CN202862594U - Polymer micro-fluidic chip bonding device - Google Patents
Polymer micro-fluidic chip bonding device Download PDFInfo
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- CN202862594U CN202862594U CN 201220367388 CN201220367388U CN202862594U CN 202862594 U CN202862594 U CN 202862594U CN 201220367388 CN201220367388 CN 201220367388 CN 201220367388 U CN201220367388 U CN 201220367388U CN 202862594 U CN202862594 U CN 202862594U
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Abstract
The utility model discloses a polymer micro-fluidic chip bonding device which comprises a laser generator, a controllable optical system, an image recognition and processing system, a control system and a displacement control platform. The polymer micro-fluidic chip bonding device is characterized in that a binary optical element is arranged in the controllable optical system, a laser beam is diffracted to a chip to be bonded on the displacement control platform through the binary optical element, and the size and the strength of a formed spot can be controlled; and the bonding device is provided with the image recognition and processing system, the image recognition and processing system comprises a CCD (charge coupled device) and a computer, diffraction images acquired by the CCD are processed through the computer so as to control the size and the strength of spots. According to the polymer micro-fluidic chip bonding device, a binary optical technology, a laser transmission welding technology for polymers and a real-time on-line measurement technology for temperature and images are integrated, and by using the diffraction effect of the binary optical element on laser, a weld joint with a narrower bonding width, a smaller heat affected zone and a higher strength in comparison with a laser mask can be obtained.
Description
Technical field
The utility model relates to a kind of micro-fluidic chip bonding equipment, relates in particular to a kind of precision of micro-fluidic chip, controlled bonding equipment.
Background technology
Micro-fluidic chip, claim again micro-total analysis system or chip lab, the processes such as a sample preparation that the fields such as chemistry, biology is related, biology and chemical reaction, separation and detection, miniature or substantially miniature to more than one square centimeters chip, and its result detected and the technology of analyzing.Relative traditional analysis technology, micro-fluidic chip are micro-s and the analytical technology platform of " entirely " also is the emphasis that current micro-total analysis system develops.
In recent years, along with the extensive use of polymeric material, some have biochemical compatibility feature and are easy to becomes the main material (such as PMMA, PC, PVC, PDMS, PETG, PE etc.) of making micro-fluidic chip by the plastics that the means such as precise injection molding and hot pressing are produced in enormous quantities.This has just overcome the expensive low-producing limitation of producing biological micro-systems take silicon or glass material as main processing technology.But, gradually reduction along with the polymers micro-devices manufacturing cost, the shared proportion of packaging cost constantly rises, and show according to external multinomial statistics: the polymers micro-devices packaging cost accounts for 50%～90% of its product, and the problem about 80% of product is owing to encapsulation causes.At present its encapsulation technology is still that microelectronic packaging process realizes by improving, and does not have versatility, does not also form unified standard.Therefore, compare with the fast development of polymer MEMS technology, its bonding and encapsulation technology are greatly backward, become the bottleneck problem in the manufacture process.The bonding packaging technique of development low cost, high reliability and equipment have become the key issue that realizes that polymer MEMS device is practical and industrialization needs to be resolved hurrily.
For the characteristic of polymeric material, the bonding method of the polymeric micro-fluidic chip that people develop mainly contains solvent bond method, gluing bonding method, microwave bonding method, Direct Bonding method, supersonic bonding method and the laser bonding method of connecing.Solvent bond is legal to be to realize that by the contact-making surface of special organic solvent dissolution polymer device device connects, after the method can't avoid the little channel material of micro-fluidic chip by organic solvent dissolution, little raceway groove pattern can be affected, and the curtain coating of solvent is difficult to controlled, the bonding quality uniformity is generally relatively poor, and the method is unfavorable for carrying out the large-scale mass production making simultaneously.The gluing bonding method that connects is to introduce binding agent to realize up and down connecting of device between substrate and cover plate.Because colloid is easy to stop up chip microchannel in the gluing termination process, and the adhesive majority has volatile flavor, affects the bio-compatibility of follow-up micro-fluidic chip in using, and therefore, the method is seldom used in micro-fluidic chip bonding field.The direct heat bonding adds to chip temperature about glass transition temperature or melt temperature, by chip being applied certain ambient pressure, makes softening wetting bonding surface close contact, intermolecular formation active force, the Direct Bonding of realization substrate and cover plate.In the larger situation of general pressure and temperature, bonding chip could obtain certain bond strength, but temperature, hypertonia easily cause the distortion of the little raceway groove of chip and substrate integral body, have a strong impact on bonding quality.Ultrasonic bonding is a kind of vibration friction bonding method, because the restriction of sound field factor, and the welding zone sealing, so that the parameter detecting of para-linkage process becomes very difficult.
