CN202845402U - Fixture used for cleaning of diode leads - Google Patents
Fixture used for cleaning of diode leads Download PDFInfo
- Publication number
- CN202845402U CN202845402U CN 201220524422 CN201220524422U CN202845402U CN 202845402 U CN202845402 U CN 202845402U CN 201220524422 CN201220524422 CN 201220524422 CN 201220524422 U CN201220524422 U CN 201220524422U CN 202845402 U CN202845402 U CN 202845402U
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- Prior art keywords
- lead
- cleaning
- plate
- diode
- hole
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Abstract
The utility model discloses a fixture used for cleaning of diode leads. The fixture comprises a lower base plate and an upper base plate which are arranged horizontally. The upper base plate and the lower base plate are fixedly connected with each other through a connecting piece, the space between the upper base plate and the lower base plate is smaller than the length of the diode leads to be cleaned, ultrasonic penetrating hole are densely formed in the lower base plate and enable foreign bodies after cleaning to be discharged out, a rectangular through hole provided with a supporting step is formed in the middle portion of the upper base plate, a lead positioning plate capable of being supported on the supporting step can be placed in the rectangular through hole, and lead holes used for placing of the diode leads are densely formed in the lead positioning plate. The fixture used for the cleaning of the diode leads enables the cleaning work of the diode leads to be simply and easily performed, and the cleaning efficiency is super fast, and therefore the cleanliness of the diode leads is guaranteed.
Description
Technical field
The present invention relates to a kind of tool for cleaning diode lead.
Background technology
As shown in Figure 1, diode lead 7 is one of vitals of making by diode, and it is made of lead-in wire body 71 and lead riser 72.Present stage, in the diode production industry, owing to do not have suitable cleaning equipment, usually can be to not cleaning as the diode lead of making raw material.Yet diode lead can cause its cleanliness factor undesirable (mainly being the lead riser part of diode lead) because of the impact of storage environment etc. usually, thus the performance of the diode that impact is made.
At present, in the manufacturing industry of diode, usually can use a kind of positioner for welding diode, this equipment is made of the lead-in wire location-plate on bracing frame and the bracing frame, offers many fairleads for placing lead-in wire on the lead-in wire location-plate.During use, with diode lead be through the lead-in wire location-plate fairlead on, at this moment, the lead-in wire body pass fairlead and be in the lead-in wire location-plate the below, lead riser be supported on the lead-in wire location-plate upper face.Then glass bulb vertically is placed on the lead-in wire location-plate, lead riser is stretched in the glass bulb, can carry out the welding job of diode lead.
Summary of the invention
The present invention seeks to: for the problems referred to above, the invention discloses a kind of tool for cleaning diode lead.
Technical scheme of the present invention is: a kind of tool for cleaning diode lead, comprise horizontally disposed infrabasal plate and upper substrate, on described, be fixed together by brace between the infrabasal plate, and on, distance between the infrabasal plate is less than the length of diode lead to be cleaned, be densely covered with the ultrasonic wave through hole on the described infrabasal plate, described upper substrate middle part offers one with the rectangular through-hole of support level, can place a lead-in wire location-plate that is supported on the described support level in the described rectangular through-hole, be densely covered with on the described lead-in wire location-plate for the fairlead of placing diode lead.
Described ultrasonic wave through hole and the dislocation of described fairlead are arranged.
Described infrabasal plate and brace are stainless steel, and described upper substrate is bakelite plate, an end of described brace and infrabasal plate welding, and the other end is connected with upper substrate by screw.
Be provided with alignment pin on the described support level, offer the dowel hole corresponding with described alignment pin on the described lead-in wire location-plate.
