CN102896128B - Jig and method for washing diode leads - Google Patents
Jig and method for washing diode leads Download PDFInfo
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- CN102896128B CN102896128B CN201210388068.2A CN201210388068A CN102896128B CN 102896128 B CN102896128 B CN 102896128B CN 201210388068 A CN201210388068 A CN 201210388068A CN 102896128 B CN102896128 B CN 102896128B
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Abstract
The invention discloses a jig and a method for washing diode leads. The jig comprises a lower base plate and an upper base plate which are horizontally arranged, wherein the upper base plate and the lower base plate are fixedly connected through a connecting piece; a distance between the upper base plate and the lower base plate is smaller than length of the diode leads to be washed; ultrasonic penetration holes are densely distributed in the lower base plate and can discharge washed foreign matters at the same time; a rectangular through hole with a supporting step is arranged in the middle of the upper base plate; a lead positioning plate supported on the supporting step can be placed in the rectangular through hole; and lead holes for placing the diode leads are densely distributed in the lead positioning plate. According to the jig and the method for washing the diode leads, operation of washing the diode leads is simple and easy to implement, washing efficiency is very high, and cleanness of the diode leads is guaranteed.
Description
Technical field
The present invention relates to a kind of tool and method of cleaning diode lead.
Background technology
As shown in Figure 1, diode lead 7 is one of vitals of making by diode, and it is made up of go between body 71 and lead riser 72.Present stage, in diode production industry, owing to there is no suitable cleaning equipment, conventionally can be to not cleaning as the diode lead of making raw material.But diode lead can cause its cleanliness factor undesirable (being mainly the lead riser part of diode lead) because of the impact of storage environment etc. conventionally, thus the performance of the diode that impact is made.
At present, in the manufacturing industry of diode, conventionally can use a kind of positioner for welding diode, this equipment is made up of the lead-in wire location-plate on bracing frame and bracing frame, offers many for placing the fairlead of lead-in wire on lead-in wire location-plate.When use, diode lead is through on the fairlead of lead-in wire location-plate, now, the below of lead-in wire body through fairlead and in lead-in wire location-plate, lead riser is supported on the upper face of lead-in wire location-plate.Then glass bulb is vertically placed on lead-in wire location-plate, lead riser is stretched in glass bulb, can carry out the welding job of diode lead.
Summary of the invention
The present invention seeks to: for the problems referred to above, the invention discloses a kind ofly for cleaning the tool of diode lead, also disclose the method that uses this tool to clean diode lead simultaneously.
Technical scheme of the present invention is: a kind of for cleaning the tool of diode lead, comprise horizontally disposed infrabasal plate and upper substrate, on described, between infrabasal plate, be fixed together by brace, and on, distance between infrabasal plate is less than the length of diode lead to be cleaned, on described infrabasal plate, be densely covered with ultrasonic wave through hole, described upper substrate middle part offers a rectangular through-hole with support level, in described rectangular through-hole, can place a lead-in wire location-plate being supported on described support level, on described lead-in wire location-plate, be densely covered with the fairlead for placing diode lead.
Described ultrasonic wave through hole and the dislocation of described fairlead are arranged.
Described infrabasal plate and brace are stainless steel, and described upper substrate is bakelite plate, one end of described brace and infrabasal plate welding, and the other end is connected with upper substrate by screw.
On described support level, be provided with alignment pin, on described lead-in wire location-plate, offer the dowel hole corresponding with described alignment pin.
