As shown in the figure, the packaging part of the auxiliary pad pasting pin of a kind of lead frame increase mainly is made up of lead frame 1, chip 2, bonding die glue 3, bonding wire 4, plastic-sealed body 5 and 8, tin ball 6, glued membrane 7, line of cut 9, auxiliary pad pasting pin 10; Added two circles, half auxiliary pad pasting pin 10 beyond the Cutting Road of the lead frame 1 after the etching, after core, pressure welding, a plastic packaging are finished on subsequently, lead frame 1 by back etched, plastic-sealed body 5 back side pins expose, all pins are connected with the tin ball 6 of implantation after the etching, glued membrane 7 sticks on the tin ball 6, and glued membrane 7 covers tin ball 6 zones of all products and the auxiliary pad pasting pin 10 of framework of outmost turns, finishes the cutting of product subsequently.Because glued membrane 7 covers tin ball 6 zones of all products and the auxiliary pad pasting pin 10 of framework of outmost turns, in secondary plastic packaging process, avoid the frame-generic problem of the auxiliary pad pasting pin 10 of nothing, the problem includes: seal discontented and the defective problem of outermost layer product design, thereby optimized the secondary plastic packaging.
As shown in the figure, a kind of lead frame increases the manufacture craft of the packaging part of auxiliary pad pasting pin, and it carries out according to following steps:
The first step, framework etch partially: lead frame 1 is etched partially, technologies such as gluing, exposure, development, plating and corrosion by maturation, etched lead frame frame 1, etch carrier at lead frame 1, and etching two circles half are assisted pad pasting pin 10 beyond the Cutting Road of lead frame 1, determine I/O Pad size, pin spacing and their positions separately at I/O Pad; As shown in Figure 3;
Second step, last core: chip 2 is bonded on lead frame 1 carrier with bonding die glue 3; As shown in Figure 4;
The 3rd step, pressure welding: with the solder joint on the chip 2 with etch partially after the pin of lead frame 1 be connected with bonding wire 4;
The 4th step, a plastic packaging: the product after the pressure welding is sent in the plastic package die automatically, seals with the product after 5 pairs of pressure weldings of plastic packaging material;
The 5th step, framework back etched: etching is carried out in lead frame 1 bottom, and the lead frame 1 after the etching as shown in Figure 7;
The 6th step, plant ball and tin cream and reflux: all pins after the etching are planted ball 6 and refluxed; As shown in Figure 8;
The 7th step, pad pasting and secondary plastic packaging: as shown in Figure 9, tin ball 6 is pasted one deck glued membrane 7, the product behind the pad pasting is sent in the plastic package die automatically, seal with the product behind 8 pairs of pad pastings of plastic packaging material;
Secondary plastic packaging product profile after common leadframe design product profile as shown in Figure 2 and the optimization as shown in figure 10, lead frame among Figure 10 is compared with Fig. 2, beyond the Cutting Road of product, namely added two circles, half auxiliary pad pasting pin 10 on common lead frame basis, glued membrane 7 covers all tin ball 6 zones and the auxiliary pad pasting pin 10 of the framework of outmost turns among Figure 10, like this, because glued membrane has covered the auxiliary pad pasting pin 10 beyond the tin ball 6, the product cutting position is between peripheral tin ball 6 and auxiliary pad pasting pin 10, because the support of peripheral auxiliary 10 pairs of glued membranes 7 of pad pasting pin, when having avoided among Fig. 2 the normal pins design to seal, since the long appearance of glued membrane because glued membrane adheres to plastic-sealed body, block plastic-sealed body flow and cause seal discontented problem; On the other hand, when also having avoided the normal pins design to seal, if glued membrane press the big or small cutting pad pasting in tin ball zone, thus behind the secondary plastic packaging during cutting because the defective problem of profile of plastic-sealed body and peripheral not pad pasting inconsistent each the Block outmost turns product that causes of plastic-sealed body height partly under the glued membrane;
The 8th the step, take off film and cutting and separating: the glued membrane 7 on the tin ball 6 is taken off film, as shown in figure 10; The product cutting and separating good to plastic packaging, the product shaping profile as shown in figure 11.
Claims (1)
1. a lead frame increases the packaging part of assisting the pad pasting pin, it is characterized in that: mainly be made up of lead frame (1), chip (2), bonding die glue (3), bonding wire (4), plastic-sealed body (5) and (8), tin ball (6), glued membrane (7), line of cut (9), auxiliary pad pasting pin (10); Described lead frame (1) is etch processes, two circles, half auxiliary pad pasting pin (10) is arranged beyond its Cutting Road, described lead frame (1) is bonding by bonding die glue (3) and chip (2), solder joint on described bonding wire (4) the connection chip (2) and the pin on the etched frame (1), described packaging part is sealed by plastic-sealed body (5) and (8), described tin ball (6) links to each other with the pin that the lead frame (1) of back etched exposes, described glued membrane (7) sticks on the tin ball (6), and glued membrane (7) covers all tin ball (6) zone and auxiliary pad pasting pins (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206913768U CN203055902U (en) | 2012-12-14 | 2012-12-14 | Packaging piece for lead framework with additional auxiliary pad pasting pins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206913768U CN203055902U (en) | 2012-12-14 | 2012-12-14 | Packaging piece for lead framework with additional auxiliary pad pasting pins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203055902U true CN203055902U (en) | 2013-07-10 |
Family
ID=48738826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012206913768U Withdrawn - After Issue CN203055902U (en) | 2012-12-14 | 2012-12-14 | Packaging piece for lead framework with additional auxiliary pad pasting pins |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203055902U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103094239A (en) * | 2012-12-14 | 2013-05-08 | 华天科技（西安）有限公司 | Auxiliary paster pin added lead frame package part and manufacture process |
-
2012
- 2012-12-14 CN CN2012206913768U patent/CN203055902U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103094239A (en) * | 2012-12-14 | 2013-05-08 | 华天科技（西安）有限公司 | Auxiliary paster pin added lead frame package part and manufacture process |
| CN103094239B (en) * | 2012-12-14 | 2017-12-15 | 华天科技（西安）有限公司 | A kind of packaging part and its manufacture craft of lead frame increase auxiliary paster pin |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20130710 Effective date of abandoning: 20171215 |