CN202917455U - 防撞针装置 - Google Patents
防撞针装置 Download PDFInfo
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- CN202917455U CN202917455U CN 201220525278 CN201220525278U CN202917455U CN 202917455 U CN202917455 U CN 202917455U CN 201220525278 CN201220525278 CN 201220525278 CN 201220525278 U CN201220525278 U CN 201220525278U CN 202917455 U CN202917455 U CN 202917455U
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CN 201220525278 CN202917455U (zh) | 2012-10-15 | 2012-10-15 | 防撞针装置 |
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CN 201220525278 CN202917455U (zh) | 2012-10-15 | 2012-10-15 | 防撞针装置 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105785260A (zh) * | 2016-05-25 | 2016-07-20 | 上海华岭集成电路技术股份有限公司 | 防止晶圆测试探针台撞针的装置及方法 |
CN106558511A (zh) * | 2015-10-22 | 2017-04-05 | 安徽超元半导体有限公司 | 一种设定晶圆针测针压的自动设定系统 |
CN107768265A (zh) * | 2017-10-16 | 2018-03-06 | 德淮半导体有限公司 | 晶圆测试系统和方法 |
CN111913096A (zh) * | 2020-08-11 | 2020-11-10 | 广东利扬芯片测试股份有限公司 | 晶圆探针卡的拆卸防护结构、晶圆测试探针台及防护方法 |
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2012
- 2012-10-15 CN CN 201220525278 patent/CN202917455U/zh not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106558511A (zh) * | 2015-10-22 | 2017-04-05 | 安徽超元半导体有限公司 | 一种设定晶圆针测针压的自动设定系统 |
CN105785260A (zh) * | 2016-05-25 | 2016-07-20 | 上海华岭集成电路技术股份有限公司 | 防止晶圆测试探针台撞针的装置及方法 |
CN107768265A (zh) * | 2017-10-16 | 2018-03-06 | 德淮半导体有限公司 | 晶圆测试系统和方法 |
CN111913096A (zh) * | 2020-08-11 | 2020-11-10 | 广东利扬芯片测试股份有限公司 | 晶圆探针卡的拆卸防护结构、晶圆测试探针台及防护方法 |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Flat-bed knitting machine needle board with knocking-proof device Effective date of registration: 20141008 Granted publication date: 20130501 Pledgee: Jiangsu Zhenjiang Rural Commercial Bank branch Dingmao Limited by Share Ltd. Pledgor: JIANGSU ACETEC SEMICONDUCTOR Co.,Ltd. Registration number: 2014980000093 |
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PLDC | Enforcement, change and cancellation of contracts on pledge of patent right or utility model | ||
C56 | Change in the name or address of the patentee | ||
CP03 | Change of name, title or address |
Address after: 212009 Zhenjiang Province Siping Road, No. 6, intelligent equipment Industrial Park, Jiangsu Patentee after: JIANGSU ACETEC SEMICONDUCTOR Co.,Ltd. Address before: 212009 Zhenjiang city of Jiangsu province science and technology park south latitude four Road No. 36 building E56 Patentee before: ZHENJIANG ATEC SEMICONDUCTOR Co.,Ltd. |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20160203 Granted publication date: 20130501 Pledgee: Jiangsu Zhenjiang Rural Commercial Bank branch Dingmao Limited by Share Ltd. Pledgor: JIANGSU ACETEC SEMICONDUCTOR Co.,Ltd. Registration number: 2014980000093 |
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CX01 | Expiry of patent term | ||
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Granted publication date: 20130501 |