CN203030546U - Thickness sorting machine of quartz wafers - Google Patents

Thickness sorting machine of quartz wafers Download PDF

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Publication number
CN203030546U
CN203030546U CN 201320057282 CN201320057282U CN203030546U CN 203030546 U CN203030546 U CN 203030546U CN 201320057282 CN201320057282 CN 201320057282 CN 201320057282 U CN201320057282 U CN 201320057282U CN 203030546 U CN203030546 U CN 203030546U
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China
Prior art keywords
module
sorting
motor
wafer
electrode
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CN 201320057282
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Chinese (zh)
Inventor
王维锐
刘木林
王均晖
张林友
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Research Institute of Zhejiang University Taizhou
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Research Institute of Zhejiang University Taizhou
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Abstract

The utility model discloses a thickness sorting machine of quartz wafers. The thickness sorting machine comprises a charging module, a taking module, a thickness measuring module and a sorting module, wherein the taking module comprises a taking motor; an output end of the taking motor is connected with the fixed end of a piece taking arm, and the taking motor can drive the piece taking arm to rotate around the fixed end of the piece taking arm; the free end of the piece taking arm is provided with an upper electrode; one side of the taking motor is provided with the charging module, and the other side of the taking motor is provided with the thickness measuring module; and one side of the thickness measuring module is provided with the sorting module. The thickness sorting machine disclosed by the utility model has the advantages that full-automatic sorting of the quartz wafers can be realized, and all the feeding, measurement and sorting are controlled by independent motors, so that the speed for measuring the thickness of the wafers can be greatly increased, the sorting efficiency can be improved and the labor cost can be reduced.

