CN202996825U - 一种迷你模塑封装手机卡 - Google Patents

一种迷你模塑封装手机卡 Download PDF

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CN202996825U
CN202996825U CN2012207050830U CN201220705083U CN202996825U CN 202996825 U CN202996825 U CN 202996825U CN 2012207050830 U CN2012207050830 U CN 2012207050830U CN 201220705083 U CN201220705083 U CN 201220705083U CN 202996825 U CN202996825 U CN 202996825U
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carrier band
chip
mobile phone
function pads
card
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杨辉峰
蒋晓兰
唐荣烨
马文耀
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SHANGHAI CHANGFENG INTELLIGENT CARD CO Ltd
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    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
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    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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    • H01L2924/181—Encapsulation

Abstract

本实用新型公开了一种迷你模塑封装手机卡，所述手机卡包括手机芯片、承载手机芯片的载带以及模塑体，载带包括芯片承载区域和若干功能焊盘，手机芯片安置在载带的芯片承载区域上，手机芯片上功能焊盘与载带上的对应功能焊盘电连接，模塑体对手机芯片和载带封装形成手机卡，载带为金属载带，封装形成的手机卡的长宽尺寸为5mm*6mm，厚度尺寸为0.5mm-0.9mm。该手机卡的尺寸比第四种规格（4FF）卡的尺寸还小，并且该手机卡集成接触式智能卡功能与非接触式智能卡功能，并获得高可靠性的产品。

Description

一种迷你模塑封装手机卡
技术领域
本实用新型涉及一种芯片及集成电路封装技术，特别涉及一种迷你手机智能卡。
背景技术
随着集成电路封装技术的不断进步，集成电路的集成度日益提高，功能越来越丰富。对于不断出现的新应用需求，要求集成电路封装企业能设计出新型的封装形式来配合新的需求。
目前，传统的手机智能卡的标准依然采用SIM卡和UIM卡标准，其存在尺寸较大、工艺繁琐、材料成本高、生产成本高等缺点；将来的手机卡越来越趋向于小型化、集成化等特点，传统的手机智能卡就不能有效发挥其性能，势必需要通过新的手机智能卡来实现。因此，一种迷你模塑封装手机卡的开发迫在眉睫。
目前，第四种规格（4FF）卡宽12.3毫米、高8.8毫米、厚0.67毫米，比目前使用的SIM卡尺寸小了40%，但是第四种规格手机卡在制作完成后仅能够实现接触式智能卡功能，如何实现手机卡集成接触式智能卡功能与非接触式智能卡功能也是本领域亟需解决的问题。
实用新型内容
本实用新型针对现有封装工艺封装成的手机智能卡尺寸较大、工艺繁琐、材料成本高、生产成本高等问题，而提供一种迷你模塑封装手机卡，该手机卡的尺寸比第四种规格（4FF）卡的尺寸还小，并且该手机卡集成接触式智能卡功能与非接触式智能卡功能，并获得高可靠性的产品。
为了达到上述目的，本实用新型采用如下的技术方案：
一种迷你模塑封装手机卡，所述手机卡包括手机芯片、承载手机芯片的载带以及模塑体，所述载带包括芯片承载区域和若干功能焊盘，所述手机芯片安置在载带的芯片承载区域上，手机芯片上功能焊盘与载带上的对应功能焊盘电连接，所述模塑体对手机芯片和载带封装形成手机卡，所述载带为金属载带，封装形成的手机卡的长宽尺寸为5mm*6mm，厚度尺寸为0.5mm-0.9mm。
在手机卡的优选方案中，所述载带为铜质载带或铜合金载带。
进一步的，所述芯片承载区域和功能焊盘的边缘为半蚀刻结构。
进一步的，所述载带包括8个相互独立的功能焊盘，其中六个接触式功能焊盘和两个非接触式功能焊盘。
再进一步的，所述六个接触式功能焊盘平均分成两组，且两组接触式功能焊盘对称分布在芯片承载区域水平或者垂直方向上的两侧，而两个非接触式功能焊盘对称分布在芯片承载区域垂直方向或水平方向上的两侧。
再进一步的，所述接触式功能焊盘为方形，且一对称边为圆弧形；所述非接触式功能焊盘为方形。
利用本实用新型提供的方案所形成的迷你模塑封装手机卡，其尺寸比目前的第四种规格（4FF）卡可达到的尺寸更小，可达到卡宽6毫米、高5毫米、厚0.5毫米的效果。并且本实用新型提供的方案将以确保向后兼容现有SIM卡的方式制定，并继续提供与目前使用卡相同的功能。
同时本实用新型提供的封装工艺其高效稳定，并且其能够适用于集成接触式智能卡功能与非接触式智能卡功能的智能手机卡生产，封装形成的手机卡具有小型化、集成化等特点，极大地推动全球手机卡行业发展，具有较好的应用前景。
附图说明
以下结合附图和具体实施方式来进一步说明本实用新型。
图1为本实用新型手机卡的内部结构示意图；
图2为图1沿A-A方向的剖视图；
图3为本实用新型长带状载带的示意图。
具体实施方式
为了使本实用新型实现的技术手段、创作特征、达成目的与功效易于明白了解，下面结合具体图示，进一步阐述本实用新型。
参见图1和2，本实用新型提供的迷你模塑封装手机卡100，其的长宽尺寸为5mm*6mm，厚度尺寸为0.5mm-0.9mm，比比目前的第四种规格（4FF）卡可达到的尺寸更小，达到相应的微型化。同时该手机卡不仅具有现有手机卡的一般功能，其还集成接触式智能卡功能与非接触式智能卡功能。
为此，本实用新型提供的手机卡100主要包括手机卡芯片101、载带102以及模塑封装体103。
手机卡芯片101为手机卡的核心，其具有8个功能焊盘，具体为6个接触式功能焊盘101a和2个非接触式功能焊盘101b，用于实现芯片的接触式功能和非接触式功能。
载带102作为手机卡芯片的承载装置，其整体有金属材质制成，具体可以为铜或者铜合金材料制成。为了实现手机卡芯片配合，载带102包括一芯片承载区域102a和8个功能焊盘。芯片承载区域102a用于安置手机卡芯片101，而8个功能焊盘与手机芯片的功能焊盘对应，具体为6个接触式功能焊盘102b和2个非接触式功能焊盘102c，分别通过金线104与手机卡芯片上的6个接触式功能焊盘101a和2个非接触式功能焊盘101b电性相接，由此实现手机卡芯片的承载。
为了保证载带102承载手机卡芯片101的可靠性，载带102上的芯片承载区域102a位于载带的中部，其大小形状与手机卡芯片相配合。
6个接触式功能焊盘102b和2个非接触式功能焊盘102c对手机卡芯片上的功能焊盘相对应的分布在芯片承载区域102a的四周。具体的，6个接触式功能焊盘102b平均分成两组对称分布在芯片承载区域102a左右两侧（如图1所示），并且每一组中的三个接触式功能焊盘102b之间匀距分布。2个非接触式功能焊盘102c对称分布在芯片承载区域102a上下两侧（如图1所示）。
再者，载带上的接触式功能焊盘102b为方形，并且一对称边为圆弧形；非接触式功能焊盘102c为方形，具体为长方形。
在载带的芯片承载区域102a、接触式功能焊盘102b以及非接触式功能焊盘102c的边缘处都设有半蚀刻结构，这样能够在封装过程加强模塑料与载带结合力，保证封装后手机卡的稳定性。
参见图3，为了便于后续封装的自动化操作和批量封装，若干载带102之间采用阵列分布的方式相互连接形成长带状的载带200。
模塑封装体103用于封装手机卡芯片101，将其与载带102封装在一起，形成一相应的手机卡。对于封装后的形状可根据实际需求而定，在本实用新型中，封装后的手机卡为长宽尺寸为5mm*6mm，厚度尺寸为0.5mm-0.9mm的方体结构。
以上显示和描述了本实用新型的基本原理、主要特征和本实用新型的优点。本行业的技术人员应该了解，本实用新型不受上述实施例的限制，上述实施例和说明书中描述的只是说明本实用新型的原理，在不脱离本实用新型精神和范围的前提下，本实用新型还会有各种变化和改进，这些变化和改进都落入要求保护的本实用新型范围内。本实用新型要求保护范围由所附的权利要求书及其等效物界定。

