CN202917478U - A packaging structure of single-row vertical pins - Google Patents
A packaging structure of single-row vertical pins Download PDFInfo
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- CN202917478U CN202917478U CN 201220646093 CN201220646093U CN202917478U CN 202917478 U CN202917478 U CN 202917478U CN 201220646093 CN201220646093 CN 201220646093 CN 201220646093 U CN201220646093 U CN 201220646093U CN 202917478 U CN202917478 U CN 202917478U
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- pin
- encapsulating structure
- vertical type
- single vertical
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 43
- 239000000463 material Substances 0.000 claims description 21
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 8
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 8
- 239000000956 alloy Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000005452 bending Methods 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 description 10
- 230000005484 gravity Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- NHDHVHZZCFYRSB-UHFFFAOYSA-N pyriproxyfen Chemical compound C=1C=CC=NC=1OC(C)COC(C=C1)=CC=C1OC1=CC=CC=C1 NHDHVHZZCFYRSB-UHFFFAOYSA-N 0.000 description 1
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Abstract
The utility model provides a packaging structure of single-row vertical pins. The packaging structure comprises a wire rack used for placing a wafer, multiple internal pins which are disposed on one side edge of the wire rack and which are electrically connected with conductive contacts, and multiple externally-connected pins which are disposed on a single side edge of the wire rack and which are correspondingly and electrically connected with the internal pins. The externally-connected pins are extended outwards in order to be bent to form bending portions. A packaging body is wrapped round the wafer, the wire rack, and part of the externally-connected pins but not wrapped round the bending portions. According to the technical thought of the packaging structure, surfaces of electronic element bodies can be welded on a circuit board in a 90 degree manner in order to reduce plane area occupied by the electronic elements on the circuit board. The packaging structure makes good use of vertical dimensional space and achieves a design with high density.
Description
Technical field
The utility model relates to a kind of encapsulating structure of electronic component, particularly a kind of encapsulating structure of single vertical type pin.
Background technology
The external leading pin type integrated circuit package structure extends pin in the outside of adhesive body at present, can consult Fig. 1 and Fig. 2, so that existing dip structural upright and quadrangle flat packaged structure stereogram to be described.
As shown in Figure 1, existing dip structure 10 is packaged types of a kind of integrated circuit, and the profile of this integrated circuit is rectangle, the parallel metal pin 12 of two rows is then arranged in its both sides, and these pins 12 can be welded in the socket corresponding on the circuit board.
And for example shown in Figure 2; be quadrangle flat packaged structure 20; it also is a kind of packaged type of integrated circuit; the profile of this integrated circuit is square; normally be applied in the central processing unit pin between the distance very little; pin is very thin, utilizes sea-gull formula pin 22 to be welded on the circuit board, and general extensive or very lagre scale integrated circuit (VLSIC) all is to adopt this packing forms.
According to present existing packaged type, haply all with behind the integrated antenna package, be encapsulated in circuit board in smooth mode, when on the circuit board when being covered with the integrated circuit of dip or quadrangle flat packaging, yet the area on the circuit board plane is limited, component placement on the circuit board will be restricted, and it is to be overcome that therefore obvious external leading pin type integrated circuit package structure still has many disappearances.
In view of this, inventor of the present utility model carries out research and discussion for the problem of above-mentioned generation, by large component analysis, finally develops a kind of encapsulating structure of single vertical type pin, will be solved above-described problem.
The utility model content
Main purpose of the present utility model, be to provide a kind of encapsulating structure of single vertical type pin, it utilizes external bending pins to consist of a kink, mode with surface-mounted pin is flush-mounted on the circuit board again, therefore according to technological thought of the present utility model, the electronic component body can be listed on the circuit board with 90 degree mode surface mount, so reduce electronic component in circuit board on the occupied area of plane, use the vertical three-dimensional space with kind, reach highdensity design.
An again purpose of the present utility model is to provide a kind of encapsulating structure of single vertical type pin, and the kink on the external pin can bend repeatedly again, consists of two kinks, increases whereby the stability of the utility model when being flush-mounted in circuit board.