The bonding method of above-mentioned plastics maybe needs the vibration friction, or needs medium directly to contact with product.Vibration is easy to shatter micro element, and directly contact is easy so that pollutant enters the functional areas such as microchannel, Micropump and little valve of micro-fluidic chip, thereby it is polluted.Simultaneously, the heat affected area of these Plastic Welding methods is difficult to control, easily causes that heat distorts and flash is too much, and these all easily cause the distortion of micro-structural or microchannel, the serious obstruction that will cause the microchannel.Therefore, all there is larger deficiency in these bonding methods aspect the bonding of polymeric micro-fluidic chip.
Laser-transmitting bonding micro-fluidic chip method, to allow laser (wavelength is generally 800-1050nm) see through transparent cover, absorbed by cover plate and produce heat at the faying face laser of cover plate and substrate, in hot concentrated area, plastics are melted, the large molecule of plastics under the heat fusing state phase counterdiffusion and entanglement under the effect of welding pressure produce Van der Waals force (intermolecular force), form strong bonding between cover plate and substrate.
The laser mask welding method is applied on the bonding of PMMA micro-fluidic chip that thickness is 0.1-2.5mm, can obtain the non-leakage microchip of 175 μ m weld widths, show that laser-transmitting is welded on polymeric micro-fluidic chip bonding field certain advantage is arranged, but the versatility of mask is poor, manufacturing process is complicated and cost is high, and the micro-fluidic chip of different structure will be furnished with different masks to adapt to the variation of microchannel in the microchip.
Because all there is certain limitation in the bonding method of present various polymeric micro-fluidic chips, how to obtain the weld seam narrower than laser-mask bonding width, that the heat affected area is less, intensity is higher, is this area technical problem to be solved.
Summary of the invention
Utility model purpose of the present utility model provides a kind of laser-transmitting polymeric micro-fluidic chip bonding apparatus that can obtain the weld seam narrower than laser-mask bonding width, that the heat affected area is less, intensity is higher.
For reaching above-mentioned utility model purpose, the technical solution adopted in the utility model is: a kind of polymeric micro-fluidic chip bonding apparatus, comprise laser generator, controllable optical system, image identifying and processing system, control system, displacement control platform, in the described controllable optical system, be provided with binary optical elements, laser beam is treated the bonding chip place through the diffraction of binary optical elements on displacement control platform, spot size and the intensity of formation are controlled; Be provided with the image identifying and processing system, described image identifying and processing system comprises CCD and computer, CCD is gathered the processing of diffraction image by computer, controls flexibly size and the intensity of hot spot.
In the technique scheme, described laser generator can adopt prior art, for example, the laser generator system comprises semiconductor laser, adjustable current source, refrigerator and Laser output coupled fiber etc., with corresponding laser diode, cooling piece, be encapsulated in the module to adjustable current source and the refrigeration temperature control circuit module of diode power supply.Described binary optical elements is the pure phase bit-type micro optical element of liquid crystal mode control, wave surface by changing light wave is to change phase place, be used for the phase place of laser beam is modulated in real time, after diffraction, the light spot shape that laser beam arrives polymeric micro-fluidic chip substrate and cover plate bonding face place is identical with the weld shape of being scheduled to.In the described controllable optical system, form at conventional laser collimating mirror, focus lamp, spectroscope etc. on the basis of optical system, introduce the binary optical elements of liquid crystal mode, the micro-optics technology is introduced in the bonding apparatus.Its basic know-why is: according to the micro-optics principle, binary optical elements (diffraction optical element) is the optical element of a pure phase bit-type, wave surface by changing light wave is to change phase place, can modulate in real time the phase place of laser beam by binary optical elements, after diffraction, the light spot shape that laser beam arrives polymeric micro-fluidic chip substrate and cover plate bonding face place is identical with the weld shape of being scheduled to, more crucial is that light intensity is distributed by the flat-top that Gaussian Profile becomes uniform intensity, realizes the homogeneity of bonding performance.