Description

Quartz wafer thickness sorting machine
Technical field
The utility model relates to a kind of process equipment of semiconductor wafer, is specifically related to a kind of quartz wafer thickness sorting machine.
Background technology
The thickness sorting of quartz wafer can effectively promote wafer passing rate.Existing sorting mode adopts the mode of physical measurement, and error is bigger.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of quartz wafer thickness sorting machine, and it can realize the automatic sorting of quartz wafer.
For solving the problems of the technologies described above, the technical solution of the utility model quartz wafer thickness sorting machine is:
Comprise material loading module 1, get material module 2, thickness measure module 3, sorting module 5; Get material module 2 and comprise and get material motor 15, the output of getting material motor 15 connects the stiff end get sheet arm 16, gets material motor 15 and can drive and get sheet arm 16 around its stiff end rotation, and the free end of getting sheet arm 16 is switched getting between material station and the measurement station; The free end of getting sheet arm 16 is provided with top electrode 17; One side of getting material motor 15 is provided with material loading module 1, and the opposite side of getting material motor 15 is provided with thickness measure module 3; One side of thickness measure module 3 is provided with sorting module 5; Get material module 2 and give thickness measure module 3 by the wafer transferring of getting sheet arm 16 material loading module 1 being sent here, sorting module 5 is carried out sorting according to the measurement result of thickness measure module 3 to wafer.
Described material loading module 1 comprises material loading motor 13, and the output of material loading motor 13 connects ball screw 12; Ball screw 12 is connected in slide block in the film magazine 9 by traveling nut, and the wafers in the film magazine 9 can be moved up and down along line slideway 11; Material loading motor 13 drives ball screw 12 rotations, and the slide block that ball screw 12 drives in the film magazine 9 moves upward along line slideway 11, thereby the wafer in the film magazine 9 is upwards sent.
The other end of described film magazine 9 is provided with film magazine magnet and inhales and piece 10, is used for the location of film magazine 9.
The both sides, top of described material loading module 1 are respectively arranged with the launching fiber module 18 of mutual correspondence and receive optic module 14; When the movement of wafers in the film magazine 9 to the top wafer of film magazine 9 just in time is in launching fiber module 18 and receive between the optic module 14, material loading motor 13 stops, get 15 drivings of material motor and get sheet arm 16 around its stiff end rotation, when moving to, the free end of getting sheet arm 16 gets material during station, the wafer that grasps in film magazines 9 by its free-ended top electrode 17.
Described thickness measure module 3 comprises bottom electrode 22, and bottom electrode 22 is positioned at the measurement station of getting sheet arm 16; Bottom electrode 22 is fixedly set on the test desk base plate 21, and test desk base plate 21 connects measurement module base plate 19 by linear bearing 20; One side of bottom electrode 22 is provided with for the differential head 23 of regulating bottom electrode 22 height; When the free end of getting sheet arm 16 moved to the measurement station, wafer was between top electrode 17 and bottom electrode 22, and carry out thickness measure by upper and lower electrode 17,22 pairs of wafers this moment.
Described sorting module 5 comprises sorting motor 25, and the output of sorting motor 25 is provided with sorting suction nozzle 26, and sorting motor 25 drives sorting suction nozzle 26 and grasps wafer from bottom electrode 22; Sorting motor 25 is movably set on the slide unit 24 by electric machine support, and slide unit motor 28 drive motors supports move along the length direction of slide unit 24; The below, zone of action of sorting suction nozzle 26 is provided with a plurality of magazines 27; Slide unit motor 28 drives sorting suction nozzle 26 by electric machine support and moves, and makes sorting suction nozzle 26 move to the top of different magazine 27, thereby the wafer that grasps is positioned in the different magazine 27.
The technique effect that the utility model can reach is:
The utility model can be realized the full-automatic sorting of quartz wafer, and charging, measurement and sorting can improve the speed of wafer thickness measuring significantly all by separate electrical motor control, improve the efficiency of separation, reduce human cost.
The utility model is measured the thickness of wafer by the mode of electrical quantity, can be accurate to 1um, and production capacity and the wafer passing rate of enterprise all had greatly improved.
Description of drawings
Below in conjunction with the drawings and specific embodiments the utility model is described in further detail:
Fig. 1 is the schematic diagram of the utility model quartz wafer thickness sorting machine;
Fig. 2 is the schematic diagram of material loading module of the present utility model;
Fig. 3 is the schematic diagram of getting the material module of the present utility model;
Fig. 4 is the schematic diagram of thickness measure module of the present utility model;
Fig. 5 is the schematic diagram of sorting module of the present utility model.
Description of reference numerals among the figure:
1 is the material loading module, and 2 for getting the material module,
3 are the thickness measure module, and 4 is display screen,
5 are the sorting module, and 6 is deck plate,
7 is underframe, and 8 is the sheet box plate,
9 is film magazine, and 10 are the suction of film magazine magnet and piece,
11 is line slideway, and 12 is ball screw,
13 is the material loading motor, and 14 are the reception optic module,
15 for getting the material motor, and 16 for getting the sheet arm,