Another purpose of the present utility model, be to provide a kind of encapsulating structure of single vertical type pin, utilize the flat horizontal bent angle design of center of gravity, the width that makes the kink on each external pin is all greater than the width of packaging body, to increase the stress of external pin, the encapsulating structure of single vertical type pin can more firmly be fitted on the circuit board.
Another purpose of the present utility model, be to provide a kind of encapsulating structure of single vertical type pin, utilize each external pin to become side by side the bus type pin, and each kink can become a sheet material shape kink side by side, increase whereby the flexibility of the utility model when being flush-mounted in circuit board.
In order to achieve the above object, the utility model provides a kind of encapsulating structure of single vertical type pin, and in order to encapsulate a wafer, this wafer has a plurality of conductive junction points, and the encapsulating structure of this single vertical type pin comprises at least:
One lead frame, in order to putting this wafer, and this lead frame side is provided with a plurality of inner pins, and an end points of this inside pin is electrically connected this conductive junction point, and another end points that each should the inside pin all is arranged at the single side of this lead frame;
A plurality of external pins are arranged at the single side of this lead frame, and corresponding be electrically connected each should the inside pin, these a plurality of external pins stretch out respectively and are bent into a kink; And
One packaging body is to coat this wafer, this lead frame and the external pin of this part and to expose this kink.
The encapsulating structure of described single vertical type pin, wherein, this external pin is surface-mounted pin.
The encapsulating structure of described single vertical type pin, wherein, this packaging body be shaped as cuboid, and the width of each this kink is all greater than the width of this packaging body.
The encapsulating structure of described single vertical type pin, wherein, these a plurality of external pins become a bus type pin side by side, and these a plurality of kinks become a sheet material shape kink side by side.
The encapsulating structure of described single vertical type pin, wherein, this packaging body be shaped as cuboid, and the width of each this sheet material shape kink is all greater than the width of this packaging body.
The encapsulating structure of described single vertical type pin, wherein, this packaging body is insulative resin.
The encapsulating structure of described single vertical type pin, wherein, this lead frame is copper alloy material or iron-nickel alloy.
The encapsulating structure of described single vertical type pin, wherein, this external pin material can be copper alloy material or iron-nickel alloy.
The encapsulating structure of described single vertical type pin, wherein, this bus type pin material can be copper alloy material or iron-nickel alloy.
The beneficial effects of the utility model are: the electronic component body can be listed on the circuit board with 90 degree mode surface mount, and then reduce electronic component in circuit board on the occupied area of plane, use the vertical three-dimensional space with kind, reach highdensity design; Increase the stability when being flush-mounted in circuit board; Increase the stress of external pin, the encapsulating structure of single vertical type pin can more firmly be fitted on the circuit board; Increase the flexibility of the utility model when being flush-mounted in circuit board.
Under cooperate appended accompanying drawing to illustrate in detail by specific embodiment, when the effect that is easier to understand the purpose of this utility model, technology contents, characteristics and reaches.
Description of drawings
Fig. 1 is existing dip structural upright;
Fig. 2 is existing quadrangle flat packaged structure stereogram;
Fig. 3 is the encapsulating structure stereoscopic figure of the single vertical type pin of the first embodiment of the present utility model;
Fig. 4 is packaging body schematic diagram of the present utility model;
Fig. 5 is the packaging body width indication figure of the utility model the first embodiment;
Fig. 6 is the external pin widths schematic diagram of the first embodiment of the present utility model;
Fig. 7 is the encapsulating structure stereoscopic figure of the single vertical type pin of the second embodiment of the present utility model;
Fig. 8 is the external pin widths schematic diagram of the second embodiment of the present utility model;
Fig. 9 is the encapsulating structure outward appearance front view of the single vertical type pin of the 3rd embodiment of the present utility model;
Figure 10 is the encapsulating structure outward appearance rearview of the single vertical type pin of the 3rd embodiment of the present utility model;
Figure 11 is the packaging body width indication figure of the 3rd embodiment of the present utility model;
Figure 12 is the external pin widths schematic diagram of the 3rd embodiment of the present utility model;
Figure 13 is the encapsulating structure stereoscopic figure of the single vertical type pin of the 4th embodiment of the present utility model;
Figure 14 is the external pin widths schematic diagram of the 4th embodiment of the present utility model.