The described image identifying and processing employing CCD of system micro imaging system is taken the MCA of polymeric micro-fluidic chip, by computer to image identifying and processing, design the target image of optimum bonding position, obtain the target image coding by numerical simulation calculation, utilize the value of the pixel in the image dynamically to control the diffraction of liquid crystal mode binary optical elements, control flexibly laser light field.
Further technical scheme is provided with temperature online Real-Time Monitoring and control system, and described temperature online Real-Time Monitoring and control system comprise that a wavelength is the thermal camera of 7.5～13 μ m.Infrared thermal imaging technique is as a kind of method of real-time of para-linkage process, and that infrared thermal imaging has is harmless, to the characteristics such as Real-Time Monitoring of heat distribution.The variation in temperature field is recorded by thermal camera, and usually, the heat sensitivity of thermal camera is at 0.08～30 degree, and frequency is 60Hz, and camera has the microspur measurement function that resolution ratio is 100 μ m.
Thermal imaging system monitoring molten bath and near Temperature Distribution thereof form corresponding thermal map vision signal, USB mouth by the PC machine after video frequency collection card gathers is inputted, thermal imaging picture by the thermal imaging system picked-up is analyzed by CAM software, analyzing and processing thermal map temperature information, provide the current regulation control instruction of laser instrument, make the weldpool temperature reach suitable temperature.
In the technique scheme, described displacement control platform adopts servo-control system control, comprises pneumatic bearing and by the ball screw arrangement of driven by servomotor.The three-dimensional mobile platform that adopts accurate pneumatic bearing and driven by servomotor ball-screw to form, its positioning accuracy can reach 5 microns, repetitive positioning accuracy ± 0.5 micron.
Because technique scheme is used, the utility model compared with prior art has following advantages:
1. the utility model is incorporated into the laser-transmitting bonding apparatus with the liquid crystal mode binary optical elements, proposition is based on liquid crystal mode binary optical elements laser bonding polymeric micro-fluidic chip new method, can realize according to the performance design laser light field, and realize the dynamic regulation technology of laser light field (intensity and shape).
2. by IMAQ and treatment system, truly realize the On-line Control technology to the polymeric micro-fluidic chip bonding quality.
3. accurate displacement is controlled platform and servo-control system, realizes the accurate location of bonding process, and realizes that automatic self-locking clamps.
4. temperature online Real-Time Monitoring and the control system innovated, traditional sensor temperature control model is reformed thoroughly, realize contactless, not damaged, high-precision temperature monitoring and control, truly reach according to preseting bonding quality and set bonding parameter.
Description of drawings
Fig. 1 is polymeric micro-fluidic chip bonding system installation drawing among the embodiment.
Fig. 2 is polymeric micro-fluidic chip bonding system FB(flow block) among the embodiment.
Wherein: 1, laser generator; 2, binary optical elements; 3, CCD charge coupled cell; 4, thermal camera; 5, control system; 6, servomotor; 7, displacement control platform; 8, ball-screw.
The specific embodiment
Below in conjunction with drawings and Examples the utility model is further described:
Embodiment one: a kind of polymeric micro-fluidic chip bonding apparatus comprises laser generator, contains controllable optical system, image identifying and processing system, temperature online Real-Time Monitoring and the control system of liquid crystal mode micro-optical device and accurate displacement control platform, servo drive system and control system.
Shown in accompanying drawing 1, in the described controllable optical system, be provided with the binary optical elements 2 of liquid crystal mode, laser beam is treated the bonding chip place through binary optical elements 2 diffraction on displacement control platform 7; Described image identifying and processing system comprises CCD3 and computer, CCD3 is gathered the processing of diffraction image by computer, controls flexibly size and the intensity of hot spot.
Described temperature online Real-Time Monitoring and control system comprise the thermal camera 4 that a wavelength is 7.5～13 μ m.Described displacement control platform 7 adopts servo-control system control, comprises pneumatic bearing and ball-screw 8 structures that driven by servomotor 6.
