CN202949397U - Wafer for HC-49S type quartz crystal resonator - Google Patents
Wafer for HC-49S type quartz crystal resonator Download PDFInfo
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- CN202949397U CN202949397U CN 201220680477 CN201220680477U CN202949397U CN 202949397 U CN202949397 U CN 202949397U CN 201220680477 CN201220680477 CN 201220680477 CN 201220680477 U CN201220680477 U CN 201220680477U CN 202949397 U CN202949397 U CN 202949397U
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Abstract
The utility model relates to a wafer for an HC-49S type quartz crystal resonator, wherein the surface of a wafer body is provided with a silvered electrode formed through the evaporation plating process, an electrode leading-out end and a transition zone for connecting the silvered electrode with the electrode leading-out end, and the middle portion of the electrode leading-out end is provided with a non-plated zone with an opening at the side end of the wafer, such that the wafer body forms a conductive glue coverage area at the middle portion and the two side portions of the electrode leading-out end. The wafer for an HC-49S type quartz crystal resonator has the advantages in that a part of conductive glue is directly contacted with the wafer body, thereby not only not influencing the conductive performance of products, but also enhancing the bonding strength between the wafer and a base, and increasing the reliability of a crystal resonator.
Description
Technical field
The utility model relates to a kind of quartz-crystal resonator, specifically a kind of HC-49S type quartz-crystal resonator wafer.
Background technology
Quartz wafer is the main body of quartz-crystal resonator, in crystal resonator is made, need to plate one deck silver layer at the wafer part surface, electrode with the formation wafer is usually said silver-coated electrode, make crystal form inverse piezoelectric effect under the effect of electric field, its electrical property is mainly that the electrode by wafer and collocation thereof determines jointly.In order to protect wafer, be generally that wafer is placed in pedestal, with conducting resinl, wafer is fixed on pedestal, then with shell and pedestal press seal.Its firm degree direct influence the reliability of crystal resonator.
The HC-49S type quartz-crystal resonator used crystal chip of commonly using at present, as shown in Figure 1, the surperficial zone line of wafer body 1 is silver-coated electrode 2, silver-coated electrode 2 one sides are provided with transition band 3 and electrode leads to client 4.When covering the electrode leads to client zone with conducting resinl, wafer can be fixed on pedestal.The reliability and the electric conductivity that are electrically connected to conducting resinl in order to increase electrode leads to client, electrode leads to client 4 are provided with the protuberance 41 of both sides projection, with the contact area of increase with conducting resinl.Although the reliability that this design electrode leads to client is electrically connected to external electrode and electric conductivity strengthen, yet, mainly cover electrode leads to client 4, the 41(cladding region of wafer due to conducting resinl) on, conducting resinl can only contact with crystal body 1 at electrode leads to client fringe region 11, wafer is relative with the adhesion strength of pedestal relatively poor, after being clashed into, easily cause electrode leads to client coating and wafer layering, even come off, thereby cause that wafer is loosening, cause the reliability decrease of quartz-crystal resonator product.
Summary of the invention
The purpose of this utility model is to provide a kind of HC-49S type quartz-crystal resonator wafer, can improve the adhesive strength between wafer and pedestal, can improve the reliability of quartz-crystal resonator product.
The utility model is achieved in that the wafer body surface is provided with silver-coated electrode, the electrode leads to client that forms by evaporation process and the transition band that connects silver-coated electrode and electrode leads to client, is provided with the non-cladding region that is opened on wafer body side in the middle of described electrode leads to client, makes the wafer body in the middle of electrode leads to client and two side areas forms the conducting resinl overlay area.
After some glue, conducting resinl not only covers the electrode leads to client surface, while is coated electrode exit both sides and middle non-cladding region also, conducting resinl not only directly contacts with the wafer body, and the regional double team respectively of two coats of metal of electrode leads to client on the crystal body, has been strengthened the adhesion strength of wafer and pedestal greatly.