Adopt above-mentioned tool to clean the diode lead method, may further comprise the steps:
Step 1, the lead-in wire location-plate that will fill lead-in wire are transformed on this tool from the bracing frame of diode welding device, and the lead riser of diode lead between upper and lower substrate down;
Step 2, the tool that diode lead will be housed are put into the guide-track groove of the cleaning equipment that cleaning fluid is housed, and make that the lead riser of diode lead is submerged in the cleaning fluid in the cleaning process, and the location-plate that goes between simultaneously is positioned at the cleaning fluid top, does not contact with cleaning fluid;
Step 4, take out from cleaning equipment discharging opening tool out, and the lead-in wire location-plate of filling lead-in wire on the tool is converted to original bracing frame flows into next processing procedure.
Advantage of the present invention is: cleaning tool of the present invention, utilized dexterously the structure of existing welding diode equipment, can clean the diode lead (especially lead riser part) in the existing processing procedure easily, and cleaning efficiency is exceedingly fast, and guaranteed the cleanliness factor of diode lead.
Description of drawings
The invention will be further described below in conjunction with drawings and Examples:
Fig. 1 is the structural representation of diode lead;
Fig. 2 is the structural representation (sectional view) that is used for the tool of cleaning diode lead in the embodiment of the invention;
Fig. 3 is the structural representation of infrabasal plate in the embodiment of the invention, wherein is welded with brace on the infrabasal plate;
Fig. 4 is the structural representation of upper substrate in the embodiment of the invention;
Fig. 5 is the structural representation of lead-in wire location-plate in the embodiment of the invention;
Fig. 6 is the using method demonstration graph that is used for the tool of cleaning diode lead in the embodiment of the invention;
Wherein: 1-infrabasal plate, 2-upper substrate, 3-brace, the 4-location-plate that goes between, 5-guide-track groove, 6-cleaning fluid;
11-ultrasonic wave through hole, 21-rectangular through-hole, 22-support level, 23-alignment pin, the 41-locating hole that goes between, 42-dowel hole.
The specific embodiment
As shown in Figure 2, present embodiment is used for cleaning the tool of diode lead, comprise horizontally disposed infrabasal plate 1 and upper substrate 2, be fixed together by brace 3 between the described upper and lower substrate 1,2, and the distance between the upper and lower substrate 1,2 is less than the length of diode lead 7 to be cleaned.Wherein, infrabasal plate 1 and brace 3 are stainless steel, and upper substrate 2 is bakelite plate, and the concrete connected mode between brace 3 and upper and lower substrate is: an end of brace 3 and infrabasal plate 1 welding, the other end is connected with upper substrate 2 by screw.
As shown in Figure 3, be densely covered with ultrasonic wave through hole 11 on the described infrabasal plate 1.
Such as Fig. 1, Fig. 4 and shown in Figure 5, described upper substrate 2 middle parts offer one with the rectangular through-hole 22 of support level 21, can place lead-in wire location-plate 4(" a lead-in wire location-plate " here that is supported on the described support level 21 in the described rectangular through-hole 22, with said in the finger background technology, the lead-in wire positioning plate structure that is used on the positioner of welding diode is the same), be densely covered with on the described lead-in wire location-plate 4 for the fairlead 41 of placing diode lead 7, and ultrasonic wave through hole 11 is arranged with fairlead 41 dislocation, thereby be convenient to when diode lead cleans, ultrasonic wave can be smoothly enters near the diode lead the cleaning fluid (lead riser can not blocked the ultrasonic wave through hole) by ultrasonic wave through hole 11, quickening simultaneously can also be by the foreign matter after this hole discharge cleaning to the cleaning efficiency of diode lead.
As shown in Figure 4 and Figure 5, for convenience goes between location-plate 4 at rectangular through-hole 22 and bracing frame (" bracing frame " here, refer in the background technology said, be used for the bracing frame on the positioner of welding diode) between conversion, the present embodiment spy is provided with alignment pin 23 at described support level 21, offers the dowel hole 42 corresponding with described alignment pin 23 on the described lead-in wire location-plate 4.
