CN202996901U - 一种在pcb表面直接点胶封装的led座 - Google Patents

一种在pcb表面直接点胶封装的led座 Download PDF

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CN202996901U
CN202996901U CN 201220258631 CN201220258631U CN202996901U CN 202996901 U CN202996901 U CN 202996901U CN 201220258631 CN201220258631 CN 201220258631 CN 201220258631 U CN201220258631 U CN 201220258631U CN 202996901 U CN202996901 U CN 202996901U
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chips
pad
utility
chip
pcb
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CN 201220258631
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朱衡
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Hunan Yuegang Mookray Industrial Co Ltd
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ANHUI ZHONGHEDA OPTOELECTRONIC Co Ltd
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Abstract

本实用新型公开了一种在PCB表面直接点胶封装的LED座，包括有PCB板，PCB板上设有多个绑定芯片的焊盘每个焊盘周围丝印有一个围墙胶圈，围墙胶圈内的焊盘上绑定有芯片，芯片上还设有一层硅胶。本实用新型即可使制作工艺简单化，又可节约材料及人工成本，并且芯片直接贴到PCB板上，散热效果佳。

Description

一种在PCB表面直接点胶封装的LED座
技术领域
本实用新型主要涉及LED灯具领域，尤其涉及一种在PCB表面直接点胶封装的LED座。 
背景技术
LED灯具的制作其传统方法是先做好SMD LED，然后再将SMD LED通过贴片或烙铁焊接的工艺固定到PCB板上，形成LED灯具的光源。其制作过程周期较长、成本较高。 
实用新型内容
本实用新型目的就是为了弥补已有技术的缺陷，提供一种不需要SMD LED的在PCB表面直接点胶封装的LED座。 
本实用新型是通过以下技术方案实现的： 
一种在PCB表面直接点胶封装的LED座，包括有PCB板，所述的PCB板上设有多个绑定芯片的焊盘，其特征在于：所述的每个焊盘周围丝印有一个围墙胶圈，所述的围墙胶圈内的焊盘上绑定有芯片，芯片上还设有一层硅胶。 
所述的硅胶通过自动点胶机点入围墙胶圈内的芯片上。 
本实用新型的原理是： 
本实用新型不需要SMD LED，直接在PCB板上绑定芯片的焊盘周围丝印有一个围墙胶圈，形成一个容硅胶的空间，以替代SMD LED支架；再在围墙胶圈内的焊盘上绑定芯片；将配好荧光粉的硅胶用自动点胶机按均匀的胶量点入围墙胶圈内，烘干即可形成灯具的LED光源。 
本实用新型的优点是： 
本实用新型即可使制作工艺简单化，又可节约材料及人工成本，并且芯片直接贴到PCB板上，散热效果佳。 
附图说明
图1为本实用新型的结构示意图。 
图2为本实用新型的剖视图。 
具体实施方式
如图1所示，一种在PCB表面直接点胶封装的LED座，包括有PCB板1，PCB 板1上设有多个绑定芯片的焊盘，每个焊盘周围丝印有一个围墙胶圈2，围墙胶圈2内的焊盘上绑定有芯片3，芯片3上还设有一层硅胶4。 
硅胶通过自动点胶机点入围墙胶圈内的芯片上。 

Claims (2)

1.一种在PCB表面直接点胶封装的LED座，包括有PCB板，所述的PCB板上设有多个绑定芯片的焊盘，其特征在于：所述的每个焊盘周围丝印有一个围墙胶圈，所述的围墙胶圈内的焊盘上绑定有芯片，芯片上还设有一层硅胶。
2.根据权利要求1所述的一种在PCB表面直接点胶封装的LED座，其特征在于：所述的硅胶通过自动点胶机点入围墙胶圈内的芯片上。 
CN 201220258631 2012-06-02 2012-06-02 一种在pcb表面直接点胶封装的led座 Expired - Lifetime CN202996901U (zh)

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CN 201220258631 CN202996901U (zh) 2012-06-02 2012-06-02 一种在pcb表面直接点胶封装的led座

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CN 201220258631 CN202996901U (zh) 2012-06-02 2012-06-02 一种在pcb表面直接点胶封装的led座

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CN202996901U true CN202996901U (zh) 2013-06-12

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106067510A (zh) * 2016-07-28 2016-11-02 马建芳 一种基于smt贴片工艺固晶的led光源应用模组

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106067510A (zh) * 2016-07-28 2016-11-02 马建芳 一种基于smt贴片工艺固晶的led光源应用模组

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C14 Grant of patent or utility model
GR01 Patent grant
TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20170714

Address after: 246000 Anqing science and Technology Park, Huaining Industrial Park, Anhui, China, No. nine

Patentee after: Zhu Heng

Address before: Huaining science and Technology Park, Anqing, Anhui

Patentee before: Anhui Zhongheda Optoelectronic Co., Ltd.

TR01 Transfer of patent right
TR01 Transfer of patent right

Effective date of registration: 20190123

Address after: 415100 Guanxi Town, Dingcheng District, Changde City, Hunan Province (Jinan Road, Changde High-tech Industrial Development Zone)

Patentee after: Hunan Hong Kong and Hong Kong Ke Ye Industrial Co., Ltd.

Address before: 246000 Weijiu Science and Technology Pioneer Park, Huaining Industrial Park, Anqing City, Anhui Province

Patentee before: Zhu Heng

CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20130612