17 is top electrode, and 18 is the launching fiber module,
19 is the measurement module base plate, and 20 is linear bearing,
21 is the test desk base plate, and 22 is bottom electrode,
23 is the differential head, and 24 is slide unit,
25 are the sorting motor, and 26 are the sorting suction nozzle,
27 is magazine, and 28 is the slide unit motor.
The specific embodiment
As shown in Figure 1, the utility model quartz wafer thickness sorting machine comprises material loading module 1, gets material module 2, thickness measure module 3, sorting module 5; Get material module 2 and comprise and get material motor 15, the output of getting material motor 15 connects the stiff end get sheet arm 16, gets material motor 15 and can drive and get sheet arm 16 around its stiff end rotation; The free end of getting sheet arm 16 is provided with top electrode 17;
One side of getting material motor 15 is provided with material loading module 1, and the opposite side of getting material motor 15 is provided with thickness measure module 3; One side of thickness measure module 3 is provided with sorting module 5;
As shown in Figure 2, material loading module 1 comprises material loading motor 13, and the output of material loading motor 13 connects ball screw 12; Ball screw 12 is connected in slide block in the strip film magazine 9 by traveling nut, and the wafers in the film magazine 9 can be moved up and down along line slideway 11; The other end of film magazine 9 is provided with film magazine magnet and inhales and piece 10, is used for the location of film magazine 9;
The bottom of film magazine 9 is provided with sheet box plate 8;
Material loading motor 13 drives ball screw 12 rotations, and the slide block that ball screw 12 drives in the film magazine 9 moves upward along line slideway 11, thereby the wafer in the film magazine 9 is upwards sent.
As shown in Figure 3, the both sides, top of material loading module 1 are respectively arranged with the launching fiber module 18 of mutual correspondence and receive optic module 14; When the movement of wafers in the film magazine 9 to the top wafer of film magazine 9 just in time is in launching fiber module 18 and receive between the optic module 14, material loading motor 13 stops, get 15 drivings of material motor and get sheet arm 16 around its stiff end rotation, when the free end of getting sheet arm 16 moves to when getting material station (get material station namely get the free end of sheet arm 16 directly over film magazine 9), the wafer that grasps in film magazines 9 by its free-ended top electrode 17.
As shown in Figure 4, thickness measure module 3 comprises bottom electrode 22, bottom electrode 22 be positioned at the measurement station of getting sheet arm 16 (measure free end that station namely gets sheet arm 16 directly over bottom electrode 22, this moment top electrode 17 with bottom electrode 22 over against); Bottom electrode 22 is fixedly set on the test desk base plate 21, and test desk base plate 21 connects measurement module base plate 19 by linear bearing 20; One side of bottom electrode 22 is provided with for the differential head 23 of regulating bottom electrode 22 height; Upper and lower electrode 17,22 connects PC by holding wire; PC connects display screen 4 by cable;
When the free end of getting sheet arm 16 moves to when measuring station, wafer carries out thickness measure by upper and lower electrode 17,22 π network frequency measurement mode to wafer at this moment between top electrode 17 and bottom electrode 22.
As shown in Figure 5, sorting module 5 comprises sorting motor 25, and the output of sorting motor 25 is provided with sorting suction nozzle 26, and sorting motor 25 drives sorting suction nozzle 26 and grasps wafer from bottom electrode 22; Sorting motor 25 is movably set on the slide unit 24 by electric machine support, and slide unit motor 28 drive motors supports move along the length direction of slide unit 24; The below, zone of action of sorting suction nozzle 26 is provided with a plurality of magazines 27; Magazine 27 is fixedly set on the deck plate 6; Deck plate 6 is realized supporting by underframe 7;
Slide unit motor 28 drives sorting suction nozzle 26 by electric machine support and moves, and makes sorting suction nozzle 26 move to the top of different magazine 27, thereby the wafer that grasps is positioned in the different magazine 27.
The course of work of the present utility model is as follows:
Measured workpiece is put into the film magazine 9 of material loading module 1; Start material loading motor 13, make material loading motor 13 drive ball screw 12 rotations, the slide block that ball screw 12 drives in the film magazine 9 moves upward along line slideway 11, thereby the wafer in the film magazine 9 is upwards sent; To get the launching fiber module 18 of material on the module 2 when sheltering from light between the reception optic module 14 when the wafer that material loading module 1 is served, material loading motor 13 stops;
Start and to get material motor 15, get material motor 15 and drive and get sheet arm 16 and rotate, be positioned at when getting the material station when getting sheet arm 16, the wafer that will deliver to the position by top electrode 17 grasps; Get sheet arm 16 backward rotation, make and get sheet arm 16 and move to the measurement station, thereby wafer is sent on the bottom electrode 22 in the thickness measure module 3;
By cooperating of top electrode 17 and following motor 22, adopt electrometric method that wafer is carried out thickness measure, and the electrical quantity of wafer is delivered to backstage PC calculate;
Sorting suction nozzle 26 on the sorting module 5 grasps the wafer on the bottom electrode 22, and according to the result of calculation of PC, under the cooperation of slide unit 24 and sorting motor 25, wafer is put into corresponding magazine 27;
One-tenth-value thickness 1/10 in the magazine 27 and quantity can arrange at display screen 4;
Under stopped status, magazine 27 can take out batch turning separately.