Adopt above-mentioned tool to clean diode lead method, comprise the following steps:
Step 2, the tool that diode lead is housed is put into the guide-track groove of the cleaning equipment that cleaning fluid is housed, the lead riser of diode lead in cleaning process is submerged in cleaning fluid, the location-plate that simultaneously goes between is positioned at cleaning fluid top, does not contact with cleaning fluid;
Advantage of the present invention is: cleaning tool of the present invention and cleaning method, utilize dexterously the structure of existing welding diode equipment, can clean the diode lead in existing processing procedure (especially lead riser part) easily, and cleaning efficiency is exceedingly fast, guarantee the cleanliness factor of diode lead.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the invention will be further described:
Fig. 1 is the structural representation of diode lead;
Fig. 2 is for cleaning the structural representation (sectional view) of tool of diode lead in the embodiment of the present invention;
Fig. 3 is the structural representation of infrabasal plate in the embodiment of the present invention, wherein on infrabasal plate, is welded with brace;
Fig. 4 is the structural representation of upper substrate in the embodiment of the present invention;
Fig. 5 is the structural representation of location-plate of going between in the embodiment of the present invention;
Fig. 6 is for cleaning the using method demonstration graph of tool of diode lead in the embodiment of the present invention;
Wherein: 1-infrabasal plate, 2-upper substrate, 3-brace, the 4-location-plate that goes between, 5-guide-track groove, 6-cleaning fluid;
11-ultrasonic wave penetrates sky, 21-rectangular through-hole, 22-support level, 23-alignment pin, the 41-locating hole that goes between, 42-dowel hole.
The specific embodiment
As shown in Figure 2, the present embodiment is for cleaning the tool of diode lead, comprise horizontally disposed infrabasal plate 1 and upper substrate 2, between described upper and lower substrate 1,2, be fixed together by brace 3, and distance between upper and lower substrate 1,2 is less than the length of diode lead 7 to be cleaned.Wherein, infrabasal plate 1 and brace 3 are stainless steel, and upper substrate 2 is bakelite plate, and the concrete connected mode between brace 3 and upper and lower substrate is: one end of brace 3 and infrabasal plate 1 weld, and the other end is connected with upper substrate 2 by screw.
As shown in Figure 3, on described infrabasal plate 1, be densely covered with ultrasonic wave through hole 11.
As Fig. 1, shown in Fig. 4 and Fig. 5, described upper substrate 2 middle parts offer a rectangular through-hole 22 with support level 21, in described rectangular through-hole 22, can place one and be supported on lead-in wire location-plate 4(on described support level 21 " lead-in wire location-plate " here, with said in finger background technology, the same for the lead-in wire positioning plate structure on the positioner of welding diode), on described lead-in wire location-plate 4, be densely covered with the fairlead 41 for placing diode lead 7, and ultrasonic wave through hole 11 is arranged with fairlead 41 dislocation, thereby be convenient in the time that diode lead cleans, ultrasonic wave can enter (lead riser can not blocked ultrasonic wave through hole) near cleaning fluid diode lead by ultrasonic wave through hole 11 smoothly, accelerate the cleaning efficiency to diode lead, can also discharge the foreign matter after cleaning by this hole simultaneously.
As shown in Figure 4 and Figure 5, for convenient lead-in wire location-plate 4 is at rectangular through-hole 22 and bracing frame (" bracing frame " here, refer in background technology said, for the bracing frame on the positioner of welding diode) between conversion, the present embodiment spy is provided with alignment pin 23 on described support level 21, offers the dowel hole 42 corresponding with described alignment pin 23 on described lead-in wire location-plate 4.
Shown in Fig. 6, the method for cleaning diode lead for above-mentioned tool is as follows:
Step 2, the tool that diode lead 7 is housed is put into the guide-track groove 5 of the cleaning equipment that cleaning fluid 6 is housed, in cleaning process, make the lead riser 72 of diode lead 7 be submerged in cleaning fluid 6, the location-plate 4 that simultaneously goes between is positioned at cleaning fluid top, does not contact with cleaning fluid;
Certainly, above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow people can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalent transformation or modification that according to the present invention, the Spirit Essence of main technical schemes does, within all should being encompassed in protection scope of the present invention.