Description of reference numerals: 10-dip structure; 12-metal pin; 20-quadrangle flat packaged structure; 22-sea-gull formula pin; The encapsulating structure of the single vertical type pin of 30-; The 32-wafer; The 34-conductive junction point; The 36-lead frame; The inner pin of 38-; The external pin of 40-; The 42-kink; The 44-packaging body; The external pin of 46-; The 48-kink; 50-bus type pin; 52-sheet material shape kink; 54-bus type pin; 56-sheet material shape kink; The B-width; The D-width; The E-width; The M-width; The N-width; The O-width; The W-width; The X-width; The Y-width; The Z-width.
Embodiment
The utility model is enumerated an embodiment in this, sees also Fig. 3 and Fig. 4, with encapsulating structure stereoscopic figure and the packaging body schematic diagram of single vertical type pin that the first embodiment is described.
As shown in the figure, a kind of encapsulating structure 30 of single vertical type pin, in order to encapsulated wafer 32, wafer 32 has a plurality of conductive junction points 34, the encapsulating structure 30 of single vertical type pin includes lead frame 36, in order to put wafer 32, and lead frame 36 sides are provided with a plurality of inner pins 38, one end points of each inner pin 38 is electrically connected conductive junction point 34, and another end points of each inner pin 38 all is arranged at the single side of lead frame 36, a plurality of external pins 40 equally also are arranged at the single side of lead frame 36, and corresponding each inner pin 38 that is electrically connected, these external pins 40 stretch out respectively and are bent into kink 42, and packaging body 44 is with coating wafer 32, lead frame 36 and the external pin 40 of part also expose kink 42.
The encapsulating structure 30 of foregoing single vertical type pin, technological thought of the present utility model is conductive junction point 34 corresponding each the inner pins 38 that are electrically connected with wafer 32 each inputs and output, and another end points unification of each inner pin 38 is arranged in the single side of lead frame 36, again through external pin 40 corresponding each inner pin 38 that are electrically connected, in addition, each external pin 40 once later can consist of a kink 42 through bending, is flush-mounted on the circuit board in the mode of surface-mounted pin more at last.
Consult Fig. 5 and Fig. 6, the packaging body width indication figure of the utility model the first embodiment and the external pin widths schematic diagram of the first embodiment are described whereby, wherein the B in accompanying drawing is the width of packaging body 44, and M is the width of the kink 42 of the first embodiment.
As shown in the figure, the utility model is in the middle of front the first embodiment that discloses, since the utility model packaging body 44 be shaped as cuboid or cube, therefore the utility model utilizes the flat horizontal bent angle design of center of gravity, make the width M of the kink 42 on each external pin 40 greater than the width B of packaging body 44, thus, the encapsulating structure 30 of single vertical type pin of the present utility model can increase the stress of external pin 40, and the encapsulating structure 30 of single vertical type pin more firmly is fitted on the circuit board.
In addition, the utility model is in front described the first embodiment, its technical characterictic only is the utility model embodiment wherein, yet the utility model is not certainly as limit, continue, consult Fig. 7 and Fig. 8, with the encapsulating structure stereoscopic figure of single vertical type pin that the second embodiment of the present utility model is described and the external pin widths schematic diagram of the second embodiment.
As shown in the figure, the wafer 32 that the utility model is addressed in front the first embodiment, lead frame 36 and inner pin 38, its execution mode is identical with the execution mode of the second embodiment, so the utility model will repeat no more in this, yet the different kinks 48 that are on the external pin 46 of the second embodiment of the present utility model can bend repeatedly again, to consist of two kinks 48, increase whereby the stability of the utility model when being flush-mounted in circuit board.
