CN202974005U - Heat-conducting thermal column - Google Patents
Heat-conducting thermal column Download PDFInfo
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- CN202974005U CN202974005U CN2012206901898U CN201220690189U CN202974005U CN 202974005 U CN202974005 U CN 202974005U CN 2012206901898 U CN2012206901898 U CN 2012206901898U CN 201220690189 U CN201220690189 U CN 201220690189U CN 202974005 U CN202974005 U CN 202974005U
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- heat
- condenser pipe
- plume
- heat conduction
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Abstract
The utility model discloses a heat-conducting thermal column. The heat-conducting thermal column comprises a base, wherein a boiling strengthening structure is arranged on the upper surface of the base. The heat-conducting thermal column further comprises a condenser pipe, a sealing cover and a charging tubule, wherein one end of the charging tubule is used for being inserted in the sealing cover, the other end of the charging tubule is used for sealing, the condenser pipe is assembled to form an inclosed hollow cavity under the coordination of the base, the sealing cover and the charging tubule, appropriate liquid working medium is filled in the hollow cavity, and the boiling strengthening structure of the upper surface of the base is located in the condenser pipe. By the adoption of the structure, the heat transfer effect of the thermal column can be enhanced, and the property is stable. In addition, the heat-conducting thermal column further has the advantages of being simple in manufacture technology and low in cost.
Description
Technical field
The utility model relates to hot conduction field, particularly, relates to a kind of heat conduction plume.
Background technology
The equipment developments such as computer, electronics, photoelectricity are rapid at present, and performance progressively strengthens, but volume reduces gradually.The performances such as central processing unit promote rapidly, but meanwhile a large amount of used heat produces, again because dwindling of volume produced great heat flow density.If heat can not in time distribute, high temperature will have a strong impact on life-span and the performance of chip, therefore must take effective means that the used heat of high heat flux is distributed.If the untimely derivation of loss heat of electronic unit, constantly accumulation of the heat on parts causes chip temperature to rise rapidly, and reliability and other performances sharply descend.The development and application of light emitting diode (LED) and for example is the big event of current illumination, and the life-span of LED, performance closely are connected with the good and bad of heat dissipation technology invariably, and heat radiation has become and restricts one of primary difficult problem that current high-power LED lamp develops.The heat dissipation technology of having developed at present comprises the heat dissipation technologys such as radiating fin heat radiation, fan cooling, heat pipe heat radiation, temperature-uniforming plate heat radiation.Plume heat radiation is also a kind of better heat dissipation technology, and described plume is one to include the closed cavity of liquid working substance, by vapour-liquid two phase change of working medium to reach the purpose of quick conductive.Plume is a kind of high-efficiency heat conduction device, and the plume temperature homogeneity of an excellent in design is good, and thermal resistance is less.Its capacity of heat transmission is considerably beyond metals such as copper, aluminium, can reach even thousands of times of the hundred times of copper, and plume is widely used in fields such as LED light fixture, electronic radiations at present.The evaporation ends of plume is in the plume bottom, and liquid here seethes with excitement or evaporates and takes away amount of heat, and steam discharges a large amount of latent heats of vaporization in the place's condensation of condensation tube wall.
Need heat that thermal component sheds to be transmitted to the boiling enhanced structure of plume condenser pipe bottom through the plume bottom, here violent boiling occurs because of heat absorption in liquid working substance, produces steam, in vaporescence vapor absorption a large amount of latent heats of vaporization.The latent heat of vaporization of liquid working substance considerably beyond its because of the heat that specific heat absorbs, considerable.Because vapours produces in the bottom, thus in condenser pipe inner bottom part gas density greater than top gas density.Overcome gravity by the reason Base Heat steam of density contrast and rise along condenser pipe, arrive the top condensation end, make that in pipe, whole gas density tends to balance.Condensation end place, top inner wall temperature is lower, and steam-like working medium condensation liquefaction on wall herein produces horizontal density contrast thus, and the vapours at central upper portion position is diffused into the tube wall place under the effect of density contrast, condensation occurs.Substantially under the impact of temperature in external environment at tube wall place in a stable running, keep constant or cyclically-varying lentamente, so the vapours that rises continually herein is able to condensation liquefaction constantly.In the process of condensation, absorb and be released by the latent heat of vaporization that vapours is taken top to by the bottom, these heats be dispersed into external environment via tube wall or the heat dissipation equipment that matches in.Steam-like working medium is after condensation liquefaction on the condenser pipe inwall, and liquid refrigerant is back to the bottom evaporation ends along inwall under action of gravitation.Herein liquid refrigerant is subjected to thermal evaporation more as mentioned above, forms therefrom a circulation, as long as heat is constantly absorbed by the bottom, such circulation will occur continuously for plume inside.Whole system does not have extraneous driving force in the engineering of operation, be mainly that the density contrast of top and the bottom gas and gravity are in the starting power effect.As long as to plume bottom input heat, system will move automatically after the liquid working substance heat absorption reaches boiling point, when the input heat improves, system is the dynamic equilibrium that reaches new, flow rate of liquid can improve, and bottom liquid evaporation severe degree can be aggravated, and the heat that whole system is distributed is also just larger.In addition, the plume internal system is without any mechanical moving element, and liquid and gas constantly undergo phase transition and circulate to carry heat, and this can reduce system cost, and reliability that more can Hoisting System makes system more stable.