With reference to shown in Figure 6, the method for cleaning diode lead for above-mentioned tool is as follows:
Step 1, will fill the lead-in wire location-plate 4 of lead-in wire from bracing frame (" bracing frame " here of diode welding device, refer in the background technology said, be used for the bracing frame on the positioner of welding diode) upward be transformed into this tool by the dowel hole 42 on the alignment pin 23 on the support level 21 and the lead-in wire location-plate 4, and the lead riser 72 of diode lead between upper and lower substrate down, such as Fig. 2;
Step 2, the tool that diode lead 7 will be housed are put into the guide-track groove 5 of the cleaning equipment that cleaning fluid 6 is housed, the lead riser 72 of diode lead 7 is submerged in the cleaning fluid 6, the location-plate 4 that goes between simultaneously is positioned at the cleaning fluid top, does not contact with cleaning fluid;
Step 4, take out from cleaning equipment discharging opening tool out, and the lead-in wire location-plate 4 of filling lead-in wire on the tool is converted to flows into next processing procedure on original bracing frame.
Certainly, above-described embodiment only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow people can understand content of the present invention and implements according to this, can not limit protection scope of the present invention with this.The all Spirit Essence of main technical schemes is done according to the present invention equivalent transformation or modification all should be encompassed within protection scope of the present invention.
Claims (4)
1. tool that be used for to clean diode lead, it is characterized in that: it comprises horizontally disposed infrabasal plate (1) and upper substrate (2), on described, infrabasal plate (1,2) be fixed together by brace (3) between, and on, infrabasal plate (1,2) distance between is less than the length of diode lead to be cleaned (7), be densely covered with ultrasonic wave through hole (11) on the described infrabasal plate (1), described upper substrate (2) middle part offers the rectangular through-hole (22) of a band support level (21), can place a lead-in wire location-plate (4) that is supported on the described support level (21) in the described rectangular through-hole (21), be densely covered with on the described lead-in wire location-plate (4) for the fairlead (41) of placing diode lead (7).
2. the tool for cleaning diode lead according to claim 1 is characterized in that: described ultrasonic wave through hole (11) and described fairlead (41) dislocation layout.
3. the tool for cleaning diode lead according to claim 1 and 2, it is characterized in that: described infrabasal plate (1) and brace (3) are stainless steel, described upper substrate (2) is bakelite plate, one end of described brace (3) and infrabasal plate (1) welding, the other end is connected with upper substrate (2) by screw.
4. the tool for cleaning diode lead according to claim 1 and 2, it is characterized in that: be provided with alignment pin (23) on the described support level (21), offer the dowel hole (42) corresponding with described alignment pin (23) on the described lead-in wire location-plate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220524422 CN202845402U (en) | 2012-10-15 | 2012-10-15 | Fixture used for cleaning of diode leads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220524422 CN202845402U (en) | 2012-10-15 | 2012-10-15 | Fixture used for cleaning of diode leads |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202845402U true CN202845402U (en) | 2013-04-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220524422 Expired - Fee Related CN202845402U (en) | 2012-10-15 | 2012-10-15 | Fixture used for cleaning of diode leads |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202845402U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102896128A (en) * | 2012-10-15 | 2013-01-30 | 苏州群鑫电子有限公司 | Jig and method for washing diode leads |
-
2012
- 2012-10-15 CN CN 201220524422 patent/CN202845402U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102896128A (en) * | 2012-10-15 | 2013-01-30 | 苏州群鑫电子有限公司 | Jig and method for washing diode leads |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SIYANG QUNXIN ELECTRONICS CO., LTD. Free format text: FORMER OWNER: SUZHOU QUNXIN ELECTRON CO., LTD. Effective date: 20150430 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 215129 SUZHOU, JIANGSU PROVINCE TO: 223700 SUQIAN, JIANGSU PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20150430 Address after: 223700, Suqian City, Jiangsu province Siyang County Road, Tai Yuen Road north side of your mouth Road West National Pioneer Park Patentee after: Suzhou Qunxin Electronics Co., Ltd. Address before: 215129 No. 568 Changjiang Road, Suzhou New District, Jiangsu, Suzhou, China Patentee before: Suzhou Qunxin Electronics Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130403 Termination date: 20191015 |