Claims (6)

1.一种迷你模塑封装手机卡，所述手机卡包括手机芯片、承载手机芯片的载带以及模塑体，所述载带包括芯片承载区域和若干功能焊盘，所述手机芯片安置在载带的芯片承载区域上，手机芯片上功能焊盘与载带上的对应功能焊盘电连接，所述模塑体对手机芯片和载带封装形成手机卡，其特征在于，所述载带为金属载带，封装形成的手机卡的长宽尺寸为5mm*6mm，厚度尺寸为0.5mm-0.9mm。
2.根据权利要求1所述的一种迷你模塑封装手机卡，其特征在于，所述载带为铜质载带或铜合金载带。
3.根据权利要求1所述的一种迷你模塑封装手机卡，其特征在于，所述芯片承载区域和功能焊盘的边缘为半蚀刻结构。
4.根据权利要求1至3中任一项所述的一种迷你模塑封装手机卡，其特征在于，所述载带包括8个相互独立的功能焊盘，其中六个接触式功能焊盘和两个非接触式功能焊盘。
5.根据权利要求4所述的一种迷你模塑封装手机卡，其特征在于，所述六个接触式功能焊盘平均分成两组，且两组接触式功能焊盘对称分布在芯片承载区域水平或者垂直方向上的两侧，而两个非接触式功能焊盘对称分布在芯片承载区域垂直方向或水平方向上的两侧。
6.根据权利要求4所述的一种迷你模塑封装手机卡，其特征在于，所述接触式功能焊盘为方形，且一对称边为圆弧形；所述非接触式功能焊盘为方形。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103887271A (zh) * 2012-12-19 2014-06-25 上海长丰智能卡有限公司 一种迷你模塑封装手机卡以及封装方法
CN104408513A (zh) * 2014-08-27 2015-03-11 北京中电华大电子设计有限责任公司 一种带可扩展焊盘的智能卡载带

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103887271A (zh) * 2012-12-19 2014-06-25 上海长丰智能卡有限公司 一种迷你模塑封装手机卡以及封装方法
CN104408513A (zh) * 2014-08-27 2015-03-11 北京中电华大电子设计有限责任公司 一种带可扩展焊盘的智能卡载带

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