Because the non-cladding region area in the middle of electrode leads to client is less, and conducting resinl covered around and lower surface cladding region arranged, can the electrical property of crystal resonator not impacted.
Described electrode leads to client cladding region takes the shape of the letter U.The electrode leads to client cladding region symmetry of this U-shaped structure is good, and overcurrent is even.
Through fall-down test, use the crystal resonator product of the utility model wafer freely to fall on the timber floor of thickness as 3cm for 3 times at the 1m height, frequency change is in 3ppm, and resistance variations is within 5 Ω.And existing HC-49S type quartz-crystal resonator frequency change is generally in 5ppm.
In vibration test, under vibration frequency 10～55Hz, amplitude 1.5mm, the condition in 1.5 minutes cycles, circulated in the X, Y, Z axis direction each 30 minutes, place and test changing value after 1 hour.Frequency change is in 5ppm.And existing HC-49S type quartz-crystal resonator frequency change is generally in 8ppm.
Above-mentioned experiment shows its anti-frequency range of falling and vibrating all less than existing product, and its good reliability is in existing product.
Description of drawings
Fig. 1 is existing HC-49S type quartz-crystal resonator chip architecture schematic diagram;
Fig. 2 is the utility model structural representation.
Embodiment
As shown in Figure 2, the utility model wafer body 1 surface is provided with silver-coated electrode 2, the electrode leads to client 4 that forms by evaporation process and the transition band 3 that connects silver-coated electrode 2 and electrode leads to client 4, the centre of described electrode leads to client 4 is provided with the non-cladding region 14 that is opened on wafer body 1 side, electrode leads to client both sides cladding region 42,43 is parallel, makes electrode leads to client 4 take the shape of the letter U.Make wafer body 1 in the middle of the electrode leads to client 14 and two side areas 12,13 form the conducting resinl overlay area.
Conducting resinl overlay area after the region representation point glue that in Fig. 2, dotted line 5 surrounds.After some glue, conducting resinl not only covers electrode leads to client 42,43 surfaces, also coated electrode exit both sides 12,13 and middle non-cladding region 14 simultaneously, conducting resinl not only directly contacts with the wafer body, and with two coat of metal zones 42,43 of electrode leads to client respectively double teams on the crystal body, strengthened greatly the adhesion strength of wafer and pedestal.
Claims (2)
1.HC-49S type quartz-crystal resonator wafer, wafer body (1) surface is provided with silver-coated electrode (2), the electrode leads to client (4) that forms by evaporation process and the transition band (3) that connects silver-coated electrode (1) and electrode leads to client (4), it is characterized in that: the centre of described electrode leads to client (4) is provided with the non-cladding region (14) that is opened on wafer body (1) side, makes wafer body (1) in the middle of the electrode leads to client and two side areas forms the conducting resinl overlay area.
2. HC-49S type quartz-crystal resonator wafer according to claim 1, it is characterized in that: described electrode leads to client (4) cladding region takes the shape of the letter U.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220680477 CN202949397U (en) | 2012-12-11 | 2012-12-11 | Wafer for HC-49S type quartz crystal resonator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220680477 CN202949397U (en) | 2012-12-11 | 2012-12-11 | Wafer for HC-49S type quartz crystal resonator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202949397U true CN202949397U (en) | 2013-05-22 |
Family
ID=48425075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220680477 Expired - Fee Related CN202949397U (en) | 2012-12-11 | 2012-12-11 | Wafer for HC-49S type quartz crystal resonator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202949397U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103036526A (en) * | 2012-12-11 | 2013-04-10 | 安徽铜峰电子股份有限公司 | HC-49S type quartz crystal harmonic oscillator chip |
-
2012
- 2012-12-11 CN CN 201220680477 patent/CN202949397U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103036526A (en) * | 2012-12-11 | 2013-04-10 | 安徽铜峰电子股份有限公司 | HC-49S type quartz crystal harmonic oscillator chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130522 Termination date: 20151211 |
|
| EXPY | Termination of patent right or utility model |