As previously mentioned, the E of the utility model in Fig. 7 and Fig. 8 is the width of packaging body 44, N, O respectively is respectively the width of the external pin 46 of the second embodiment, since the packaging body 44 among the utility model the second embodiment be shaped as cuboid or cube, therefore the utility model utilizes the flat horizontal bent angle design of center of gravity, make the width N of the kink 48 on each external pin 46, O is all greater than the width E of packaging body 44, thus, the encapsulating structure 30 of single vertical type pin of the present utility model can increase the stress of external pin 46, and the encapsulating structure 30 of single vertical type pin more firmly is fitted on the circuit board.
In addition, the utility model is in front described the first embodiment and the second embodiment, its external pin 40 and external pin 46 only are the utility model embodiment wherein with the technical characterictic of surface-mounted pin, yet the utility model is not certainly as limit, continue and see also Fig. 9 and Figure 10, encapsulating structure outward appearance front view and outward appearance rearview with single vertical type pin that the 3rd embodiment of the present utility model is described, consult and be aided with simultaneously Fig. 3, as shown in the figure, the utility model in the first embodiment when described in and wafer 32, the execution mode of lead frame 36 and inner pin 38 is identical with the described execution mode of the 3rd embodiment, so the utility model repeats no more in this, yet different each external pin 40 that is in the 3rd embodiment can change in mode arranged side by side, to consist of bus type pin 50, and each kink 42 can become a sheet material shape kink 52 side by side, increases whereby the flexibility of the utility model when being flush-mounted in circuit board.
Consult Figure 11 and Figure 12, the packaging body width indication figure of the 3rd embodiment of the present utility model and the external pin widths schematic diagram of the 3rd embodiment are described whereby, wherein the W in accompanying drawing is the width of packaging body 44, and X is the width of the sheet material shape kink 52 of the 3rd embodiment.
The 3rd embodiment of the present utility model, the shape of packaging body 44 is similarly cuboid or cube, therefore, therefore the utility model utilizes the flat horizontal bent angle design of center of gravity, make each sheet material shape kink 52 all greater than the width of packaging body 44, can increase the stress of bus type pin 50, the encapsulating structure 30 of single vertical type pin more firmly is fitted on the circuit board.
In addition, the utility model only is the utility model embodiment wherein in the technical characterictic of front described the 3rd embodiment, yet the utility model is not certainly as limit, continue and consult Figure 13 and Figure 14, the encapsulating structure stereoscopic figure of single vertical type pin of the 4th embodiment of the present utility model and the external pin widths schematic diagram of the 4th embodiment are described whereby, as shown in the figure, sheet material shape kink 56 on the bus type pin 54 of the 4th embodiment of the present utility model can bend repeatedly again, consist of two sheet material shape kinks 56, increase whereby the stability of the utility model when being flush-mounted in circuit board.
In addition, foregoing the 4th embodiment, the shape of packaging body 44 of the present utility model is similarly cuboid or cube, therefore the width of each sheet material shape kink 56 is equally all greater than the width of packaging body 44, can increase the stress of bus type pin 54, the encapsulating structure 30 of single vertical type pin more firmly is fitted on the circuit board.
As previously mentioned, the D of the utility model in Figure 13 and Figure 14 is the width of packaging body 44, and Y, Z are the width of the sheet material shape kink 56 of the 4th embodiment.
The 4th embodiment of the present utility model, the shape of packaging body 44 is similarly cuboid or cube, therefore, therefore the utility model utilizes the flat horizontal bent angle design of center of gravity, make each sheet material shape kink 56 all greater than the width of packaging body 44, can increase the stress of bus type pin 50, the encapsulating structure 30 of single vertical type pin more firmly is fitted on the circuit board.
Wherein, the encapsulating structure 30 of the single vertical type pin that the first embodiment of the present utility model, the second embodiment, the 3rd embodiment and the 4th embodiment disclose, wherein packaging body 44 can be copper alloy material or iron-nickel alloy for insulative resin, lead frame 36 for copper alloy material or iron-nickel alloy, external pin 40, external pin 46, bus type pin 50 materials.