Claims (6)

1. a quartz wafer thickness sorting machine is characterized in that: comprise material loading module (1), get material module (2), thickness measure module (3), sorting module (5); Get the material module (2) comprise get the material motor (15), the output of getting material motor (15) connects gets the stiff end of sheet arm (16), get material motor (15) and can drive and get sheet arm (16) around the rotation of its stiff end, the free end of getting sheet arm (16) is switched getting between material station and the measurement station; The free end of getting sheet arm (16) is provided with top electrode (17);
One side of getting material motor (15) is provided with material loading module (1), and the opposite side of getting material motor (15) is provided with thickness measure module (3); One side of thickness measure module (3) is provided with sorting module (5);
Get material module (2) and give thickness measure module (3) by the wafer transferring of getting sheet arm (16) material loading module (1) being sent here, sorting module (5) is carried out sorting according to the measurement result of thickness measure module (3) to wafer.
2. quartz wafer thickness sorting machine according to claim 1, it is characterized in that: described material loading module (1) comprises material loading motor (13), the output of material loading motor (13) connects ball screw (12); Ball screw (12) is connected in the interior slide block of film magazine (9) by traveling nut, and the wafer in the film magazine (9) can be moved up and down along line slideway (11); Material loading motor (13) drives ball screw (12) rotation, and the slide block that ball screw (12) drives in the film magazine (9) moves upward along line slideway (11), thereby the wafer in the film magazine (9) is upwards sent.
3. quartz wafer thickness sorting machine according to claim 2 is characterized in that: the other end of described film magazine (9) is provided with film magazine magnet and inhales and piece (10), for the location of film magazine (9).
4. quartz wafer thickness sorting machine according to claim 1 is characterized in that: the both sides, top of described material loading module (1) are respectively arranged with the launching fiber module (18) of mutual correspondence and receive optic module (14); When the movement of wafers in the film magazine (9) to the top wafer of film magazine (9) just in time is in launching fiber module (18) and receive between the optic module (14), material loading motor (13) stops, get material motor (15) driving and get sheet arm (16) around its stiff end rotation, get material during station when the free end of getting sheet arm (16) moves to, grasp wafer in film magazine (9) by its free-ended top electrode (17).
5. quartz wafer thickness sorting machine according to claim 1, it is characterized in that: described thickness measure module (3) comprises bottom electrode (22), bottom electrode (22) is positioned at the measurement station of getting sheet arm (16); Bottom electrode (22) is fixedly set on the test desk base plate (21), and test desk base plate (21) connects measurement module base plate (19) by linear bearing (20); One side of bottom electrode (22) is provided with for the differential head (23) of regulating bottom electrode (22) height;
When the free end of getting sheet arm (16) moved to the measurement station, wafer was positioned between top electrode (17) and the bottom electrode (22), and carry out thickness measure by upper and lower electrode (17,22) to wafer this moment.
6. quartz wafer thickness sorting machine according to claim 1, it is characterized in that: described sorting module (5) comprises sorting motor (25), the output of sorting motor (25) is provided with sorting suction nozzle (26), and sorting motor (25) drives sorting suction nozzle (26) and grasps wafer from bottom electrode (22); Sorting motor (25) is movably set on the slide unit (24) by electric machine support, and slide unit motor (28) drive motors support is along the length direction motion of slide unit (24); The below, zone of action of sorting suction nozzle (26) is provided with a plurality of magazines (27);
It is mobile that slide unit motor (28) drives sorting suction nozzle (26) by electric machine support, makes sorting suction nozzle (26) move to the top of different magazines (27), thereby the wafer that grasps is positioned in the different magazine (27).
CN 201320057282 2013-02-01 2013-02-01 Thickness sorting machine of quartz wafers Active CN203030546U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201320057282 CN203030546U (en) 2013-02-01 2013-02-01 Thickness sorting machine of quartz wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 201320057282 CN203030546U (en) 2013-02-01 2013-02-01 Thickness sorting machine of quartz wafers

Publications (1)

Publication Number Publication Date
CN203030546U true CN203030546U (en) 2013-07-03

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Country Status (1)

Country Link
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103056114A (en) * 2013-02-01 2013-04-24 浙江大学台州研究院 Quartz crystal wafer thickness sorting machine and method
CN104772288A (en) * 2015-04-20 2015-07-15 浙江海洋学院 Quartz wafer angle sorting machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103056114A (en) * 2013-02-01 2013-04-24 浙江大学台州研究院 Quartz crystal wafer thickness sorting machine and method
CN104772288A (en) * 2015-04-20 2015-07-15 浙江海洋学院 Quartz wafer angle sorting machine

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CP02 Change in the address of a patent holder

Address after: Truman town Yuhuan County Taizhou city Zhejiang province 317605 Hu Xing Industrial Park (Wu Jiaduan) Chu Chau talent dream factory

Patentee after: Research Institute of Zhejiang University-Taizhou

Address before: 317600 Yuhuan County Zhejiang Automobile & Motorcycle Industrial Zone Zhejiang Taizhou Motorcycle & motorcycle Research Institute

Patentee before: Research Institute of Zhejiang University-Taizhou

C56 Change in the name or address of the patentee