In existing plume designs and produces process, boiling enhanced not can be good at of plume base position solves, it is former because the manufacturing process of general plume is all to carry out the making of inner ebullition strengthening surface after each component combinations such as condenser pipe and base are got up again, but boiling enhanced surface is difficult to design processing under steric requirements less on base; In addition, the plume that can see most of producer on market all can be done to strengthen to the condenser pipe inwall and process, groove structure or be similar to the sintering structure of conventional heat pipe for example, but complex process and cost are higher.Therefore, the shortcoming of existing plume is: does not strengthen should augmentation of heat transfer getting locally (1); (2) complex manufacturing technology, cost are high.
The utility model content
For the problems referred to above, it is good and make simple heat conduction plume that main purpose of the present utility model is to provide a kind of heat conductivility.
To achieve these goals, the utility model adopts following technical scheme:
A kind of heat conduction plume, comprise base, its upper surface is provided with boiling enhanced structure, also comprise condenser pipe, capping and topping up tubule, described topping up tubule one end is used for inserting capping, and the other end is used for sealing, and described condenser pipe is assembled under the cooperation of base, capping and topping up tubule and formed airtight hollow cavity, described hollow cavity inside has charged appropriate amount of fluid working medium, and the boiling enhanced structure of described base upper surface is positioned at condenser pipe.
Further, the inner surface of described condenser pipe is smooth surface, flute surfaces or is coated with nanostructured layers.
Further, described capping is elastic closure, adopts the elastic shell structure, the arc-shaped surface Glabrous thorn that it contacts with the condenser pipe tight fit.
Further, each assembling parts of described hollow cavity by welding assembly together.
Further, described boiling enhanced structure is powder sintered capillary structure, groove capillary structure, twine capillary structure, microchannel or micropin rib structure.
Compared with prior art, the utlity model has following beneficial effect:
1, the utility model is transformed the internal structure of plume, upper surface at base is provided with boiling enhanced structure, strengthens in place that should augmentation of heat transfer, even the condenser pipe inwall is not processed, also can reach desirable heat-conducting effect, greatly improve heat conduction efficiency.Because base is namely to carry out the processing of boiling enhanced structure before assembling, avoided carrying out again after the assembling the narrow and small defective of design processing space that boiling enhanced structure processing exists.
2, the inner surface of condenser pipe can be smooth surface, flute surfaces or is coated with nanostructured layers, is current material, carries out the processing of inwall after need not to assemble again and processes, and has reduced the complexity of technique, has reduced simultaneously cost.
3, heat conduction plume of the present utility model, the sealing means of elastic closure is adopted in its capping, and it makes simple and easy with respect to existing plume, greatly reduce difficulty and the cost of sealing.
In sum, the utlity model has above-mentioned plurality of advantages and practical value, no matter it all has larger improvement on product structure or function, significant progress is arranged technically, given prominence to effect and lower cost, have industrial utilization widely.
Below by drawings and Examples, the technical solution of the utility model is described in further detail.
Description of drawings
Fig. 1 is heat conduction plume textural association figure of the present utility model;
Fig. 2 is heat conduction plume STRUCTURE DECOMPOSITION figure of the present utility model;
Fig. 3 is the understructure figure of heat conduction plume of the present utility model;
Fig. 4 is the braze-welded structure schematic diagram in heat conduction plume preparation method;
Fig. 5 is processing assembling jumper bar schematic diagram used in heat conduction plume preparation method;
Fig. 6 is the operating mode modulated structure exploded view that contains the heat conduction plume;
Fig. 7 is the figure that coordinates that contains plume and fin in the operating mode lamp of heat conduction plume.