In sum, the utility model discloses a kind of encapsulating structure 30 of single vertical type pin in this, it is to utilize a plurality of external pins 40 to be arranged at the single side of lead frame 36, external pin 40 once later can consist of a kink 42 through bending, and the mode with surface-mounted pin is flush-mounted on the circuit board again.In addition, each external pin 40 can become bus type pin 50 side by side, and each kink 42 can become a sheet material shape kink 52 side by side, therefore according to technological thought of the present utility model, when the encapsulating structure 30 of single vertical type pin is installed on the circuit board, the electronic component body can be listed on the circuit board with 90 degree mode surface mount, so reduce electronic component in circuit board on the occupied area of plane, use the vertical three-dimensional space with kind, reach highdensity design.
Yet above-described embodiment only is preferred embodiment of the present utility model, by embodiment characteristics of the present utility model are described, its purpose is had the knack of this operator and can be understood content of the present utility model and implement according to this making, and is not to limit to the scope that the utility model is implemented.Such as the equalization of using the described structure of the utility model claim, shape, feature and spirit to do changes and modifies, and all should be included in the scope that the utility model applies for a patent.
Claims (9)
1. the encapsulating structure of a single vertical type pin is characterized in that, in order to encapsulate a wafer, this wafer has a plurality of conductive junction points, and the encapsulating structure of this single vertical type pin comprises at least:
One lead frame, in order to putting this wafer, and this lead frame side is provided with a plurality of inner pins, and an end points of this inside pin is electrically connected this conductive junction point, and another end points that each should the inside pin all is arranged at the single side of this lead frame;
A plurality of external pins are arranged at the single side of this lead frame, and corresponding be electrically connected each should the inside pin, these a plurality of external pins stretch out respectively and are bent into a kink; And
One packaging body is to coat this wafer, this lead frame and the external pin of this part and to expose this kink.
2. the encapsulating structure of single vertical type pin as claimed in claim 1 is characterized in that, this external pin is surface-mounted pin.
3. the encapsulating structure of single vertical type pin as claimed in claim 2 is characterized in that, this packaging body be shaped as cuboid, and the width of each this kink is all greater than the width of this packaging body.
4. the encapsulating structure of single vertical type pin as claimed in claim 1 is characterized in that, these a plurality of external pins become a bus type pin side by side, and these a plurality of kinks become a sheet material shape kink side by side.
5. the encapsulating structure of single vertical type pin as claimed in claim 4 is characterized in that, this packaging body be shaped as cuboid, and the width of each this sheet material shape kink is all greater than the width of this packaging body.
6. the encapsulating structure of single vertical type pin as claimed in claim 1 is characterized in that, this packaging body is insulative resin.
7. the encapsulating structure of single vertical type pin as claimed in claim 1 is characterized in that, this lead frame is copper alloy material or iron-nickel alloy.
8. the encapsulating structure of single vertical type pin as claimed in claim 1 is characterized in that, this external pin material can be copper alloy material or iron-nickel alloy.
9. the encapsulating structure of single vertical type pin as claimed in claim 4 is characterized in that, this bus type pin material can be copper alloy material or iron-nickel alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220646093 CN202917478U (en) | 2012-11-29 | 2012-11-29 | A packaging structure of single-row vertical pins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220646093 CN202917478U (en) | 2012-11-29 | 2012-11-29 | A packaging structure of single-row vertical pins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202917478U true CN202917478U (en) | 2013-05-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220646093 Expired - Lifetime CN202917478U (en) | 2012-11-29 | 2012-11-29 | A packaging structure of single-row vertical pins |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202917478U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047636A (en) * | 2014-04-17 | 2015-11-11 | 恩智浦有限公司 | Single inline no-lead semiconductor package |
-
2012
- 2012-11-29 CN CN 201220646093 patent/CN202917478U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105047636A (en) * | 2014-04-17 | 2015-11-11 | 恩智浦有限公司 | Single inline no-lead semiconductor package |
| CN105047636B (en) * | 2014-04-17 | 2019-02-15 | 恩智浦有限公司 | Single straight cutting is encapsulated without lead semiconductor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130501 |
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| CX01 | Expiry of patent term |