CN202996824U - Minisize moulding packaging handset card framework and framework ribbon - Google Patents
Minisize moulding packaging handset card framework and framework ribbon Download PDFInfo
- Publication number
- CN202996824U CN202996824U CN 201220708366 CN201220708366U CN202996824U CN 202996824 U CN202996824 U CN 202996824U CN 201220708366 CN201220708366 CN 201220708366 CN 201220708366 U CN201220708366 U CN 201220708366U CN 202996824 U CN202996824 U CN 202996824U
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- China
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- framework
- mobile phone
- phone card
- bonding wires
- chip bearing
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- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The utility model discloses a minisize moulding packaging handset card framework and a framework ribbon. The framework comprises a framework body which has a dimension of 5mm*6mm and a thickness of 0.125mm-0.25mm. The framework ribbon is a banding framework ribbon formed by a plurality of frameworks connected in an array assignment mode. According to the scheme of the utility model, the handset card function can be maximized and meanwhile the dimension can be minimized; material costs can be saved to a larger degree and most present devices can be utilized to perform large batch production.
Description
Technical field
The utility model relates to a kind of chip and integrated antenna package technology, particularly a kind of mini mobile phone intelligent card framework.
Background technology
Along with the continuous progress of integrated antenna package technology, the integrated level of integrated circuit improves day by day, and function is more and more abundanter.For the new application demand of continuous appearance, require integrated antenna package enterprise can design novel packing forms and coordinate new demand.
At present, the standard of traditional mobile phone intelligent card still adopts SIM card and UIM card standard, and there are the shortcomings such as size is large, technique is loaded down with trivial details, material cost is high, production cost is high in it; Mobile phone card in the future more and more trends towards miniaturization, the characteristics such as integrated, and traditional mobile phone intelligent card just can not effectively be brought into play its performance, is bound to realize by new mobile phone intelligent card.
People have developed the 4th kind of specification (4FF) card for this reason, this card is wide 12.3 millimeters, high 8.8 millimeters, thick 0.67 millimeter, although the card of this specification than the SIM card size of using at present little 40%, it can't satisfy the long term growth trend of Mobile phone card miniaturization.For this reason, exploitation is a kind of is that this area is needed the problem that will solve badly for microminiaturized Mobile phone card more.Only can realize the contact intelligent card function after also having present the 4th kind of standard mobile phone to be stuck in to complete, how realize that Mobile phone card integrated touch intelligent card function and non-contact intelligent card function are also the problems that this area is needed solution badly.
Due to the size of Mobile phone card and function integrated mainly by the realization that brings that is used for carries chips, this shows that design is a kind of to can be used in encapsulation to form the less and carrier band integrated multi-purpose Mobile phone card of size be the problem that this area is needed solution badly.
The utility model content
The problems such as the utility model is large for the cell phone intelligent card size that existing carrier band encapsulation forms, manufacture craft is loaded down with trivial details, production cost is high and integrated functionality is few, and a kind of miniature molded packages Mobile phone card framework is provided.The mobile phone khaki size of utilizing the encapsulation of this framework to form is less than the present accessible size of the 4th kind of specification (4FF) card, can reach card wide 6 millimeters, high 5 millimeters, thick 0.5 millimeter, and integrated touch intelligent card function and non-contact intelligent card function.
In order to achieve the above object, the utility model adopts following technical scheme:
A kind of miniature molded packages Mobile phone card framework, described framework comprises a frame body, described frame body comprises that a chip bearing is regional and some bonding wires are regional, separately between described chip bearing zone and some bonding wires zones separate setting, and each isolated area is by outside dowel and frame body side edge; Described frame body is of a size of 5mm*6mm, and thickness is 0.125mm-0.25mm.
In preferred embodiment of the present utility model, described framework is by copper or Cu alloy material punch forming.
Further, described some bonding wires zone comprises that 6 contact bonding wires are regional and 2 contactless bonding wires are regional, described 6 contact bonding wire zones are divided into two groups, and two winding touch bonding wire zones are symmetrically distributed in the both sides on chip bearing zone level or vertical direction, and 2 contactless bonding wire zones are symmetrically distributed in the both sides on chip bearing regions perpendicular direction or horizontal direction.
Further, the edge in described chip bearing zone and some bonding wires zones is provided with and etches partially structure and engraved structure.