The specific embodiment
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described, should be appreciated that preferred embodiment described herein only is used for description and interpretation the utility model, and be not used in restriction the utility model.
As shown in Figure 1, 2, 3, a kind of heat conduction plume of the present utility model, comprise base 1, the upper surface of base 1 is provided with boiling enhanced structure 5, also comprises condenser pipe 2, capping 3 and topping up tubule 4, and topping up tubule 4 one ends are used for inserting capping 3, the other end is used for sealing, condenser pipe 2 is assembled under the cooperation of base 1, capping 3 and topping up tubule 4 and is formed airtight hollow cavity, and hollow cavity inside has charged appropriate amount of fluid working medium, and the boiling enhanced structure 5 of base 1 upper surface is positioned at condenser pipe 2.
Wherein, the fine copper that base 1 use thermal conductivity factor is high is made, and lower surface needs smooth smooth, makes a call to four fixing holes on base 1, is used for the fixing parts that need heat radiation; Boiling enhanced structure 5 places on base 1, the liquid refrigerant boiling is strengthened and produces a large amount of steam takes away with the form of the latent heat of vaporization used heat that the bottom needs thermal component to produce.Condenser pipe 2 is hollow cylinder, with the high material of thermal conductivity factor, to make as fine copper, working substance steam is in tube wall place's condensation and reflux under Action of Gravity Field, working medium discharges a large amount of latent heats of vaporization in this process, and the heat convection of condenser pipe 2 outer tube walls and air is derived heat.The center of capping 3 is provided with hole, and an end of topping up tubule 4 can insert in hole, and it is the pure copper tube of 6mm that topping up tubule 4 can be selected external diameter, and its effect is conveniently to charge liquid equipment plume is vacuumized and fill with liquid.
In the above-described embodiments, condenser pipe 2 can adopt existing material of the prior art, does not do complicated processing and processes, and is smooth surface (common metallic cylinder), flute surfaces or is coated with nanostructured layers as the inner wall surface of condenser pipe 2.
In the above-described embodiments, capping 3 can be adopted the elastic shell structure, the arc-shaped surface Glabrous thorn that it contacts with condenser pipe 2 tight fits, it makes material is the material that has certain elasticity and be easy to weld or otherwise be connected with the material of condenser pipe 2 sealing.As select the punching press of fine copper plate to make, the upper surface flush of external arc highest point plane and condenser pipe 2.
In the above-described embodiments, each assembling parts of hollow cavity (base 1, condenser pipe 2, capping 3 and topping up tubule 4) can be by welding assembly together.
In the above-described embodiments, described boiling enhanced structure 5 can adopt powder sintered capillary structure, groove capillary structure, twine capillary structure, microchannel or micropin rib structure.
The below describes the preparation method of above-mentioned heat conduction plume, as shown in Fig. 1-5, comprising:
(1) strengthen the boiling structure moulding process in the boiling enhanced structure 5 of upper surface processing of base 1 with copper powder sintering or other.
(2) capping 3 is placed in an end of condenser pipe 2, and topping up tubule 4 is inserted in capping 3, insertion depth is determined according to technological requirement; Particularly, wherein, the capping of capping preferred elastomeric can adopt punching press or other technique to make, and adopts jumper bar 6 elastic closure to be pushed up an end of condenser pipe 2.
(3) other end with condenser pipe 2 is placed on base 1, makes boiling enhanced structure 5 be positioned at condenser pipe 2.
(4) each assembling parts assembling is formed hollow cavity; Form hollow cavity as the connecting portion (a, b, c) of each assembling parts being welded (comprising all kinds of solderings, soldering, argon arc welding etc.) with assembling.Figure 4 shows that and use the solder brazing of braze-welding rings material to weld.Be specially, weld at a, b, c three places, overall structure is put into soldering oven carry out soldering, plume is taken out from soldering oven after good according to the soldering processes soldering.
(5) on apparatus for filling by charging appropriate liquid working substance in 4 pairs of hollow cavities of topping up tubule.
(6) hollow cavity is vacuumized, then with topping up tubule 4 exposed junction pinch ofves and adopt argon arc welding sealing, form airtight hollow cavity.