Shown in accompanying drawing 2, when polymeric micro-fluidic chip places on the displacement control platform 7, the CCD micro imaging system is taken the MCA of polymeric micro-fluidic chip, by computer to image identifying and processing, design the target image of optimum bonding position, obtain the target image coding by numerical simulation calculation, utilize the value of the pixel in the image dynamically to control the diffraction of liquid crystal mode binary optical elements 2, the control laser light field is realized the On-line Control to the polymeric micro-fluidic chip bonding quality flexibly.In the bonding process, the thermal camera that the variation in temperature field is 7.5～13 μ m by a wavelength in temperature online Real-Time Monitoring and the control system is recorded, thermal imaging system monitoring molten bath and near Temperature Distribution form corresponding thermal map vision signal, USB mouth by PC after video frequency collection card gathers is inputted, thermal imaging picture by the thermal imaging system picked-up is analyzed by CAM software, analyzing and processing thermal map temperature information, provide the current regulation control instruction of laser instrument, make the weldpool temperature reach suitable temperature, realize setting bonding parameter according to preseting bonding quality.Accurate displacement control platform and servo-control system adopt the three-dimensional mobile platform that accurate pneumatic bearing and driven by servomotor ball-screw form simultaneously, the accurate location of realizing bonding process, and realize that automatic self-locking clamps.
Claims (4)
1. polymeric micro-fluidic chip bonding apparatus, comprise laser generator, controllable optical system, control system, displacement control platform, it is characterized in that: in the described controllable optical system, be provided with binary optical elements, laser beam is treated the bonding chip place through the binary optical elements diffraction on displacement control platform, spot size and the intensity of formation are controlled; Be provided with the image identifying and processing system, described image identifying and processing system comprises CCD and computer, CCD is gathered the processing of diffraction image by computer, size and the intensity of control hot spot.
2. polymeric micro-fluidic chip bonding apparatus according to claim 1, it is characterized in that: described binary optical elements is the pure phase bit-type micro optical element of liquid crystal mode control, wave surface by changing light wave is to change phase place, be used for the phase place of laser beam is modulated in real time, after diffraction, the light spot shape that laser beam arrives polymeric micro-fluidic chip substrate and cover plate bonding face place is identical with the weld shape of being scheduled to.
3. polymeric micro-fluidic chip bonding apparatus according to claim 1, it is characterized in that: be provided with temperature online Real-Time Monitoring and control system, described temperature online Real-Time Monitoring and control system comprise that a wavelength is the thermal camera of 7.5～13 μ m.
4. polymeric micro-fluidic chip bonding apparatus according to claim 1 is characterized in that: described displacement control platform adopts servo-control system control, comprises pneumatic bearing and by the ball screw arrangement of driven by servomotor.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201220367388 CN202862594U (en) | 2012-07-27 | 2012-07-27 | Polymer micro-fluidic chip bonding device |
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| CN 201220367388 CN202862594U (en) | 2012-07-27 | 2012-07-27 | Polymer micro-fluidic chip bonding device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102756474A (en) * | 2012-07-27 | 2012-10-31 | 苏州大学 | Bonding device for polymer microfluidic chip |
| CN103474588A (en) * | 2013-09-30 | 2013-12-25 | 上海大学 | OLED packaging device and OLED packaging method |
| CN114768895A (en) * | 2022-03-12 | 2022-07-22 | 北京化工大学 | Laser bonding method suitable for thermoplastic polymer material microfluidic chip |
-
2012
- 2012-07-27 CN CN 201220367388 patent/CN202862594U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102756474A (en) * | 2012-07-27 | 2012-10-31 | 苏州大学 | Bonding device for polymer microfluidic chip |
| CN103474588A (en) * | 2013-09-30 | 2013-12-25 | 上海大学 | OLED packaging device and OLED packaging method |
| CN103474588B (en) * | 2013-09-30 | 2016-04-13 | 上海大学 | OLED packaging system and OLED encapsulation method |
| CN114768895A (en) * | 2022-03-12 | 2022-07-22 | 北京化工大学 | Laser bonding method suitable for thermoplastic polymer material microfluidic chip |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130410 Termination date: 20160727 |