Claims (1)
1. one kind is cleaned diode lead method with tool, it is characterized in that described tool comprises horizontally disposed infrabasal plate (1) and upper substrate (2), on described, infrabasal plate (1, 2) between, be fixed together by brace (3), and on, infrabasal plate (1, 2) distance between is less than the length of diode lead to be cleaned (7), on described infrabasal plate (1), be densely covered with ultrasonic wave through hole (11), described upper substrate (2) middle part offers the rectangular through-hole (22) of a band support level (21), in described rectangular through-hole (21), can place a lead-in wire location-plate (4) being supported on described support level (21), on described lead-in wire location-plate (4), be densely covered with the fairlead (41) for placing diode lead (7),
The method comprises the following steps:
Step 1, the lead-in wire location-plate (4) of filling lead-in wire is transformed on this tool from the bracing frame of former diode welding device, and the lead riser of diode lead (72) between upper and lower substrate (1,2) down;
Step 2, the tool that diode lead (7) is housed is put into the guide-track groove (5) of the cleaning equipment that cleaning fluid (6) is housed, the lead riser (72) of diode lead in cleaning process (7) is submerged in cleaning fluid (6), the location-plate (4) that simultaneously goes between is positioned at cleaning fluid top, does not contact with cleaning fluid;
Step 3, unlatching cleaning equipment clean lead-in wire, and cleaning equipment is provided with hot air apparatus, carry out air-dry to cleaning lead-in wire;
Step 4, take out from cleaning equipment discharging opening tool out, and the lead-in wire location-plate (4) of filling lead-in wire on tool is converted to original bracing frame flows into next processing procedure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210388068.2A CN102896128B (en) | 2012-10-15 | 2012-10-15 | Jig and method for washing diode leads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210388068.2A CN102896128B (en) | 2012-10-15 | 2012-10-15 | Jig and method for washing diode leads |
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| Publication Number | Publication Date |
|---|---|
| CN102896128A CN102896128A (en) | 2013-01-30 |
| CN102896128B true CN102896128B (en) | 2014-06-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201210388068.2A Active CN102896128B (en) | 2012-10-15 | 2012-10-15 | Jig and method for washing diode leads |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102664157A (en) * | 2012-06-04 | 2012-09-12 | 扬州扬杰电子科技股份有限公司 | Vibration flushing device for diode after acid treatment |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6393140A (en) * | 1986-10-07 | 1988-04-23 | Mitsubishi Electric Corp | Device for cleaning lead frame for semiconductor device |
| JP3027960B2 (en) * | 1997-05-14 | 2000-04-04 | サンケン電気株式会社 | Semiconductor device dirt removal method |
| CN200954509Y (en) * | 2006-09-21 | 2007-10-03 | 马艳丽 | Pucture-needle washing device |
| CN201518315U (en) * | 2009-09-18 | 2010-06-30 | 苏州群鑫电子有限公司 | Plastic-sealed diode tinning positioning fixture |
| CN202097155U (en) * | 2011-05-31 | 2012-01-04 | 常州佳讯光电产业发展有限公司 | Device for cleaning surfaces of diodes |
| CN202377233U (en) * | 2011-12-15 | 2012-08-15 | 常州星海电子有限公司 | Device for cleaning frame diodes |
| CN202845402U (en) * | 2012-10-15 | 2013-04-03 | 苏州群鑫电子有限公司 | Fixture used for cleaning of diode leads |
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2012
- 2012-10-15 CN CN201210388068.2A patent/CN102896128B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102664157A (en) * | 2012-06-04 | 2012-09-12 | 扬州扬杰电子科技股份有限公司 | Vibration flushing device for diode after acid treatment |
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| CN102896128A (en) | 2013-01-30 |
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| C14 | Grant of patent or utility model | ||
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Owner name: SIYANG QUNXIN ELECTRONICS CO., LTD. Free format text: FORMER OWNER: SUZHOU QUNXIN ELECTRON CO., LTD. Effective date: 20150522 |
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| C41 | Transfer of patent application or patent right or utility model | ||
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Free format text: CORRECT: ADDRESS; FROM: 215129 SUZHOU, JIANGSU PROVINCE TO: 223700 SUQIAN, JIANGSU PROVINCE |
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| TR01 | Transfer of patent right |
Effective date of registration: 20150522 Address after: 223700, Suqian City, Jiangsu province Siyang County Road, Tai Yuen Road north side of your mouth Road West National Pioneer Park Patentee after: Suzhou Qunxin Electronics Co., Ltd. Address before: 215129 No. 568 Changjiang Road, Suzhou New District, Jiangsu, Suzhou, China Patentee before: Suzhou Qunxin Electronics Co., Ltd. |