(7) polishing and anti-oxidant treatment are carried out in whole plume surface, so far plume machines.
The below sets forth the application example of heat conduction plume.
Heat conduction plume of the present utility model is widely used, as being applied in the electronic equipment or LED light fixture that contains heat abstractor.The below only should be used as the summary elaboration with regard to it in the LED bulkhead lamp capable.
As shown in Fig. 6,7, application mode is that plume 11 is inserted in the hole at fin 12 centers, and then the mode such as or tight fit gluing with heat conduction is fixed with fin 12.The miscellaneous part of LED bulkhead lamp capable is respectively: fin protective cover 7, light fixture upper cover 8, suspension hook 9, power supply 10, fin protective cover through hole 13, power supply connecting plate 14, lampshade 15, seal washer 16, great power LED integrated lamp bulb 17, lens combination 18.This example selects a great power LED integrated lamp bulb 17 as light source, by 10 power supplies of a great power LED power supply.LED bulkhead lamp capable radiator part detailed construction is the heat abstractor of heronsbill fin structure as shown in Figure 7, the high-efficiency heat conduction plume 11 in a basic utility model is inserted at the center of heronsbill.This heat abstractor is useful on the fixedly hole of adjacent component as the prop carrier of whole lamp part on it.Add plume in the LED bulkhead lamp capable after, multiple advantage is arranged.Plume and fin are combined closely, and (close-fitting and two kinds of techniques of welding are arranged) conducts to heat on fin fast by plume, and chip heat is effectively controlled; Because the capacity of heat transmission of plume itself is very strong, the up and down temperature homogeneity is high, so the fin structure temperature homogeneity of heated beam is higher than the temperature homogeneity of heated beam not, the heat-sinking capability of fin has obtained more effective utilization.
It should be noted that at last: the above only is preferred embodiment of the present utility model, be not limited to the utility model, although with reference to previous embodiment, the utility model is had been described in detail, for a person skilled in the art, it still can be modified to the technical scheme that previous embodiment is put down in writing, and perhaps part technical characterictic wherein is equal to replacement.All within spirit of the present utility model and principle, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection domain of the present utility model.
Claims (5)
1. heat conduction plume, it is characterized in that, comprise base, its upper surface is provided with boiling enhanced structure, also comprises condenser pipe, capping and topping up tubule, and described topping up tubule one end is used for inserting capping, the other end is used for sealing, described condenser pipe is assembled under the cooperation of base, capping and topping up tubule and is formed airtight hollow cavity, and described hollow cavity inside has charged appropriate amount of fluid working medium, and the boiling enhanced structure of described base upper surface is positioned at condenser pipe.
2. heat conduction plume according to claim 1, is characterized in that, the inner surface of described condenser pipe is smooth surface, flute surfaces or is coated with nanostructured layers.
3. heat conduction plume according to claim 1, is characterized in that, described capping is elastic closure, adopts the elastic shell structure, the arc-shaped surface Glabrous thorn that it contacts with the condenser pipe tight fit.
4. heat conduction plume according to claim 1, is characterized in that, each assembling parts of described hollow cavity by welding assembly together.
5. according to claim 1-4 described heat conduction plumes of any one, is characterized in that, described boiling enhanced structure is powder sintered capillary structure, groove capillary structure, twine capillary structure, microchannel or micropin rib structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206901898U CN202974005U (en) | 2012-12-13 | 2012-12-13 | Heat-conducting thermal column |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012206901898U CN202974005U (en) | 2012-12-13 | 2012-12-13 | Heat-conducting thermal column |
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| Publication Number | Publication Date |
|---|---|
| CN202974005U true CN202974005U (en) | 2013-06-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012206901898U Expired - Fee Related CN202974005U (en) | 2012-12-13 | 2012-12-13 | Heat-conducting thermal column |
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| Country | Link |
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| CN (1) | CN202974005U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103017583A (en) * | 2012-12-13 | 2013-04-03 | 中国科学院大学 | Heat conduction column, method for producing same and application |
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2012
- 2012-12-13 CN CN2012206901898U patent/CN202974005U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103017583A (en) * | 2012-12-13 | 2013-04-03 | 中国科学院大学 | Heat conduction column, method for producing same and application |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130605 Termination date: 20141213 |
|
| EXPY | Termination of patent right or utility model |