Further, described engraved structure comprises ellipse, semicircle, irregular cycle, rectangle, and the combination of above figure.
As the second purpose of the present utility model, the utility model also provides a kind of miniature molded packages Mobile phone card frame strip of being convenient to encapsulate, described frame strip comprises some said frame, is connected to form banded frame strip with the array arrangement mode between described some frameworks.
Prevent when further, the back side of described frame strip is pasted with for the encapsulation of rear road flash heat-pesistant thin film.
Utilize the mobile phone khaki size of the packaged formation of framework that the utility model provides less than the present accessible size of the 4th kind of specification (4FF) card, can reach card wide 6 millimeters, high 5 millimeters, thick 0.5 millimeter; Also integrated touch intelligent card function and non-contact intelligent card function of this Mobile phone card simultaneously.
The utility model can be realized Mobile phone card miniaturization, multifunctional integrated simultaneously, greatly promotes global Mobile phone card industry development, has application prospect preferably.
Description of drawings
Further illustrate the utility model below in conjunction with the drawings and specific embodiments.
Fig. 1 is the utility model middle frame schematic diagram;
Fig. 2 is the cutaway view of the A-A direction of Fig. 1;
Fig. 3 is the structural representation of the utility model frame strip.
Embodiment
For technological means, creation characteristic that the utility model is realized, reach purpose and effect is easy to understand, below in conjunction with concrete diagram, further set forth the utility model.
Referring to Fig. 1, a kind of miniature molded packages Mobile phone card framework 100 that the utility model provides, its overall dimension is 5mm*6mm, reaches small-sized mini effect.This framework 100 comprises a frame body 101, and frame body 101 comprises a chip bearing zone 102 and some bonding wires zone 103.
Wherein, chip bearing zone 102 is used for the chip of carrying smart mobile phone card; When bonding wire zone 103 is used for encapsulation formation Mobile phone card, realize being electrically connected to the chip functions pad.
For making mobile phone intelligent card integrated touch intelligent card function and non-contact intelligent card function, this bonding wire zone 103 comprises contact function bonding wire zone 103a and contactless function bonding wire zone 103b, is electrically connected to non-contact function pad and contact function pads on chip respectively.
Influence each other between bonding wire zone 103 and chip bearing zone 102, guarantee the stability of the Mobile phone card that encapsulation forms, separate separation setting between some bonding wires zone 103 and chip bearing zone 102.
In the utility model, can decide according to the function pads of the chip of carrying on chip bearing zone 102 for the quantity in bonding wire zone 103 and concrete distributing position.As shown in Figure 1, have bonding wire zone, 102 and 8,1 chip bearing zone 103 in framework of the present utility model, its chip bearing zone 102 is positioned at the middle part of whole framework 100; And 8 bonding wire zones 103 have 6 contact function bonding wires zone 103a and two contactless function bonding wire zone 103b, and 6 contact function bonding wire zone 103a are divided into two groups, and be symmetrically distributed in the left and right sides (as position in Fig. 1) in chip bearing zone 102, two contactless function bonding wire zone 103b are symmetrically distributed in the both sides up and down (as position in Fig. 1) in chip bearing zone 102.
Further, in order to make in rear road encapsulation process the adhesion that increases moulding compound and framework, the edge in chip bearing regional 102 and some bonding wires zone 103 is provided with irregular structure 104 and the engraved structure 105 of etching partially.
Wherein engraved structure 105 is arranged on the two ends up and down in the two winding touch function bonding wire zones that are positioned at 102 left and right sides, chip bearing zone.Make it at the be combined with different-effect of zones of different to moulding compound, its shape comprises ellipse, semicircle, irregular cycle, rectangle, and the combination of above figure.
In selection, frame body 101 adopts thickness to adopt copper product or the Cu alloy material that is fit to Packaging Industry, and stamping forming thickness is 0.125mm-0.25mm.For this thickness, in chip bearing zone 102 and the gauge that etches partially structure 104 of the edge setting in some bonding wires zone 103 be 0.05mm-0.125mm.Guarantee thus the effect of follow-up encapsulation.
For ease of the automation encapsulation of industry, the utility model also provides a kind of frame strip 200 that existing packaging technology is carried out the automation encapsulation of being convenient on the basis of said frame 100.
Referring to Fig. 3, frame strip 200 comprises some said frame 100, and these some frameworks 100 are connected to form banded frame strip 200 with the array arrangement mode, and each framework 100 is by outside dowel 203 and other frame body 101 side edge.
Corresponding according to the array arrangement mode location hole 201 that is provided with on this frame strip 200 is convenient to follow-up lay chip, routing, encapsulation and cutting etc.
Arrange with which kind of array for frame strip 200 middle frames 100, do not limited herein, it can be decided according to the packaging technology of reality.
The concrete manufacturing process of metal framework band is as follows:
1. the egative film (the two-layer egative film in up and down) that will set up figure is attached on the metal framework band, exposes, develops, to demonstrate the figure that needs reservation;
2. the metal framework band is positioned over etching area, carries out simultaneously up and down the corrosion of etchant, keep needed metal part, wherein etch partially the metal segment thickness that keeps and be of a size of 0.05mm-0.125mm;
3. the metal framework band of etching being completed cleans, paste at the back side of framework at last prevent when being used for the encapsulation of rear road flash heat-pesistant thin film 202(as shown in Figure 3).
The mobile phone intelligent card that utilizes the said frame encapsulation to form not only can make mobile phone intelligent card reach small-sized miniaturization, also makes mobile phone intelligent card integrated touch intelligent card function and non-contact intelligent card function.
Above demonstration and described basic principle of the present utility model, principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; that describes in above-described embodiment and specification just illustrates principle of the present utility model; under the prerequisite that does not break away from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall in claimed the utility model scope.The claimed scope of the utility model is defined by appending claims and equivalent thereof.
Claims (7)
1. miniature molded packages Mobile phone card framework, described framework comprises a frame body, described frame body comprises that a chip bearing is regional and some bonding wires are regional, separately between described chip bearing zone and some bonding wires zones separate setting, and each isolated area is by outside dowel and frame body side edge; It is characterized in that, described frame body is of a size of 5mm*6mm, and thickness is 0.125mm-0.25mm.
2. a kind of miniature molded packages Mobile phone card framework according to claim 1, it is characterized in that, described some bonding wires zone comprises that 6 contact bonding wires are regional and 2 contactless bonding wires are regional, described 6 contact bonding wire zones are divided into two groups, and two winding touch bonding wire zones are symmetrically distributed in the both sides on chip bearing zone level or vertical direction, and 2 contactless bonding wire zones are symmetrically distributed in the both sides on chip bearing regions perpendicular direction or horizontal direction.
3. a kind of miniature molded packages Mobile phone card framework according to claim 1, is characterized in that, the edge in described chip bearing zone and some bonding wires zones is provided with and etches partially structure and engraved structure.
4. a kind of miniature molded packages Mobile phone card framework according to claim 3, is characterized in that, described engraved structure comprises ellipse, semicircle, irregular cycle, rectangle, and the combination of above figure.
5. the described a kind of miniature molded packages Mobile phone card framework of any one according to claim 1 to 4, is characterized in that, described framework is by copper or Cu alloy material punch forming.
6. a miniature molded packages Mobile phone card frame strip of being convenient to encapsulate, is characterized in that, described frame strip comprises the described framework of some claim 1 to 5 any one, is connected to form banded frame strip with the array arrangement mode between described some frameworks.
7. a kind of miniature molded packages Mobile phone card frame strip of being convenient to encapsulate according to claim 6, is characterized in that, the back side of described frame strip prevent when being pasted with for the encapsulation of rear road flash heat-pesistant thin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220708366 CN202996824U (en) | 2012-12-19 | 2012-12-19 | Minisize moulding packaging handset card framework and framework ribbon |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220708366 CN202996824U (en) | 2012-12-19 | 2012-12-19 | Minisize moulding packaging handset card framework and framework ribbon |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202996824U true CN202996824U (en) | 2013-06-12 |
Family
ID=48567964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220708366 Expired - Fee Related CN202996824U (en) | 2012-12-19 | 2012-12-19 | Minisize moulding packaging handset card framework and framework ribbon |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202996824U (en) |
-
2012
- 2012-12-19 CN CN 201220708366 patent/CN202996824U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130612 Termination date: 20191219 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |